CN103265907A - Wear-resistant conductive adhesive composition - Google Patents
Wear-resistant conductive adhesive composition Download PDFInfo
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- CN103265907A CN103265907A CN 201310155414 CN201310155414A CN103265907A CN 103265907 A CN103265907 A CN 103265907A CN 201310155414 CN201310155414 CN 201310155414 CN 201310155414 A CN201310155414 A CN 201310155414A CN 103265907 A CN103265907 A CN 103265907A
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Abstract
The invention relates to the technical field of conductive adhesives, specifically to a wear-resistant conductive adhesive composition which is an improvement to the prior art. The wear-resistant conductive adhesive composition is composed of a wear resistance reinforcing agent, a conductive filling material, a diluent, a curing agent, a promoter, a plasticizer and a modified resin. Compared with the prior art, the invention has the following striking advantages: 1, addition of the wear resistance reinforcing agent enables wear resistance of a conductive adhesive to be substantially improved; and 2, a mechanical milling method is used for full mixing of the wear resistance reinforcing agent with the conductive filling material, so stability of the performances of the conductive adhesive is improved. The wear-resistant conductive adhesive composition provided by the invention is practical and has wide application prospects.
Description
Technical field
The present invention relates to the conductive resin technical field, is improvements over the prior art, is specifically related to a kind of wear-resistant conductive glue composition.
Background technology
Connect in the technology at traditional electronic product, the main employing has lead solder.Along with people to plumbous toxic understanding deeply and people to the growing interest of environment protection and self healthy aspect; there is lead solder to be substituted by lead-free brazing gradually, but lead-free brazing also the exists solder weldability is poorer, the more high industry of welding temperature can't overcome technical barrier.Along with the continuous development of adhesive technology, connect temperature conductive resin low, that connection reliability is high and the feature of environmental protection is good and more and more be subject to people's attention, be expected to become the main product of new generation that electronic product connects industry.But also there are shortcomings such as stability is not high, abrasion resistance properties is bad in present conductive resin, has limited conductive resin in wider application.
Summary of the invention
A kind of wear-resistant conductive glue composition that the objective of the invention is to avoid above-mentioned weak point of the prior art and provide.The interpolation of wear resistance toughener makes the present invention than prior art, has significantly improved the abrasion resistance properties of conductive resin; Adopt the mechanical ball milling method that wear resistance toughener and conductive filler material are fully mixed, be conducive to improve the stability of conductive adhesive performance.
Purpose of the present invention can realize by following measure:
A kind of wear-resistant conductive glue composition of the present invention, its ingredient weight percent (%) is:
Thinner 3 ~ 15%,
Solidifying agent 5 ~ 18%,
Promotor 0.01 ~ 0.15%,
Softening agent 0.05 ~ 0.8%,
Wear resistance toughener 8 ~ 18%,
Conductive filler material 20 ~ 65%,
All the other are modified resin, and each composition weight sum is 100%.
Described thinner is pimelinketone, acetone, methylethylketone, N-BUTYL ACETATE, vinyl acetic monomer, Virahol, propyl carbinol, Triethylene glycol, 2-ethyl-1, one or more in the 3-hexylene glycol.It mainly acts on is that the reduction viscosity is easy to use, and improves work-ing life.
Described solidifying agent is diaminodiphenyl-methane, 4,4 '-diamino-3,3 '-diethyl ditane, N-aminoethyl piperazine, 3-aminomethyl-3,5,5-trimethyl cyclohexylamine, 1, one or more among two (aminomethyl) hexanaphthenes of 3-, trimellitic anhydride, the tetrahydrotoluene tetracarboxylic dianhydride.It mainly acts on and is and prepolymer reaction, generates tridimensional network, improves the mechanical property of product.
Described promotor is one or more in 2,2-dithio-bis-benzothiazole, the trolamine.It mainly acts on is to accelerate curing reaction.
Described softening agent is one or more in m-phthalic acid dibutylester, dioctyl isophthalate, dibutyl terephthalate, the dioctyl terephthalate.It mainly acts on is the plasticity and toughness that improve after conductive resin solidifies, and improves the plasticity and toughness after conductive resin solidifies.
Described wear resistance toughener is one or more in manganese-titanium powder, tungsten-carbide powder, titanium carbide powder, nanometer tungsten carbide, nano titanium carbide, wolfram steel powder, alpha-silicon nitride powders, nano-silicon nitride, vanadium carbide powder, nano vanadium carbide powder, vanadium nitride powder, the nano vanadium nitride.It mainly acts on is the abrasion resistance properties that improves conductive resin, and plays electric action to a certain extent.
Described conductive filler material is one or more in silver powder, copper powder, nickel powder, silver-plated copper powder, silver-plated nickel powder, silver-coated copper powder, the silver-colored nickel coat powder.It mainly acts on is to provide conductivity for conductive resin.
Described modified resin is one or more in alkyd modified Resins, epoxy, acrylic modified epoxy resin, polyester modified epoxy resin, modifying epoxy resin by organosilicon, epoxy alkyd resin, silicone alkyd, acrylic acid modified alkyd resin, epoxy modified acrylic resin, organosilicon modified crylic acid resin, the alkyd modified acrylic resin.It mainly acts on and provides the required cohesive strength of conductive resin.
The preparation method of a kind of wear-resistant conductive glue composition of the present invention comprises following two steps:
(1) the abundant mixing of wear resistance toughener and conductive filler material: at first 8 ~ 18% wear resistance tougheners and 20 ~ 75% conductive filler materials are added in the ball mill of argon shield successively, ratio of grinding media to material is 6 ~ 10:1, rotating speed is 300 rev/mins ± 100 rev/mins, the ball milling time is 6 hours ± 1 hour, namely gets abundant mixed wear resistance toughener and conductive filler material;
(2) preparation of conductive resin: modified resin, 3 ~ 15% thinners, 5 ~ 18% solidifying agent, 0.01 ~ 0.15% promotor and 0.05 ~ 0.8% softening agent are added to are stirred in the vacuum mixer evenly successively, vacuum tightness is that 0.065 ~ 0.085 MPa, rotating speed are 300 rev/mins ± 100 rev/mins; Metal-powder behind the planetary ball mill that slow adding step (1) makes when stirring is stirred to evenly then, namely gets a kind of wear-resistant conductive glue composition.
Compared to existing technology, the present invention has following advantage: the one, and the interpolation of wear resistance toughener has significantly improved the abrasion resistance properties of conductive resin; The 2nd, adopt the mechanical ball milling method that wear resistance toughener and conductive filler material are fully mixed, improved the stability of conductive adhesive performance.Practicality of the present invention, application prospect is wide.
Embodiment
Embodiment 1: methylethylketone 3%,
Tetrahydrotoluene tetracarboxylic dianhydride 18%,
2,2-dithio-bis-benzothiazole 0.01%,
M-phthalic acid dibutylester 0.05%,
Tungsten-carbide powder 18%,
Silver powder 20%,
Alkyd modified Resins, epoxy 40.85%.
Preparation process: the abundant mixing of (1) wear resistance toughener and conductive filler material: at first 18% wolfram varbide and 20% silver powder are added in the planetary ball mill of argon shield successively, ratio of grinding media to material is 6:1, rotating speed is 300 rev/mins, and the ball milling time is 6 hours, namely gets the metal-powder behind the planetary ball mill; (2) preparation of conductive resin: successively with 40.85% alkyd modified Resins, epoxy, 3% methylethylketone, 18% tetrahydrotoluene tetracarboxylic dianhydride, 0.01%2,2-dithio-bis-benzothiazole and 0.05% m-phthalic acid dibutylester are added to and are stirred in the vacuum mixer evenly, and vacuum tightness is that 0.075 MPa, rotating speed are 300 rev/mins; When stirring, slowly add abundant mixed tungsten-carbide powder and the silver powder that step (1) makes then, be stirred to evenly, namely get a kind of wear-resistant conductive glue composition.
Embodiment 2: N-BUTYL ACETATE 8%,
N-aminoethyl piperazine 10%,
2,2-dithio-bis-benzothiazole 0.08%,
Dioctyl terephthalate 0.5%,
Vanadium carbide powder 8%,
Nano vanadium carbide powder 7%,
Silver-plated copper powder 40%,
Silver powder 10%,
Epoxy modified acrylic resin 16.42%.
Preparation process: the abundant mixing of (1) wear resistance toughener and conductive filler material: at first 8% vanadium carbide powder, 7% nano vanadium carbide powder, 40% silver-plated copper powder and 10% silver powder are added in the planetary ball mill of argon shield successively, ratio of grinding media to material is 6:1, rotating speed is 300 rev/mins, the ball milling time is 6 hours, namely gets the metal-powder behind the planetary ball mill; (2) preparation of conductive resin: successively with 16.42% epoxy modified acrylic resin, 8% N-BUTYL ACETATE, 10%N-aminoethyl piperazine, 0.08%2,2-dithio-bis-benzothiazole and 0.5% dioctyl terephthalate are added to and are stirred in the vacuum mixer evenly, and vacuum tightness is that 0.075 MPa, rotating speed are 300 rev/mins; When stirring, slowly add abundant mixed vanadium carbide powder, nano vanadium carbide powder and the silver powder that step (1) makes then, be stirred to evenly, namely get a kind of wear-resistant conductive glue composition.
Embodiment 3: N-BUTYL ACETATE 15%,
Tetrahydrotoluene tetracarboxylic dianhydride 5%,
Trolamine 0.15%,
Dibutyl terephthalate 0.8%,
Nano vanadium nitride 8%,
Silver-plated nickel powder 65%,
Modifying epoxy resin by organosilicon 6.05%.
Preparation process: the abundant mixing of (1) wear resistance toughener and conductive filler material: at first 8% nano vanadium nitride and 65% silver-plated nickel powder are added in the planetary ball mill of argon shield successively, ratio of grinding media to material is 6:1, rotating speed is 300 rev/mins, the ball milling time is 6 hours, namely gets the metal-powder behind the planetary ball mill; (2) preparation of conductive resin: 6.05% modifying epoxy resin by organosilicon, 15% N-BUTYL ACETATE, 5% tetrahydrotoluene tetracarboxylic dianhydride, 0.15% trolamine and 0.8% dibutyl terephthalate are added to are stirred in the vacuum mixer evenly successively, vacuum tightness is that 0.075 MPa, rotating speed are 300 rev/mins; When stirring, slowly add abundant mixed nano vanadium nitride and the silver powder that step (1) makes then, be stirred to evenly, namely get a kind of wear-resistant conductive glue composition.
Table 1 is the salient features test correlation data of embodiment of the invention 1-3 and a commercially available conductive resin.
The salient features comparison of test results data of table 1 embodiment 1-3
Claims (8)
1. wear-resistant conductive glue composition, its ingredient weight percent (%) is:
Thinner 3 ~ 15%,
Solidifying agent 5 ~ 18%,
Promotor 0.01 ~ 0.15%,
Softening agent 0.05 ~ 0.8%,
Wear resistance toughener 8 ~ 18%,
Conductive filler material 20 ~ 65%,
All the other are modified resin, and each composition weight sum is 100%.
2. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described thinner is pimelinketone, acetone, methylethylketone, N-BUTYL ACETATE, vinyl acetic monomer, Virahol, propyl carbinol, Triethylene glycol, 2-ethyl-1, one or more in the 3-hexylene glycol.
3. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described solidifying agent is diaminodiphenyl-methane, 4,4 '-diamino-3,3 '-diethyl ditane, N-aminoethyl piperazine, 3-aminomethyl-3,5,5-trimethyl cyclohexylamine, 1, one or more among two (aminomethyl) hexanaphthenes of 3-, trimellitic anhydride, the tetrahydrotoluene tetracarboxylic dianhydride.
4. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described promotor is one or more in 2,2-dithio-bis-benzothiazole, the trolamine.
5. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described softening agent is one or more in m-phthalic acid dibutylester, dioctyl isophthalate, dibutyl terephthalate, the dioctyl terephthalate.
6. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described wear resistance toughener is one or more in manganese-titanium powder, tungsten-carbide powder, titanium carbide powder, nanometer tungsten carbide, nano titanium carbide, wolfram steel powder, alpha-silicon nitride powders, nano-silicon nitride, vanadium carbide powder, nano vanadium carbide powder, vanadium nitride powder, the nano vanadium nitride.
7. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described conductive filler material is one or more in silver powder, copper powder, nickel powder, silver-plated copper powder, silver-plated nickel powder, silver-coated copper powder, the silver-colored nickel coat powder.
8. a kind of high-temperature resistant conducting glue according to claim 1, it is characterized in that: described modified resin is one or more in alkyd modified Resins, epoxy, acrylic modified epoxy resin, polyester modified epoxy resin, modifying epoxy resin by organosilicon, epoxy alkyd resin, silicone alkyd, acrylic acid modified alkyd resin, epoxy modified acrylic resin, organosilicon modified crylic acid resin, the alkyd modified acrylic resin.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 201310155414 CN103265907A (en) | 2013-04-29 | 2013-04-29 | Wear-resistant conductive adhesive composition |
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| CN 201310155414 CN103265907A (en) | 2013-04-29 | 2013-04-29 | Wear-resistant conductive adhesive composition |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103881610A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Conductive adhesive and preparation method thereof |
| CN104893630A (en) * | 2015-05-05 | 2015-09-09 | 深圳市嘉瑞俊新材料科技有限公司 | Liquid silkscreen conducting resin and preparation method thereof |
| CN105440960A (en) * | 2015-11-23 | 2016-03-30 | 苏州盖德精细材料有限公司 | Acrylate screw glue and preparation method thereof |
| CN106756172A (en) * | 2016-12-16 | 2017-05-31 | 安徽宝恒新材料科技有限公司 | A kind of preparation method of ternary metal self-lubricating composite |
| CN110268030A (en) * | 2017-03-28 | 2019-09-20 | 东洋纺株式会社 | Polyester adhesive composition containing carboxylic acid group |
| US10550295B2 (en) * | 2013-12-26 | 2020-02-04 | Hitachi Chemical Company, Ltd. | Film for temporary fixing, film sheet for temporary fixing and semiconductor device |
| TWI738173B (en) * | 2020-01-07 | 2021-09-01 | 翌驊實業股份有限公司 | Conductive glue for shingled solar module, conductive film, and manufacturing process of p-series solar module using conductive film |
-
2013
- 2013-04-29 CN CN 201310155414 patent/CN103265907A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10550295B2 (en) * | 2013-12-26 | 2020-02-04 | Hitachi Chemical Company, Ltd. | Film for temporary fixing, film sheet for temporary fixing and semiconductor device |
| CN103881610A (en) * | 2014-03-10 | 2014-06-25 | 苏州捷德瑞精密机械有限公司 | Conductive adhesive and preparation method thereof |
| CN104893630A (en) * | 2015-05-05 | 2015-09-09 | 深圳市嘉瑞俊新材料科技有限公司 | Liquid silkscreen conducting resin and preparation method thereof |
| CN105440960A (en) * | 2015-11-23 | 2016-03-30 | 苏州盖德精细材料有限公司 | Acrylate screw glue and preparation method thereof |
| CN106756172A (en) * | 2016-12-16 | 2017-05-31 | 安徽宝恒新材料科技有限公司 | A kind of preparation method of ternary metal self-lubricating composite |
| CN110268030A (en) * | 2017-03-28 | 2019-09-20 | 东洋纺株式会社 | Polyester adhesive composition containing carboxylic acid group |
| CN110268030B (en) * | 2017-03-28 | 2021-12-28 | 东洋纺株式会社 | Polyester-based adhesive composition containing carboxylic acid group |
| TWI738173B (en) * | 2020-01-07 | 2021-09-01 | 翌驊實業股份有限公司 | Conductive glue for shingled solar module, conductive film, and manufacturing process of p-series solar module using conductive film |
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130828 |