CN103240833B - The method of molded integrated circuit - Google Patents
The method of molded integrated circuit Download PDFInfo
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- CN103240833B CN103240833B CN201210326320.7A CN201210326320A CN103240833B CN 103240833 B CN103240833 B CN 103240833B CN 201210326320 A CN201210326320 A CN 201210326320A CN 103240833 B CN103240833 B CN 103240833B
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Abstract
The invention provides a kind of method, be included in molded polymer on package parts.Molding process is included in the first moulding phases that the first temperature place implements, and at the second moulding phases that the second temperature place being different from the first temperature implements.Present invention also offers the method for molded integrated circuit.
Description
The cross reference of related application
This application claims the name submitted on February 14th, 2012 and be called that the patent application serial numbers of " MethodforMoldingProcess " is the priority of the U.S. Patent application of the following interim submission of 61/598,567, its full content is hereby expressly incorporated by reference.
Technical field
Relate generally to technical field of semiconductors of the present invention, more specifically, relates to the method for molded integrated circuit.
Background technology
Molded is the technology of a kind of conventional Protective IC device from external environment.In typical molding process, moulding compound spreads out on the device that will be molded.Mould is used for restriction and finishing die plastics.Then, solidify and solidify moulding compound, moving moulds subsequently and leave moulding compound.
When molded large-scale integrated circuit components (such as, wafer), bubble can be caught in moulding compound.This is usually caused by the high viscosity of moulding compound, and moulding compound fails to flow to all regions that will be molded.When change of atmospheric pressure, due to the existence of bubble, in mold encapsulated piece installing, stress can be produced.Such as, after molded device, need in vacuum environment, implement some processing steps.Such as, these processing steps comprise chemical vapor deposition (CVD), PVD (PVD) etc.Due to the pressure reduction that bubble is inside and outside, bubble result in the stress in mold encapsulated piece installing.Stress can cause thin wafer to break.In addition, bubble also can cause warpage degree higher in mold encapsulated piece installing.
Summary of the invention
In order to solve defect existing in prior art, according to an aspect of the present invention, provide a kind of method, comprising: molded polymer on package parts, wherein, molding process comprises: the first moulding phases implemented with the first temperature; And with the second moulding phases that the second temperature being different from described first temperature is implemented.
In the method, described first temperature is lower than the gelling temp of described polymer, and described second temperature is higher than the described gelling temp of described polymer.
In the method, described molding process comprises further: spread out by described polymer on described package parts; Use polymer described in mold compresses to spread out described polymer, wherein, from very first time of described mould and described polymer contact point in the time cycle that described polymer is terminated by the second time point spread out completely, described mould maintains described first temperature or lower than described first temperature; And after described polymer is spread out completely, by described mold heated to described second temperature.
The method comprises further, after described second moulding phases, when not moving described mould and leaving described polymer, cool described polymer.
In the method, implement to cool the step of described polymer in the pipeline that is built in described mould by being guided to by cooling agent.
In the method, described second temperature is than the temperature difference of high more than about 2 DEG C of described first temperature.
In the method, during described first moulding phases, the first electric current is conducted to the heating element heater in mould, described mould is for heating described polymer, and during described second moulding phases, the second electric current higher than described first electric current is conducted to described heating element heater.
According to a further aspect in the invention, provide a kind of method, comprising: molded polymer on package parts, wherein, described polymer has gelling temp, and molding process comprises: implement the first molding process with the first temperature lower than described gelling temp; And after described first molding process, implement the second molding process with the second temperature higher than described gelling temp.
The method comprises further: spread out by described polymer on described package parts; And use mold to press described polymer to spread out described polymer, described first molding process is located to terminate by the time of the second time point spread out completely from the very first time point place of described mold and described polymer contact and being no earlier than described polymer, and described second molding process starts after spreading out completely at described polymer.
The method comprises further: when enforcement described second molding process after and when not moving described mold and leaving described polymer, cool described polymer.
In the method, implement to cool the step of described polymer in the pipeline that is built in described mold by being guided to by cooling agent.
In the method, described second temperature is than the temperature difference of high more than about 2 DEG C of described first temperature.
In the method, during described first molding process, the first electric current is conducted to the heating element heater in mold, described mold is used for keeping and heating described polymer, and during described second molding process, the second electric current higher than described first electric current is conducted to described heating element heater.
The method comprises further: move down in described second temperature the mould employed in implementing molding process and leave described polymer.
According to another aspect of the invention, provide a kind of method, comprising: use mould at package parts patrix molding plastics, wherein, described mould comprises the heating element heater for heating described mould, and molding process comprises: spread out by described moulding compound on described package parts; First electric current is supplied to described heating element heater to be maintained at a first temperature by described mould; When described mould is in described first temperature, press described mould to spread out described moulding compound above described package parts towards described moulding compound; And after pressing step, the second electric current higher than described first electric current is supplied to described heating element heater so that the temperature of described mould is increased to the second temperature.
In the method, described moulding compound has gelling temp, and described first temperature is lower than described gelling temp, and described second temperature is higher than described gelling temp.
The method comprises the 3rd temperature temperature of described mould being adjusted to and being different from described first temperature and described second temperature further.
In the method, described 3rd temperature is lower than described first temperature and described second temperature, and the step temperature of described mould being adjusted to described 3rd temperature comprises and provides cooling agent to cool described mould to described mould.
In the method, after described moulding compound is fully cured, the step temperature of described mould being adjusted to described 3rd temperature is implemented.
In the method, described 3rd temperature is higher than described first temperature and described second temperature.
Accompanying drawing explanation
In order to understand embodiment and advantage thereof better, now by following description carried out by reference to the accompanying drawings as a reference, wherein:
Fig. 1 to Fig. 3 is the cross-sectional view in the interstage according to some exemplary embodiment mold encapsulated piece installings;
Fig. 4 shows viscosity and the storage modulus (storagemodulus) of the moulding compound of the function as temperature; And
Fig. 5 to Fig. 9 shows the various exemplary temperature curve of the molding process according to embodiment.
Detailed description of the invention
Below be discussed in detail manufacture and the use of the embodiment of the present invention.But should be appreciated that, embodiment provides many applicable creative concepts that can realize in various specific environment.The specific embodiment discussed is only illustrative, and does not limit scope of the present invention.
Many temperature molding process is provided according to various exemplary embodiment.Show the interstage of molding process.Discuss the modified example of embodiment.In each accompanying drawing and all illustrative embodiment, identical reference number is used to specify identical element.
Fig. 1 to Fig. 3 shows the cross-sectional view in the interstage according to some exemplary embodiment molded package parts 20.Package parts 20 comprise the package parts 26 being engaged to package parts 22.In certain embodiments, package parts 22 are device wafers, and it can be the semiconductor crystal wafer with the integrated circuit be formed in wherein.In an alternative embodiment, package parts 22 are middle wafers, and it is not included in the active device of such as resistor wherein.When package parts 22 are middle wafers, these package parts can comprise or can not included in passive device wherein.In these embodiments, middle wafer can comprise the through hole (not shown) that electrical interconnection is positioned at the conductive component on package parts 22 opposite side.In another embodiment, package parts 22 are package substrate (such as laminated substrates).
Package parts 26 can be component pipe core, packaging part etc.Bottom filler 24 can be filled in the gap between package parts 26 and package parts 22.Polymer 28 spreads out on package parts 22 and/or 26.In certain embodiments, polymer 28 spreads out above the central part of package parts 20.Polymer 28 can be moulding compound, molded bottom filler, resin etc.At this moment, polymer 28 not solidification.
With reference to figure 2, mould 30 is for molded polymer 28 on package parts 20.In certain embodiments, mould 30 comprises mold 30A and bed die 30B.In an alternative embodiment, mold 30A can be used and not use bed die 30B to implement to be molded.In an illustrated embodiment, package parts 20 are placed on bed die 30B.Polymer 28 spreads out on package parts 20.Then, towards polymer 28 pressing mold 30A downwards.Therefore, as shown in Figure 3, polymer 28 is squeezed into side, and spreads out above whole package parts 20.In molding process, mould 30 is also for keeping and shaped polymer 28.Polymer 28 fills the gap between package parts 26, and may further include the part be positioned at above package parts 26.
Should be appreciated that, mould 30 can have various shape, and has the various methods spreading out polymer 28.Such as, in certain embodiments, first, package parts 20 are placed on bed die 30B.Then, mold 30A is placed on bed die 30B.Mold 30A and bed die 30B defines space, and wherein, package parts 22 are placed within this space.Then, polymer 28 is spread out in the space limited by mold 30A and bed die 30B.
Refer again to Fig. 2, mould 30 is included in heating element heater 32 wherein.Heating element heater 32 is configured to mould 30 to be heated to preferred temperature.Heating element heater 32 is connected to power supply unit 33 further, and this power supply unit is configured to regulate and supply suitable electric current, makes heating element heater 32 mold heated 30 can be arrived preferred temperature.Such as, heating element heater 32 can comprise coil.In addition, heating element heater 32 can be embedded in mold 30A and bed die 30B any one or both in.
In addition, as shown in Figures 2 and 3, cooling element 34 also can be formed in mould 30.Cooling element 34 is configured to mould 30 to be cooled to preferred temperature.Cooling element 34 is connected to cooling device 36 further, and this cooling device is configured to provide cooling agent to cooling element 34.Such as, cooling element 34 can comprise coiled pipe, and this coiled pipe is connected to cooling device 36 and receives the cooling agent of self-cooling set 36.In certain embodiments, cooling device 36 comprises compressor, or comprises the storeroom for storing cooling agent.Cooling agent can be oil, water, compressible gas etc.In addition, cooling element 34 can be embedded in or be attached in mold 30A and bed die 30B any one or or both.
Fig. 4 shows viscosity and the storage modulus of the exemplary polymer 28 illustrated in figs. 2 and 3, and wherein, viscosity and storage modulus are shown as the function of temperature.Left Y-axis mark viscosity, corresponding to the point being labeled as 40.Right Y-axis mark storage modulus, corresponding to the point being labeled as 38.Polymer 28 has gelling temp Tgp (also known as gel point), and gelling temp significantly increases along with temperature raises in the viscosity higher than polymer 28 when this gelling temp.But, when lower than gelling temp Tgp, such as, keep substantially consistent in the temperature range of viscosity between room temperature (about 21 DEG C) and gelling temp.
In addition, as shown in Figure 4, when the temperature of polymer 28 is equal to or less than gelling temp Tgp, the storage modulus (right Y-axis) of polymer 28 can be lower.When higher than gelling temp Tgp, the storage modulus of polymer 28 significantly increases along with the rising of temperature, this means when the temperature of polymer 28 is higher than gelling temp Tgp, and polymer 28 starts solidification.Therefore, when lower than gelling temp Tgp, such as, when being pressed by mold 30A (Fig. 2), the shape of polymer 28 can be changed easily.In addition, due to when polymer 28 temperature lower than or when being in gelling temp Tgp the viscosity of polymer 28 lower, so be in or be easy to lower than polymer 28 during gelling temp Tgp flowing when polymer 28.On the contrary, when higher than gelling temp Tgp, when the temperature of polymer 28 raises, the flowing of polymer 28 is more and more difficult.
Fig. 5 shows the exemplary temperature curve of mould 30 and polymer 28, and wherein, temperature curve is corresponding to the moulding phases in the process be molded into by polymer 28 (Fig. 2 and Fig. 3) on package parts 20.Function as the time shows the temperature of mould 30 and polymer 28.Should be appreciated that, the temperature of polymer 28 is slightly different from the temperature of mould 30.But difference is significantly to being enough to the characteristic changing causing polymer 28.In addition, along with some penetration periods, the temperature difference between polymer 28 and mould 30 can be reduced further.Therefore, in describing, suppose that the temperature of polymer 28 is identical with the temperature of mould 30 in the whole text.
According to some embodiments, at time point TP0, the temperature of mould 30 and polymer 28 is in the T1 place lower than gelling temp Tgp.As shown in Figure 2, time point TP0 can be that mould 30 (such as, mold 30A) is in the time point with the state of polymer contact.But at this time point place, polymer 28 does not also spread out fully above whole package parts 22.The shape of polymer 28 neither polymer 28 net shape that will be cured as.
To during just in time spreading out time cycle that polymer 28 terminates completely contacting from mold 30A with polymer 28, the temperature T1 of mould 30 can keep below gelling temp Tgp.Temperature T1 can be maintained in the time period of the additional time period of temperature after polymer 28 spreads out completely of mould 30.In some exemplary embodiments, temperature T1 is between about 25 DEG C and about 100 DEG C.As shown in Figure 5, for the temperature difference Δ T1 of (Tgp-T1) can be greater than about 0.5 DEG C, or about 1 DEG C is greater than.Such as, temperature T1 also can keep substantially consistent within the time period of being longer than about 30 seconds.Be time point TP1 place after polymer 28 spreads out completely, the temperature of mould 30 is increased to the temperature T2 higher than gelling temp Tgp.In some exemplary embodiments, temperature T2 is between about 100 DEG C and about 250 DEG C.
The maintenance of mould 30 at temperature T1 and T2 and the rising of mould 30 temperature is realized suitable electric current to be conducted to heating element heater 32 by controlling electric supply installation 33 (Fig. 2 and Fig. 3).Therefore, for mould 30/ polymer 28 being heated to the electric current of the second temperature T2 higher than electric current mould 30/ polymer 28 being heated to the first temperature T1.While heating mould 30, cooling device 36 (Fig. 2 and Fig. 3) turns off the flowing of cooling agent to cooling element 34.
In certain embodiments, as shown in Figure 3, after mold 30A contacts with package parts 22 or bed die 30B, time of occurrence point TP1.Time point TP1 is also after polymer 28 spreads out completely.In certain embodiments, during the whole time cycle by mould 30 shaped polymer 28, the temperature of mould 30 can keep below gelling temp Tgp.Therefore, polymer 28 is also in the temperature place lower than gelling temp Tgp, and therefore polymer 28 is easy to flowing, and reduces the chance at polymer 28 trapped inside bubble.
Temperature T2 higher than gelling temp Tgp is high enough to cure polymer 28.According to some embodiments, for the temperature difference Δ T2 of (T2-Tgp) is greater than about 0.5 DEG C, and about 1 DEG C can be greater than.In addition, such as, for the temperature difference Δ T3 of (T2-T1) can be greater than about 3 DEG C, and about 5 DEG C can be greater than.After the time cycle, and at time point TP2 place, complete the solidification of polymer 28, polymer 28 is solidified.Then, can move moulds and 30 leave package parts 20 and polymer 28 (Fig. 3).In certain embodiments, move moulds 30 leave polymer 28 time, mould 30 is still in temperature T2 place.
Fig. 6 to Fig. 9 shows the temperature curve of polymer 28 according to embodiment and/or mould 30.Unless otherwise stated, the temperature in these embodiments can be similar in the embodiment shown in fig. 5 by temperature that same reference numbers indicates.
Fig. 6 shows the exemplary temperature curve of the mould 30 (or polymer 28) according to embodiment.After completing solidification at time point TP2 place, implement process for cooling with outside cooling die 30, polymer 28 and package parts 20 (Fig. 3), this molding process is similar to the molding process shown in Fig. 5.In process for cooling process, such as, by future self-cooling set 36 cooling agent guide to cooling element 34 and carry out cooling die 30.Meanwhile, the electric current being used for heating mould 30 is disconnected.Such as, the cooling of mould 30 and/or polymer 28 can be implemented with the speed between about 10 DEG C/sec and about 1 DEG C/sec, but different cooling velocities can be used.Moving moulds the 30 temperature T3 leaving polymer 28 can between about 20 DEG C and about 50 DEG C.During owing to implementing cooling, mould 30 is rigidity and limits polymer 28 and package parts 20, mould 30 helps to absorb the stress resulted from polymer 28 and package parts 20, and this stress part is due to the difference of the thermal coefficient of expansion (CTE) between polymer 28 and package parts 20.
Fig. 7, Fig. 8 and Fig. 9 show the temperature curve of mould 30 according to optional molding process and/or polymer 28.In the figure 7, add additional temp stage T4, wherein, temperature T4 is higher than temperature T2.Therefore, at temperature stage T2 place, can partially cured polymer 28, and at temperature T4 place, complete cure polymer 28.For the temperature difference Δ T3 of (T4-T2) can be greater than about 1 DEG C, and about 5 DEG C can be greater than further.
In fig. 8, add additional temp stage T5, and temperature T5 is lower than temperature T1, and lower than gelling temp Tgp.Temperature stage T5 can be dispensed on temperature stage T1 occur before or afterwards.For the temperature difference Δ T4 of (T1-T5) can be greater than about 1 DEG C, and about 5 DEG C can be greater than further.
In fig .9, temperature T1 (mould 30 starts the time contacted with polymer 28) is low temperature, such as, close to room temperature.Temperature T1 in these embodiments also can between about 20 DEG C and about 50 DEG C.Between temperature T1 and T2, the temperature of mould 30 and/or polymer 28 continuously and raise gradually.Therefore, temperature is elevated to T2 from temperature T1 can spend the longer time, and what make polymer 28 has spread out time enough (polymer 28 lower than gelling temp Tgp during).
In whole embodiments of Fig. 5 to Fig. 9, temperature T1 to T5 can remain substantially consistent in the time period of time cycle, to allow polymer 28 (Fig. 2) to flow, and allowed solidification.In certain embodiments, such as, substantially consistent temperature can be kept in the time period of time cycle between about 30 seconds and about 120 seconds.
Should be appreciated that, many temperature are molded may be used for various method of moulding, comprises and is not limited to, compression molded, transfer moulding etc.In addition, many temperature are molded and may be used for comprising the package parts that tube core engages with wafer, tube core engages with tube core.
According to embodiment, method is included in molded polymer on package parts.Molding process is included in the first moulding phases that the first temperature place implements, and at the second moulding phases that the second temperature being different from the first temperature is implemented.
According to other embodiments, method is included in molded polymer on package parts, and wherein, polymer has gelling temp.The first temperature place that molding process is included in lower than gelling temp implements the first molding process.After the first molding process, implement the second molding process at the second temperature place higher than gelling temp.
According to other embodiment, method comprises use mould at package parts patrix molding plastics, and wherein, mould comprises the heating element heater for heating mould.Molding process comprises and being spread out on package parts by moulding compound, and the first electric current is supplied to heating element heater mould to be maintained the first temperature place.When mould is in the first temperature, towards moulding compound by compression mould so that moulding compound is spread out above package parts.After pressing step, the second electric current higher than the first electric current is supplied to heating element heater so that the temperature of mould is increased to the second temperature.
Although describe in detail embodiment and advantage thereof, should be appreciated that, when not deviating from purport and the scope of the present embodiment that claims limit, various different change, replacement and change can have been made.And, the scope of the application be not limited in describe in this description technique, machine, manufacture, material component, device, method and step specific embodiment.Should understand as those of ordinary skill in the art, by the present invention, existing or Future Development for perform with according to the substantially identical function of described corresponding embodiment of the present invention or obtain the technique of basic identical result, machine, manufacture, material component, device, method or step and can be used according to the present invention.Therefore, claims should be included in the scope of such technique, machine, manufacture, material component, device, method or step.In addition, every bar claim forms independent embodiment, and the combination of multiple claim and embodiment within the scope of the invention.
Claims (17)
1. a method for molded polymer, comprising:
Molded polymer on package parts, wherein, molding process comprises:
With the first moulding phases that the first temperature is implemented; And
With the second moulding phases that the second temperature being different from described first temperature is implemented;
Wherein, described first temperature starts lower than described polymer the temperature spot becoming gel state, and described second temperature is higher than the described temperature spot of described polymer.
2. method according to claim 1, wherein, described molding process comprises further:
Described polymer is spread out on described package parts;
Use polymer described in mold compresses to spread out described polymer, wherein, from very first time of described mould and described polymer contact point in the time cycle that described polymer is terminated by the second time point spread out completely, described mould maintains described first temperature or lower than described first temperature; And
After described polymer is spread out completely, by described mold heated to described second temperature.
3. method according to claim 2, comprises further, after described second moulding phases, when not moving described mould and leaving described polymer, cool described polymer.
4. method according to claim 3, wherein, implements to cool the step of described polymer in the pipeline that is built in described mould by being guided to by cooling agent.
5. method according to claim 1, wherein, described second temperature is higher than described first temperature more than 2 DEG C.
6. method according to claim 1, wherein, during described first moulding phases, first electric current is conducted to the heating element heater in mould, described mould is for heating described polymer, and during described second moulding phases, the second electric current higher than described first electric current is conducted to described heating element heater.
7. a method for molded polymer, comprising:
Molded polymer on package parts, wherein, described polymer has the temperature spot starting to become gel state, and molding process comprises:
The first molding process is implemented with the first temperature lower than described temperature spot; And
After described first molding process, implement the second molding process with the second temperature higher than described temperature spot;
Comprise further:
Described polymer is spread out on described package parts; And
Mold is used to press described polymer to spread out described polymer, described first molding process is located to terminate by the time of the second time point spread out completely from the very first time point place of described mold and described polymer contact and being no earlier than described polymer, and described second molding process starts after spreading out completely at described polymer.
8. method according to claim 7, comprises further, when enforcement described second molding process after and when not moving described mold and leaving described polymer, cool described polymer.
9. method according to claim 8, wherein, implements to cool the step of described polymer in the pipeline that is built in described mold by being guided to by cooling agent.
10. method according to claim 7, wherein, described second temperature is higher than described first temperature more than 2 DEG C.
11. methods according to claim 7, wherein, during described first molding process, first electric current is conducted to the heating element heater in mold, described mold is used for keeping and heating described polymer, and during described second molding process, the second electric current higher than described first electric current is conducted to described heating element heater.
12. methods according to claim 7, comprise further: move down in described second temperature the mould employed in implementing molding process and leave described polymer.
The method of 13. 1 kinds of molded polymers, comprising:
Use mould at package parts patrix molding plastics, wherein, described mould comprises the heating element heater for heating described mould, and molding process comprises:
Described moulding compound is spread out on described package parts;
First electric current is supplied to described heating element heater to be maintained at a first temperature by described mould;
When described mould is in described first temperature, press described mould to spread out described moulding compound above described package parts towards described moulding compound; And
After pressing step, the second electric current higher than described first electric current is supplied to described heating element heater so that the temperature of described mould is increased to the second temperature;
Wherein, described moulding compound has the temperature spot starting to become gel state, and described first temperature is lower than described temperature spot, and described second temperature is higher than described temperature spot.
14. methods according to claim 13, comprise the 3rd temperature temperature of described mould being adjusted to and being different from described first temperature and described second temperature further.
15. methods according to claim 14, wherein, described 3rd temperature is lower than described first temperature and described second temperature, and the step temperature of described mould being adjusted to described 3rd temperature comprises and provides cooling agent to cool described mould to described mould.
16. methods according to claim 15, wherein, implement the step temperature of described mould being adjusted to described 3rd temperature after described moulding compound is fully cured.
17. methods according to claim 14, wherein, described 3rd temperature is higher than described first temperature and described second temperature.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261598567P | 2012-02-14 | 2012-02-14 | |
| US61/598,567 | 2012-02-14 | ||
| US13/485,307 US9662812B2 (en) | 2012-02-14 | 2012-05-31 | Methods for molding integrated circuits |
| US13/485,307 | 2012-05-31 |
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| CN103240833A CN103240833A (en) | 2013-08-14 |
| CN103240833B true CN103240833B (en) | 2015-11-18 |
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| CN201210326320.7A Active CN103240833B (en) | 2012-02-14 | 2012-09-05 | The method of molded integrated circuit |
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| CN104080281B (en) * | 2014-07-04 | 2017-01-25 | 华进半导体封装先导技术研发中心有限公司 | Laminating method of printed circuit board |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419864A (en) * | 1991-05-15 | 1995-05-30 | E. I. Du Pont De Nemours And Company | Process for encapsulating inserts with wet-laid material via compression molding |
| CN101060263A (en) * | 2006-04-19 | 2007-10-24 | 煤炭科学研究总院上海分院 | A method for packaging the stator with vacuum automatic pressure gem |
| CN101079383A (en) * | 2006-05-23 | 2007-11-28 | 冲电气工业株式会社 | Method and device for manufacturing semiconductor device |
| CN101436557A (en) * | 2007-11-13 | 2009-05-20 | 香港科技大学 | Wafer level encapsulation method of LED array encapsulation and LED encapsulation device made thereby |
| CN101625983A (en) * | 2008-07-09 | 2010-01-13 | 中国科学院半导体研究所 | Method for curing low-permittivity BCB resin |
| CN101834235A (en) * | 2009-03-10 | 2010-09-15 | 亿光电子工业股份有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
| CN102044448A (en) * | 2009-10-09 | 2011-05-04 | 亿光电子工业股份有限公司 | Method for manufacturing LED (Light-Emitting Diode) device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5486431B2 (en) * | 2010-07-27 | 2014-05-07 | 日東電工株式会社 | LIGHT EMITTING DEVICE COMPONENT, LIGHT EMITTING DEVICE, AND ITS MANUFACTURING METHOD |
-
2012
- 2012-09-05 CN CN201210326320.7A patent/CN103240833B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5419864A (en) * | 1991-05-15 | 1995-05-30 | E. I. Du Pont De Nemours And Company | Process for encapsulating inserts with wet-laid material via compression molding |
| CN101060263A (en) * | 2006-04-19 | 2007-10-24 | 煤炭科学研究总院上海分院 | A method for packaging the stator with vacuum automatic pressure gem |
| CN101079383A (en) * | 2006-05-23 | 2007-11-28 | 冲电气工业株式会社 | Method and device for manufacturing semiconductor device |
| CN101436557A (en) * | 2007-11-13 | 2009-05-20 | 香港科技大学 | Wafer level encapsulation method of LED array encapsulation and LED encapsulation device made thereby |
| CN101625983A (en) * | 2008-07-09 | 2010-01-13 | 中国科学院半导体研究所 | Method for curing low-permittivity BCB resin |
| CN101834235A (en) * | 2009-03-10 | 2010-09-15 | 亿光电子工业股份有限公司 | Light-emitting diode packaging structure and manufacture method thereof |
| CN102044448A (en) * | 2009-10-09 | 2011-05-04 | 亿光电子工业股份有限公司 | Method for manufacturing LED (Light-Emitting Diode) device |
Non-Patent Citations (1)
| Title |
|---|
| 刘雄亚等.《模压工艺》.《复合材料工艺及设备》.武汉工业大学出版社,1997,(第1版),第96-103页. * |
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