CN101583475B - Method and device for encapsulating electronic components, wherein the encapsulating material is cooled - Google Patents

Method and device for encapsulating electronic components, wherein the encapsulating material is cooled Download PDF

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Publication number
CN101583475B
CN101583475B CN200780044105.5A CN200780044105A CN101583475B CN 101583475 B CN101583475 B CN 101583475B CN 200780044105 A CN200780044105 A CN 200780044105A CN 101583475 B CN101583475 B CN 101583475B
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China
Prior art keywords
mold component
die cavity
cooling
mold
encapsulating material
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CN200780044105.5A
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Chinese (zh)
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CN101583475A (en
Inventor
约安内斯·莱昂纳德斯·于里安·泽尔
马克·亚历山大·默肯斯
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Fico BV
Besi Netherlands BV
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Besi Netherlands BV
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/02—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04—Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00—After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/02—Thermal after-treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould
    • B29C2045/735—Heating or cooling of the mould heating a mould part and cooling another mould part during moulding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3425—Printed circuits

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

The invention relates to a method for encapsulating electronic components mounted on a carrier, wherein a liquid encapsulating material comprising polymer after curing is cooled in forced manner. The invention further also comprises a mould part for applying in a device for encapsulating electronic components mounted on a carrier, and such a device.

Description

Encapsulating material obtains the cooling method and apparatus for encapsulating electronic components
The present invention relates to the method that electronic component to installing on carrier encapsulates (encapsulating).The mold component that the present invention also provides the equipment that encapsulates at the electronic component for installing on to carrier to apply, and such mold component forms its a part of sealed in unit.
During the electronic component of installing on to carrier encapsulates, especially, during semiconductor circuit (chip) is encapsulated, according to prior art, conventionally use the encapsulation press with two mould halves, wherein at least one has the die cavity of depression.After between described mould halves, placement has the carrier of electronic component to be packaged, described mould halves is moved towards each other, so that their clamp carrier.Then, conventionally utilize transfer modling to die cavity feed fluid encapsulating material.After at least part of chemosetting of encapsulating material, from encapsulation press, take out the carrier with packaged electronic element.As encapsulating material be epoxy resin (also referred to as resin), its conventionally have for example take silicon as basis, for example especially silica or quartzy packing material.After solidifying, epoxy resin is comprised of polymeric material; And before solidifying, chain is shorter; Polymeric material can be comprised of monomer, dimer, oligomer or polymeric material or its hybrid form.
An object of the present invention is to provide alternative and the equipment that with respect to prior art, can reduce the cycle time of encapsulation.
For this purpose, the invention provides a kind of method electronic component of installing on carrier being encapsulated by following continuous processing step: A) utilize the die cavity being recessed in mold component to surround and be positioned at least one electronic component on carrier, B) liquid encapsulating material that comprises polymer after solidifying is supplied to die cavity, C) at least a portion that is supplied to the encapsulating material of die cavity is forced coolingly in die cavity, be preferably cooled to lower than being the vitrification point (T of the material of polymer after solidifying g), D) from die cavity, shift out the electronic component that packed material surrounds at least partly, and E) encapsulating material that surrounds at least partly electronic component is solidified outward at die cavity.Because encapsulating material must be fluid when being supplied to, the supply of the liquid encapsulating material that comprises polymer after therefore solidifying should be carried out certainly at this at the temperature of the vitrification point (Tg) higher than the curing rear encapsulating material for polymer.Outside demonomerization, dimer, oligomer or polymeric material (or its hybrid form), encapsulating material also comprises packing material conventionally.For this object typical case packing material, be silicon compound (silica), its amount is for making the % by weight of silicon in packing material be greater than the % by weight of polymer.Force the cooling active cooling that is interpreted as the electronic component to having encapsulated.
Polymer has the many phase transformations with temperature correlation conventionally.These transformations relate to and the motility of determining polymer chain and/or the segment of temperature correlation.Most important phase transformation is when temperature raises, from hard glassy mass, to change the transformation of rubber-like polymer into.This transformation usually occurs in relatively little temperature range: i.e. so-called nominal vitrification point T g(also referred to as glass transition temperature, vitrifying point or glass-rubber transition temperature).Along with temperature further raises and surpasses rubber phase scope, cross-linked polymer will decompose more quickly, and thermoplastic is conventionally by melting with become liquid.Time scale and the other factors of transformation process depended in the exact position of vitrification point.In this, go back reference time temperature principle of stacking.For the polymer with sizable crosslinking degree (crosslinked in a large number), glass transition broadens becomes the performance gradual change at wide temperature range; Then can no longer be called vitrification point, but be called glass temperature range.In the situation that using term vitrification point, must understand in a broad sense: it also comprises glass temperature range.If mention glass transition temperature in the application's description, it is interpreted as being illustrated in the loss amount of touching G in dynamic mechanical analysis so " under 1Hz frequency, show peaked temperature.
An advantage of the inventive method is: be different from according to prior art, needn't only at encapsulating material, fully solidify after having shape maintenance to a certain degree and just start step D).The curing of encapsulating material is that the crosslinked physical/chemical technique of chain occurs.This technique and time correlation, and need tens of seconds according to prior art.Yet the present invention makes the curing first stage no longer must occur in die cavity now.For this purpose, need to make (heating) mould cooling within the very short time, preferably be cooled to the relevant vitrification point T lower than (part) encapsulating material g.Therefore adopt the inventive method can make processing step A) to D) cycle time be reduced to and be less than for 60 seconds or be even less than for 45 seconds or 35 seconds.Therefore can reduce 30-60% the cycle time of sealed in unit.Another advantage of the inventive method is: now whole solidifying can carry out under the condition of optimizing for solidifying in adjustable environment.Before this, the curing first stage can not be optimized for solidification process; This is because the speed of curing first stage must be optimized.Therefore the inventive method can produce the encapsulated result improvement of the aspects such as distortion, delamination, thermic load of encapsulating electronic components (for example) of improvement.Another significant advantage is that the electronic component of encapsulation can relatively simply take out from die cavity.Although also produce encapsulating material during encapsulation material solidifies, the enhancing of die cavity is adhered to, when temperature drops to lower than temperature T gtime, encapsulating material finally will adhere to sealed in unit securely.Therefore mould no longer rapidly packed material pollute, so less cleaning die can satisfy the demand.Except time acceleration period, adhere to and reduce also to cause the productivity ratio of sealed in unit to increase, thereby make significantly to reduce machine cost during encapsulating.
Die cavity can be by carrying cooling medium to come cooling through at least one mold component.Cooling device makes to carry out rapidly large calorimetric transmission.If cooling medium during cooling undergoes phase transition, so hot transmission is especially large.Therefore, the cooling of two mold components has advantages of cooling can carrying out more fast certainly at this.
After at least one mold component is cooling, then cooling medium can be cooling again in mold component outside, again cooling for mold component during follow-up packaging technology.Therefore, cooling medium cooling do not need to show time restriction factor.
By encapsulating material after die cavity shifts out, at processing step E) during, adopt the solidifying of electronic component of polymer encapsulated in adjustable environment, to carry out.It should be understood that especially adjustable environment refers to cure package material at the temperature higher than environment temperature, for example, utilize baking oven heating.During curing, the also air humidity of adjusting ambient as required.
For excellent operation, be also desirably in and start processing step C) before, the processing temperature of the liquid encapsulating material that comprises polymer after at least a portion of mold component is heated to solidify.Therefore in order to make encapsulating material fully mobile, and make it possible to for example good and loading mould cavity rapidly, die cavity must at least be heated to be almost the processing temperature (T of encapsulating material melting).Certainly to being also same situation for supplying with the feedway of encapsulating material.Once according to processing step D) at least part of electronic component surrounding of packed material is shifted out, the heating of at least one in mold component (more preferably two mold components) can start new circulation so.Or this heating can be by carrying heat medium through at least one mold component and carry out, this heat medium can experience phase transformation (condensation) for Rapid Thermal transmission in this article.
The mold component that the present invention also provides a kind of equipment encapsulating at the electronic component for installing on to carrier to apply, comprises: at least one is recessed to the die cavity in contact side, for surrounding at least one electronic component being positioned on carrier; Contact surface with at least part of encirclement die cavity, is characterized in that: mold component has heater and cooling device.Mold component also can have the feed path for delivery of encapsulating material that is connected to die cavity.Cooling device can be for example by for guided, at least one passage by mold component forms.For the application of this passage and further illustrating of associated advantages thereof, please refer to the above description according to the inventive method.
In a specific change scheme, mold component partly consists of at least two mold components: the first mold component part with die cavity, contact surface and cooling device, with be positioned at the side away from die cavity of the first mold component part and there is the second mold component part of heater, wherein the first and second mold components parts are movably between disconnected position and contact position connected to one another.If mold component part interconnects via at least one guiding device, they can mutually move and locate in simple mode so.A this important advantage that is divided into the mold component of several parts is: can utilize second mold component with large thermal capacity partly to make the first mold component part reach fast operating temperature (higher than vitrification point T g, preferably reach processing temperature T melting).Yet in encapsulating material cooling period, mold component part also can be separated, and makes to only have the first mold component partly to need again cooling.This has the following advantages: the thermal capacity of the first mold component part is less than the thermal capacity of the mold component part of institute's combination; Can carry out significantly more quickly thus cooling.In addition, due to the finite part of mold component only need cooling and and then heating, so energy requirement is less; The second mold component part can be retained in higher temperature levels.At this, the thermal capacity of expectation the second mold component part is at least 2 times of the first mold component thermal capacity partly.The difference of thermal capacity is more preferably even greater than 2 times, for example, be at least 4 times, 6 times or 8 times.
In order to make the heat transmission between mold component part good as far as possible, advantageously, the opposed facing side of the first and second mold component parts has complementary shape and is enhanced so that the heat between mold component part is delivered in contact position place.Cooling the first mold component part can be by partly contacting with the second mold component therefore by Fast Heating again.
The present invention also provides a kind of equipment for the electronic component of installing on carrier is encapsulated, and comprising: mold component movably relative to each other, and it limits at least one die cavity for surrounding electronic component in closed position; With the liquid encapsulating material feedway that is connected to die cavity, wherein at least one mold component is formed by aforementioned mould part.Described equipment preferably also has the cooling medium feedway for cooling at least one mold component.This equipment also expects to have enclosed cooling system, for cooling medium being supplied to at least one mold component, for discharging heated cooling medium from least one mold component and for cooling described cooling medium.For the explanation of the advantage of this equipment, please refer to the advantage of the method according to this invention already described above and mold component.Expectation external refrigeration device must have enough capacity, so that not to having a negative impact cycle time.Thus, yes there is no coolant loss for the advantage of enclosed cooling system, and do not produce environmental pollution, because the character of packaging technology causes this, is particularly the factor of being extremely correlated with.In addition, also can use the through-flow cooling of noncirculating water of for example wherein flowing.
On the basis of the non-limiting example embodiment shown in the following drawings, can further illustrate the present invention.Wherein:
Fig. 1 shows through the schematic cross-sectional intercepting according to a part for sealed in unit of the present invention;
Fig. 2 shows the perspective view of the possible finished product that the method according to this invention encapsulates the electronic component of installing on carrier;
Fig. 3 A and 3B show through the cross section intercepting according to two positions of a part for mold component of the present invention alternate embodiment variant;
Fig. 3 C shows through the cross section intercepting according to a part for the second alternate embodiment variant of mold component of the present invention; With
Fig. 3 D shows through the cross section intercepting according to a part for the 3rd alternate embodiment variant of mold component of the present invention.
Fig. 1 show have can be mutually mobile upper mold part 2 and a part for the sealed in unit 1 of lower mold half 3.Be clipped between upper mold part 2 and lower mold half 3 is the carrier 4 that electronic component 5 is installed on it.For this reason, lower mold half 3 has the spatial accommodation 6 for carrier 5, and die cavity 7 is recessed in upper mold part 2 with containing electronic components 5.By as arrow P 1shown in mobile piston 8, with promote liquid encapsulating material 9 by runner 10 to die cavity 7.Therefore the electronic component in the die cavity 75 packed material 9 of free space is around filled.During the movement towards die cavity 7, also due to the heating element heater 11,12 of arranging respectively in upper mold part 2 and lower mold half 3, make encapsulating material 9 for liquid.Upper mold part 2 also has coolant channel 13, at die cavity 7 after packed material 9 has been filled, makes liquid coolant 14 from cooling and pump unit 15 as arrow P 2shown in be supplied to passage 13.In the position of die cavity 7, liquid coolant 14 becomes gas phase 16, absorbs thus large energy, and therefore the encapsulating material 9 in die cavity 7 is cooled to the vitrification point (T lower than encapsulating material 9 again in pressure mode (again) g) (or be at least the vitrification point (T of the polymer forming section of encapsulating material g)).During supplying with encapsulating material 9, material temperature T supply with> T g, the polymer in encapsulating material 9 is amorphous state, chain can slide over each other and (flow; Plastically), but after the encapsulating material of die cavity 7 and wherein existence is cooled, T after cooling< T g, so the polymer in encapsulating material 9 forms solid, glass material.The cooling agent 16 of gas phase is back to cooling and pump unit 15, at this by the cooling liquid coolant 14 that becomes again.
Fig. 2 shows baking oven 20, is wherein provided with the carrier 21 of packaging body of encapsulating material 22 thereon as arrow P 3shown in slide.Encapsulating material 22 is glassy phase in this case, and will in baking oven 20, by being cross-linked of encapsulating material 22, change solid matter into.
Fig. 3 A shows that mold component 30 is divided into two parts: base part 31 and molding portion 32 through the cross section of mold component 30 interceptings.Base part 31 has (electricity) heater 33 and has sizable quality, and it also has large thermal capacity thus.Mould part 32 has die cavity 34 and the runner 35 being connected with die cavity 34, and the thickness of molding portion 32 is significantly less than base part 31, so the thermal capacity of molding portion 32 is also significantly less than the thermal capacity of base part 31.Molding portion 32 has the cooling duct 36 that can carry cooling agent (this figure is not shown).Because molding portion 32 does not contact base part 31, so consider the thermal capacity that it is limited, can utilize cooling agent to it, to carry out cooling in relatively simple mode.As shown in Figure 3 B in the situation that, molding portion 32 contact base part 31.In this case, were it not for cooling agent and be transferred by cooling duct 36, molding portion 32 can be by Fast Heating.This is because it is little that the thermal capacity of molding portion 32 is compared with the thermal capacity of base part 31, so molding portion 32 will be heated to the temperature that almost reaches base part 31.With guiding device 37 and intermediate compression spring 38, regulate the relative position of part 31,32.
Fig. 3 C shows an alternate embodiment variant of mold component 40, and this mold component 40 is divided into two parts: base part 41 and molding portion 42.As the mold component 30 as shown in front figure, base part 41 has heater 43, and molding portion 42 has die cavity 44 and the runner 45 that is connected die cavity 44.Molding portion 42 has cooling duct 46.Different from the molded parts 30 shown in Fig. 3 A and 3B, the opposed facing side separately 47,48 of base part 41 and molding portion 42 has compromise face, thereby can improve the heat transmission (comparing with molded parts 30) between part 41,42.
Fig. 3 D shows the follow-up alternate embodiment variant of mold component 50, and mold component 50 is not divided into part that can be mutually mobile specifically.Mold component 50 consists of two plate-shaped members 51,52 that are rigidly connected to each other.Lower plate member 51 has die cavity 54 and the runner 55 being recessed in contact side 53.Plate part 52 has towards lower plate member 51 and wherein caves in the side 56 of passage 57.These passages 57 can, before plate part 52 and lower plate member 51 are assembled, be arranged in plate part 52 in relatively simple mode.Passage 57 can be used as the feed path of cooling agent, but can as the feed path of heater, for example, for condensation in passage 57 and during feeding, be also still the oil of heating of gas phase or the situation of liquid.Therefore do not need the as above electric heater unit shown in Fig. 3 A-3C 33,43.

Claims (14)

1. the method electronic component of installing on carrier being encapsulated by following continuous processing step:
A) utilize the die cavity being recessed in mold component to surround and be positioned at least one electronic component on carrier,
B) to described die cavity, supply with the liquid encapsulating material that comprises polymer after solidifying,
C) in described die cavity, to being supplied at least a portion of the described encapsulating material of described die cavity, force cooling, a part that makes to be supplied to the described encapsulating material of described die cavity is cooled to the vitrification point lower than the described encapsulating material that comprises polymer after solidifying
D) from described die cavity, shift out the described electronic component that packed material surrounds at least partly, and
E) the described encapsulating material that makes to surround at least partly described electronic component solidifies outward at described die cavity.
2. method according to claim 1, is characterized in that: at processing step C) during cooling described die cavity.
3. according to aforementioned method claimed in claim 1, it is characterized in that: by cooling medium is carried through at least one mold component and carried out cooling described die cavity.
4. method according to claim 3, is characterized in that: described cooling medium during cooling experiences phase transformation.
5. according to the method described in claim 3 or 4, it is characterized in that: after at least one mold component is cooling, the cooling described cooling medium again in described mold component outside, again cooling for described mold component during follow-up packaging technology.
6. according to the method described in any one in aforementioned claim 1-4, it is characterized in that: at processing step E) during, with being solidificated in adjustable environment of described electronic component of polymer encapsulated, carry out.
7. according to the method described in any one in aforementioned claim 1-4, it is characterized in that: at processing step C) before, the processing temperature of the described liquid encapsulating material that comprises polymer after at least a portion of mold component is heated to solidify.
8. a mold component of applying in the equipment encapsulating at the electronic component for installing on to carrier according to the method described in claim 1-7 any one, comprises:
-at least one is recessed to the die cavity of contact in side, for surrounding at least one electronic component being positioned on carrier, and
-surround at least partly the contact surface of described die cavity,
It is characterized in that:
Described mold component has heater and cooling device, and
Described mold component partly consists of at least two mold components:
The-the first mold component part, it has described die cavity, described contact surface and described cooling device, and
The-the second mold component part, its be positioned at described the first mold component part away from the side of described die cavity and there is described heater,
Wherein said the first and second mold component parts are movably between disconnected position and contact position connected to one another,
The thermal capacity of wherein said the second mold component part is at least 2 times of described the first mold component thermal capacity partly.
9. mold component according to claim 8, is characterized in that: described cooling device is by for guided, at least one passage by described mold component forms.
10. mold component according to claim 8, is characterized in that: described mold component part interconnects via at least one guiding device.
Mold component in 11. according to Claim 8-10 described in any one, it is characterized in that: the opposed facing side of described the first and second mold components parts has complementary shape, make heat between described mold component part be delivered in described contact position place and be enhanced.
12. 1 kinds of equipment for the electronic component of installing on carrier is encapsulated, comprise:
-relative to each other mold component movably, and described mold component is defined at least one die cavity that surrounds electronic component in closed position, and
-be connected to the liquid encapsulating material feedway of described die cavity,
Mold component described in any one of at least one in wherein said mold component according to Claim 8-11 forms.
13. sealed in units according to claim 12, is characterized in that: described equipment also has the cooling medium feedway at least one of cooling described mold component.
14. according to the sealed in unit described in claim 12 or 13, it is characterized in that: described equipment has enclosed cooling system, for supplying with cooling medium at least one of described mold component, for from described at least one mold component heated described cooling medium of discharge with for cooling described cooling medium.
CN200780044105.5A 2006-12-05 2007-11-28 Method and device for encapsulating electronic components, wherein the encapsulating material is cooled Active CN101583475B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
NL2000356 2006-12-05
NL2000356A NL2000356C2 (en) 2006-12-05 2006-12-05 Method and device for encapsulating electronic components wherein the encapsulating material is cooled.
PCT/NL2007/050602 WO2008085026A1 (en) 2006-12-05 2007-11-28 Method and device for encapsulating electronic components, wherein the encapsulating material is cooled

Publications (2)

Publication Number Publication Date
CN101583475A CN101583475A (en) 2009-11-18
CN101583475B true CN101583475B (en) 2014-09-10

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