CN101210327A - Plastic surface copper plating agent and using method thereof - Google Patents
Plastic surface copper plating agent and using method thereof Download PDFInfo
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- CN101210327A CN101210327A CNA2006101556265A CN200610155626A CN101210327A CN 101210327 A CN101210327 A CN 101210327A CN A2006101556265 A CNA2006101556265 A CN A2006101556265A CN 200610155626 A CN200610155626 A CN 200610155626A CN 101210327 A CN101210327 A CN 101210327A
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Abstract
The invention provides a copper plating agent for plating copper on plastic surface and an application method thereof. The copper plating agent is composed of a deoiling agent, a roughing solution, a sensitizing solution, an activating solution, a copper immersing solution, a copper plating solution and a full-bright copper plating solution. The copper plating agent has protection effect and significant decoration effect for plastic, thus obtaining a plastic product with more beautiful profile, firm plating layer, no occurrences of discoloration or color fading over time and complete usage.
Description
Technical field
The present invention relates to a kind of chemical agent and using method thereof, more particularly, relate to a kind of plastic surface copper plating agent and using method thereof.
Background technology
Along with the raising of people's living standard, people also constantly increase the demand of plastics, and the plastics with special efficacy are also had specific demand, particularly have the plastics of metal color.
Summary of the invention
The purpose of this invention is to provide a kind of plastic surface copper plating agent, so that the metal color is scattered in the plastics equably.
Another object of the present invention provides a kind of preparation method of above-mentioned composition.
A kind of plastic surface copper plating agent of the present invention, a kind of plastic surface copper plating agent, it is made up of degreaser, coarsening solution, sensitizing solution, activation solution, copper leaching liquid, copper plating bath and whole bright plating copper liquid, its component is following proportioning respectively: degreaser: sodium hydroxide 80g, yellow soda ash 15g, tertiary sodium phosphate 35g, alkylphenol polyoxyethylene 6ml, pure water 1000ml; Coarsening solution: sulfuric acid 600ml, chromic oxide 30g, pure water 400ml; Sensitizing solution: tin protochloride 10g, tin bar 5~10g, hydrochloric acid 40~50ml, pure water 1000ml; Activation solution: Silver Nitrate 1.5~3g, ammoniacal liquor 2ml, pure water 1000ml; Copper leaching liquid: Seignette salt 45~50g; Sodium hydroxide 9~10g, yellow soda ash 4~5g, copper sulfate 14g, nickelous chloride 4~5g, pure water 1000ml; Copper plating bath: copper sulfate 180~200g, sulfuric acid 40~50ml, ethanol, 5~10ml, pure water 1000ml; Whole bright plating copper liquid: copper sulfate 80~100g, nitrilotriacetic acid(NTA) 15~25g, selenous acid copper 0.2~0.5g, quadrol 50~70ml, ammonium nitrate 30~40g, pure water 1000ml.
The using method of this plastic surface copper plating agent is characterized in that this method may further comprise the steps: with mechanical means with surface of plastic products hacking to be plated, be placed on handle 4~5 minutes in the degreaser after; Put into the coarsening solution alligatoring 10~15 minutes, put into sensitizing solution again 20~30 minutes; Take out and use flushing with clean water, again with the deionized water rinsing number all over after put into the activation solution activation treatment 4~5 minutes, in copper leaching liquid, carry out the electrification processing then; Through 30~40 minutes slow stirring, frosting formed the copper film that one deck can conduct electricity; Then carry out copper facing in acid copper plating bath, voltage is 24V during copper facing, and electric current is 100~10A/ square; Send in the whole bright plating copper liquid 20~30 minutes, pH value is that 7~75 current densities are 200~300 flat.
Embodiment
Further specify the present invention below by embodiment.
Embodiment 1, and its component is following proportioning respectively: degreaser: sodium hydroxide 80g, yellow soda ash 15g, tertiary sodium phosphate 35g, alkylphenol polyoxyethylene 6ml, pure water 1000ml; Coarsening solution: sulfuric acid 600ml, chromic oxide 30g, pure water 400ml; Sensitizing solution: tin protochloride 10g, tin bar 5~10g, hydrochloric acid 40~50ml, pure water 1000ml; Activation solution: Silver Nitrate 1.5~3g, ammoniacal liquor 2ml, pure water 1000ml; Copper leaching liquid: Seignette salt 45~50g; Sodium hydroxide 9~10g, yellow soda ash 4~5g, copper sulfate 14g, nickelous chloride 4~5g, pure water 1000ml; Copper plating bath: copper sulfate 180~200g, sulfuric acid 40~50ml, ethanol, 5~10ml, pure water 1000ml; Whole bright plating copper liquid: copper sulfate 80~100g, nitrilotriacetic acid(NTA) 15~25g, selenous acid copper 0.2~0.5g, quadrol 50~70ml, ammonium nitrate 30~40g, pure water 1000ml.
Degreaser preparation: at first dissolution of sodium hydroxide in the 200ml pure water, constantly stir and make it all after the dissolving, add rest materials again, be stirred to moltenly entirely, add remaining pure water.
The coarsening solution preparation at first adds sulfuric acid in the pure water, constantly stirs, and adds chromic oxide, is stirred to complete promptly molten.
The sensitizing solution preparation adds tin protochloride in the hydrochloric acid, adds pure water and tin bar again, is stirred to molten entirely.
The activation solution preparation in the 1000ml pure water, slowly splashes into strong aqua to silver nitrate solution, the brown precipitation can occur, continues to splash into precipitation again and all dissolves promptly.
The copper leaching liquid preparation is dissolved in material in the pure water respectively.
The copper plating bath preparation is dissolved in copper sulfate in the pure water of prescription, after the stirring and dissolving, adds sulfuric acid and ethanol, fills up the water yield at last and gets final product.
The preparation of whole bright plating copper liquid is dissolved in copper sulfate, selenous acid copper, ammonium nitrate in the pure water, adds nitrilotriacetic acid(NTA) and quadrol again, and stirring gets final product.
With mechanical means with surface of plastic products hacking to be plated, be placed on handle 4~5 minutes in the degreaser after; Put into the coarsening solution alligatoring 10~15 minutes, put into sensitizing solution again 20~30 minutes; Take out and use flushing with clean water, again with the deionized water rinsing number all over after put into the activation solution activation treatment 4~5 minutes, in copper leaching liquid, carry out the electrification processing then;
Through 30~40 minutes slow stirring, frosting formed the copper film that one deck can conduct electricity; Then carry out copper facing in acid copper plating bath, voltage is 24V during copper facing, and electric current is 100~150A/ square;
Send in the whole bright plating copper liquid 20~30 minutes, pH value is 7~7.5, and current density is that the proportioning of 200~300A/ square of this plastic surface copper plating agent is as follows: acetone 100L, Cellulose diacetate 4kg, dibutyl phthalate 1kg, pearlescence 0.05kg, aluminium powder 1kg, pigment 0.05kg.
The present invention has provide protection to plastics, and plastics are had tangible decorative effect, makes plastics more attractive in appearance, and coating is firm, can be along with the prolongation of time variable color or fade, use fully.
, need only and on copper-plated plastics, carry out multiple plating in the nickel plating of plastic plating chromium as needs.
Claims (2)
1. plastic surface copper plating agent, it is made up of degreaser, coarsening solution, sensitizing solution, activation solution, copper leaching liquid, copper plating bath and whole bright plating copper liquid, and its component is following proportioning respectively:
Degreaser: sodium hydroxide 80g, yellow soda ash 15g, tertiary sodium phosphate 35g, alkylphenol polyoxyethylene 6ml, pure water 1000ml;
Coarsening solution: sulfuric acid 600ml, chromic oxide 30g, pure water 400ml;
Sensitizing solution: tin protochloride 10g, tin bar 5~10g, hydrochloric acid 40~50ml, pure water 1000ml;
Activation solution: Silver Nitrate 1.5~3g, ammoniacal liquor 2ml, pure water 1000ml;
Copper leaching liquid: Seignette salt 45~50g; Sodium hydroxide 9~10g, yellow soda ash 4~5g, copper sulfate 14g, nickelous chloride 4~5g, pure water 1000ml;
Copper plating bath: copper sulfate 180~200g, sulfuric acid 40~50ml, ethanol, 5~10ml, pure water 1000ml;
Whole bright plating copper liquid: copper sulfate 80~100g, nitrilotriacetic acid(NTA) 15~25g, selenous acid copper 0.2~0.5g, quadrol 50~70ml, ammonium nitrate 30~40g, pure water 1000ml.
2. the using method of the described plastic surface copper plating agent of claim 1 is characterized in that this method may further comprise the steps:
(1) with mechanical means with surface of plastic products hacking to be plated, be placed on handle 4~5 minutes in the degreaser after; Put into the coarsening solution alligatoring 10~15 minutes, put into sensitizing solution again 20~30 minutes; Take out and use flushing with clean water, again with the deionized water rinsing number all over after put into the activation solution activation treatment 4~5 minutes, in copper leaching liquid, carry out the electrification processing then;
(2) through 30~40 minutes slow stirring, frosting formed the copper film that one deck can conduct electricity; Then carry out copper facing in acid copper plating bath, voltage is 24V during copper facing, and electric current is 100~150A/ square;
(3) send in the whole bright plating copper liquid 20~30 minutes, pH value is 7~7.5, and current density is 200~300A/ square.
Priority Applications (1)
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CNA2006101556265A CN101210327A (en) | 2006-12-30 | 2006-12-30 | Plastic surface copper plating agent and using method thereof |
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CNA2006101556265A CN101210327A (en) | 2006-12-30 | 2006-12-30 | Plastic surface copper plating agent and using method thereof |
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CN101210327A true CN101210327A (en) | 2008-07-02 |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102061499A (en) * | 2010-12-02 | 2011-05-18 | 上海师范大学 | Method for preparing multihole hydroxyapatite/polyurethane composite material by electrochemical deposition |
CN102121101A (en) * | 2011-02-23 | 2011-07-13 | 广东工业大学 | Method for chemically plating copper without palladium on polyester film |
CN103225092A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Plated copper for plastics |
CN103225091A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Aluminum product copper-plating solution |
CN104073788A (en) * | 2014-07-21 | 2014-10-01 | 扬州大学 | Modification method for surface hydrophilization of PVC plastic |
CN104087975A (en) * | 2013-12-19 | 2014-10-08 | 浙江工商大学 | Preparation method of foamed copper |
CN106567114A (en) * | 2016-11-02 | 2017-04-19 | 华南理工大学 | Electroplating method for spraying and activating of surface of ABS plastic |
CN106676917A (en) * | 2016-12-28 | 2017-05-17 | 合肥海景包装制品有限公司 | Engineering plastic surface printing process |
CN111763930A (en) * | 2020-07-14 | 2020-10-13 | 赤壁市聚茂新材料科技有限公司 | Non-palladium activated copper plating process and sensitizer and activator thereof |
-
2006
- 2006-12-30 CN CNA2006101556265A patent/CN101210327A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102061499A (en) * | 2010-12-02 | 2011-05-18 | 上海师范大学 | Method for preparing multihole hydroxyapatite/polyurethane composite material by electrochemical deposition |
CN102121101A (en) * | 2011-02-23 | 2011-07-13 | 广东工业大学 | Method for chemically plating copper without palladium on polyester film |
CN102121101B (en) * | 2011-02-23 | 2012-06-27 | 广东工业大学 | Method for chemically plating copper without palladium on polyester film |
CN103225092A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Plated copper for plastics |
CN103225091A (en) * | 2013-05-22 | 2013-07-31 | 南通鑫平制衣有限公司 | Aluminum product copper-plating solution |
CN104087975A (en) * | 2013-12-19 | 2014-10-08 | 浙江工商大学 | Preparation method of foamed copper |
CN104073788A (en) * | 2014-07-21 | 2014-10-01 | 扬州大学 | Modification method for surface hydrophilization of PVC plastic |
CN106567114A (en) * | 2016-11-02 | 2017-04-19 | 华南理工大学 | Electroplating method for spraying and activating of surface of ABS plastic |
CN106676917A (en) * | 2016-12-28 | 2017-05-17 | 合肥海景包装制品有限公司 | Engineering plastic surface printing process |
CN111763930A (en) * | 2020-07-14 | 2020-10-13 | 赤壁市聚茂新材料科技有限公司 | Non-palladium activated copper plating process and sensitizer and activator thereof |
CN111763930B (en) * | 2020-07-14 | 2022-04-19 | 赤壁市聚茂新材料科技有限公司 | Non-palladium activated copper plating process and sensitizer and activator thereof |
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