CN104593754A - Tire bead steel wire copper-plating additive - Google Patents
Tire bead steel wire copper-plating additive Download PDFInfo
- Publication number
- CN104593754A CN104593754A CN201310520820.9A CN201310520820A CN104593754A CN 104593754 A CN104593754 A CN 104593754A CN 201310520820 A CN201310520820 A CN 201310520820A CN 104593754 A CN104593754 A CN 104593754A
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- China
- Prior art keywords
- steel wire
- copper
- tire bead
- plating additive
- wire copper
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Abstract
The invention discloses a tire bead steel wire copper-plating additive. The tire bead steel wire copper-plating additive is composed of 1.5 to 2mg/L of ethylene thiourea, 1 to 1.5mg/L of 2-hydroxybenzimidazole, 0.8 to 1mg/L of 3,3'-dithiobis-1-propanesulfuric acid disodium salt, 80 to 100mg/L of polyethylene glycol, 5 to 10mg/L of sodium chloride, and 5 to 10mg/L of ammonium chloride. Adding of the tire bead steel wire copper-plating additive in chemical copper plating is capable of ensuring copper plating quality, and realizing firm adhesion of copper layer on the surface of steel wire.
Description
Technical field
The invention belongs to tire bead production technical field, be specifically related to a kind of steel bead wire copper plating additive formula.
Background technology
Steel bead wire copper electroplating method has electroless plating method and electrochemical plating usually, and electroless plating method is more conventional, and good electroless copper formula can make coating thickness even, and smooth surface, quality is good.
Summary of the invention
The object of the invention is to, a kind of steel bead wire copper plating additive formula is provided, is added in electroless copper formula and can ensures copper facing quality, make layers of copper more firm be attached to Steel Wire Surface.
Steel bead wire copper plating additive formula provided by the invention, its component proportion is as follows:
Ethylene thiourea 1.5-2mg ∕ L,
2-hydroxybenzimidazole, 1-1.5mg ∕ L,
Polydithio-dipropyl sodium sulfate 0.8-1mg ∕ L,
Polyoxyethylene glycol 80-100mg ∕ L,
Sodium-chlor 5-10mg ∕ L,
Ammonium chloride 5-10mg ∕ L.
Steel bead wire copper plating additive provided by the invention formula, its beneficial effect is: be added in electroless copper formula and can ensure copper facing quality, make layers of copper more firm be attached to Steel Wire Surface.
Embodiment
Below in conjunction with an embodiment, steel bead wire copper plating additive formula provided by the invention is described in detail.
Embodiment
The steel bead wire copper plating additive formula of the present embodiment, its component proportion is as follows:
Ethylene thiourea 1.8mg ∕ L,
2-hydroxybenzimidazole 1.2mg ∕ L,
Polydithio-dipropyl sodium sulfate 0.9mg ∕ L,
Polyoxyethylene glycol 90mg ∕ L,
Sodium-chlor 8mg ∕ L,
Ammonium chloride 8mg ∕ L.
Claims (1)
1. a steel bead wire copper plating additive formula, it is characterized in that, its component proportion is as follows:
Ethylene thiourea 1.5-2mg ∕ L,
2-hydroxybenzimidazole, 1-1.5mg ∕ L,
Polydithio-dipropyl sodium sulfate 0.8-1mg ∕ L,
Polyoxyethylene glycol 80-100mg ∕ L,
Sodium-chlor 5-10mg ∕ L,
Ammonium chloride 5-10mg ∕ L.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520820.9A CN104593754A (en) | 2013-10-30 | 2013-10-30 | Tire bead steel wire copper-plating additive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310520820.9A CN104593754A (en) | 2013-10-30 | 2013-10-30 | Tire bead steel wire copper-plating additive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104593754A true CN104593754A (en) | 2015-05-06 |
Family
ID=53119799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310520820.9A Pending CN104593754A (en) | 2013-10-30 | 2013-10-30 | Tire bead steel wire copper-plating additive |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104593754A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112899738A (en) * | 2021-02-10 | 2021-06-04 | 张志梁 | Steel matrix direct cyanide-free copper plating electroplating solution under strong acid condition and preparation method thereof |
-
2013
- 2013-10-30 CN CN201310520820.9A patent/CN104593754A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112899738A (en) * | 2021-02-10 | 2021-06-04 | 张志梁 | Steel matrix direct cyanide-free copper plating electroplating solution under strong acid condition and preparation method thereof |
| WO2022170803A1 (en) * | 2021-02-10 | 2022-08-18 | 张志梁 | Electroplating solution for steel substrate direct cyanide-free plating under strong acidic conditions, and preparation method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150506 |