CN103225091A - Aluminum product copper-plating solution - Google Patents
Aluminum product copper-plating solution Download PDFInfo
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- CN103225091A CN103225091A CN2013101903932A CN201310190393A CN103225091A CN 103225091 A CN103225091 A CN 103225091A CN 2013101903932 A CN2013101903932 A CN 2013101903932A CN 201310190393 A CN201310190393 A CN 201310190393A CN 103225091 A CN103225091 A CN 103225091A
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- parts
- plating bath
- copper plating
- soda ash
- yellow soda
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Abstract
The invention relates to an aluminum product copper-plating solution which comprises the following components in parts by weight: 6-16 parts of sodium carbonate, 3-8 parts of alkylphenol polyoxyethylene, 15-18 parts of tin dichloride, 4-7 parts of potassium sodium tartrate, 5-13 parts of sodium carbonate, 4-11 parts of nitrilotriacetic acid, 2-8 parts of ethylenediamine, 7-15 parts of zinc oxide and 6-9 parts of disodium hydrogen phosphate. When copper-plating operation is performed on an aluminum product according to the invention, the plating solution is stable; and a plated film is firm, level and smooth, and has long service life and weldability.
Description
Technical field
The present invention is specifically related to a kind of aluminium copper plating bath.
Background technology
In metallic substance, advantages such as aluminium is in light weight because of it, low price, the parent who is subjected to people looks at.Just compare difficulty but will carry out welding operation, if can plate layer of copper, can not only solve above-mentioned difficulties, and can increase the ornamental and electroconductibility of aluminium at aluminium material surface at aluminium material surface.
Summary of the invention
Goal of the invention: the invention provides a kind of aluminium copper plating bath, bath stability, plated film is firm, smooth smooth.
Technical scheme: a kind of aluminium copper plating bath, described aluminium copper plating bath is made up of according to parts by weight following component: yellow soda ash 6-16 part, alkylphenol polyoxyethylene 3-8 part, tin protochloride 15-18 part, Seignette salt 4-7 part, yellow soda ash 5-13 part, nitrilotriacetic acid(NTA) 4-11 part, quadrol 2-8 part, zinc oxide 7-15 part, Sodium phosphate dibasic 6-9 part.
As preferably, described aluminium copper plating bath is made up of according to parts by weight following component: 14 parts in yellow soda ash, 6 parts of alkylphenol polyoxyethylene, 17 parts of tin protochlorides, 5 parts of Seignette salts, 11 parts in yellow soda ash, 9 parts of nitrilotriacetic acid(NTA)s, 6 parts of quadrols, 11 parts in zinc oxide, 8 parts of Sodium phosphate dibasics.
Beneficial effect: the present invention is copper facing on aluminium, bath stability, and plated film is firm, smooth smooth, and long service life has weldability.
Embodiment
The present invention will be described in detail below in conjunction with specific embodiment.
Specific embodiment 1:
A kind of aluminium copper plating bath, described aluminium copper plating bath is made up of according to parts by weight following component: 6 parts in yellow soda ash, 3 parts of alkylphenol polyoxyethylene, 15 parts of tin protochlorides, 4 parts of Seignette salts, 5 parts in yellow soda ash, 4 parts of nitrilotriacetic acid(NTA)s, 2 parts of quadrols, 7 parts in zinc oxide, 6 parts of Sodium phosphate dibasics.
Specific embodiment 2:
A kind of aluminium copper plating bath, described aluminium copper plating bath is made up of according to parts by weight following component: 16 parts in yellow soda ash, 8 parts of alkylphenol polyoxyethylene, 18 parts of tin protochlorides, 7 parts of Seignette salts, 13 parts in yellow soda ash, 11 parts of nitrilotriacetic acid(NTA)s, 8 parts of quadrols, 15 parts in zinc oxide, 9 parts of Sodium phosphate dibasics.
Specific embodiment 3:
A kind of aluminium copper plating bath, described aluminium copper plating bath is made up of according to parts by weight following component: 14 parts in yellow soda ash, 6 parts of alkylphenol polyoxyethylene, 17 parts of tin protochlorides, 5 parts of Seignette salts, 11 parts in yellow soda ash, 9 parts of nitrilotriacetic acid(NTA)s, 6 parts of quadrols, 11 parts in zinc oxide, 8 parts of Sodium phosphate dibasics.
Claims (2)
1. aluminium copper plating bath, it is characterized in that: described aluminium copper plating bath is made up of according to parts by weight following component: yellow soda ash 6-16 part, alkylphenol polyoxyethylene 3-8 part, tin protochloride 15-18 part, Seignette salt 4-7 part, yellow soda ash 5-13 part, nitrilotriacetic acid(NTA) 4-11 part, quadrol 2-8 part, zinc oxide 7-15 part, Sodium phosphate dibasic 6-9 part.
2. aluminium copper plating bath as claimed in claim 1, it is characterized in that: described aluminium copper plating bath is made up of according to parts by weight following component: 14 parts in yellow soda ash, 6 parts of alkylphenol polyoxyethylene, 17 parts of tin protochlorides, 5 parts of Seignette salts, 11 parts in yellow soda ash, 9 parts of nitrilotriacetic acid(NTA)s, 6 parts of quadrols, 11 parts in zinc oxide, 8 parts of Sodium phosphate dibasics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101903932A CN103225091A (en) | 2013-05-22 | 2013-05-22 | Aluminum product copper-plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101903932A CN103225091A (en) | 2013-05-22 | 2013-05-22 | Aluminum product copper-plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103225091A true CN103225091A (en) | 2013-07-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101903932A Pending CN103225091A (en) | 2013-05-22 | 2013-05-22 | Aluminum product copper-plating solution |
Country Status (1)
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| CN (1) | CN103225091A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB869433A (en) * | 1958-11-25 | 1961-05-31 | Adolph Miller | Improvements in metal plating baths |
| GB1347936A (en) * | 1971-11-10 | 1974-02-27 | Canada Wire & Cable Co Ltd | Plating copper on aluminium |
| CN1922340A (en) * | 2004-02-17 | 2007-02-28 | 泰科印刷电路集团有限公司 | Method of electroplating on aluminum |
| CN101210327A (en) * | 2006-12-30 | 2008-07-02 | 陈东明 | Plastic surface copper plating agent and using method thereof |
| CN101368285A (en) * | 2008-08-28 | 2009-02-18 | 尼尔金属(苏州)有限公司 | Technique for plating copper on aluminum and aluminum alloy base material and products produced thereby |
| CN101418450A (en) * | 2008-10-27 | 2009-04-29 | 江苏佳成机械有限公司 | Copper plating process of aluminum wire material |
| CN101928940A (en) * | 2009-06-22 | 2010-12-29 | 尼尔金属(苏州)有限公司 | Process method of plating copper on aluminum and aluminum alloy substrate |
| CN102071442A (en) * | 2009-11-24 | 2011-05-25 | 徐久春 | Copper electroplating solution for pre-plating aluminum part |
| CN102212855A (en) * | 2011-05-20 | 2011-10-12 | 湘潭大学 | Aluminium strip with tin soldering performance and high corrosion resistance and preparation technology thereof |
| CN102605368A (en) * | 2012-04-16 | 2012-07-25 | 河南新开电气集团股份有限公司 | Surface treatment method for increasing conductivity of aluminum conductive body for switch cabinet |
-
2013
- 2013-05-22 CN CN2013101903932A patent/CN103225091A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB869433A (en) * | 1958-11-25 | 1961-05-31 | Adolph Miller | Improvements in metal plating baths |
| GB1347936A (en) * | 1971-11-10 | 1974-02-27 | Canada Wire & Cable Co Ltd | Plating copper on aluminium |
| CN1922340A (en) * | 2004-02-17 | 2007-02-28 | 泰科印刷电路集团有限公司 | Method of electroplating on aluminum |
| CN101210327A (en) * | 2006-12-30 | 2008-07-02 | 陈东明 | Plastic surface copper plating agent and using method thereof |
| CN101368285A (en) * | 2008-08-28 | 2009-02-18 | 尼尔金属(苏州)有限公司 | Technique for plating copper on aluminum and aluminum alloy base material and products produced thereby |
| CN101418450A (en) * | 2008-10-27 | 2009-04-29 | 江苏佳成机械有限公司 | Copper plating process of aluminum wire material |
| CN101928940A (en) * | 2009-06-22 | 2010-12-29 | 尼尔金属(苏州)有限公司 | Process method of plating copper on aluminum and aluminum alloy substrate |
| CN102071442A (en) * | 2009-11-24 | 2011-05-25 | 徐久春 | Copper electroplating solution for pre-plating aluminum part |
| CN102212855A (en) * | 2011-05-20 | 2011-10-12 | 湘潭大学 | Aluminium strip with tin soldering performance and high corrosion resistance and preparation technology thereof |
| CN102605368A (en) * | 2012-04-16 | 2012-07-25 | 河南新开电气集团股份有限公司 | Surface treatment method for increasing conductivity of aluminum conductive body for switch cabinet |
Non-Patent Citations (2)
| Title |
|---|
| 方景礼: "《电镀添加剂理论与应用》", 30 April 2006, article "9.1 镀铜电解液的基本类型", pages: 152 * |
| 王锦 等: "络合剂对铝基化学镀Ni-Cu-P合金性能的影响", 《轻金属》, no. 8, 20 August 2011 (2011-08-20), pages 68 - 71 * |
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Application publication date: 20130731 |