In concrete enforcement, the array base palte comprising anode array also comprises:
The TFT rete 302 of deposition on 301 on substrate, and the pixel electrode layer 303 of deposition on TFT rete 302.Wherein, in TFT rete 302, comprise the TFT zone of formation.In TFT zone, be formed with source region, gate electrode, source electrode and drain electrode (not shown in Fig. 2 a).
Particularly, in TFT rete 302, TFT zone comprises the grid of formation, active area, source area and drain region.Can adopt chemical vapor deposition method on the active area deposit thickness be the gate insulation layer of 100nm ~ 150nm, the material of gate insulation layer can be, but not limited to be silicon dioxide or silicon nitride etc.After formation gate insulation layer, on the substrate forming gate insulation layer, form grid by depositing operation and patterning processes.Wherein grid is positioned on the gate insulation layer of active area.After forming grid, carry out doping process process, to make formation source area, active area, active layer, drain region.On TFT rete 302, form pixel electrode rete 303 by depositing operation, then based on patterning processes, pixel electrode rete 303 forms anode, thus form the array base palte comprising anode array.
Preferably, the structure composition originally comprising anode array substrate is set forth below in conjunction with concrete accompanying drawing:
As shown in Figure 2 b, TFT rete 302 is included in the polysilicon layer (not shown) of deposition on substrate 301, carries out photoetching, etching technics process, be formed with source region 3021 and pixel electrode district 3022 to described polysilicon layer according to required figure.
As shown in Figure 2 c, by depositing operation and patterning processes process, active area 3021 forms gate insulation layer 3023.Wherein gate insulation layer can be silicon nitride or silicon dioxide.
As shown in Figure 2 d, based on patterning processes process, form grid 3024 on the substrate, the grid of formation is positioned on the gate insulation layer 3023 on described active area 3021.Carry out doping process process to the active area formed and pixel electrode district, to make formation source area, active area, active layer, drain region, described pixel electrode district forms pixel electrode layer.Wherein, described grid, active layer, source area and drain region form TFT zone, and active layer is between source-drain electrode area.Form the array base palte comprising anode array.
Correspondingly, the invention process also proposes a kind of display device here, and this display device comprises the WOLED of the above-mentioned proposition of the embodiment of the present invention.
The embodiment of the present invention proposes a kind of method manufacturing WOLED here, and as shown in Figure 3 a, concrete technology flow process is as following:
Step 21, forms the array base palte comprising anode array on substrate based on patterning processes, and forms colored optical filtering substrates based on patterning processes.
It should be noted that, in the technical scheme that the embodiment of the present invention proposes here, described in comprise the array base palte of anode array, be described in detail for Thin Film Transistor (TFT) (TFT, ThinFilmTransistor) array base palte.And, in the technical scheme that the embodiment of the present invention proposes here, only provide the main manufacturing process for the array base palte comprising anode array, in concrete enforcement, the array base palte comprising anode array that the manufacture method that can refer to tft array substrate in prior art proposes here to manufacture the embodiment of the present invention.
Wherein, forming the concrete technology flow process comprising the array base palte of anode array is: as shown in Figure 3 b, substrate 301 forms TFT rete 302, wherein, in the TFT rete 302 formed, comprises the TFT zone of formation.In TFT zone, be formed with source region, gate electrode, source electrode and drain electrode (not shown in Fig. 3 a).
Particularly, in TFT rete 302, TFT zone comprises the grid of formation, active area, source area and drain region.Can adopt chemical vapor deposition method on the active area deposit thickness be the gate insulation layer of 100nm ~ 150nm, the material of gate insulation layer can be, but not limited to be silicon dioxide or silicon nitride etc.After formation gate insulation layer, on the substrate forming gate insulation layer, form grid by depositing operation and patterning processes.Wherein grid is positioned on the gate insulation layer of active area.After forming grid, carry out doping process process, to make formation source area, active area, active layer, drain region.
On TFT rete 302, form pixel electrode rete 303 by depositing operation, then based on patterning processes, pixel electrode rete 303 forms anode, thus form the array base palte comprising anode array.
Particularly, described substrate can be, but not limited to be the substrate of arbitrary forms such as transparency carrier, ceramic substrate or metal substrate, in the technical scheme that the embodiment of the present invention proposes here, is not restricted this.
Wherein, the manufacturing process of colored optical filtering substrates is identical with the manufacturing process of the colored optical filtering substrates proposed in prior art, and the embodiment of the present invention repeats no more here.
Step 22, deposit transparent organic film and reflective metal film successively on the array base palte formed.
Wherein, as shown in Figure 3 c, comprise on the array base palte of anode array what formed, successively deposit transparent organic film layer by layer 304 and reflective metal film 305.The material of transparent organic film 304 can be, but not limited to be acrylic based material or organic resin material.The thickness of the transparent organic film of deposition can between 1um ~ 2.5um, and preferably, can be, but not limited to is 1.5um or 2um.In the technical scheme that the embodiment of the present invention proposes here, this is not limited, can change according to practical application request.
Particularly, the material of the reflective metal film 305 of deposition can be that light reflectivity is greater than 80%, thickness is the metallic diaphragm of 80nm ~ 500nm.This metallic diaphragm can be, but not limited to be metallic aluminium rete or argent rete.
Preferably, in the technical scheme that the embodiment of the present invention proposes here, the material of the reflective metal film 305 of deposition is the argent rete with higher light reflectivity.
Step 23, reflective metal film described in patterning, removes the metallic film above described anode electrode.
Wherein, as shown in Figure 3 d, the patterning processes such as mask, exposure, development, photoetching, etching can be carried out to the reflective metal film 305 of deposition, remove the reflective metal film be positioned at above anode electrode.
Step 24, with the metallic film after described patterning for organic film transparent described in mask etching, exposes described anode electrode, forms pixel definition pattern.
Wherein, dry etching can be adopted to remove transparent organic film directly over described anode electrode, expose described anode electrode, form pixel definition pattern.
Particularly, the profile of pixel defining layer 304 can with reference to shown in Fig. 3 e, and pixel defining layer 304 covers pixel electrode periphery.
Particularly, in step 23 ~ step 24, when carrying out patterned process, the mask plate with same pattern can be adopted to process accordingly.
It should be noted that, in above-mentioned steps 23 ~ step 24, be the one preferably implementation that the embodiment of the present invention proposes here.In concrete enforcement, to the array base palte after deposit transparent organic film successively and reflective metal film, the mask plate with identical patterns can also be adopted, together with reflective metal film, patterning is carried out to transparent organic film, expose anode electrode, form pixel definition layer pattern.Or to the array base palte after deposit transparent organic film successively and reflective metal film, adopt same mask plate, respectively patterned process is carried out to the reflective metal film deposited and transparent organic film, cruelly spill anode electrode, form pixel definition pattern.
Preferably, the mask plate that patterned reflection metallic film uses can be, but not limited to be the pixel defining layer mask plate that patterned pixel definition layer uses, and also can be the mask plate with pixel definition layer pattern of additional customized.
Preferably, in the technical scheme that the embodiment of the present invention proposes here, when carrying out patterning to the reflective metal film of deposition, employing be pixel defining layer mask plate, like this can preferably by the quantity of few use mask plate, reduce the production cost of enterprise.
Step 25, evaporation organic light-emitting units and negative electrode successively on the array base palte forming pixel definition pattern.
Wherein, the array base palte forming pixel definition pattern forms OLED.Particularly, thin film deposition processes can be adopted on the array base palte forming pixel definition pattern to form hole transmission layer, organic luminous layer, electron transfer layer, OLED top electrodes successively, form OLED.
As illustrated in figure 3f, on the array base palte forming pixel definition pattern, evaporation organic light-emitting units 306 and negative electrode 307 successively, thus form array base palte 401.
Particularly, the organic light-emitting units 306 of evaporation can be white-light emitting unit.
Step 26, fits the array base palte and colored optical filtering substrates that comprise organic light-emitting units and negative electrode, forms WOLED display unit.
Wherein, as shown in Figure 4, the array base palte 401 of formation and colored optical filtering substrates 402 are carried out laminating process, form WOLED display unit.
Particularly, the manufacturing process of colored optical filtering substrates is identical with prior art, and the embodiment of the present invention no longer repeats here.
Adopt the technical scheme that the embodiment of the present invention proposes, the WOLED profile formed as shown in Figure 5, owing to adding the metallic reflector with reflective function, thus the light that luminescence unit is sent, arrive in the process of side direction colored optical filtering substrates, running into the metallic reflector with high reflectance is reflected back as shown in Figure 5, thus, even if still there is gap after laminating, also side direction light leakage phenomena can be reduced preferably, achieve the object reducing colour mixture, and then improve the image displaying quality of WOLED.
Adopt the technical scheme that the embodiment of the present invention proposes here, when making array base palte, by deposition layer of metal reflector, make the light sent from organic light-emitting units, reach at a certain angle in the process of color membrane substrates, can be returned by metal reflection layer reflects, thus reduce WOLED side direction light leakage phenomena, realize the object reducing colour mixture, improve display quality preferably.
Although describe the preferred embodiments of the present invention, those skilled in the art once obtain the basic creative concept of cicada, then can make other change and amendment to these embodiments.So claims are intended to be interpreted as comprising preferred embodiment and falling into all changes and the amendment of the scope of the invention.
Obviously, those skilled in the art can carry out various change and modification to the present invention and not depart from the spirit and scope of the present invention.Like this, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.