CN103208442A - Immersed type permeating lower piece - Google Patents
Immersed type permeating lower piece Download PDFInfo
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- CN103208442A CN103208442A CN201210067835XA CN201210067835A CN103208442A CN 103208442 A CN103208442 A CN 103208442A CN 201210067835X A CN201210067835X A CN 201210067835XA CN 201210067835 A CN201210067835 A CN 201210067835A CN 103208442 A CN103208442 A CN 103208442A
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- chip
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- ceramic disk
- aqueous solution
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Abstract
The invention provides an immersed type permeating lower piece. A process for separating a grinded and polished chip from a ceramic plate is improved to decrease breakage and warping times of the chip in the separating process, and accordingly the yield and the quality of the chip are improved.
Description
Technical field
The invention belongs to the led chip preparation field, relate to the technology that the chip after grinding, polishing is broken away from from ceramic disk.
Background technology
In the preparation process of chip, need chip surface is ground and polishes, usually for easy to process, earlier chip by paraffin and certain pressure fixing on ceramic disk, then chip is ground, polish after being thinned to desired thickness, in this process, be fixed on chip and abrasive wheel on the ceramic disk, polishing disk has the friction of tight contact mutually, abrasive wheel in the process of friction, polishing disk can produce certain stress to chip, by processing, chip is more and more thinner, and stress is also increasing thereupon, the chip warpage, the probability of fragment can constantly increase, and has increased the difficulty that follow-up chip is taken off from ceramic disk relatively.Existing technology mainly contains two kinds, and is a kind of by polished chip, is placed directly in Fast Heating on the heating plate and makes wax dissolving between ceramic disk and the chip, reaches the purpose that makes chip disengaging ceramic disk, is referred to as to heat flake.Because the speed that chip breaks away from the ceramic disk is very fast, chip discharges stress also to be accelerated thereupon, causes the angularity of chip very big, and chip is broken easily.The another kind of artificial chip that promotes is referred to as the external force flake.This process has a large amount of uncontrollable factors, must grasp opportunity, this method is by ceramic disk is heated, after forming the bubble of some between heating process chips and the paraffin, promote chip by the artificial application of force, formed bubble situation when this process paraffin melts, push jack opportunity, and the dynamics of push jack all needs, and we are artificial to judge, must remove to promote chip in rational state, suitable time, suitable dynamics, too early, push away motionless chip, easily chip edge is pushed away broken.Cross slowly, chip can very fast automatic disengaging ceramic disk, is subjected to the influence of chip material, and when chip broke away from ceramic disk automatically, the angularity of chip and fragmentation rate all can increase.
Summary of the invention
The objective of the invention is to break away from easy warpage, broken problem in the ceramic disk process in order to solve chip.
In order to address the above problem, the present inventor passes through experiment test many times, found that by sheet under the immersion infiltration, namely ceramic disk and by wax chip fixed thereon, be immersed in the solution in the lump, by heated solution, the infiltration of hyperacoustic vibrations simultaneously and solution slowly breaks away from chip with ceramic disk, wax.Because chip is by the solution infiltration and utilize ultrasonic echography to make it break away from ceramic disk, the time that discharges stress is not very fast, simultaneously but solution is to the pressure of the chip also speed of control chip Stress Release, the suffered power of whole process chips all is the processes that weighing apparatus is fixed, and it also is a process that slowly increases progressively that chip is heated, so the angularity of chip and fragment also can reduce, allow whole yield promote to some extent.
Immersion infiltration down in the sheet process solutions employed be selected from: water, the aqueous solution, contain the basic component aqueous solution, contain in the aqueous solution of surfactant one or more.
The preferred ultra-pure water of described water.
The described aqueous solution, contain the basic component aqueous solution, contain that the aqueous solution is the aqueous solution of ultra-pure water in the aqueous solution of surfactant.
The described aqueous solution preferably contains the aqueous solution of dewax liquid.
Described basic component is selected from alkali metal hydroxide, as lithium hydroxide, NaOH, potassium hydroxide; Alkaline earth metal hydroxide is as calcium hydroxide, magnesium hydroxide, barium hydroxide; The inorganic hydrogen amine-oxides is as ammonia, hydroxylamine; The organic hydroxide ammonium, as monomethyl ammonium hydroxide, dimethyl hydrogen amine-oxides, trimethylammonium hydroxide, Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, (different) TPAOH, just a kind of in (XOR uncle) TBAH, four pentyl ammonium hydroxide, four hexyl ammonium hydroxide or the choline just, or two or more mixture in above-mentioned.Preferred ammonia, Tetramethylammonium hydroxide or choline in these basic components.
Described surfactant is selected from: a kind of in nonionic surface active agent, anionic surfactant, cationic surface active agent, the amphoteric surfactant, or above-mentioned two or more mixture.
Described heated solution is that (25 ℃) begin heating, solution maximum temperature≤85 ℃ under normal temperature.Preferred 60 ℃-85 ℃.
Described ultrasonic wave, its frequency are 35kHz-55kHz, preferred 40kHz-45kHz.
Chip need grind and polish, for easy to process in preparation process chip, need chip by paraffin and certain pressure fixing on ceramic disk, grind, polish, to be ground, the polishing after again chip is taken off from ceramic disk, again the chip of taking off is cleaned.The present invention takes off the improvement of this technology at the chip after former grinding, the polishing from ceramic disk, and purpose is that control chip takes off this process chips angularity and percentage of damage thereof from ceramic disk.
Chip is immersed in the solution in the lump with ceramic disk after grinding, polishing, and solution is heated, and utilizes the ultrasonic infiltration that involves solution that chip is slowly broken away from ceramic disk, wax with Ultrasound Instrument simultaneously.Because chip makes it break away from ceramic disk by utilizing the infiltration of ultrasonic echography and solution, so all keep weighing apparatus fixed in the little and whole process of stress of chip disengaging ceramic disk relatively, temperature because of solution begins slowly to be heated to maximum temperature from room temperature in addition, can not make chip temperature drastic change, reduce warpage or the broken probability of chip.
Can directly fall into container bottom after process chips of the present invention breaks away from ceramic disk, with container certain friction be arranged, chip surface easily scratches, and the easy company of subsides between a plurality of chips has increased follow-up difficulty of getting sheet in addition.The present invention discloses a kind of shelf on the other hand, be referred to as immersion infiltration horse such as Fig. 1-2 down, this shelf is made up of two parts, a part is for the chip of placing ceramic disk and fixed thereon, be referred to as ceramic plate rail, ceramic plate rail, another part are the chips under coming off from ceramic disk for placement, be referred to as chip carrier, specifically see accompanying drawing 1 immersion infiltration horse down.Ceramic disk lies in a horizontal plane in the following horse of immersion infiltration, ceramic disk in the above, chip below, the corresponding chip carrier of each chip, when chip directly falls in the chip carrier after ceramic disk breaks away from, do not paste and connect phenomenon and container bottom or a plurality of chip can not occur falling into.
Description of drawings
Following accompanying drawing is for the present invention is further described, but not limits the scope of the present invention.
The infiltration of Fig. 1 immersion is horse pottery plate rail down
The infiltration of Fig. 2 immersion is the horse chip carrier down
Execution mode
Following embodiment mainly is for the present invention that further explains, rather than to the restriction of claim protection range of the present invention.
Embodiment 1
Get 180 4 inches chips, be separately fixed on the ceramic disk by paraffin and pressure, after grinding, polishing, be divided into four groups of A, B, C, D at random, every group each 45, A group heats flake, ceramic disk and on chip be placed directly in Fast Heating on the heating plate and make wax dissolving between ceramic disk and the chip, chip breaks away from from ceramic disk.The B group is carried out the external force flake, and ceramic disk is heated, and after forming the bubble of some between heating process chips and the paraffin, the application of force promotes chip, and chip breaks away from from ceramic disk.The C group is carried out immersion type infiltration sheet down, ceramic disk and the chip on it are put into immersion type infiltration horse down, chip down, level is immersed in and is added with in the dewax ultra-pure water solution at night, and this solution under the room temperature is heated, open Ultrasound Instrument simultaneously, frequency adjustment is utilized the ultrasonic infiltration that involves solution to 41kHz, and heated solution to 60 ℃ slowly, make chip slowly break away from, and fall in the chip carrier with ceramic disk, wax.The D group is carried out immersion type infiltration sheet down, ceramic disk and the chip on it are put into immersion type infiltration horse down, chip down, level is immersed in the ultra-pure water, and the ultra-pure water under the room temperature is heated, open Ultrasound Instrument simultaneously, frequency adjustment is utilized the ultrasonic infiltration that involves ultra-pure water to 43kHz, and heated solution to 67 ℃ slowly, make chip slowly break away from, and fall in the chip carrier with ceramic disk, wax.
Chip after breaking away from is carried out the ratio that warpage and crushing account for the pilot chip amount, draw separately warpage rate and percentage of damage.Specifically see Table 1.
Quality after table 1 chip breaks away from from ceramic disk
| Group | The chip experiment quantity | Amount of warpage | Crushing | The warpage rate | Percentage of damage | Qualification rate |
| A | 45 | 8 | 1 | 17.78% | 2.22% | 80.00% |
| B | 45 | 1 | 6 | 2.22% | 13.33% | 84.44% |
| C | 45 | 0 | 0 | 0 | 0 | 100% |
| D | 45 | 0 | 0 | 0 | 0 | 100% |
Embodiment 2
Get 160 2 inches chips, be separately fixed on the ceramic disk by paraffin and pressure, after grinding, polishing, be divided into four groups of A, B, C, D at random, every group each 40, A group heats flake, ceramic disk and on chip be placed directly in Fast Heating on the heating plate and make wax dissolving between ceramic disk and the chip, chip breaks away from from ceramic disk.The B group is carried out the external force flake, and ceramic disk is heated, and after forming the bubble of some between heating process chips and the paraffin, the application of force promotes chip, and chip breaks away from from ceramic disk.The C group is carried out immersion type infiltration sheet down, ceramic disk and the chip on it are put into immersion type infiltration horse down, chip down, level is immersed in the ultra-pure water solution that is added with dewax liquid, and this solution under the room temperature is heated, open Ultrasound Instrument simultaneously, frequency adjustment is utilized the ultrasonic infiltration that involves solution to 45kHz, and heated solution to 60 ℃ slowly, make chip slowly break away from, and fall in the chip carrier with ceramic disk, wax.The D group is carried out immersion type infiltration sheet down, ceramic disk and the chip on it are put into immersion type infiltration horse down, chip down, level is immersed in the ultra-pure water solution of choline, and the solution under the room temperature is heated, open Ultrasound Instrument simultaneously, frequency adjustment is utilized the ultrasonic infiltration that involves solution to 44kHz, and heated solution to 62 ℃ slowly, make chip slowly break away from, and fall in the chip carrier with ceramic disk, wax.
Chip after breaking away from is carried out the ratio that warpage and crushing account for the pilot chip amount, draw separately warpage rate and percentage of damage.Specifically see Table 2.
Quality after table 2 chip breaks away from from ceramic disk
| Group | The chip experiment quantity | Amount of warpage | Crushing | The warpage rate | Percentage of damage | Qualification rate |
| A | 40 | 4 | 1 | 10.00% | 2.50% | 87.50% |
| B | 40 | 1 | 5 | 2.50% | 12.50% | 85.00% |
| C | 40 | 0 | 0 | 0 | 0 | 100% |
| D | 40 | 0 | 0 | 0 | 0 | 100% |
Claims (10)
1. one kind makes chip from the method that ceramic disk breaks away from, and it is characterized in that adopting the mode of submergence, infiltration that chip is broken away from from ceramic disk.
2. the described method of claim 1 is characterized in that submergence, penetration mode for ceramic disk and by wax chip fixed thereon, are immersed in the solution in the lump, and the infiltration by heated solution and solution makes chip and ceramic disk, wax disengaging.
3. the described method of claim 2 is characterized in that ceramic disk and is immersed in the solution by wax chip fixed thereon that it is ultrasonic to utilize Ultrasound Instrument to carry out simultaneously.
4. claim 2 or 3 described methods is characterized in that the temperature of solution begins heating from normal temperature, the maximum temperature of solution≤85 ℃.
5. the described method of claim 4 is characterized in that maximum temperature≤85 ℃ of 60 ℃≤solution.
6. the described method of claim 3, the supersonic frequency that it is characterized in that Ultrasound Instrument is 35kHz-55kHz.
7. the described method of claim 6 is characterized in that the preferred 40kHz-45kHz of supersonic frequency of Ultrasound Instrument.
8. the described method of claim 2 is characterized in that described solution is selected from: water, the aqueous solution, contain the basic component aqueous solution, contain in the aqueous solution of surfactant one or more.
9. the described method of claim 8 is characterized in that described water is ultra-pure water, the described aqueous solution, contains the basic component aqueous solution, contains that the aqueous solution is the aqueous solution of ultra-pure water in the aqueous solution of surfactant.
10. the method for claim 1-9 further comprises a kind of immersion infiltration horse down, formed by two parts, a part is for the chip of placing ceramic disk and fixed thereon, be referred to as ceramic plate rail, another part is the chip under coming off from ceramic disk for placement, be referred to as chip carrier, ceramic plate rail, chip carrier are formed immersion infiltration horse down jointly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210067835XA CN103208442A (en) | 2012-03-15 | 2012-03-15 | Immersed type permeating lower piece |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210067835XA CN103208442A (en) | 2012-03-15 | 2012-03-15 | Immersed type permeating lower piece |
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| CN103208442A true CN103208442A (en) | 2013-07-17 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526538A (en) * | 2014-11-18 | 2015-04-22 | 天津中环领先材料技术有限公司 | Novel silicon wafer wax-polishing method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010005043A1 (en) * | 1999-12-24 | 2001-06-28 | Masaki Nakanishi | Semiconductor device and a method of manufacturing the same |
| CN201077033Y (en) * | 2007-04-19 | 2008-06-25 | 刘培东 | Integral polishing ceramic plate for silicon chip wax-free polishing |
| CN101752243A (en) * | 2008-12-08 | 2010-06-23 | 北京有色金属研究总院 | Method for removing silicon dioxide film on front chemical vapor deposition layer |
| US20100190296A1 (en) * | 2005-11-22 | 2010-07-29 | Success International Corporation | Method of manufacturing semiconductor device |
| CN201619014U (en) * | 2010-04-02 | 2010-11-03 | 北京特能设备有限公司 | Horizontal type glass straight four-side grinding wheel edge finishing machine |
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2012
- 2012-03-15 CN CN201210067835XA patent/CN103208442A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010005043A1 (en) * | 1999-12-24 | 2001-06-28 | Masaki Nakanishi | Semiconductor device and a method of manufacturing the same |
| US20100190296A1 (en) * | 2005-11-22 | 2010-07-29 | Success International Corporation | Method of manufacturing semiconductor device |
| CN201077033Y (en) * | 2007-04-19 | 2008-06-25 | 刘培东 | Integral polishing ceramic plate for silicon chip wax-free polishing |
| CN101752243A (en) * | 2008-12-08 | 2010-06-23 | 北京有色金属研究总院 | Method for removing silicon dioxide film on front chemical vapor deposition layer |
| CN201619014U (en) * | 2010-04-02 | 2010-11-03 | 北京特能设备有限公司 | Horizontal type glass straight four-side grinding wheel edge finishing machine |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104526538A (en) * | 2014-11-18 | 2015-04-22 | 天津中环领先材料技术有限公司 | Novel silicon wafer wax-polishing method |
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Application publication date: 20130717 |