CN108130036A - Flexible splicing conducting resinl and preparation method thereof - Google Patents
Flexible splicing conducting resinl and preparation method thereof Download PDFInfo
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- CN108130036A CN108130036A CN201711364577.0A CN201711364577A CN108130036A CN 108130036 A CN108130036 A CN 108130036A CN 201711364577 A CN201711364577 A CN 201711364577A CN 108130036 A CN108130036 A CN 108130036A
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
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Abstract
The present invention relates to a kind of flexible splicing conducting resinl and preparation method thereof, the raw material components of flexible splicing conducting resinl by weight, including：60~80 parts of 9~10 parts of flexible polyester resin, 2.5~3.0 parts of epoxy resin, 1.3~1.5 parts of acrylic resin, 0.15~0.25 part of blocked curing agent, 0.2~0.4 part of resting form cation curing agent, 0.8~1.2 part of silane coupling agent, 14~15 parts of organic solvent and silver powder.Flexible splicing conducting resinl provided by the invention, can improve the cementability of conducting resinl, and can stablize conducting resinl room temperature, during heating 130 DEG C of bakings can react curing；Novel consumption electronic product is can be widely applied to, including flexible touch display screen, the splicing of large scale flexible screen, Curved screen encapsulation and hull cell etc..
Description
Technical field
The present invention relates to conducting resinl technical fields, and in particular to a kind of flexible splicing conducting resinl and preparation method thereof.
Background technology
All it is that electronic component is welded on substrate using the technique of congruent melting scolding tin in conventional microelectronic industry, however
Solder used in congruent melting scolding tin contains lead, does not meet environmental requirement, and welding needs high temperature to make alloy molten, this requires make
With the thermostabilization substrate to involve great expense.Substitute products of the conducting resinl as tradition Sn/Pb solders have solidification temperature low, are suitble to
High density, the connection of thin space and good environmental-protecting performance, can with the substrate bonding of unlike material, bonding apparatus it is simple and
The advantages that at low cost, therefore be widely used.
It is, in general, that conducting resinl is made of resin carrier and conductive filler.Most of carriers are in the majority with epoxy resin, epoxy
Resin has good physics, chemical property, it all has excellent adhesive strength to the surface of metal and nonmetallic materials, is situated between
Electrical property is good, and product size stability is good, and hardness is high, to alkali and most of solvent-stable.In addition, common filler have gold,
Silver, copper, aluminium, nickel, graphite etc., silver have good electric conductivity, and chemical stability is preferable, are filled out so silver is proper as conduction
Material, conducting resinl currently on the market is also mostly based on silver.
In recent years, as people propose electronic product new flexible demand, flexible electronic product has obtained swift and violent hair
Exhibition, it is desirable to electronic product can more flexibility, such as flexible touch display screen, flexible general character antenna, film crystal
Pipe, sensor array, thin-film solar cells array, flexible energy storage facilities etc., electronic product can bend curling or
It rolls, is convenient for carrying and uses.The flexibility of electronic product proposes conductive connecting material flexible requirement, with traditional
Although epoxy resin has many good qualities for the conducting resinl of matrix, but its flexibility is not good enough, easily cracks, can not bend volume
Song can not meet the needs of flexible electronic product is bonded compliant conductive.
Invention content
For the defects in the prior art, present invention aims at provide a kind of flexible splicing conducting resinl and its preparation side
Method to improve the cementability of conducting resinl, and can stablize conducting resinl room temperature, during heating 130 DEG C of bakings can occur
Reaction curing；Novel consumption electronic product is can be widely applied to, the spelling including flexible touch display screen, large scale flexible screen
It connects, Curved screen encapsulation and hull cell etc..
To achieve the above object, technical solution provided by the invention is：
In a first aspect, the present invention provides a kind of flexible splicing conducting resinl, raw material components by weight, including：It is flexible
9~10 parts of polyester resin, 2.5~3.0 parts of epoxy resin, 1.3~1.5 parts of acrylic resin, blocked curing agent 0.15~
0.25 part, 0.2~0.4 part of resting form cation curing agent, 0.8~1.2 part of silane coupling agent, 14~15 parts of organic solvent and silver
60~80 parts of powder.
Epoxy resin is one or more in cycloaliphatic epoxy resin and hydrogenated epoxy resin；Acrylic resin is selected from
Pressure sensitive acrylic's resin, epoxy modified acrylic resin, polyester modification acrylic resin and polyurethane modified acrylic resin
In it is one or more；Blocked curing agent is selected from based on hexamethylene diisocyanate closing curing agent, diacetylmonoxime closing fat
It is one or more in fat race polyisocyanates and phenol closing toluene di-isocyanate(TDI)；Resting form cation curing agent is selected from six
It is one or more in fluorine antimonate, hexafluorophosphate and boron trifluoride-ammino-complex；Silane coupling agent is selected from epoxy radicals silicone hydride
It is one or more in coupling agent, vinyl silicane coupling agent, sulfenyl silane coupling agent and mercaptosilane coupling agents；Organic solvent
Selected from butyl acetate, diethylene glycol ether acetate, dimethyl adipate, dimethyl glutarate, DBE and different Buddhist
It is one or more in your ketone.
Preferably, silver powder includes large stretch of diameter silver powder and small flake diameter silver powder, and the grain size of large stretch of diameter silver powder is 6~12 μm, small pieces
The grain size of diameter silver powder is 0.5~3 μm；The mass ratio of large stretch of diameter silver powder and small flake diameter silver powder is 9:1.
Preferably, flexible polyester resin is flexible non-crystalline type polyester resin, and Tg is 20~30 DEG C, and number-average molecular weight is
10000~30000.
Preferably, the Tg of acrylic resin is -20 DEG C~20 DEG C, and number-average molecular weight is 3000~15000.
Preferably, the raw material components of flexible splicing conducting resinl by weight, including：9.8 parts of flexible polyester resin, alicyclic ring
2.8 parts of race's epoxy resin, 1.4 parts of pressure sensitive acrylic's resin, based on hexamethylene diisocyanate closing 0.2 part of curing agent,
0.3 part of hexafluoro antimonate, 1.0 parts of epoxy silane coupling, 14.5 parts of butyl acetate, grain size are 6~12 μm
63 parts of large stretch of diameter silver powder, grain size be 0.5~3 μm of 7 parts of small flake diameter silver powder.It should be noted that select flexible amorphism
For saturated polyester resin as matrix resin, wherein Tg is less than room temperature (- 20~20 DEG C), and number-average molecular weight is 10000~30000,
Conducting resinl can be made to have good bending resistance and the cementability to flexible parent metal.Mix hydrogenated epoxy resin or alicyclic epoxy
Resin can ensure not influencing to improve the bonding force to metal, non-metallic substrate on the basis of conducting resinl is flexible.Incorporation is few
Measurer has the acrylic resin of pressure-sensitive, can further improve the cementability of conducting resinl.It is 100~110 DEG C to select deblocking temperature
Blocked Isocyanate Curing Agents curing polyester and acrylic resin, including diacetylmonoxime closing aliphatic polyisocyante, benzene
Phenol block toluene di-isocyanate(TDI) closes curing agent etc. based on hexamethylene diisocyanate；It is 80~100 to select initiation temperature
DEG C resting form cation curing agent cured epoxy resin, including hexafluorophosphate, hexafluoro antimonate, boron trifluoride-ammonia complexing
Object, such curing agent room temperature stability is good, and thermal booster reaction temperature is low, and conducting resinl can be made to be placed at room temperature for stabilization, heats 130 DEG C
It is i.e. curable.Large and small grain size flake silver powder is selected to arrange in pairs or groups, effective overlapping area of flake silver powder is big, to obtain accumulation densification
Conducting resinl is conducive to bend being conductively connected at stretching.
Second aspect, the present invention provides the preparation method of flexible splicing conducting resinl, including step：S1：By flexible polyester
Resin and organic solvent are with 1:It is uniformly dispersed after 1 mass ratio mixing, obtains dispersion；S2：Ring is sequentially added in dispersions
Oxygen resin, acrylic resin, closing curing agent, resting form cation curing agent, silane coupling agent and remaining organic solvent, are stirred
It mixes uniformly, obtains conducting resinl presoma；S3：Silver powder is added in conducting resinl presoma, is uniformly dispersed；S4：Step S3 is obtained
Mixture filtering, obtain conducting resinl；S5：Conducting resinl is subjected to evacuation and centrifugal degassing, obtains flexible splicing conducting resinl.
Preferably, in step S1, dispersion is to carry out heating stirring dispersion, and the temperature of heating is 80 DEG C, and the time of stirring is 4
~6h.
Preferably, in step S3, it is to use planet stirring deaeration machine high-speed stirred 3~5 times to be uniformly dispersed.
Preferably, in step S4, filtering is filtered using 100~200 mesh stainless (steel) wires.
Technical solution provided by the invention has following advantageous effect：(1) flexible splicing provided by the invention is conductive
Glue can meet the flexible application of novel consumption electronic product, such as flexible touch display screen, the splicing of large scale flexible screen, curved surface
Shield the application fields such as encapsulation, hull cell；(2) flexible splicing conducting resinl provided by the invention is a kind of ambient-temp-stable conducting resinl,
Longevity of service at room temperature, it is possible to reduce the waste used does not need to cryopreservation, and storage condition is loose；(3) it is of the invention
The flexible splicing conducting resinl of offer is one-component conducting resinl, can directly dip in glue, dispensing or be coated on abutting edge, easy to use；(4)
Flexible splicing conducting resinl solidification temperature provided by the invention is low compared with epoxy conducting, can save the cured baking energy.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
It obtains significantly or is recognized by the practice of the present invention.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme of the present invention is clearly and completely described.Implement below
Example is only used for clearly illustrating technical scheme of the present invention, therefore be intended only as example, and cannot limit this hair with this
Bright protection domain.
Experimental method in following embodiments is conventional method unless otherwise specified.Examination used in following embodiments
Material is tested, is to be commercially available from regular shops unless otherwise specified.Quantitative test in following embodiment, is respectively provided with three
Secondary to repeat to test, data are the average value or mean+SD of three repeated experiments.
Embodiment one
The present embodiment provides a kind of flexible splicing conducting resinl, raw material components by weight, including：Flexible non-crystalline type gathers
9.8 parts of ester resin, 2.8 parts of cycloaliphatic epoxy resin, 1.4 parts of pressure sensitive acrylic's resin, based on hexamethylene diisocyanate
Close 0.2 part of curing agent, 0.3 part of hexafluoro antimonate, 1.0 parts of epoxy silane coupling, butyl acetate 14.5
Part, 63 parts of large stretch of diameter silver powder that grain size is 6~12 μm, 7 parts of the small flake diameter silver powder that grain size is 0.5~3 μm.
By above-mentioned raw material, using the preparation method of flexible splicing conducting resinl provided by the invention, prepare flexible splicing and lead
Electric glue：
S1：By flexible polyester resin and butyl acetate with 1:1 mass ratio mixing, then 80 DEG C of heating are stirred
Dispersion 5h is mixed, resin is completely dispersed, obtains dispersion；
S2：Cycloaliphatic epoxy resin, pressure sensitive acrylic's resin, different based on hexa-methylene two is sequentially added in dispersions
Cyanate closing curing agent, resting form cation curing agent hexafluoro antimonate, epoxy silane coupling and remaining diethyl two
Alcohol monobutyl ether acetate, double-planet are stirred to substantially uniformity, obtain conducting resinl presoma；
S3：Big grain size flake silver powder and small particle flake silver powder are added in conducting resinl presoma, stirs evenly, uses row
Star stirring deaeration machine high-speed stirred 5 times is to being uniformly dispersed；
S4：The mixture that step S3 is obtained is filtered using 200 mesh stainless (steel) wires, obtains conducting resinl；
S5：Conducting resinl is subjected to evacuation and centrifugal degassing, obtains flexible splicing conducting resinl.
Embodiment two
The present embodiment provides a kind of flexible splicing conducting resinl, raw material components by weight, including：Flexible non-crystalline type gathers
9 parts of ester resin, 2.5 parts of cycloaliphatic epoxy resin, 1.3 parts of pressure sensitive acrylic's resin, based on hexamethylene diisocyanate seal
Close 0.15 part of curing agent, 0.2 part of hexafluoro antimonate, 0.8 part of epoxy silane coupling, 14 parts of butyl acetate,
54 parts of large stretch of diameter silver powder that grain size is 6~12 μm, 6 parts of the small flake diameter silver powder that grain size is 0.5~3 μm.
By above-mentioned raw material, using the preparation method of flexible splicing conducting resinl provided by the invention, prepare flexible splicing and lead
Electric glue：
S1：By flexible polyester resin and butyl acetate with 1:1 mass ratio mixing, then 80 DEG C of heating are stirred
Dispersion 4h is mixed, resin is completely dispersed, obtains dispersion；
S2：Cycloaliphatic epoxy resin, pressure sensitive acrylic's resin, different based on hexa-methylene two is sequentially added in dispersions
Cyanate closing curing agent, resting form cation curing agent hexafluoro antimonate, epoxy silane coupling and remaining diethyl two
Alcohol monobutyl ether acetate, double-planet are stirred to substantially uniformity, obtain conducting resinl presoma；
S3：Big grain size flake silver powder and small particle flake silver powder are added in conducting resinl presoma, stirs evenly, uses row
Star stirring deaeration machine high-speed stirred 4 times is to being uniformly dispersed；
S4：The mixture that step S3 is obtained is filtered using 200 mesh stainless (steel) wires, obtains conducting resinl；
S5：Conducting resinl is subjected to evacuation and centrifugal degassing, obtains flexible splicing conducting resinl.
Embodiment three
The present embodiment provides a kind of flexible splicing conducting resinl, raw material components by weight, including：Flexible non-crystalline type gathers
10 parts of ester resin, 3.0 parts of cycloaliphatic epoxy resin, 1.5 parts of pressure sensitive acrylic's resin, based on hexamethylene diisocyanate seal
Close 0.25 part of curing agent, 0.4 part of hexafluoro antimonate, 1.2 parts of epoxy silane coupling, 15 parts of butyl acetate,
72 parts of large stretch of diameter silver powder that grain size is 6~12 μm, 8 parts of the small flake diameter silver powder that grain size is 0.5~3 μm.
By above-mentioned raw material, using the preparation method of flexible splicing conducting resinl provided by the invention, prepare flexible splicing and lead
Electric glue：
S1：By flexible polyester resin and butyl acetate with 1:1 mass ratio mixing, then 80 DEG C of heating are stirred
Dispersion 6h is mixed, resin is completely dispersed, obtains dispersion；
S2：Cycloaliphatic epoxy resin, pressure sensitive acrylic's resin, different based on hexa-methylene two is sequentially added in dispersions
Cyanate closing curing agent, resting form cation curing agent hexafluoro antimonate, epoxy silane coupling and remaining diethyl two
Alcohol monobutyl ether acetate, double-planet are stirred to substantially uniformity, obtain conducting resinl presoma；
S3：Big grain size flake silver powder and small particle flake silver powder are added in conducting resinl presoma, stirs evenly, uses row
Star stirring deaeration machine high-speed stirred 3 times is to being uniformly dispersed；
S4：The mixture that step S3 is obtained is filtered using 100 mesh stainless (steel) wires, obtains conducting resinl；
S5：Conducting resinl is subjected to evacuation and centrifugal degassing, obtains flexible splicing conducting resinl.
The flexible splicing conducting resinl that the embodiment of the present invention one to embodiment three is prepared is by function assessment experiment
System evaluates its effect.
The test of the resistivity of conducting resinl is according to the method for four-point probe after curing, and the test of thermal conductivity is according to ASTMD
5470 standards carry out.The test result of each embodiment is as shown in table 1.
1 performance measurement of table
It should be noted that unless otherwise indicated, technical term or scientific terminology used in this application should be this hair
The ordinary meaning that bright one of ordinary skill in the art are understood.Unless specifically stated otherwise, it otherwise illustrates in these embodiments
Component and opposite step, numerical expression and the numerical value of step are not limit the scope of the invention.It is illustrated and described herein
In all examples, unless otherwise prescribed, any occurrence should be construed as merely illustrative, not as limitation, because
This, other examples of exemplary embodiment can have different values.
In the description of the present invention, it is to be understood that term " first ", " second " are only used for description purpose, and cannot
It is interpreted as indicating or implies relative importance or imply the quantity of the technical characteristic indicated by indicating.Define as a result, " the
One ", one or more this feature can be expressed or be implicitly included to the feature of " second ".In the description of the present invention,
" multiple " are meant that two or more, unless otherwise specifically defined.
Finally it should be noted that：The above embodiments are only used to illustrate the technical solution of the present invention., rather than its limitations；To the greatest extent
Pipe is described in detail the present invention with reference to foregoing embodiments, it will be understood by those of ordinary skill in the art that：Its according to
Can so modify to the technical solution recorded in foregoing embodiments either to which part or all technical features into
Row equivalent replacement；And these modifications or replacement, various embodiments of the present invention technology that it does not separate the essence of the corresponding technical solution
The range of scheme should all cover in protection scope of the present invention.
Claims (10)
1. a kind of flexible splicing conducting resinl, which is characterized in that raw material components by weight, including：
9~10 parts of flexible polyester resin, 2.5~3.0 parts of epoxy resin, 1.3~1.5 parts of acrylic resin, blocked curing agent
0.15~0.25 part, 0.2~0.4 part of resting form cation curing agent, 0.8~1.2 part of silane coupling agent, organic solvent 14~15
60~80 parts of part and silver powder.
2. flexible splicing conducting resinl according to claim 1, it is characterised in that：
The epoxy resin is one or more in cycloaliphatic epoxy resin and hydrogenated epoxy resin；
The acrylic resin is selected from pressure sensitive acrylic's resin, epoxy modified acrylic resin, polyester modification acrylic resin
With it is one or more in polyurethane modified acrylic resin；
The blocked curing agent is selected from based on hexamethylene diisocyanate closing curing agent, diacetylmonoxime closing aliphatic polyisocyanate
It is one or more in cyanate and phenol closing toluene di-isocyanate(TDI)；
The resting form cation curing agent in hexafluoro antimonate, hexafluorophosphate and boron trifluoride-ammino-complex one
Kind is a variety of；
The silane coupling agent is selected from epoxy silane coupling, vinyl silicane coupling agent, sulfenyl silane coupling agent and sulfydryl
It is one or more in silane coupling agent；
The organic solvent is selected from butyl acetate, diethylene glycol ether acetate, dimethyl adipate, glutaric acid
It is one or more in dimethyl ester, DBE and isophorone.
3. flexible splicing conducting resinl according to claim 1, it is characterised in that：
The silver powder includes large stretch of diameter silver powder and small flake diameter silver powder, and the grain size of the sheet diameter silver powder is 6~12 μm, the small pieces
The grain size of diameter silver powder is 0.5~3 μm；
The mass ratio of the sheet diameter silver powder and the small flake diameter silver powder is 9:1.
4. flexible splicing conducting resinl according to claim 1, it is characterised in that：
The flexible polyester resin is flexible non-crystalline type polyester resin, and Tg is 20~30 DEG C, number-average molecular weight for 10000~
30000。
5. flexible splicing conducting resinl according to claim 1, it is characterised in that：
The Tg of the acrylic resin is -20 DEG C~20 DEG C, and number-average molecular weight is 3000~15000.
6. flexible splicing conducting resinl according to claim 1, which is characterized in that raw material components by weight, including：
9.8 parts of flexible polyester resin, 2.8 parts of cycloaliphatic epoxy resin, 1.4 parts of pressure sensitive acrylic's resin, based on hexa-methylene
0.2 part of curing agent of diisocyanate closing, 0.3 part of hexafluoro antimonate, 1.0 parts of epoxy silane coupling, butyl
63 parts of large stretch of diameter silver powder that 14.5 parts of acetate, grain size are 6~12 μm, 7 parts of the small flake diameter silver powder that grain size is 0.5~3 μm.
7. the preparation method of claim 1-6 any one of them flexible splicing conducting resinls, which is characterized in that including step：
S1：By flexible polyester resin and organic solvent with 1:It is uniformly dispersed after 1 mass ratio mixing, obtains dispersion；
S2：Epoxy resin, acrylic resin, closing curing agent, resting form cationic curing are sequentially added in the dispersion
Agent, silane coupling agent and remaining organic solvent, stir evenly, and obtain conducting resinl presoma；
S3：Silver powder is added in the conducting resinl presoma, is uniformly dispersed；
S4：The mixture that step S3 is obtained filters, and obtains conducting resinl；
S5：The conducting resinl is subjected to evacuation and centrifugal degassing, obtains the flexible splicing conducting resinl.
8. the preparation method of flexible splicing conducting resinl according to claim 7, it is characterised in that：
In step S1, the dispersion is to carry out heating stirring dispersion, and the temperature of heating is 80 DEG C, and the time of stirring is 4~6h.
9. the preparation method of flexible splicing conducting resinl according to claim 7, it is characterised in that：
In step S3, described be uniformly dispersed is to use planet stirring deaeration machine high-speed stirred 3~5 times.
10. the preparation method of flexible splicing conducting resinl according to claim 7, it is characterised in that：
In step S4, the filtering is filtered using 100~200 mesh stainless (steel) wires.
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| CN201711364577.0A CN108130036B (en) | 2017-12-18 | 2017-12-18 | Flexible bonding conductive adhesive and preparation method thereof |
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| CN201711364577.0A CN108130036B (en) | 2017-12-18 | 2017-12-18 | Flexible bonding conductive adhesive and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181223A (en) * | 2018-08-01 | 2019-01-11 | 广东和润新材料股份有限公司 | Insulating radiation composition, insulating radiation pad pasting and insulating radiation cover cover preparation method |
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| WO2022188504A1 (en) * | 2021-03-11 | 2022-09-15 | 无锡帝科电子材料股份有限公司 | Heat-cured conductive adhesive and preparation method therefor |
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