CN103194047A - High-radiating printed board insulating layer and preparation method thereof - Google Patents
High-radiating printed board insulating layer and preparation method thereof Download PDFInfo
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- CN103194047A CN103194047A CN 201310107942 CN201310107942A CN103194047A CN 103194047 A CN103194047 A CN 103194047A CN 201310107942 CN201310107942 CN 201310107942 CN 201310107942 A CN201310107942 A CN 201310107942A CN 103194047 A CN103194047 A CN 103194047A
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Abstract
The invention discloses a high-radiating printed board insulating layer and a preparation method of the high-radiating printed board insulating layer. The high-radiating printed board insulating layer is prepared by taking a halogen-free modified resin as a principle component and adding a proper amount of halogen-free radiating reinforcing agent, wherein the halogen-free modified resin is a copolymerization modified halogen-free resin; the halogen-free radiating reinforcing agent is a halogen-free mixture of nano silicon carbide and nano aluminum oxide. Compared with the prior art, the high-radiating printed board insulating layer has the advantages that 1, the halogen-free resin is modified by adopting the copolymerization technology, and the insulating property of the circuit board base material is effectively improved; 2, due to adding of the halogen-free radiating reinforcing agent, the circuit board has high radiating performance; and 3, the circuit board base material which meets the halogen-free requirements is prepared by adopting the halogen-free raw materials, and the application range is widened. The high-radiating printed board insulating layer is high in practicality and high in application potential.
Description
Technical field
The present invention relates to used in electronic industry wiring board technical field, is improvements over the prior art, is specifically related to a kind of high heat radiation printed board insulation layer and preparation method thereof.
Background technology
Wiring board, the printed circuit board that is otherwise known as, PCB, aluminium base etc.It is the indispensable a kind of matrix material of hyundai electronics industry.From in essence, wiring board generally is made of metal-based layer, copper foil layer and insulation layer.Wherein, insulation layer is the key component of wiring board, main insulation and the conductive force of rising.Along with electronic product constantly towards the density height, volume is little, function is strong, high-power direction develops, people require higher to the thermal diffusivity of wiring board insulation layer and insulativity.Existing insulating layer material often can not satisfy the requirement of the timely and effective heat radiation of electronic product, causes electronic package can't realize expectation function.Yet, install heat abstractor (as fan etc.) additional and not only take big quantity space but also increase small product size and weight, can't satisfy service requirements.In addition; along with the ever more important of people to environment protection and personnel safety; the non-halogen of electronic product comes into effect, but Halogen insulation layer in the market can't meet people's requirement fully, presses for the Halogen board substrate of developing the energy high efficiency and heat radiation.
Summary of the invention
A kind of high heat radiation printed board insulation layer that the objective of the invention is to avoid above-mentioned weak point of the prior art and provide and preparation method thereof.This board substrate has excellent insulating property, heat dispersion and satisfy the Halogen requirement efficiently.
Purpose of the present invention can realize by following measure:
The high heat radiation of the present invention printed board insulation layer, its ingredient weight percent (%) is::
Halogen heat radiation toughener 1.5 ~ 11.0%
Solidifying agent 5.0 ~ 25.0%
Softening agent 1.0 ~ 6.0%
Coupling agent 0.1 ~ 3.0%
Solvent 5.0 ~ 25.0%
All the other are Halogen modified resin, and each composition weight sum is 100%.
Described Halogen heat radiation toughener is the Halogen mixture that 30.0 ~ 60.0% nanometer silicon carbides and 40.0 ~ 70.0% nano-aluminium oxides are formed.It mainly acts on is to make wiring board have heat dispersion efficiently.
Described solidifying agent is diethylenetriamine, N, N '-dihydroxy ethyl diethylenetriamine, Triethylenetetramine (TETA), ten dimethylene diamines, trimethylhexamethylenediamine, 4,4 '-diamino-3,3 '-diethyl ditane, 3,3 '-diaminodiphenylsulfone(DDS), 4, one or more in 4 '-diaminodiphenylsulfone(DDS).It mainly acts on and is and Resins, epoxy generation chemical reaction, forms netted space polymer, makes the line style resin become tough and tensile build solid.
Described softening agent is one or more in glycol ether benzoic ether, Vanay, hexanodioic acid propylene glycol polyester, sebacic acid propylene glycol polyester, epoxidation tri-glyceride, the epoxyoleic acid butyl ester.It mainly acts on is the plasticity and toughness that increase board substrate, improves the shock resistance of board substrate.。
Described coupling agent is one or more in γ-(2,3-epoxy, third oxygen) propyl trimethoxy silicane, γ-An Bingjisanyiyangjiguiwan, N-β (aminoethyl)-γ-aminopropyl methyl dimethoxy oxygen base silicon, N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan, two-[γ-(triethoxysilicane) propyl group] tetrasulfide.It mainly acts on is to improve cohesive force under the hygrometric state and weathering resistance etc., strengthens crosslinked with resin.
Described solvent is methylethylketone, dibutyl phthalate, 1, one or more in 2-benzene dihydroxy acid dibutylester, N-BUTYL ACETATE, the vinyl acetic monomer.It mainly acts on is that the reduction viscosity is easy to use, and prolongs the storage time of product.
In the halogen-free epoxy resin that described Halogen modified resin is the acrylic acid copolymer modification, the halogen-free epoxy resin of urethane modification by copolymerization one or more.It mainly acts on is the insulativity that has effectively strengthened board substrate, and prolongs the work-ing life of circuit card.
The preparation method of the high heat radiation of the present invention printed board insulation layer, comprise the steps: that (1) is successively with Halogen modified resin, 1.0 ~ 6.0% softening agent and 5.0 ~ 25.0% solvents, add in the vacuum planetary mixer, stir 30min ± 5min, wherein vacuum tightness is that 0.065 ~ 0.085MPa, rotating speed are 50r/min ± 10r/min; (2) add the heat radiation of 1.5 ~ 11.0% Halogens toughener, 5.0 ~ 25.0% solidifying agent and 0.1 ~ 3.0% coupling agent more successively, wherein vacuum tightness is that 0.065 ~ 0.085MPa, rotating speed are 300 r/min ± 50r/min; Namely get the high heat radiation of the present invention printed board insulation layer.
The present invention has following advantage compared to existing technology: the one, and adopt copolymerization technique that the Halogen resin is carried out modification, effectively strengthened the insulativity of board substrate; The 2nd, the interpolation of Halogen heat radiation toughener makes wiring board have heat dispersion efficiently; The 3rd, adopt the Halogen raw material preparing to obtain meeting the board substrate of Halogen requirement, further increase its scope of application.The present invention is practical, and application potential is big.
Embodiment
Embodiment 1: the high heat radiation of the present invention printed board insulation layer, be prepared according to following steps: (1) is successively with halogen-free epoxy resin, the 1.0% hexanodioic acid propylene glycol polyester and 25.0%1 of 67.4% acrylic acid copolymer modification, 2-benzene dihydroxy acid dibutylester, add in the vacuum planetary mixer, stir 30min ± 5min, wherein vacuum tightness is that 0.075MPa, rotating speed are 55r/min; (2) add 0.45% nanometer silicon carbide, 1.05% nano-aluminium oxide, 5.0% N more successively, N '-dihydroxy ethyl diethylenetriamine and 0.1% γ-(2,3-epoxy third oxygen) propyl trimethoxy silicane, wherein vacuum tightness is that 0.075MPa, rotating speed are 300 r/min; Namely get high heat radiation printed board insulation layer.After tested: thermal conductivity is 2.3W/ (mK), and be 1 year storage time, and the room temperature shearing resistance is 22kg/die, and cl content is 0.0ppm, and bromine content is 500ppm, and the content of chlorine+bromine is 500ppm.
Embodiment 2: the high heat radiation of the present invention printed board insulation layer, be prepared according to following steps: (1) is successively with the halogen-free epoxy resin of 29.5% urethane modification by copolymerization, halogen-free epoxy resin, 3.0% softening agent and the 15.0% dibutyl phthalate of 30.0% acrylic acid copolymer modification, add in the vacuum planetary mixer, stir 30min, wherein vacuum tightness is that 0.075MPa, rotating speed are 50r/min; (2) add 3.0% nanometer silicon carbide, 3.0% nano-aluminium oxide, 15.0%3 more successively, 3 '-diaminodiphenylsulfone(DDS) and 1.5%N-β (aminoethyl)-γ-aminopropyl methyl dimethoxy oxygen base silicon, wherein vacuum tightness is that 0.075MPa, rotating speed are 340 r/min; Namely get the high heat radiation of the present invention printed board insulation layer; After tested: thermal conductivity is 3.2W/ (mK), and be 1 year storage time, and the room temperature shearing resistance is 24kg/die, and cl content is 0.0ppm, and bromine content is 100ppm, and the content of chlorine+bromine is 100ppm.
Embodiment 3: the high heat radiation of the present invention printed board insulation layer, be prepared according to following steps: (1) is successively with halogen-free epoxy resin, 6.0% glycol ether benzoic ether and 5.0% methylethylketone of 70.0% acrylic acid copolymer modification, add in the vacuum planetary mixer, stirring 30min wherein vacuum tightness is that 0.075MPa, rotating speed are 50r/min; (2) add 6.0% nanometer silicon carbide, 5.0% nano-aluminium oxide, 5.0% N more successively, N '-dihydroxy ethyl diethylenetriamine and 3.0% pair-[γ-(triethoxysilicane) propyl group] tetrasulfide, wherein vacuum tightness is that 0.075MPa, rotating speed are 300 r/min; Namely get the high heat radiation of the present invention printed board insulation layer; After tested: thermal conductivity is 3.2W/ (mK), and be 1 year storage time, and the room temperature shearing resistance is 20kg/die, and cl content is 0.0ppm, and bromine content is 150ppm, and the content of chlorine+bromine is 150ppm.
Claims (8)
1. one kind high heat radiation printed board insulation layer, its ingredient weight percent (%) is::
Halogen heat radiation toughener 1.5 ~ 11.0%
Solidifying agent 5.0 ~ 25.0%
Softening agent 1.0 ~ 6.0%
Coupling agent 0.1 ~ 3.0%
Solvent 5.0 ~ 25.0%
All the other are Halogen modified resin, and each composition weight sum is 100%.
2. high heat radiation printed board insulation layer according to claim 1, it is characterized in that: described Halogen heat radiation toughener is the Halogen mixture that 30.0 ~ 60.0% nanometer silicon carbides and 40.0 ~ 70.0% nano-aluminium oxides are formed.
3. high heat radiation printed board insulation layer according to claim 1, it is characterized in that: described solidifying agent is diethylenetriamine, N, N '-dihydroxy ethyl diethylenetriamine, Triethylenetetramine (TETA), ten dimethylene diamines, trimethylhexamethylenediamine, 4,4 '-diamino-3,3 '-diethyl ditane, 3,3 '-diaminodiphenylsulfone(DDS), 4, one or more in 4 '-diaminodiphenylsulfone(DDS).
4. high heat radiation printed board insulation layer according to claim 1, it is characterized in that: described softening agent is one or more in glycol ether benzoic ether, Vanay, hexanodioic acid propylene glycol polyester, sebacic acid propylene glycol polyester, epoxidation tri-glyceride, the epoxyoleic acid butyl ester.
5. high heat radiation printed board insulation layer according to claim 1, it is characterized in that: described coupling agent is one or more in γ-(2,3-epoxy, third oxygen) propyl trimethoxy silicane, γ-An Bingjisanyiyangjiguiwan, N-β (aminoethyl)-γ-aminopropyl methyl dimethoxy oxygen base silicon, N-(β-aminoethyl)-γ-An Bingjisanjiayangjiguiwan, two-[γ-(triethoxysilicane) propyl group] tetrasulfide.
6. high heat radiation printed board insulation layer according to claim 1, it is characterized in that: described solvent is methylethylketone, dibutyl phthalate, 1, one or more in 2-benzene dihydroxy acid dibutylester, N-BUTYL ACETATE, the vinyl acetic monomer.
7. high heat radiation printed board insulation layer according to claim 1 is characterized in that: one or more in the halogen-free epoxy resin that described Halogen modified resin is the acrylic acid copolymer modification, the halogen-free epoxy resin of urethane modification by copolymerization.
8. the preparation method of high heat radiation printed board insulation layer according to claim 1, it is characterized in that, comprise the steps: that (1) is successively with Halogen modified resin, 1.0 ~ 6.0% softening agent and 5.0 ~ 25.0% solvents, add in the vacuum planetary mixer, stir 30min ± 5min, wherein vacuum tightness is that 0.065 ~ 0.085MPa, rotating speed are 50r/min ± 10r/min; (2) add the heat radiation of 1.5 ~ 11.0% Halogens toughener, 5.0 ~ 25.0% solidifying agent and 0.1 ~ 3.0% coupling agent more successively, wherein vacuum tightness is that 0.065 ~ 0.085MPa, rotating speed are 300 r/min ± 50r/min; Namely get the high heat radiation of the present invention printed board insulation layer.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201310107942 CN103194047A (en) | 2013-03-31 | 2013-03-31 | High-radiating printed board insulating layer and preparation method thereof |
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| CN 201310107942 CN103194047A (en) | 2013-03-31 | 2013-03-31 | High-radiating printed board insulating layer and preparation method thereof |
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| CN103194047A true CN103194047A (en) | 2013-07-10 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104497491A (en) * | 2014-12-23 | 2015-04-08 | 安徽助成信息科技有限公司 | Method for improving thermal conductivity of epoxy resin based on nanometer silicon carbide |
| CN109181223A (en) * | 2018-08-01 | 2019-01-11 | 广东和润新材料股份有限公司 | Insulating radiation composition, insulating radiation pad pasting and insulating radiation cover cover preparation method |
-
2013
- 2013-03-31 CN CN 201310107942 patent/CN103194047A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104497491A (en) * | 2014-12-23 | 2015-04-08 | 安徽助成信息科技有限公司 | Method for improving thermal conductivity of epoxy resin based on nanometer silicon carbide |
| CN109181223A (en) * | 2018-08-01 | 2019-01-11 | 广东和润新材料股份有限公司 | Insulating radiation composition, insulating radiation pad pasting and insulating radiation cover cover preparation method |
| CN109181223B (en) * | 2018-08-01 | 2021-02-23 | 广东和润新材料股份有限公司 | Insulating and heat-dissipating composition, insulating and heat-dissipating adhesive film and preparation method of insulating and heat-dissipating mask |
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Application publication date: 20130710 |