CN103228804B - 电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材 - Google Patents

电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材 Download PDF

Info

Publication number
CN103228804B
CN103228804B CN201180057533.8A CN201180057533A CN103228804B CN 103228804 B CN103228804 B CN 103228804B CN 201180057533 A CN201180057533 A CN 201180057533A CN 103228804 B CN103228804 B CN 103228804B
Authority
CN
China
Prior art keywords
atom
copper alloy
electronic apparatus
scope
atomic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180057533.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN103228804A (zh
Inventor
牧一诚
伊藤优树
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Materials Corp
Original Assignee
Mitsubishi Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Publication of CN103228804A publication Critical patent/CN103228804A/zh
Application granted granted Critical
Publication of CN103228804B publication Critical patent/CN103228804B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/01—Alloys based on copper with aluminium as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
CN201180057533.8A 2010-12-03 2011-11-24 电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材 Expired - Fee Related CN103228804B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010-270890 2010-12-03
JP2010270890A JP5712585B2 (ja) 2010-12-03 2010-12-03 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
PCT/JP2011/077011 WO2012073777A1 (ja) 2010-12-03 2011-11-24 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Publications (2)

Publication Number Publication Date
CN103228804A CN103228804A (zh) 2013-07-31
CN103228804B true CN103228804B (zh) 2016-05-25

Family

ID=46171719

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180057533.8A Expired - Fee Related CN103228804B (zh) 2010-12-03 2011-11-24 电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材

Country Status (5)

Country Link
US (1) US20130284327A1 (https=)
JP (1) JP5712585B2 (https=)
CN (1) CN103228804B (https=)
TW (1) TWI591191B (https=)
WO (1) WO2012073777A1 (https=)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
JP5903842B2 (ja) 2011-11-14 2016-04-13 三菱マテリアル株式会社 銅合金、銅合金塑性加工材及び銅合金塑性加工材の製造方法
CN103388089B (zh) * 2013-04-25 2015-06-17 刘春忠 电流通、断金属材料及其用途
CN103290254A (zh) * 2013-05-07 2013-09-11 锡山区羊尖泓之盛五金厂 一种耐高温超导铜线及其制备方法
CN107531527B (zh) * 2015-05-18 2021-04-09 三菱电机株式会社 水处理系统及水处理方法
JP6736869B2 (ja) * 2015-11-09 2020-08-05 三菱マテリアル株式会社 銅合金素材
CN106834788A (zh) * 2015-12-03 2017-06-13 黄波 一种含钐元素抗拉伸铜合金导线及其制备方法
CN106834787A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Pm-Au-B合金导线及其制备方法
CN106834789A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Ce-Au-B合金导线及其制备方法
CN106834790A (zh) * 2015-12-03 2017-06-13 黄波 一种Gu-Gd-Au-B合金导线及其制备方法
CN108598058B (zh) * 2017-12-21 2020-05-19 汕头市骏码凯撒有限公司 一种铜合金键合丝及其制造方法
CN108162564A (zh) * 2018-01-23 2018-06-15 东北大学 用于薄规格电连接器端子的铜钢铜复合材料及其制备方法
CN109022878B (zh) * 2018-09-11 2020-12-22 广东美的制冷设备有限公司 用于空调消音降噪的泡沫合金及其制备方法和应用
CN111192704A (zh) * 2019-12-30 2020-05-22 南通南平电子科技有限公司 一种耐弯折的无座板片式电容引线
CN111334729B (zh) * 2020-02-28 2021-09-24 交大材料科技(江苏)研究院有限公司 一种高密度纳米孪晶高性能镍铝青铜合金板材及其制备方法
CN114951609B (zh) * 2022-04-13 2024-04-19 佛山市陶本科技有限公司 具有均匀闭孔的泡沫铝板及其制备方法
CN115786764B (zh) * 2022-11-22 2023-12-22 广州番禺职业技术学院 一种铜镜材料及其制备方法
CN117604321B (zh) * 2024-01-22 2024-03-29 西安稀有金属材料研究院有限公司 一种完全共格氧化物弥散强化铜基复合材料及其制备方法
CN120452906B (zh) * 2025-06-16 2025-11-07 西安中实金属有限公司 一种耐腐蚀铜槽线及其防电化学腐蚀工艺

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070056661A1 (en) * 2005-09-09 2007-03-15 Ngk Insulators, Ltd. Beryllium copper alloy and method of manufacturing beryllium copper alloy
CN101001965A (zh) * 2004-08-17 2007-07-18 株式会社神户制钢所 具有弯曲加工性的电气电子部件用铜合金板

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4715910A (en) * 1986-07-07 1987-12-29 Olin Corporation Low cost connector alloy
JPH06100984A (ja) * 1992-09-22 1994-04-12 Nippon Steel Corp バネ限界値と形状凍結性に優れたバネ用材料及びその製造方法
JPH06100983A (ja) * 1992-09-22 1994-04-12 Nippon Steel Corp 高ヤング率・高降伏強度を有するｔａｂテープ用金属箔およびその製造方法
SE525460C2 (sv) * 2002-02-28 2005-02-22 Sandvik Ab Användning av en kopparlegering i uppkolande miljöer
JP4787986B2 (ja) * 2002-11-25 2011-10-05 Ｄｏｗａメタルテック株式会社 銅合金およびその製造方法
US20100086435A1 (en) * 2007-03-30 2010-04-08 Nippon Mining & Metals Co., Ltd. Cu-Ni-Si SYSTEM ALLOY FOR ELECTRONIC MATERIALS
EP2248921A4 (en) * 2008-01-31 2011-03-16 Furukawa Electric Co Ltd COPPER ALLOY MATERIAL FOR ELECTRICAL / ELECTRONIC COMPONENT AND METHOD FOR PRODUCING THE COPPER ALLOY MATERIAL
JP5260992B2 (ja) * 2008-03-19 2013-08-14 Ｄｏｗａメタルテック株式会社 銅合金板材およびその製造方法
JP5420328B2 (ja) * 2008-08-01 2014-02-19 三菱マテリアル株式会社 フラットパネルディスプレイ用配線膜形成用スパッタリングターゲット
JP5045784B2 (ja) * 2010-05-14 2012-10-10 三菱マテリアル株式会社 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101001965A (zh) * 2004-08-17 2007-07-18 株式会社神户制钢所 具有弯曲加工性的电气电子部件用铜合金板
US20070056661A1 (en) * 2005-09-09 2007-03-15 Ngk Insulators, Ltd. Beryllium copper alloy and method of manufacturing beryllium copper alloy

Also Published As

Publication number Publication date
WO2012073777A1 (ja) 2012-06-07
JP5712585B2 (ja) 2015-05-07
TW201235484A (en) 2012-09-01
CN103228804A (zh) 2013-07-31
JP2012117142A (ja) 2012-06-21
TWI591191B (zh) 2017-07-11
US20130284327A1 (en) 2013-10-31

Similar Documents

Publication Publication Date Title
CN103228804B (zh) 电子设备用铜合金、电子设备用铜合金的制造方法及电子设备用铜合金轧材
CN102892908B (zh) 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
CN102822363B (zh) 电子器件用铜合金及其制造方法及电子器件用铜合金轧材
KR102254086B1 (ko) 전자·전기 기기용 구리 합금, 전자·전기 기기용 구리 합금 박판, 전자·전기 기기용 부품, 단자 및 버스 바
JP5045783B2 (ja) 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
CN103502487B (zh) 电子设备用铜合金、电子设备用铜合金的制造方法、电子设备用铜合金塑性加工材料、及电子设备用组件
CN103842551B (zh) 电子设备用铜合金、电子设备用铜合金的制造方法、电子设备用铜合金轧材及电子设备用组件
CN103842531A (zh) 电子设备用铜合金、电子设备用铜合金的制造方法、电子设备用铜合金塑性加工材料及电子设备用组件
JP5703975B2 (ja) 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材
CN104822853A (zh) 电子电气设备用铜合金、电子电气设备用零件及端子
JP5045782B2 (ja) 電子機器用銅合金、電子機器用銅合金の製造方法及び電子機器用銅合金圧延材

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160525