In concrete the enforcement, comprise that the array base palte of anode array also comprises:
The TFT rete 302 of 301 depositions on substrate, and the pixel electrode layer 303 that deposits on the TFT rete 302.Wherein, in the TFT rete 302, comprise the TFT zone of formation.In the TFT zone, be formed with source region, gate electrode, source electrode and drain electrode (not shown among Fig. 2 a).
Particularly, in TFT rete 302, the TFT zone comprises grid, active area, source area and the drain region of formation.Can adopt chemical vapor deposition method deposit thickness on active area is the gate insulation layer of 100nm ~ 150nm, the material of gate insulation layer can but to be not limited to be silicon dioxide or silicon nitride etc.After forming gate insulation layer, form grid by depositing operation and composition technology at the substrate that forms gate insulation layer.Wherein grid is positioned on the gate insulation layer of active area.Form after the grid, carry out doping process and handle, so that active area forms source area, active layer, drain region.On TFT rete 302, form pixel electrode rete 303 by depositing operation, then based on composition technology, form anode at pixel electrode rete 303, thereby form the array base palte that comprises anode array.
Preferably, setting forth the structure that originally comprises the anode array substrate below in conjunction with concrete accompanying drawing forms:
Shown in Fig. 2 b, TFT rete 302 is included in the polysilicon layer (not shown) of deposition on the substrate 301, and described polysilicon layer is carried out photoetching, etching technics processing according to required figure, is formed with source region 3021 and pixel electrode district 3022.
Shown in Fig. 2 c, by depositing operation and composition PROCESS FOR TREATMENT, form gate insulation layer 3023 at active area 3021.Wherein gate insulation layer can be silicon nitride or silicon dioxide.
Shown in Fig. 2 d, based on the composition PROCESS FOR TREATMENT, form grid 3024 at described substrate, the grid of formation is positioned on the gate insulation layer 3023 on the described active area 3021.Active area and the pixel electrode district that forms carried out the doping process processing, so that active area forms source area, active layer, drain region, described pixel electrode district forms pixel electrode layer.Wherein, described grid, active layer, source area and drain region constitute the TFT zone, and active layer is between source-drain electrode area.Formation comprises the array base palte of anode array.
Correspondingly, the invention process also proposes a kind of display device here, and this display device comprises the WOLED of the above-mentioned proposition of the embodiment of the invention.
The embodiment of the invention proposes the method for a kind of WOLED of manufacturing here, shown in Fig. 3 a, and concrete technological process such as following:
Step 21 forms the array base palte that comprises anode array based on composition technology at substrate, and forms colored optical filtering substrates based on composition technology.
Need to prove that in the technical scheme that the embodiment of the invention proposes, the described array base palte that comprises anode array is that example is described in detail with Thin Film Transistor (TFT) (TFT, Thin Film Transistor) array base palte here.And, in the technical scheme that the embodiment of the invention proposes here, only provide the main manufacturing process at the array base palte that comprises anode array, in concrete the enforcement, can make the array base palte that comprises anode array that the embodiment of the invention proposes here with reference to the manufacture method of tft array substrate in the prior art.
Wherein, the concrete technological process that forms the array base palte that comprises anode array is: shown in Fig. 3 b, form TFT rete 302 at substrate 301, wherein, in the TFT rete 302 that forms, comprise the TFT zone of formation.In the TFT zone, be formed with source region, gate electrode, source electrode and drain electrode (not shown among Fig. 3 a).
Particularly, in TFT rete 302, the TFT zone comprises grid, active area, source area and the drain region of formation.Can adopt chemical vapor deposition method deposit thickness on active area is the gate insulation layer of 100nm ~ 150nm, the material of gate insulation layer can but to be not limited to be silicon dioxide or silicon nitride etc.After forming gate insulation layer, form grid by depositing operation and composition technology at the substrate that forms gate insulation layer.Wherein grid is positioned on the gate insulation layer of active area.Form after the grid, carry out doping process and handle, so that active area forms source area, active layer, drain region.
On TFT rete 302, form pixel electrode rete 303 by depositing operation, then based on composition technology, form anode at pixel electrode rete 303, thereby form the array base palte that comprises anode array.
Particularly, described substrate can but to be not limited to be the substrate of arbitrary forms such as transparency carrier, ceramic substrate or metal substrate, in the technical scheme that the embodiment of the invention proposes here, this is not restricted.
Wherein, the manufacturing process of the colored optical filtering substrates that proposes in the manufacturing process of colored optical filtering substrates and the prior art is identical, and the embodiment of the invention repeats no more here.
Step 22, deposit transparent organic film and reflective metal film successively on the array base palte that forms.
Wherein, shown in Fig. 3 c, on the array base palte that comprises anode array that forms, deposit transparent organic thin film layer 304 and reflective metal film 305 successively.The material of transparent organic film 304 can but to be not limited to be acrylic based material or organic resin material.The thickness of the transparent organic film of deposition can be between 1um ~ 2.5um, preferably, can but to be not limited to be 1.5um or 2um.In the technical scheme that the embodiment of the invention proposes here, this is not limited, can change according to practical application request.
Particularly, the material of the reflective metal film 305 of deposition can be light reflectivity greater than 80%, thickness is the metallic diaphragm of 80nm ~ 500nm.This metallic diaphragm can but to be not limited to be metallic aluminium rete or argent rete.
Preferably, in the technical scheme that the embodiment of the invention proposes here, the material of the reflective metal film 305 of deposition is the argent rete with higher light reflectivity.
Step 23, the described reflective metal film of patterning is removed the metallic film of described anode electrode top.
Wherein, shown in Fig. 3 d, can carry out composition technologies such as mask, exposure, development, photoetching, etching to the reflective metal film 305 of deposition, remove the reflective metal film that is positioned at the anode electrode top.
Step 24 is the described transparent organic film of mask etching with the metallic film behind the described patterning, exposes described anode electrode, forms the pixel definition pattern.
Wherein, can adopt dry etching to remove transparent organic film directly over the described anode electrode, expose described anode electrode, form the pixel definition pattern.
Particularly, the profile of pixel defining layer 304 can be with reference to shown in Fig. 3 e, and pixel defining layer 304 covers the pixel electrode periphery.
Particularly, in step 23 ~ step 24, when carrying out patterned process, can adopt the mask plate with same pattern to handle accordingly.
Need to prove, in above-mentioned steps 23 ~ step 24, be a kind of preferably implementation that the embodiment of the invention proposes here.In concrete the enforcement, array base palte to after deposit transparent organic film and the reflective metal film successively can also adopt the mask plate with identical patterns, and transparent organic film and reflective metal film are carried out patterning together, expose anode electrode, form the pixel definition layer pattern.Or to the array base palte after deposit transparent organic film and the reflective metal film successively, adopt same mask plate, reflective metal film and transparent organic film to deposition carries out patterned process respectively, spills anode electrode cruelly, forms the pixel definition pattern.
Preferably, the mask plate that the patterning reflective metal film uses can but to be not limited to be the employed pixel defining layer mask plate of patterning pixel defining layer, also can be the mask plate with pixel definition layer pattern of additional customized.
Preferably, in the technical scheme that the embodiment of the invention proposes here, to the reflective metal film of deposition when carrying out patterning, employing be the pixel defining layer mask plate, can will use the quantity of mask plate less preferably like this, reduce the production cost of enterprise.
Step 25, evaporation organic light-emitting units and negative electrode successively on the array base palte that forms the pixel definition pattern.
Wherein, form the OLED device at the array base palte that forms the pixel definition pattern.Particularly, can adopt thin film deposition processes on the array base palte that forms the pixel definition pattern, to form hole transmission layer, organic luminous layer, electron transfer layer, OLED top electrodes successively, form the OLED device.
Shown in Fig. 3 f, on the array base palte that forms the pixel definition pattern, evaporation organic light-emitting units 306 and negative electrode 307 successively, thus form array base palte 401.
Particularly, the organic light-emitting units 306 of evaporation can be the white-light emitting unit.
Step 26, array base palte and the colored optical filtering substrates that will comprise organic light-emitting units and negative electrode are fitted, and form the WOLED display unit.
Wherein, as shown in Figure 4, with processings of fitting of the array base palte 401 that forms and colored optical filtering substrates 402, formation WOLED display unit.
Particularly, identical in the manufacturing process of colored optical filtering substrates and the prior art, the embodiment of the invention is no longer given unnecessary details here.
The technical scheme that adopts the embodiment of the invention to propose, the WOLED profile that forms as shown in Figure 5, owing to increased the metallic reflector with reflective function, thereby make the light that luminescence unit sends, arrive in the process of side direction colored optical filtering substrates, running into the metallic reflector with high reflectance is reflected as shown in Figure 5, thereby, even after applying, still there is the slit, also can reduce the side direction light leakage phenomena preferably, realize reducing the purpose of colour mixture, and then improved the image displaying quality of WOLED.
The technical scheme that adopts the embodiment of the invention to propose here, when making array base palte, by deposition layer of metal reflector, the feasible light that sends from organic light-emitting units, reach at a certain angle in the process of color membrane substrates, can be reflected by metallic reflector, thereby reduce WOLED side direction light leakage phenomena, realize reducing the purpose of colour mixture, improved display quality preferably.
Although described the preferred embodiments of the present invention, in a single day those skilled in the art get the basic creative concept of cicada, then can make other change and modification to these embodiment.So claims are intended to all changes and the modification that are interpreted as comprising preferred embodiment and fall into the scope of the invention.
Obviously, those skilled in the art can carry out various changes and modification to the present invention and not break away from the spirit and scope of the present invention.Like this, if of the present invention these are revised and modification belongs within the scope of claim of the present invention and equivalent technologies thereof, then the present invention also is intended to comprise these changes and modification interior.