Accurate conductive adhesive film cutter sweep
Technical field
The present invention relates to the technical field of transmission mechanism, relate in particular to a kind of for the accurate cutter sweep on the automatic production line.
Background technology
In the manufacturing automated production process of tradition, a lot of occasions all need to use clamp mechanism cuts and cuts, to finish some the necessary operations in the manufacture process.
In the prior art, on production line ACF glue conducting film is cut when cutting, referring to Fig. 1, adopted the vertical cut pattern to cut usually and cut, namely cutting knife moving slide board 1' becomes an angle of 90 degrees to move upward.Can take ACF glue 12' when the edge of a knife of cutting knife 2' out of when breaking away from conducting film, make ACF glue 12' produce wrinkle and peel off, it is bad to cause fitting, and product percent of pass is poor.In addition, the gap between existing cutting knife 2' and the cutting knife baffle plate 4' is to regulate by screw rod, and degree of regulation is low, can only be at 0.05MM, and do not have scale and indicate bad control cutter location.Cause cutting knife to cut off ACF strip 13' sometimes during the accent machine, cut again sometimes less than ACF glue 12', automaticity is poor, and production efficiency is low.
Summary of the invention
The invention provides a kind of accurate conducting film cutter sweep, being intended to solve vertical cut pattern of the prior art is easy to product is cut bad problem, the cutting knife of this cutter sweep adopts the mode of cutting sth. askew to cut and cuts, and can not cause any damage to product in cutting the process of cutting, and effectively enhances productivity.
Technical scheme of the present invention is: a kind of accurate conducting film cutter sweep, comprise base plate, and described base plate is provided with cutting knife movable block, dynamical element and is driven and can be driven the cylinder system of described cutting knife movable block motion by this dynamical element; The direction of motion of described cutting knife movable block and the angle between the horizontal plane are acute angle.Because cutting knife adopts the mode of cutting sth. askew that conducting film is cut, make the edge of a knife when breaking away from ACF glue, can not take ACF glue out of.
The present invention can do following improvement, and described base plate comprises horizontal base plate and vertical base plate, and described cylinder is the front of being located at described vertical base plate, and the back side of described vertical base plate is provided with the high accuracy guide rail suitable with the cutting knife movable block.
Cutting knife movable block of the present invention comprises cutting knife and can do the cutting knife moving slide board of diagonal movement at the described high accuracy guide rail in drive lower edge of cylinder system.
The present invention can also do following improvement, and described cutting knife is located at the top of cutting knife moving slide board, and the outside, the bottom of described cutting knife moving slide board is provided with the inclined-plane perpendicular with described high accuracy guide rail, this inclined-plane be provided with for link to each other with described cylinder system from dynamic pressure plate.
Cutting knife moving slide board of the present invention top is provided with the cutting knife level governor for fixed cutting tool.
The present invention can also be further improved, and the top of described vertical base plate is provided with horizontally disposed cutting knife baffle plate, described also being provided with from the dynamic pressure plate for the differential head of regulating gap between cutting knife and the cutting knife baffle plate.Because the differential head is provided with detailed scale, the adjustment process simple and convenient can accurately be regulated the cutting knife gap, thereby guarantees machining accuracy.
Cylinder of the present invention system is provided with floating junction with described between the dynamic pressure plate, and it is more smooth that cutting knife is moved.
The direction of motion of cutting knife movable block of the present invention and the angle between the horizontal plane are 25~35 degree angles.
The invention has the beneficial effects as follows:
Accurate conducting film cutter sweep of the present invention, novel structure, practical, the cutting mechanism that production lines is united has carried out improvement in essence, the automaticity height, controllability is good, and is easy to operate, quick, enhances productivity greatly.
(1) accurate conducting film cutter sweep of the present invention, the blade movement track in the mechanism is oblique line, the sizing zoning when effectively having avoided mechanism to reset, and then guaranteed the applying quality of product.
(2) accurate conducting film cutter sweep of the present invention, transmission of power between the cutting knife movable block is regulated by cylinder system realization dynamical element and level is not because can there be the gap in the cooperation between the slide block, so can effectively avoid the cutting knife shake, can accurately locate the machining accuracy height to the cutting knife progress.
(3) accurate conducting film cutter sweep of the present invention, the governor motion of cutting knife movement velocity is designed to exposed, the convenient adjusting, at grade, can regulate cutting knife and move with respect to base left and right sides straight line, also can carry out the front and back fine setting, to satisfy actual process requirements.
Description of drawings
Fig. 1 is that the master of ACF cutter of the prior art looks schematic diagram;
Fig. 2 is that the master of the accurate conducting film cutter sweep that provides of the embodiment of the invention looks schematic diagram;
Fig. 3 is that the axle of the accurate conducting film cutter sweep that provides of the embodiment of the invention is surveyed one of schematic diagram;
Fig. 4 is that the axle of the accurate conducting film cutter sweep that provides of the embodiment of the invention is surveyed two of schematic diagram.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explaining the present invention, and be not used in restriction the present invention.
Below in conjunction with concrete accompanying drawing realization of the present invention is described in detail.
The specific embodiment of the present invention such as Fig. 2-shown in Figure 4, a kind of accurate conducting film cutter sweep, comprise base plate 5, base plate 5 is used for fixing whole cutter sweep in board equipment, and base plate 5 is provided with cutting knife movable block, dynamical element and is driven and can be driven the cylinder system of cutting knife movable block motion by this dynamical element; The direction of motion of cutting knife movable block and the angle between the horizontal plane are acute angle.Owing to adopt the mode of cutting sth. askew to cut, make the edge of a knife when breaking away from ACF glue 12, can not take ACF glue 12 out of, the sizing zoning when effectively having avoided mechanism to reset.
In the present embodiment, base plate 5 comprises horizontal base plate and vertical base plate, and cylinder system is located at the front of vertical base plate, and vertically the back side of base plate is provided with the high accuracy guide rail 6 suitable with the cutting knife movable block.The cutting knife movable block comprises cutting knife 2 and can do the cutting knife moving slide board 1 of diagonal movement at the drive lower edge high accuracy guide rail 6 of cylinder system.Cutting knife 2 is located at the top of cutting knife moving slide board 1, and the outside, the bottom of cutting knife moving slide board 1 is provided with the inclined-plane perpendicular with high accuracy guide rail 6, this inclined-plane be provided with for link to each other with cylinder system from dynamic pressure plate 7.Should be provided with two binding faces that are mutually the right angle from dynamic pressure plate 7, two binding faces respectively with the cutting knife movable plate on inclined-plane and the back side suitable.Cutting knife moving slide board 1 top is provided with the cutting knife level governor 8 for fixed cutting tool 2.Vertically the top of base plate is provided with horizontally disposed cutting knife baffle plate 4, also is provided with for the differential head 9 of regulating gap between cutting knife 2 and the cutting knife baffle plate 4 from dynamic pressure plate 7.Be that gap between cutting knife 2 and the cutting knife baffle plate 4 is regulated by turn differential head 9, the gap precision of regulating can reach 0.001MM, the about 0.15MM of ACF strip 13 thickness, the about 0.05MM of the thickness of ACF glue 12, thus guarantee can not to cut off ACF strip 13 when cutting knife 2 cuts off ACF glue 12.Differential head 9 is provided with limited screw 14.Cylinder is and is provided with floating junction 10 between the dynamic pressure plate 7.
In the present embodiment, the direction of motion of cutting knife movable block and the angle between the horizontal plane are 25~35 degree angles, can be according to the instructions for use flexible design.In the present embodiment, the direction of motion of cutting knife movable block and the angle between the horizontal plane are 30 degree angles.
In the above embodiments, cylinder system can be rotating disk cylinder system, Rodless cylinder system or slide unit cylinder system.Dynamical element is choke valve, and choke valve is installed on the base plate 5 by choke valve holder 11.This dynamical element also can be the dynamical element of other form.
The above embodiments only are the preferred embodiments of the present invention, can not limit interest field of the present invention with this, and therefore, the equivalent variations according to the present patent application claim is done still belongs to the scope that the present invention is contained.