CN105066897A - Thin substrate deformation measuring method eliminating influence of gravity - Google Patents
Thin substrate deformation measuring method eliminating influence of gravity Download PDFInfo
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- CN105066897A CN105066897A CN201510496479.7A CN201510496479A CN105066897A CN 105066897 A CN105066897 A CN 105066897A CN 201510496479 A CN201510496479 A CN 201510496479A CN 105066897 A CN105066897 A CN 105066897A
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Abstract
The invention discloses a thin substrate deformation measuring method eliminating influence of gravity. A thin substrate is supported by three supporting balls. The method comprises the following steps that the positions of the three supporting balls are confirmed through measurement; the thin substrate to be measured is arranged on the three supporting balls, and thickness and the position of the thin substrate are confirmed; the measured position information of the three supporting balls and thickness, contour and position information of the thin substrate are inputted to finite element analysis software to perform gravity additional deformation simulation, and gravity additional deformation is calculated; and total deformation of the thin substrate is measured through scanning, and the calculated gravity additional deformation is subtracted from total deformation so that real deformation of the thin substrate is obtained. No ion pollution is generated, liquid is not used and surface tension additional deformation is not generated by the method; the method has no requirement for the positions of the supporting balls or assembling precision of the supporting mechanism; and an additional centering mechanism for ensuring the center of the thin substrate to be positioned on a forward and backward measurement overturning shaft is not required.
Description
Technical field
The present invention relates to deformation of body measuring method technical field, be specifically related to a kind of thin substrate deformation measuring method eliminating gravity effect.
Background technology
Thin substrate is the thin plate in mechanics, geometric properties is circle, rectangle or other shape, its gauge is much smaller than planar dimension, thin substrate easily produces warpage or flexural deformation in process, in order to detect the machining deformation of thin substrate, or optimization processing technology is to reduce machining deformation, need to measure the distortion of thin substrate.Because the rigidity of thin substrate is very low, its deformation measurement is subject to supporting way and external environment, and as the impact of vibration, air-flow and gravity, when adopting vibration isolation and air-flow shielding, the impact of gravity becomes the factor that can not be ignored.When current existing measuring method measures substrate deformation, that with platform horizontal positioned, supported at three point horizontal positioned, single-point clamping, vertically lifting placement or 3 radial support are vertically placed by thin substrate, warpage or diastrophic thin substrate can produce additional deformation under gravity, directly affect thin substrate deformation measurement result.
The people such as KanzakiToyoki of Japan is in " method measuring flatness and device " patent of invention of JP2000234919A in the patent No., invents a kind of method utilizing the transparent and translucent object flatness of interferometer measurement.Object being measured part immersed in liquid in measurement, in atmosphere, lower surface in a liquid for the upper surface of testee.When adopting the method to measure deformation of body, need object measured surface on liquid surface, cannot the less and larger thin substrate of distortion of detect thickness; Further, can be subject to surface tension of liquid effect because testee part immerses in liquid, introduce surface tension additional deformation, meanwhile, also there is ion contamination problems in the method.Therefore the measuring method reducing or eliminate gravity additional deformation and eliminate surface tension of liquid additional deformation is needed to measure thin substrate deformation exactly.
The OkumuraHirosh of Japan is in " silicon warp degree measuring method " patent of invention of JP2002243431A in the patent No., invent supported at three point reversion measuring method, thin substrate is by supported at three point horizontal positioned, reverse after measuring the surperficial profile pattern of thin substrate one thin substrate, again measures the profile pattern on thin another surface of substrate.Suffered gravity additional deformation is identical when supposing that thin substrate pros and cons is measured, by calculating the thin substrate surface profile pattern of agravic additional deformation, determine the distortion of thin substrate.During the method operating cost, and require that thin substrate and supporting point position are relative to positive and negative trip shaft full symmetric, otherwise after upset, thin substrate gravity additional deformation is different, cannot carry out arithmetical operation.Symmetry requirement needs the assembly precision ensureing supporting mechanism, limit the usable range of supported at three point method, need extra thin substrate centering machine to ensure that thin substrate center is on positive and negative measurement trip shaft in addition, and some thin substrates are as silicon chip, intensity is more weak, in centering operation, general needs makes it to move to center in edge applying power, adds the risk of silicon chip fragmentation.Therefore, need to supporting mechanism without accuracy requirement, without the need to the thin substrate deformation method of the elimination gravity additional deformation of centering machine.
Summary of the invention
The present invention is directed to that existing measuring method set forth above is introduced surface tension additional deformation, be there is ionic soil, the requirement of supporting mechanism assembly precision is high and need the problem of extra centering machine, and a kind of thin substrate deformation measuring method eliminating gravity effect of research and design.The technological means that the present invention adopts is as follows:
Eliminate a thin substrate deformation measuring method for gravity effect, described thin substrate is supported by three fulcrum balls, comprises the following steps:
1. by measuring the position determining three fulcrum balls;
2. thin substrate to be measured is positioned on three fulcrum balls, determines the thickness of thin substrate, position and profile information;
The positional information of three fulcrum balls 3. step 1. 2. recorded with step and the thickness of thin substrate, position and profile information input in finite element analysis software, carry out the emulation of gravity additional deformation, calculate gravity additional deformation;
4. scanning records the total deformation of thin substrate, and total deformation deducts the gravity additional deformation that 3. step calculates, and draws thin substrate true strain.
Further, 1. step uses optical displacement sensor to measure, optical displacement sensor is fixed an axial coordinate, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball on this shifting axle direction, uses the same method and records another axial centre coordinate of this fulcrum ball; Use the same method and record the position coordinates of two other fulcrum ball.
If do not adopt round matching, direct employing fulcrum ball profile peak error is larger, this is because fulcrum ball profile peak slope is zero, sensor reading jumping effect is larger, and distance center remotely, fulcrum ball profile slope is comparatively large, and same reading jumping effect is little, can be significantly improved the precision at fulcrum ball center by matching.
Further, step 2. in thin substrate position use optical displacement sensor measure, optical displacement sensor is fixed an axial coordinate, thin substrate is scanned along another axle, inner until outside non-metering from thin substrate, measurement data is carried out to the least square fitting of boundary curve and surperficial straight line, the intersection point of surperficial straight line and boundary curve is the marginal point of thin substrate, edge point carries out least square fitting, draws position and the profile of thin substrate.
For optical sensor, the determination of height is determined by the facula position on testee, but when measuring edge, hot spot can not be streamlined any further as luminous point, height value error is larger, therefore determined the marginal point of intersection point as thin substrate of thin substrate surface straight line and boundary curve by the mode of matching, the impact of marginal point elevation carrection error can be eliminated, improve the precision that marginal point is found.
Further, step 2. in thin substrate thickness use optical displacement sensor measure, first record the apex coordinate of fulcrum ball, then measure fulcrum ball place and place height after thin substrate, the difference in height of placing the height after thin substrate and fulcrum ball summit is the thickness of thin substrate;
Before the thin substrate of placement, an axial coordinate fixed by optical displacement sensor, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball on this shifting axle direction, is fixed on centre coordinate, along another axle scanning survey fulcrum ball profile by an axle of optical displacement sensor, Least Square Circle matching scanning profile, peak is fulcrum ball summit; Or the fulcrum ball profile of scanning survey more than two, carries out the matching of least square ball to measurement data, and be supported ball apex coordinate; Then measure fulcrum ball place and place height after thin substrate.
When allowing thin substrate be positioned in plane, during substrate thickness thin by sensor measurement, due to the distortion of self, have space in the middle of thin substrate and reference planes, measuring error is larger.Generally adopt dual sensor to measure to improve precision, two sensor locations, in the both sides of thin substrate, demarcate the distance of two sensors by the substrate of a standard thickness, then measure the thickness of thin substrate.Adopt this kind of method to need two sensors, add measurement cost, and need the substrate of standard thickness to demarcate, complex operation.Method in this patent, thin substrate is supported by three fulcrum balls, and both contact conditions are unique, there is not space, and only need single-sensor, without the need to the demarcation of standard thickness substrate.
Further, described optical displacement sensor is laser triangulation sensor, laser co-focusing sensor or white light confocal sensor.
Compared with the prior art, a kind of thin substrate deformation measuring method eliminating gravity effect of the present invention has the following advantages:
1, without ionic soil, do not use liquid, do not produce surface tension additional deformation;
2, to the position not requirement of fulcrum ball, the assembly precision of supporting mechanism is not required;
3, thin substrate placement position is flexible, does not need extra centering machine to ensure that thin substrate center is in three fulcrum ball centers.
Accompanying drawing explanation
Fig. 1 is the measurement mechanism structural representation that the embodiment of the present invention uses.
Fig. 2 is the thin substrate support state schematic top plan view of the embodiment of the present invention.
Fig. 3 is the deformational overprint principle schematic of the embodiment of the present invention.
Fig. 4 is the principle schematic measuring fulcrum ball vertex position in the embodiment of the present invention.
Fig. 5 is to the matched curve figure that fulcrum ball scans in the x-direction in the embodiment of the present invention.
Fig. 6 is to the matched curve figure that fulcrum ball scans in the y-direction in the embodiment of the present invention.
Fig. 7 is the principle schematic measuring edge point position in the embodiment of the present invention.
Fig. 8 is the matched curve figure measuring thin substrate edge point in the embodiment of the present invention.
Fig. 9 is the partial enlarged drawing of Fig. 8.
Figure 10 is the thin substrate total deformation figure that the embodiment of the present invention directly records.
Figure 11 is the FEM (finite element) calculation thin substrate gravity additional deformation figure of the embodiment of the present invention.
Figure 12 is the thin substrate true strain figure of the embodiment of the present invention.
Embodiment
Eliminate a thin substrate deformation measuring method for gravity effect, described thin substrate is supported by three fulcrum balls, comprises the following steps:
1. by measuring the position determining three fulcrum balls;
2. thin substrate to be measured is positioned on three fulcrum balls, determines the thickness of thin substrate, position and profile information;
The positional information of three fulcrum balls 3. step 1. 2. recorded with step and the thickness of thin substrate, position and profile information input in finite element analysis software, carry out the emulation of gravity additional deformation, calculate gravity additional deformation;
4. scanning records the total deformation of thin substrate, and total deformation deducts the gravity additional deformation that 3. step records, and draws thin substrate true strain.
As shown in Figure 1, the measurement mechanism that the present embodiment uses comprises workbench 1, two-dimension moving platform 7 is provided with above workbench 1, workbench 1 is placed with fulcrum ball 2, optical displacement sensor 4 adopts laser triangle displacement sensor 4, and thin substrate 3 is thin substrate, and optical displacement sensor 4 is fixed on two-dimension moving platform 7 by installing plate 9, regulate the position of two-dimension moving platform 7 before measuring, thin substrate 3 is within the measurement range of optical displacement sensor 4.Described optical displacement sensor 4 is laser triangulation sensor, laser co-focusing sensor or white light confocal sensor.
Two-dimension moving platform 7 carries out x, y to two dimensional motion according to the track of setting, thin substrate 3 surface of optical displacement sensor 4 scanning survey, optical displacement sensor 4 is initial is positioned at thin substrate center point, start scanning after directly to y to forward move to thin substrate edge select 5 places then start by zigzag scanning whole thin substrate.According to the coordinate figure of two-dimension moving platform 7 and the reading of optical displacement sensor 4, become thin substrate 3 three-dimensional surface shape figure by computer fitting, calculate and determine actual warpage and the flexural deformation of substrate.To measure the fulcrum ball of acquisition and thin substrate position and thickness feedback above in limit element artificial module, calculate the gravity additional deformation of thin substrate 3, practical distortion deducts the true strain that gravity additional deformation obtains thin substrate 3.
As Figure 2-3, the gravity additional deformation of thin substrate 3 is uniquely determined by the position of three fulcrum balls 2 and the position of thin substrate 3, is (x for a coordinate on thin substrate 3, y) some A (x, y), s (x, y) measures thin substrate 3 deformation values obtained; Also be the superposition of thin substrate true strain value w (x, y) and gravity additional deformation value g (x, y) simultaneously.Therefore, under thin substrate 3 free state, thin substrate true strain value w (x, y) can deduct g (x, y) acquisition by s (x, y).
1. step uses optical displacement sensor to measure, as shown in Figure 4, fulcrum ball 2 is positioned at the below of two-dimension moving platform 7, and optical displacement sensor 4 represents to the distance of fulcrum ball 2 with Z, then known fulcrum ball summit (peak) is nearest apart from optical displacement sensor 4 is Z
min, only need measure thus and that is to say that peak just can determine the position of fulcrum ball 2 from the point that optical displacement sensor 4 is nearest.For a fulcrum ball 2, when scanning pattern is linear, profile is for circular.Therefore, the impact in order to reduce reading fluctuation adopts the profile of circle matching fulcrum ball 2.Optical displacement sensor is fixed an axial coordinate, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball 2 on this shifting axle direction, uses the same method and records another axial centre coordinate of this fulcrum ball 2; Use the same method and record the position coordinates of two other fulcrum ball 2.
As seen in figs. 5-6, along x to the profile of y to scanning survey fulcrum ball.For laser triangulation sensor, reading is the position based on the imaging center on the detector of the hot spot on testee.When along x to the summit of measurement fulcrum ball, hot spot on the detector light distribution can change along with x coordinate, produces larger error.And fulcrum ball profile peak slope is zero, sensor reading jumping effect is large, and distance center remotely, fulcrum ball profile slope is larger, same reading jumping effect is little, the precision at fulcrum ball center can be significantly improved by matching, as shown in Figure 5, need to adopt the mode of matching to eliminate interference.And during along y to the profile of scanning fulcrum ball, although there is no large reading change, still have the impact of beating, significantly can be improved the searching precision at fulcrum ball center by matching.
As Figure 7-9, step 2. in thin substrate position use optical displacement sensor measure, the positional information of thin substrate can be obtained by the coordinate fitting of thin substrate edge point.Therefore gordian technique is exactly determine marginal point 5 position of thin substrate, thin substrate 3 is positioned at the below of optical displacement sensor 4, optical displacement sensor is fixed an axial coordinate, thin substrate is scanned along another axle, point on thin substrate 3 represents to the distance Z ' of optical displacement sensor 4, during concrete enforcement, scan along X to thin substrate edge from thin substrate is more submarginal with optical displacement sensor 4, until scan non-metering outside edge, in order to eliminate the impact of sensor reading fluctuation, be straight line by thin substrate 3 surface fitting, the marginal point 5 of thin substrate 3 is the intersection point that thin substrate surface profile and edge contour are formed, measurement data is carried out to the least square fitting of boundary curve and surperficial straight line, boundary curve is as shown in the solid-line curve part in Fig. 8 and Fig. 9, surface straight line is strictly according to the facts shown in straight line portion, marginal point 5 is by the part that circle marks in Fig. 8 and Fig. 9, after obtaining multiple marginal point 5, edge point 5 carries out least square fitting, draw profile and the position of thin substrate.When marginal point 5 quantity is fewer, its precision is larger by the Accuracy of marginal point 5, for the thin substrate of circle, measure three with the position of up contour point 5, preferred measurement five is with up contour point 5, utilize the coordinate data of marginal point 5 to carry out Least Square Circle matching, draw the profile information of thin substrate, and its center position coordinates of reverse.For rectangle substrate, choose and measure two or more marginal point 5, carry out least squares line fitting, then choose lower while measure two or more marginal point 5 to carry out fitting a straight line, by that analogy.The model of this flat board is set up after determining in the position on each limit in finite element.Polygonal substrate method in like manner.
Step 2. in the thickness of thin substrate use optical displacement sensor to measure, first record the apex coordinate of fulcrum ball, then measure fulcrum ball place and place height after thin substrate, the difference in height of placing the height after thin substrate and fulcrum ball summit is the thickness of thin substrate;
Before the thin substrate of placement, an axial coordinate fixed by optical displacement sensor, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball on this shifting axle direction, is fixed on centre coordinate, along another axle scanning survey fulcrum ball profile by an axle of optical displacement sensor, Least Square Circle matching scanning profile, peak is fulcrum ball summit; Or the fulcrum ball profile of scanning survey more than two, carries out the matching of least square ball to measurement data, and be supported ball apex coordinate; Then measure fulcrum ball place and place height after thin substrate.
When measuring fulcrum ball summit, first x coordinate is fixed, fulcrum ball profile is obtained along y scanning direction fulcrum ball, the matching justified of outline data obtained is found out to the y coordinate of the strong point, then conversely, fixing y coordinate obtains another profile of fulcrum ball along x scanning direction fulcrum ball, use the same method and obtain the x coordinate of the strong point.After obtaining steel ball centre coordinate, fix a centre coordinate value, along another coordinate direction scanning fulcrum ball, utilize software matching to be supported ball peak height value.
When allowing thin substrate be positioned in plane, during substrate thickness thin by sensor measurement, due to the distortion of self, have space in the middle of thin substrate and reference planes, measuring error is larger.Generally adopt dual sensor to measure to improve precision prior art, two sensor locations, in the both sides of thin substrate, demarcate the distance of two sensors by the substrate of a standard thickness, then measure the thickness of thin substrate.Adopt this kind of method to need two sensors, add measurement cost, and need the substrate of standard thickness to demarcate, complex operation.Method in this patent, thin substrate is supported by three fulcrum balls, and both contact conditions are unique, there is not space, and only need single-sensor, without the need to the demarcation of standard thickness substrate.
As shown in figs. 10-12, be the example of a measurement twin polishing silicon chip.Figure 10 is the total deformation that equipment directly scans silicon chip and obtains, Figure 11 is the gravity additional deformation will calculated in fulcrum ball position and silicon wafer thickness and Position input finite element model, and Figure 12 is the silicon chip true strain obtained after total deformation deducts gravity additional deformation.As can be seen from Figure 10 and Figure 11 contrast, because silicon wafer thickness is less, gravity additional deformation is greater than silicon chip true strain, as shown in the scale of the upper right corner, about 40 microns of gravity additional deformation scope, and silicon chip true strain scope is less than 10 microns, the impact of gravity must be removed.After determining fulcrum ball position and silicon wafer thickness and position, after deducting gravity additional deformation, obtain the true strain of silicon chip.
The above; be only the present invention's preferably embodiment; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.
Claims (5)
1. eliminate a thin substrate deformation measuring method for gravity effect, described thin substrate is supported by three fulcrum balls, it is characterized in that: comprise the following steps:
1. by measuring the position determining three fulcrum balls;
2. thin substrate to be measured is positioned on three fulcrum balls, determines the thickness of thin substrate, position and profile information;
The positional information of three fulcrum balls 3. step 1. 2. recorded with step and the thickness of thin substrate, position and profile information input in finite element analysis software, carry out the emulation of gravity additional deformation, calculate gravity additional deformation;
4. scanning records the total deformation of thin substrate, and total deformation deducts the gravity additional deformation that 3. step calculates, and draws thin substrate true strain.
2. the thin substrate deformation measuring method of elimination gravity effect according to claim 1, it is characterized in that: 1. step uses optical displacement sensor to measure, optical displacement sensor is fixed an axial coordinate, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball on this shifting axle direction, uses the same method and records another axial centre coordinate of this fulcrum ball; Use the same method and record the position coordinates of two other fulcrum ball.
3. the thin substrate deformation measuring method of elimination gravity effect according to claim 1, it is characterized in that: step 2. in thin substrate position use optical displacement sensor measure, optical displacement sensor is fixed an axial coordinate, thin substrate is scanned along another axle, inner until outside non-metering from thin substrate, measurement data is carried out to the least square fitting of boundary curve and surperficial straight line, the intersection point of surface straight line and boundary curve is the marginal point of thin substrate, edge point carries out least square fitting, draws position and the profile of thin substrate.
4. the thin substrate deformation measuring method of elimination gravity effect according to claim 1, it is characterized in that: step 2. in thin substrate thickness use optical displacement sensor measure, first the apex coordinate of fulcrum ball is recorded, measure fulcrum ball place again and place height after thin substrate, the difference in height of placing the height after thin substrate and fulcrum ball summit is the thickness of thin substrate;
Before the thin substrate of placement, an axial coordinate fixed by optical displacement sensor, along another axle scanning survey fulcrum ball profile, Least Square Circle matching is carried out to outline data, circle centre coordinate is the centre coordinate of fulcrum ball on this shifting axle direction, is fixed on centre coordinate, along another axle scanning survey fulcrum ball profile by an axle of optical displacement sensor, Least Square Circle matching scanning profile, peak is fulcrum ball summit; Or the fulcrum ball profile of scanning survey more than two, carries out the matching of least square ball to measurement data, and be supported ball apex coordinate; Then measure fulcrum ball place and place height after thin substrate.
5. the thin substrate deformation measuring method of the elimination gravity effect according to Claims 2 or 3, is characterized in that: described optical displacement sensor is laser triangulation sensor, laser co-focusing sensor or white light confocal sensor.
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| CN106855395A (en) * | 2015-12-08 | 2017-06-16 | 中国航空工业第六八研究所 | A kind of optical detection evaluation method of silicon chip anode linkage technique deformation |
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| CN114467007A (en) * | 2019-10-11 | 2022-05-10 | 信越半导体株式会社 | Method for measuring wafer shape |
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