CN109181223B - Insulating and heat-dissipating composition, insulating and heat-dissipating adhesive film and preparation method of insulating and heat-dissipating mask - Google Patents
Insulating and heat-dissipating composition, insulating and heat-dissipating adhesive film and preparation method of insulating and heat-dissipating mask Download PDFInfo
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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Abstract
The invention relates to the technical field of insulating and heat-dissipating materials, in particular to an insulating and heat-dissipating composition, an insulating and heat-dissipating film and a preparation method of an insulating and heat-dissipating mask, wherein the insulating and heat-dissipating composition comprises the following raw materials in parts by weight: 60-80 parts of epoxy resin, 20-35 parts of tung oil, 40-50 parts of cross-linked polyethylene resin, 10-15 parts of polyurethane resin, 30-40 parts of heat-conducting insulating filler, 10-20 parts of moisture retention aid, 11-19 parts of plasticizer, 12-20 parts of silicon dioxide, 11-16 parts of sericite powder, 9-12 parts of curing agent, 5-10 parts of coupling agent and 25-36 parts of cosolvent.
Description
Technical Field
The invention relates to the technical field of insulating and heat-dissipating materials, in particular to an insulating and heat-dissipating composition, an insulating and heat-dissipating adhesive film and a preparation method of an insulating and heat-dissipating mask.
Background
The shielding cover is a tool for shielding the influence of external electromagnetic waves on an internal circuit and the outward radiation of the electromagnetic waves generated inside, and is mainly applied to the fields of mobile phones, GPS and the like. The shielding case is made of stainless steel with a thickness of 0.2mm and copper white, wherein the copper white is not only a metal shielding material which is easy to be tinned, but also has a certain conductivity, and the shielding case made of copper white may be electrically connected with an electronic element or a PCB board, which may cause an open circuit of the electronic element or a short circuit of the PCB board, and affect the normal and stable operation of the electronic product. Meanwhile, electronic product components can generate heat when working, when the heat inside the electronic product cannot be diffused to the outside of the electronic product in time through the shielding case, the heat inside the electronic product can be concentrated, and the temperature of the electronic components is increased to cause the problem of dead halt or component burnout. Therefore, the heat dissipation performance and the insulation performance of the shielding case are critical to the service life of the electronic product.
Disclosure of Invention
In order to overcome the defects and shortcomings in the prior art, the first object of the present invention is to provide an insulating and heat dissipating composition, which has excellent electrical insulating performance and load performance, and has the characteristics of good flame retardant effect and good smoke suppression performance in a high temperature environment.
The second objective of the present invention is to provide a method for preparing an insulating heat dissipation film, wherein the insulating heat dissipation film prepared by simple preparation steps has high adhesion and thin thickness, and is suitable for application of a shielding case.
The third purpose of the invention is to provide a preparation method of the insulating heat dissipation shielding case, wherein the prepared insulating heat dissipation shielding case has the heat conductivity coefficient of between 101 and 103W/(m.k), the electric strength of between 84 and 89KV/mm, and the volume resistivity of 1.48x1013-1.82x1013Omega cm, surface resistivity of 1.34x1013-1.82x1013And the electric insulation performance and the heat dissipation performance are excellent between omega, and the preparation steps are simple, safe and controllable.
The first purpose of the invention is realized by the following technical scheme: an insulating heat-dissipating composition comprises the following raw materials in parts by weight: 60-80 parts of epoxy resin, 20-35 parts of tung oil, 40-50 parts of cross-linked polyethylene resin, 10-15 parts of polyurethane resin, 30-40 parts of heat-conducting insulating filler, 10-20 parts of moisture retention aid, 11-19 parts of plasticizer, 12-20 parts of silicon dioxide, 11-16 parts of sericite powder, 9-12 parts of curing agent, 5-10 parts of coupling agent and 25-36 parts of cosolvent.
According to the invention, the insulating and heat-dissipating composition is prepared by adopting the raw materials in parts by weight, and the epoxy resin, the tung oil, the crosslinked polyethylene resin and the polyurethane resin are compounded, so that the composition has excellent electric insulating property and load performance, and has the characteristics of good flame retardant effect and good smoke suppression property in a high-temperature environment.
The polyurethane resin and the epoxy resin are compounded, so that the compounded resin not only has the characteristics of large bonding force and small shrinkage rate of the epoxy resin, but also has high toughness and excellent tensile strength and shear strength. The crosslinked polyethylene resin with excellent electrical insulation effect and large current-carrying capacity and the tung oil are added into the composite resin system to modify the epoxy resin matrix, so that the electrical insulation effect and the load capacity of the composition can be effectively improved, and the addition of the tung oil is also beneficial to improving the adhesive force of the composition.
The sericite powder has excellent infrared radiation capability, and can reduce damage of light and heat to a coating film of the composition and increase acid resistance and alkali resistance of a coating of the composition when added into the composition; the silicon dioxide has strong absorption capacity to the spectrum of the wave band above 8 microns, and the silicon dioxide and the sericite powder are mixed for use, so that a good radiation refrigeration layer can be formed in the composite resin matrix, and the heat dissipation capacity of the coating is improved through the radiation effect. Therefore, the heat-conducting insulating filler and the radiation filler are synergistic, so that the composition coating has excellent heat dissipation performance, and the heat dissipation performance of the composition is improved and the insulation performance of the composition is further improved by adding the heat-conducting insulating filler.
By mixing the heat-conducting insulating filler, the silicon dioxide and the sericite powder in parts by weight, the mixed composite filler is bridged in a composite resin system to form a continuous heat-conducting network, so that the heat-conducting property of the composition is effectively improved, and meanwhile, the mechanical property of the coating is further improved by the heat-conducting insulating filler bridged in the composite resin matrix.
The coupling agent in parts by weight is added to modify the heat-conducting insulating filler, so that the uniform dispersibility of the heat-conducting insulating filler in a composite resin system is further improved, the interface thermal resistance of the heat-conducting insulating filler and the composite resin system is reduced, and the heat dissipation performance of the composition is further improved.
The composite resin system and the curing agent form a composite coating after a crosslinking reaction, so that the film forming property and the mechanical property of the composite resin are improved, the curing temperature of the composite is reduced, the composite is cured at a lower temperature to form a film, and the energy loss is reduced. When the curing agent is added in parts by weight, the film forming performance of the composite resin is good, the mechanical performance and the adhesion performance of a coating after film forming are good, when the content of the curing agent is too low, the crosslinking density of the composite resin and the curing agent is too low, so that the composite resin is difficult to form a film, and when the content of the curing agent is too high, the crosslinking density of the composite resin and the curing agent is too high, so that the adhesion performance of the composition is influenced.
The addition of the moisturizing aid is beneficial to prolonging the storage stability period of the composition, so that the composition still has certain humidity after being placed for a long time to keep the original adhesive property of the composition, the curing and film forming of the composite resin can be influenced when the content of the moisturizing aid is higher than 20 parts by weight, and the storage time of the composition can be reduced when the content of the moisturizing aid is lower than 10 parts by weight, so that the viscosity of the composition is reduced.
Preferably, the cosolvent is a mixture of isopropanol and propylene glycol methyl ether in a weight ratio of 3-8: 6-11.
When the isopropanol and the propylene glycol methyl ether are mixed according to the weight ratio, the prepared mixed system has excellent film forming performance, is more beneficial to uniformly and stably dispersing other raw material components in a composite resin system, improves the weather resistance and the mechanical property of the composition, and the coating after film forming has excellent heat dispersion, insulating property and high adhesive force.
The invention is further configured to: the heat-conducting insulating filler is at least one of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride and silicon carbide.
The heat-conducting insulating filler has good heat-conducting effect and insulating effect, improves the heat-conducting property of the composition, and further improves the insulating property of the composition, so that the composition can show good insulating property and heat dissipation property when the usage amount of the composition is smaller.
The invention is further configured to: the heat-conducting insulating filler is nano-scale needle-shaped, granular, fibrous and columnar filler.
The particles with different shapes are bridged in the composite resin system, so that more points of mutual contact among the particles with different shapes are provided, the bridging rate is improved, and more heat conduction paths are formed in the composite resin system. Therefore, the invention simultaneously utilizes the heat-conducting insulating fillers with different particle sizes, different shapes and different types to be mixed for use, increases the mutual contact and interaction among the fillers, can obtain higher heat conductivity coefficient under the condition of lower filler content, and the nanoscale insulating heat-conducting filler can improve the stacking degree of the fillers, improve the heat conductivity and further improve the heat radiation performance of the composition. Preferably, the weight ratio of the acicular filler, the granular filler, the fibrous filler and the columnar filler is 1:2.5:1.5: 0.8.
The invention is further configured to: the moisture retention aid is a mixture of glycerol and a water retention agent according to the weight ratio of 1-2: 0.01-0.1.
Because the water-retaining agent has good reversibility of absorbing and releasing water and good water absorbing capacity, the glycerol and the water-retaining agent are compounded, the using amount of the glycerol can be greatly reduced, the composition can keep certain humidity for a long time under the condition of adding a small amount of the glycerol, the water-retaining agent can release water from the inside to wet the composition when the humidity of the composition is too low, the water-retaining agent can absorb the water in the composition when the humidity of the composition is too high, and the addition of the water-retaining agent can adjust the humidity of the composition, so that the composition can keep certain humidity in a dry or humid environment. When the adding amount of the water retaining agent is too large, the humidity of the composition is too large, the water retaining agent absorbs water and expands to influence the film forming of the composition, and when the content of the water retaining agent is too low, the effect of the water retaining agent on the humidity regulation of the composition is not obvious.
The water-retaining agent is at least one of polyacrylamide, sodium polyacrylate, potassium polyacrylate, ammonium polyacrylate and starch grafted acrylate.
The water-retaining agent has good water-retaining effect and long water-retaining period, and is more favorable for adjusting the humidity of the composition in the storage process.
The invention is further configured to: the curing agent is a closed isocyanate curing agent which is prepared by using at least one of butanone oxime, phenol and ethylene glycol as a sealing agent to seal hexamethylene diisocyanate.
The deblocking temperature of the sealant is lower, hexamethylene diisocyanate can be deblocked at lower temperature, and free isocyanate groups are generated to generate a crosslinking reaction with crosslinking groups on a composite resin chain, so that the composition is cured to form a coating, the curing temperature is reduced, energy is saved, and the film-forming property is improved.
The invention is further configured to: the coupling agent is at least one of vinyl triethoxysilane, aniline methyl triethoxysilane, gamma-methacryloxypropyl trimethoxysilane, methyl triethoxysilane, pyrophosphate titanate and vinyl tri (beta-methoxyethoxy) silane; the plasticizer is at least one of dioctyl phthalate, dibutyl phthalate, diheptyl phthalate, diisodecyl phthalate and diisooctyl phthalate.
By adopting the coupling agent of the type, the coupling agent can be matched with other raw materials to perform synergistic reaction, so that the tight combination among the raw materials is effectively improved, the interface performance between a composite resin system and heat-conducting insulating filler, silicon dioxide and sericite powder can be improved, and the dispersibility, viscosity, compatibility and processability of the raw materials are improved, so that the prepared composition has better heat resistance, dispersibility and binding power, and has excellent electric insulating property and heat dissipation performance; the adopted vinyl triethoxysilane can effectively improve the affinity among the raw materials and enhance the strength of the composition; the adopted gamma-methacryloxypropyltrimethoxysilane improves the mechanical property, the electrical property and the weather resistance of the composition, and has good adhesive force and strong durability; the adopted methyl triethoxysilane can effectively improve the performances of the composition such as impact resistance, rheological property, processability, stability and the like.
The second purpose of the invention is realized by the following technical scheme: a preparation method of an insulating heat dissipation film comprises the following steps:
s1, preparing the insulating and heat-dissipating composition: adding the epoxy resin, the tung oil, the cross-linked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent in parts by weight into a cosolvent, and heating while stirring to obtain a solution A; adding the heat-conducting insulating filler, the silicon dioxide and the sericite powder into the solution A, and uniformly stirring to obtain solution B; adding the moisture retention aid and the curing agent into the solution B, and uniformly stirring to obtain a thick hot glue solution, namely the insulating and heat-dissipating composition;
s2, coating the insulating heat dissipation composition on the first release film, wherein the coating thickness is 0.01-0.04mm, and covering the second release film on the surface of the insulating heat dissipation composition after the insulating heat dissipation composition is cooled to room temperature to obtain the insulating heat dissipation adhesive film.
The epoxy resin, the tung oil, the crosslinked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent are added into the cosolvent, and are stirred and heated at the same time, so that the resin system is fully mixed, the heating and the stirring can promote the resin system to carry out crosslinking reaction, the reaction rate and the grafting efficiency are improved, the heat-conducting insulating filler, the silicon dioxide and the sericite powder are favorably and uniformly dispersed in the composite resin system, the prepared composition has excellent and uniform electrical insulating property and heat dissipation performance, and the preparation steps are simple.
In S2, the thickness of the insulating and heat-dissipating composition coated on the release film is 0.01-0.04mm, and the prepared insulating and heat-dissipating adhesive film has excellent insulating performance and heat-dissipating performance, flame resistance and high temperature resistance. When the thickness of the coating is too small, the insulation performance of the prepared insulation heat dissipation film is weaker, when the thickness of the coating is too large, raw materials are wasted, and when the insulation heat dissipation film is too thick and is attached to the shielding cover, the space in the shielding cover is affected, and then the installation of electronic components is affected.
The invention is further set that the heating temperature for preparing the solution A is 55-65 ℃, and the stirring speed is 800-1000 r/min.
The insulating and heat-dissipating composition prepared at the stirring speed has a more stable and uniform mixed system, is not easy to generate a layering phenomenon, has complete reaction among the components, has high grafting rate between the mixed resin and the curing agent, and is more favorable for improving the adhesive force, the insulating property, the heat dissipation performance and the flame retardant property of the composition. When the stirring speed is too low, the reaction among the components is incomplete, the insulating property and the heat dissipation performance of the mixed system are influenced, the adhesive force of the mixed system is low, and the mixed system is unstable and is easy to generate the layering phenomenon. When the stirring speed is too high, too high shearing force can be generated, the grafting rate of the mixed resin is influenced, the mixed system is easy to generate a layering phenomenon, and the comprehensive performance is poor.
The third purpose of the invention is realized by the following technical scheme: a preparation method of an insulating heat-dissipation shielding case comprises the following steps:
s1, punching the metal material belt into positioning holes through punching;
s2, mounting the metal material belt punched with the positioning holes on a positioning jig of a laminating machine, placing the metal material belt on a platform of the laminating machine, removing the first release film of the insulating heat dissipation film, adhering the insulating heat dissipation film on the metal material belt according to the shape of the shielding case, wherein the adhering position of the insulating heat dissipation film is symmetrical to the positioning holes, and finally, pressing down and heating a laminating part of the laminating machine to 80-95 ℃ to adhere the insulating heat dissipation film with the first release film removed on the metal material belt;
the insulating heat dissipation film is prepared by the preparation method of the insulating heat dissipation film as claimed in claim 8 or 9.
The shielding case with excellent electric insulation performance and heat dissipation performance can be prepared by the preparation method, the adhesion between the shielding case and the insulating heat dissipation adhesive film is high, the adhesive film is not easy to fall off, the thickness of the adhesive film is thin, the installation of electronic components is not influenced, and the preparation method is simple, safe and controllable. When the pressing temperature is too high and is higher than 95 ℃, the adhesive force of the prepared insulating heat dissipation film is reduced, and when the temperature is too low and is lower than 80 ℃, the deblocking temperature of a sealant of a blocking type curing agent cannot be reached, so that the insulating heat dissipation film is difficult to cure, the insulating effect and the heat dissipation effect of the insulating heat dissipation film are influenced, and the adhesive property of the insulating heat dissipation film is also influenced.
The invention has the beneficial effects that:
1. the insulating and heat-dissipating composition is compounded by epoxy resin, tung oil, cross-linked polyethylene resin and polyurethane resin, so that the composition has excellent electrical insulating property and load performance, has the characteristics of good flame retardant effect and good smoke suppression performance in a high-temperature environment, is compounded by the heat-conducting insulating filler and the radiation filler consisting of silicon dioxide and sericite powder, and is bridged with each other in a composite resin system to form a heat-conducting network, so that the heat dissipation performance of the composite resin system is improved;
2. the invention adopts the insulating heat-dissipation composition to prepare the brilliant heat-dissipation adhesive film, the preparation steps are simple, and the prepared insulating heat-dissipation adhesive film has high adhesive force and thinner thickness and is suitable for the application of the shielding case.
3. The preparation method of the insulating heat dissipation shielding case can prepare the shielding case with excellent electric insulation performance and heat dissipation performance, the adhesion between the shielding case and the insulating heat dissipation film is high, the film is not easy to fall off, the thickness of the film is thin, the installation of electronic components is not influenced, and the preparation steps are simple, safe and controllable.
Detailed Description
The present invention will be further described with reference to the following examples for facilitating understanding of those skilled in the art, and the description of the embodiments is not intended to limit the present invention.
Example 1
An insulating heat-dissipating composition comprises the following raw materials in parts by weight: 60 parts of epoxy resin, 20 parts of tung oil, 40 parts of cross-linked polyethylene resin, 10 parts of polyurethane resin, 30 parts of heat-conducting insulating filler, 10 parts of moisture retention aid, 11 parts of dioctyl phthalate plasticizer, 12 parts of silicon dioxide, 11 parts of sericite powder, 9 parts of curing agent, 5 parts of vinyl triethoxysilane coupling agent and 25 parts of cosolvent.
Wherein the heat-conducting insulating filler is a mixture of nano needle-shaped alumina filler, nano granular alumina filler, nano fibrous alumina filler and nano columnar alumina filler according to the weight ratio of 1:2.5:1.5: 0.8. The curing agent is prepared by using butanone oxime as a blocking agent to block hexamethylene diisocyanate.
The moisture retention aid is a mixture of glycerol and a polyacrylamide water retention agent in a weight ratio of 5:0.1, and the cosolvent is a mixture of isopropanol and propylene glycol methyl ether in a weight ratio of 3: 6.
A preparation method of an insulating heat dissipation film comprises the following steps:
s1, preparing the insulating and heat-dissipating composition: adding the epoxy resin, the tung oil, the cross-linked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent in parts by weight into a cosolvent, and heating while stirring at the heating temperature of 55 ℃ to obtain a solution A; adding the heat-conducting insulating filler, the silicon dioxide and the sericite powder into the solution A, and uniformly stirring to obtain solution B; adding the moisture retention aid and the curing agent into the solution B, and uniformly stirring to obtain a thick hot glue solution, namely the insulating and heat-dissipating composition, with the stirring speed of 800 r/min;
s2, coating the insulating heat dissipation composition on the first release film, wherein the coating thickness is 0.01mm, and covering the second release film on the surface of the insulating heat dissipation composition after the insulating heat dissipation composition is cooled to room temperature to obtain the insulating heat dissipation adhesive film.
A preparation method of an insulating heat-dissipation shielding case comprises the following steps:
s1, punching the metal material belt into positioning holes through punching;
s2, mounting the metal material belt punched with the positioning holes on a positioning jig of a laminating machine, placing the metal material belt on a platform of the laminating machine, removing the first release film of the insulating heat dissipation film, adhering the insulating heat dissipation film on the metal material belt according to the shape of the shielding case, wherein the adhering position of the insulating heat dissipation film is symmetrical to the positioning holes, and finally, pressing down and heating a laminating part of the laminating machine to 80 ℃ to adhere the insulating heat dissipation film removed the first release film on the metal material belt;
the insulating heat dissipation film is prepared by the preparation method of the insulating heat dissipation film.
Example 2
An insulating heat-dissipating composition comprises the following raw materials in parts by weight: 70 parts of epoxy resin, 27.5 parts of tung oil, 45 parts of cross-linked polyethylene resin, 12.5 parts of polyurethane resin, 35 parts of heat-conducting insulating filler, 15 parts of moisture retention aid, 15 parts of dibutyl phthalate plasticizer, 16 parts of silicon dioxide, 13.5 parts of sericite powder, 10.5 parts of curing agent, 7.5 parts of aniline methyl triethoxysilane coupling agent and 30.5 parts of cosolvent.
Wherein the heat-conducting insulating filler is a mixture of nano needle-shaped magnesium oxide filler, nano granular magnesium oxide filler, nano fibrous magnesium oxide filler and nano columnar magnesium oxide filler in a weight ratio of 1:2.5:1.5:0.8, and the curing agent is prepared by using phenol as a sealing agent to seal hexamethylene diisocyanate.
The moisture retention aid is a mixture of glycerol and a potassium polyacrylate water retention agent in a weight ratio of 5.5:0.15, and the cosolvent is a mixture of isopropanol and propylene glycol methyl ether in a weight ratio of 5.5: 8.5.
A preparation method of an insulating heat dissipation film comprises the following steps:
s1, preparing the insulating and heat-dissipating composition: adding the epoxy resin, the tung oil, the cross-linked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent in parts by weight into a cosolvent, and heating while stirring at the heating temperature of 60 ℃ to obtain a solution A; adding the heat-conducting insulating filler, the silicon dioxide and the sericite powder into the solution A, and uniformly stirring to obtain solution B; adding the moisture retention aid and the curing agent into the solution B, and uniformly stirring to obtain a thick hot glue solution, namely the insulating heat-dissipation composition, with the stirring speed of 900 r/min;
and S2, coating the insulating heat dissipation composition on the first release film, wherein the coating thickness is 0.025mm, and covering the second release film on the surface of the insulating heat dissipation composition after the insulating heat dissipation composition is cooled to room temperature to obtain the insulating heat dissipation adhesive film.
A preparation method of an insulating heat-dissipation shielding case comprises the following steps:
s1, punching the metal material belt into positioning holes through punching;
s2, mounting the metal material belt punched with the positioning holes on a positioning jig of a laminating machine, placing the metal material belt on a platform of the laminating machine, removing the first release film of the insulating heat dissipation film, adhering the insulating heat dissipation film on the metal material belt according to the shape of the shielding case, wherein the adhering position of the insulating heat dissipation film is symmetrical to the positioning holes, and finally, pressing down and heating a laminating part of the laminating machine to 87.5 ℃ to adhere the insulating heat dissipation film removed the first release film on the metal material belt;
the insulating heat dissipation film is prepared by the preparation method of the insulating heat dissipation film.
Example 3
An insulating heat-dissipating composition comprises the following raw materials in parts by weight: 80 parts of epoxy resin, 35 parts of tung oil, 50 parts of cross-linked polyethylene resin, 15 parts of polyurethane resin, 40 parts of heat-conducting insulating filler, 20 parts of moisturizing aid, 19 parts of diheptyl phthalate plasticizer, 20 parts of silicon dioxide, 16 parts of sericite powder, 12 parts of curing agent, 10 parts of gamma-methacryloxypropyl trimethoxy silane coupling agent and 36 parts of cosolvent.
Wherein the heat-conducting insulating filler is a mixture of nano needle-shaped zinc oxide filler, nano granular zinc oxide filler, nano fibrous zinc oxide filler and nano columnar zinc oxide filler in a weight ratio of 1:2.5:1.5:0.8, and the curing agent is prepared by using ethylene glycol as a sealing agent to seal hexamethylene diisocyanate.
The moisture retention aid is a mixture of glycerol and a sodium polyacrylate water retention agent in a weight ratio of 6:0.2, and the cosolvent is a mixture of isopropanol and propylene glycol methyl ether in a weight ratio of 8: 11.
A preparation method of an insulating heat dissipation film comprises the following steps:
s1, preparing the insulating and heat-dissipating composition: adding the epoxy resin, the tung oil, the cross-linked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent in parts by weight into a cosolvent, and heating while stirring at the heating temperature of 65 ℃ to obtain a solution A; adding the heat-conducting insulating filler, the silicon dioxide and the sericite powder into the solution A, and uniformly stirring to obtain solution B; adding the moisture retention aid and the curing agent into the solution B, and uniformly stirring to obtain a thick hot glue solution, namely the insulating and heat-dissipating composition, with the stirring speed of 1000 r/min;
s2, coating the insulating heat dissipation composition on the first release film, wherein the coating thickness is 0.04mm, and covering the second release film on the surface of the insulating heat dissipation composition after the insulating heat dissipation composition is cooled to room temperature to obtain the insulating heat dissipation adhesive film.
A preparation method of an insulating heat-dissipation shielding case comprises the following steps:
s1, punching the metal material belt into positioning holes through punching;
s2, mounting the metal material belt punched with the positioning holes on a positioning jig of a laminating machine, placing the metal material belt on a platform of the laminating machine, removing the first release film of the insulating heat dissipation film, adhering the insulating heat dissipation film on the metal material belt according to the shape of the shielding case, wherein the adhering position of the insulating heat dissipation film is symmetrical to the positioning holes, and finally, pressing down and heating a laminating part of the laminating machine to 95 ℃ to adhere the insulating heat dissipation film removed the first release film on the metal material belt;
the insulating heat dissipation film is prepared by the preparation method of the insulating heat dissipation film.
Example 4
An insulating and heat-dissipating composition is disclosed in example 4, which is different from example 2 in that the heat-conducting and insulating filler is a mixture of aluminum nitride, boron nitride and silicon carbide in a weight ratio of 1:1:1, and the aluminum nitride, the boron nitride and the silicon carbide are nanoscale needle-shaped, granular, fibrous and columnar fillers, wherein the weight ratio of the nanoscale needle-shaped filler, the nanoscale granular filler, the nanoscale fibrous filler and the nanoscale columnar filler is 1:2.5:1.5: 0.8.
The water retention agent is a mixture of ammonium polyacrylate and starch grafted sodium acrylate according to the weight ratio of 1: 1.
The curing agent is a blocked isocyanate curing agent, wherein the blocking agent is a mixture of butanone oxime, phenol and ethylene glycol in a weight ratio of 1:1: 1.
The following performance tests were performed on the insulation heat dissipation shields prepared in examples 1 to 4, and the test results are recorded in table 1.
Table 1 summary of the performance test results for the insulating and heat-dissipating shields prepared in examples 1-4
As shown in Table 1, the thermal conductivity of the insulating and heat-dissipating shield prepared by the invention is between 101-103W/(m.k), the heat dissipation performance is excellent, the electrical strength is between 84 KV/mm and 89KV/mm, and the volume resistivity is 1.48x1013-1.82x1013Omega cm, surface resistivity of 1.34x1013-1.82x1013And the insulating property is excellent between omega, the adhesive force of the insulating heat dissipation film on the surface of the shielding case can reach one level, the flexibility is good, and the flexibility test is between 5 and 7 mm.
The above-described embodiments are preferred implementations of the present invention, and the present invention may be implemented in other ways without departing from the spirit of the present invention.
Claims (7)
1. An insulating heat-dissipation composition is characterized by comprising the following raw materials in parts by weight: 60-80 parts of epoxy resin, 20-35 parts of tung oil, 40-50 parts of cross-linked polyethylene resin, 10-15 parts of polyurethane resin, 30-40 parts of heat-conducting insulating filler, 10-20 parts of moisture retention aid, 11-19 parts of plasticizer, 12-20 parts of silicon dioxide, 11-16 parts of sericite powder, 9-12 parts of curing agent, 5-10 parts of coupling agent and 25-36 parts of cosolvent;
the heat-conducting insulating filler is at least one of aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride and silicon carbide; the heat-conducting insulating filler is a mixture consisting of needle-shaped filler, granular filler, fibrous filler and columnar filler according to the weight ratio of 1:2.5:1.5: 0.8;
the curing agent is a closed isocyanate curing agent which is prepared by using at least one of butanone oxime, phenol and ethylene glycol as a sealing agent to seal hexamethylene diisocyanate.
2. The insulating and heat-dissipating composition as claimed in claim 1, wherein the moisture retention aid is a mixture of glycerin and a water retention agent in a weight ratio of 5-6: 0.1-0.2.
3. The insulating and heat dissipating composition of claim 2, wherein the water retaining agent is at least one of polyacrylamide, sodium polyacrylate, potassium polyacrylate, ammonium polyacrylate, and starch grafted acrylate.
4. The insulating and heat-dissipating composition as claimed in claim 1, wherein the coupling agent is at least one of vinyltriethoxysilane, aniline methyltriethoxysilane, γ -methacryloxypropyltrimethoxysilane, methyltriethoxysilane, pyrophosphate titanate, and vinyltris (β -methoxyethoxy) silane; the plasticizer is at least one of dioctyl phthalate, dibutyl phthalate, diheptyl phthalate, diisodecyl phthalate and diisooctyl phthalate.
5. The preparation method of the insulating heat dissipation film is characterized by comprising the following steps of:
s1, preparing the insulating heat-dissipating composition of any one of claims 1 to 4: adding the epoxy resin, the tung oil, the cross-linked polyethylene resin, the polyurethane resin, the plasticizer and the coupling agent in parts by weight into a cosolvent, and heating while stirring to obtain a solution A; adding the heat-conducting insulating filler, the silicon dioxide and the sericite powder into the solution A, and uniformly stirring to obtain solution B; adding the moisture retention aid and the curing agent into the solution B, and uniformly stirring to obtain a thick hot glue solution, namely the insulating and heat-dissipating composition;
s2, coating the insulating heat dissipation composition on the first release film, wherein the coating thickness is 0.01-0.04mm, and covering the second release film on the surface of the insulating heat dissipation composition after the insulating heat dissipation composition is cooled to room temperature to obtain the insulating heat dissipation adhesive film.
6. The method for preparing an insulating heat-dissipating film according to claim 5, wherein the heating temperature for preparing the solution A is 55-65 ℃, and the stirring speed is 800-1000 r/min.
7. A preparation method of an insulating heat-dissipation shielding case is characterized by comprising the following steps:
s1, punching the metal material belt into positioning holes through punching;
s2, mounting the metal material belt punched with the positioning holes on a positioning jig of a laminating machine, placing the metal material belt on a platform of the laminating machine, removing the first release film of the insulating heat dissipation film, adhering the insulating heat dissipation film on the metal material belt according to the shape of the shielding case, wherein the adhering position of the insulating heat dissipation film is symmetrical to the positioning holes, and finally, pressing down and heating a laminating part of the laminating machine to 80-95 ℃ to adhere the insulating heat dissipation film with the first release film removed on the metal material belt;
the insulating heat dissipation film is prepared by the preparation method of the insulating heat dissipation film as claimed in claim 5 or 6.
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| CN103194047A (en) * | 2013-03-31 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | High-radiating printed board insulating layer and preparation method thereof |
| CN104559653A (en) * | 2013-10-29 | 2015-04-29 | 中国石油天然气集团公司 | Hydrogenated bisphenol A epoxy deck paint and preparation method thereof |
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| CN108130036A (en) * | 2017-12-18 | 2018-06-08 | 深圳市思迈科新材料有限公司 | Flexible splicing conducting resinl and preparation method thereof |
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| JP5396721B2 (en) * | 2008-02-26 | 2014-01-22 | パナソニック株式会社 | Thermally conductive cured product, heat dissipation substrate using the same, and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103194047A (en) * | 2013-03-31 | 2013-07-10 | 广东普赛特电子科技股份有限公司 | High-radiating printed board insulating layer and preparation method thereof |
| CN104559653A (en) * | 2013-10-29 | 2015-04-29 | 中国石油天然气集团公司 | Hydrogenated bisphenol A epoxy deck paint and preparation method thereof |
| CN105949722A (en) * | 2016-05-20 | 2016-09-21 | 安徽新科电缆集团股份有限公司 | Cable outer jacket insulating environment-friendly material formulation |
| CN108130036A (en) * | 2017-12-18 | 2018-06-08 | 深圳市思迈科新材料有限公司 | Flexible splicing conducting resinl and preparation method thereof |
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