CN108130036B - Flexible bonding conductive adhesive and preparation method thereof - Google Patents
Flexible bonding conductive adhesive and preparation method thereof Download PDFInfo
- Publication number
- CN108130036B CN108130036B CN201711364577.0A CN201711364577A CN108130036B CN 108130036 B CN108130036 B CN 108130036B CN 201711364577 A CN201711364577 A CN 201711364577A CN 108130036 B CN108130036 B CN 108130036B
- Authority
- CN
- China
- Prior art keywords
- parts
- conductive adhesive
- flexible
- silver powder
- curing agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
- C09J175/04—Polyurethanes
- C09J175/06—Polyurethanes from polyesters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/4009—Two or more macromolecular compounds not provided for in one single group of groups C08G18/42 - C08G18/64
- C08G18/4045—Mixtures of compounds of group C08G18/58 with other macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/42—Polycondensates having carboxylic or carbonic ester groups in the main chain
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/28—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
- C08G18/40—High-molecular-weight compounds
- C08G18/58—Epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G18/00—Polymeric products of isocyanates or isothiocyanates
- C08G18/06—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
- C08G18/70—Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
- C08G18/72—Polyisocyanates or polyisothiocyanates
- C08G18/73—Polyisocyanates or polyisothiocyanates acyclic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Abstract
The invention relates to a flexible bonding conductive adhesive and a preparation method thereof, wherein the flexible bonding conductive adhesive comprises the following raw material components in parts by weight: 9-10 parts of flexible polyester resin, 2.5-3.0 parts of epoxy resin, 1.3-1.5 parts of acrylic resin, 0.15-0.25 part of closed curing agent, 0.2-0.4 part of latent cationic curing agent, 0.8-1.2 parts of silane coupling agent, 14-15 parts of organic solvent and 60-80 parts of silver powder. The flexible bonding conductive adhesive provided by the invention can improve the bonding property of the conductive adhesive, and can be stably placed at normal temperature, and can be reacted and cured after being baked at 130 ℃ during heating; the flexible touch screen can be widely applied to novel consumer electronics products, including flexible touch display screens, splicing of large-size flexible screens, curved-surface screen packaging, thin-film batteries and the like.
Description
Technical Field
The invention relates to the technical field of conductive adhesives, in particular to a flexible bonding conductive adhesive and a preparation method thereof.
Background
In the conventional microelectronics industry, eutectic solder processes are used to solder electronic components to substrates, however, the solder used in eutectic solder contains lead, which is not environmentally friendly, and the soldering requires high temperatures to melt the alloy, which requires the use of expensive thermally stable substrates. The conductive adhesive is used as a substitute product of the traditional Sn/Pb solder, has the advantages of low curing temperature, suitability for connection with high density and narrow spacing, good environmental protection performance, capability of being bonded with substrates made of different materials, simple bonding equipment, low cost and the like, and is widely applied.
Generally, the conductive paste is composed of a resin carrier and a conductive filler. Most of the carriers are epoxy resin, and the epoxy resin has good physical and chemical properties, excellent bonding strength to the surfaces of metal and nonmetal materials, good dielectric property, good product dimensional stability, high hardness and stability to alkali and most solvents. In addition, the commonly used fillers include gold, silver, copper, aluminum, nickel, graphite and the like, and the silver has good conductivity and good chemical stability, so the silver is more suitable to be used as a conductive filler, and the conductive adhesive in the current market is mainly silver.
In recent years, as people put forward new flexible requirements on electronic products, flexible electronic products are developed rapidly, people hope that the electronic products can be more flexible, such as flexible touch display screens, flexible common antennas, thin film transistors, sensor arrays, thin film solar cell arrays, flexible energy storage devices and the like, and the electronic products can be bent, curled or rolled up and are convenient to carry and use. The flexibility of electronic products puts forward the flexible requirement to the conductive connecting material, and the conductive adhesive using the traditional epoxy resin as a base body has many advantages, but the flexibility is not good enough, the conductive adhesive is easy to crack and cannot be bent and curled, and the requirement of the flexible electronic products on flexible conductive bonding cannot be met.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a flexible bonding conductive adhesive and a preparation method thereof, so that the bonding property of the conductive adhesive is improved, the conductive adhesive can be stably placed at normal temperature, and can be reacted and cured after being baked at 130 ℃ during heating; the flexible touch screen can be widely applied to novel consumer electronics products, including flexible touch display screens, splicing of large-size flexible screens, curved-surface screen packaging, thin-film batteries and the like.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
in a first aspect, the invention provides a flexible bonding conductive adhesive, which comprises the following raw material components in parts by weight: 9-10 parts of flexible polyester resin, 2.5-3.0 parts of epoxy resin, 1.3-1.5 parts of acrylic resin, 0.15-0.25 part of closed curing agent, 0.2-0.4 part of latent cationic curing agent, 0.8-1.2 parts of silane coupling agent, 14-15 parts of organic solvent and 60-80 parts of silver powder.
The epoxy resin is selected from one or more of alicyclic epoxy resin and hydrogenated epoxy resin; the acrylic resin is selected from one or more of pressure-sensitive acrylic resin, epoxy modified acrylic resin, polyester modified acrylic resin and polyurethane modified acrylic resin; the blocked curing agent is selected from one or more of hexamethylene diisocyanate-based blocked curing agent, butanone oxime-blocked aliphatic polyisocyanate and phenol-blocked toluene diisocyanate; the latent cationic curing agent is selected from one or more of hexafluoroantimonate, hexafluorophosphate and boron trifluoride-ammonia complex; the silane coupling agent is selected from one or more of epoxy silane coupling agent, vinyl silane coupling agent, sulfenyl silane coupling agent and sulfydryl silane coupling agent; the organic solvent is one or more selected from diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, dimethyl adipate, dimethyl glutarate, DBE and isophorone.
Preferably, the silver powder comprises large-sheet-diameter silver powder and small-sheet-diameter silver powder, the particle size of the large-sheet-diameter silver powder is 6-12 mu m, and the particle size of the small-sheet-diameter silver powder is 0.5-3 mu m; the mass ratio of the large-diameter silver powder to the small-diameter silver powder is 9: 1.
Preferably, the flexible polyester resin is a flexible amorphous polyester resin, the Tg is 20-30 ℃, and the number average molecular weight is 10000-30000.
Preferably, the acrylic resin has a Tg of-20 ℃ to 20 ℃ and a number average molecular weight of 3000 to 15000.
Preferably, the raw material components of the flexible bonding conductive adhesive comprise, by weight: 9.8 parts of flexible polyester resin, 2.8 parts of alicyclic epoxy resin, 1.4 parts of pressure-sensitive acrylic resin, 0.2 part of hexamethylene diisocyanate based blocking curing agent, 0.3 part of hexafluoroantimonate, 1.0 part of epoxy silane coupling agent, 14.5 parts of diethylene glycol butyl ether acetate, 63 parts of large-size silver powder with the particle size of 6-12 mu m and 7 parts of small-size silver powder with the particle size of 0.5-3 mu m. The conductive adhesive has good bending resistance and adhesion to a flexible base material by using a flexible amorphous saturated polyester resin as a main resin, wherein Tg is lower than room temperature (-20 ℃), and the number average molecular weight is 10000-30000. The hydrogenated epoxy resin or the alicyclic epoxy resin is doped, so that the bonding force to metal and nonmetal substrates can be improved on the basis of ensuring that the flexibility of the conductive adhesive is not influenced. The adhesion of the conductive adhesive can be further improved by adding a small amount of acrylic resin with pressure-sensitive property. Curing polyester and acrylic resin by using a blocked isocyanate curing agent with the deblocking temperature of 100-110 ℃, wherein the blocked isocyanate curing agent comprises butanone oxime blocked aliphatic polyisocyanate, phenol blocked toluene diisocyanate, a hexamethylene diisocyanate-based blocked curing agent and the like; the latent cationic curing agent with the initiation temperature of 80-100 ℃ is selected to cure epoxy resin, and comprises hexafluorophosphate, hexafluoroantimonate and boron trifluoride-ammonia complex, the curing agent has good room temperature stability, the thermal initiation reaction temperature is low, the conductive adhesive can be placed stably at room temperature, and the curing agent can be cured by heating at 130 ℃. The flake silver powder with large and small grain diameters is selected for matching, and the effective lap joint area of the flake silver powder is large, so that the conductive adhesive which is compactly stacked is obtained, and conductive connection at the bending and stretching part is facilitated.
In a second aspect, the invention provides a method for preparing a flexible adhesive conductive adhesive, comprising the following steps: s1: mixing flexible polyester resin and an organic solvent according to a mass ratio of 1:1, and uniformly dispersing to obtain a dispersion; s2: adding epoxy resin, acrylic resin, a closed curing agent, a latent cationic curing agent, a silane coupling agent and the rest of organic solvent into the dispersion in sequence, and uniformly stirring to obtain a conductive adhesive precursor; s3: adding silver powder into the conductive adhesive precursor, and uniformly dispersing; s4: filtering the mixture obtained in the step S3 to obtain conductive adhesive; s5: and (4) conducting centrifugal defoaming on the conductive adhesive to obtain the flexible bonding conductive adhesive.
Preferably, in the step S1, the dispersing is performed by heating, stirring and dispersing, wherein the heating temperature is 80 ℃, and the stirring time is 4-6 h.
Preferably, in step S3, the uniform dispersion is performed by high-speed stirring for 3-5 times by using a planetary stirring defoaming machine.
Preferably, in step S4, the filtering is performed by using a 100-200 mesh stainless steel net.
The technical scheme provided by the invention has the following beneficial effects: (1) the flexible bonding conductive adhesive provided by the invention can meet the flexible application of novel consumer electronics products, such as flexible touch display screens, splicing of large-size flexible screens, packaging of curved screens, thin-film batteries and other application fields; (2) the flexible bonding conductive adhesive provided by the invention is a stable conductive adhesive at room temperature, has long working time at room temperature, can reduce the waste of use, does not need to be stored at ultralow temperature, and has loose storage conditions; (3) the flexible bonding conductive adhesive provided by the invention is a single-component conductive adhesive, can be directly dipped in adhesive, dispensed or coated on a bonding part, and is convenient to use; (4) the curing temperature of the flexible bonding conductive adhesive provided by the invention is lower than that of epoxy conductive adhesive, and the curing baking energy can be saved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
The experimental procedures in the following examples are conventional unless otherwise specified. The test materials used in the following examples were purchased from a conventional store unless otherwise specified. In the quantitative tests in the following examples, three replicates were set, and the data are the mean or the mean ± standard deviation of the three replicates.
Example one
The embodiment provides a flexible bonding conductive adhesive, which comprises the following raw material components in parts by weight: 9.8 parts of flexible amorphous polyester resin, 2.8 parts of alicyclic epoxy resin, 1.4 parts of pressure-sensitive acrylic resin, 0.2 part of hexamethylene diisocyanate blocking curing agent, 0.3 part of hexafluoroantimonate, 1.0 part of epoxy silane coupling agent, 14.5 parts of diethylene glycol butyl ether acetate, 63 parts of large-diameter silver powder with the particle diameter of 6-12 mu m and 7 parts of small-diameter silver powder with the particle diameter of 0.5-3 mu m.
According to the raw materials, the preparation method of the flexible bonding conductive adhesive provided by the invention is adopted to prepare the flexible bonding conductive adhesive:
s1: mixing flexible polyester resin and diethylene glycol monobutyl ether acetate according to the mass ratio of 1:1, heating and stirring at 80 ℃ for dispersing for 5 hours to completely disperse the resin to obtain a dispersion;
s2: sequentially adding alicyclic epoxy resin, pressure-sensitive acrylic resin, a hexamethylene diisocyanate-based closed curing agent, a latent cationic curing agent hexafluoroantimonate, an epoxy silane coupling agent and the rest diethylene glycol butyl ether acetate into the dispersion, and stirring the mixture in a double-planet manner until the mixture is completely uniform to obtain a conductive adhesive precursor;
s3: adding flaky silver powder with large particle size and flaky silver powder with small particle size into the conductive adhesive precursor, uniformly stirring, and stirring at high speed for 5 times by using a planetary stirring defoaming machine until the silver powder is uniformly dispersed;
s4: filtering the mixture obtained in the step S3 by using a 200-mesh stainless steel net to obtain conductive adhesive;
s5: and (4) conducting centrifugal defoaming on the conductive adhesive to obtain the flexible bonding conductive adhesive.
Example two
The embodiment provides a flexible bonding conductive adhesive, which comprises the following raw material components in parts by weight: 9 parts of flexible amorphous polyester resin, 2.5 parts of alicyclic epoxy resin, 1.3 parts of pressure-sensitive acrylic resin, 0.15 part of hexamethylene diisocyanate based blocking curing agent, 0.2 part of hexafluoroantimonate, 0.8 part of epoxy silane coupling agent, 14 parts of diethylene glycol butyl ether acetate, 54 parts of large-sheet-diameter silver powder with the particle diameter of 6-12 mu m and 6 parts of small-sheet-diameter silver powder with the particle diameter of 0.5-3 mu m.
According to the raw materials, the preparation method of the flexible bonding conductive adhesive provided by the invention is adopted to prepare the flexible bonding conductive adhesive:
s1: mixing flexible polyester resin and diethylene glycol monobutyl ether acetate according to the mass ratio of 1:1, heating and stirring at 80 ℃ for dispersing for 4 hours to completely disperse the resin to obtain a dispersion;
s2: sequentially adding alicyclic epoxy resin, pressure-sensitive acrylic resin, a hexamethylene diisocyanate-based closed curing agent, a latent cationic curing agent hexafluoroantimonate, an epoxy silane coupling agent and the rest diethylene glycol butyl ether acetate into the dispersion, and stirring the mixture in a double-planet manner until the mixture is completely uniform to obtain a conductive adhesive precursor;
s3: adding flake silver powder with large particle size and flake silver powder with small particle size into the conductive adhesive precursor, uniformly stirring, and stirring at high speed for 4 times by using a planetary stirring defoaming machine until the silver powder is uniformly dispersed;
s4: filtering the mixture obtained in the step S3 by using a 200-mesh stainless steel net to obtain conductive adhesive;
s5: and (4) conducting centrifugal defoaming on the conductive adhesive to obtain the flexible bonding conductive adhesive.
EXAMPLE III
The embodiment provides a flexible bonding conductive adhesive, which comprises the following raw material components in parts by weight: 10 parts of flexible amorphous polyester resin, 3.0 parts of alicyclic epoxy resin, 1.5 parts of pressure-sensitive acrylic resin, 0.25 part of hexamethylene diisocyanate based blocking curing agent, 0.4 part of hexafluoroantimonate, 1.2 parts of epoxy silane coupling agent, 15 parts of diethylene glycol butyl ether acetate, 72 parts of large-sheet-diameter silver powder with the particle diameter of 6-12 mu m and 8 parts of small-sheet-diameter silver powder with the particle diameter of 0.5-3 mu m.
According to the raw materials, the preparation method of the flexible bonding conductive adhesive provided by the invention is adopted to prepare the flexible bonding conductive adhesive:
s1: mixing flexible polyester resin and diethylene glycol monobutyl ether acetate according to the mass ratio of 1:1, heating and stirring at 80 ℃ for dispersing for 6 hours to completely disperse the resin to obtain a dispersion;
s2: sequentially adding alicyclic epoxy resin, pressure-sensitive acrylic resin, a hexamethylene diisocyanate-based closed curing agent, a latent cationic curing agent hexafluoroantimonate, an epoxy silane coupling agent and the rest diethylene glycol butyl ether acetate into the dispersion, and stirring the mixture in a double-planet manner until the mixture is completely uniform to obtain a conductive adhesive precursor;
s3: adding flake silver powder with large particle size and flake silver powder with small particle size into the conductive adhesive precursor, uniformly stirring, and stirring at high speed for 3 times by using a planetary stirring defoaming machine until the silver powder is uniformly dispersed;
s4: filtering the mixture obtained in the step S3 by using a 100-mesh stainless steel net to obtain conductive adhesive;
s5: and (4) conducting centrifugal defoaming on the conductive adhesive to obtain the flexible bonding conductive adhesive.
The effects of the flexible adhesive conductive adhesive prepared in the first to third embodiments of the invention are systematically evaluated through functional tests.
The resistivity of the cured conductive adhesive was tested according to the four-point probe method and the thermal conductivity was tested according to astm d 5470 standard. The test results of the respective examples are shown in table 1.
TABLE 1 measurement of Properties
It is to be noted that, unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the invention pertains. Unless specifically stated otherwise, the relative steps, numerical expressions, and values of the components and steps set forth in these embodiments do not limit the scope of the present invention. In all examples shown and described herein, unless otherwise specified, any particular value should be construed as merely illustrative, and not restrictive, and thus other examples of example embodiments may have different values.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention, and all of the technical solutions are covered in the protective scope of the present invention.
Claims (6)
1. The flexible bonding conductive adhesive is characterized by comprising the following raw material components in parts by weight:
9-10 parts of flexible polyester resin, 2.5-3.0 parts of epoxy resin, 1.3-1.5 parts of acrylic resin, 0.15-0.25 part of closed curing agent, 0.2-0.4 part of latent cationic curing agent, 0.8-1.2 parts of silane coupling agent, 14-15 parts of organic solvent and 60-80 parts of silver powder;
the epoxy resin is selected from one or more of alicyclic epoxy resin and hydrogenated epoxy resin;
the acrylic resin is selected from one or more of pressure-sensitive acrylic resin, epoxy modified acrylic resin, polyester modified acrylic resin and polyurethane modified acrylic resin;
the blocked curing agent is selected from one or more of hexamethylene diisocyanate-based blocked curing agent, butanone oxime-blocked aliphatic polyisocyanate and phenol-blocked toluene diisocyanate;
the latent cationic curing agent is selected from one or more of hexafluoroantimonate, hexafluorophosphate and boron trifluoride-ammonia complex;
the silane coupling agent is selected from one or more of epoxy silane coupling agent, vinyl silane coupling agent, sulfenyl silane coupling agent and sulfenyl silane coupling agent;
the organic solvent is selected from one or more of diethylene glycol butyl ether acetate, diethylene glycol ethyl ether acetate, dimethyl adipate, dimethyl glutarate, DBE and isophorone;
the silver powder comprises large-sheet-diameter silver powder and small-sheet-diameter silver powder, the particle size of the large-sheet-diameter silver powder is 6-12 mu m, and the particle size of the small-sheet-diameter silver powder is 0.5-3 mu m;
the mass ratio of the large-diameter silver powder to the small-diameter silver powder is 9: 1;
the flexible polyester resin is flexible amorphous polyester resin, the Tg is 20-30 ℃, and the number average molecular weight is 10000-30000;
the Tg of the acrylic resin is-20 ℃, and the number average molecular weight is 3000-15000.
2. The flexible adhesive conductive adhesive of claim 1, wherein the raw material composition comprises, by weight:
9.8 parts of flexible polyester resin, 2.8 parts of alicyclic epoxy resin, 1.4 parts of pressure-sensitive acrylic resin, 0.2 part of hexamethylene diisocyanate based blocking curing agent, 0.3 part of hexafluoroantimonate, 1.0 part of epoxy silane coupling agent, 14.5 parts of diethylene glycol butyl ether acetate, 63 parts of large-size silver powder with the particle size of 6-12 mu m and 7 parts of small-size silver powder with the particle size of 0.5-3 mu m.
3. The method for preparing the flexible adhesive conductive adhesive of claim 1 or 2, characterized by comprising the steps of:
s1: mixing flexible polyester resin and an organic solvent according to a mass ratio of 1:1, and uniformly dispersing to obtain a dispersion;
s2: adding epoxy resin, acrylic resin, a closed curing agent, a latent cationic curing agent, a silane coupling agent and the rest of organic solvent into the dispersion in sequence, and uniformly stirring to obtain a conductive adhesive precursor;
s3: adding silver powder into the conductive adhesive precursor, and uniformly dispersing;
s4: filtering the mixture obtained in the step S3 to obtain conductive adhesive;
s5: and performing centrifugal defoaming on the conductive adhesive to obtain the flexible bonding conductive adhesive.
4. The method for preparing the flexible adhesive conductive adhesive according to claim 3, characterized in that:
in the step S1, the dispersion is carried out by heating, stirring and dispersing, wherein the heating temperature is 80 ℃, and the stirring time is 4-6 h.
5. The method for preparing the flexible adhesive conductive adhesive according to claim 3, characterized in that:
in step S3, the dispersion is performed at a high speed for 3-5 times by using a planetary stirring and defoaming machine.
6. The method for preparing the flexible adhesive conductive adhesive according to claim 3, characterized in that:
in step S4, the filtering is performed by using a stainless steel net of 100-200 meshes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364577.0A CN108130036B (en) | 2017-12-18 | 2017-12-18 | Flexible bonding conductive adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711364577.0A CN108130036B (en) | 2017-12-18 | 2017-12-18 | Flexible bonding conductive adhesive and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108130036A CN108130036A (en) | 2018-06-08 |
| CN108130036B true CN108130036B (en) | 2021-02-02 |
Family
ID=62390582
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711364577.0A Active CN108130036B (en) | 2017-12-18 | 2017-12-18 | Flexible bonding conductive adhesive and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108130036B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109181223B (en) * | 2018-08-01 | 2021-02-23 | 广东和润新材料股份有限公司 | Insulating and heat-dissipating composition, insulating and heat-dissipating adhesive film and preparation method of insulating and heat-dissipating mask |
| KR102220288B1 (en) * | 2018-11-28 | 2021-02-25 | 주식회사 케이씨씨 | Curable Coating Composition |
| CN110951440A (en) * | 2019-12-09 | 2020-04-03 | 苏州禾川化学技术服务有限公司 | Polyurethane acrylate multi-component curing conductive silver adhesive |
| CN113004807A (en) * | 2021-03-11 | 2021-06-22 | 无锡帝科电子材料股份有限公司 | Thermosetting conductive adhesive and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101608107A (en) * | 2008-06-16 | 2009-12-23 | 华东理工大学 | Adhesive composite and contain the anisotropically conducting adhesive of this adhesive composite |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102634313B (en) * | 2012-04-23 | 2014-06-11 | 广州市白云化工实业有限公司 | Epoxy conductive resin applicable to binding of LED (light-emitting diode) chips, and preparation method thereof |
| CN102703013B (en) * | 2012-06-28 | 2013-10-23 | 芜湖群跃电子科技有限公司 | Polyester hot-melt adhesive and coating method thereof |
| CN108538442B (en) * | 2015-05-27 | 2020-07-17 | 苏州市贝特利高分子材料股份有限公司 | Preparation method of high-conductivity low-temperature silver paste |
| CN105405489A (en) * | 2015-12-16 | 2016-03-16 | 佛山市顺德区百锐新电子材料有限公司 | Low-temperature cured and weldable high-conductivity slurry and preparation method thereof |
| CN106847369A (en) * | 2016-12-15 | 2017-06-13 | 西北稀有金属材料研究院 | A kind of printed form capacitive touch screen low-temperature cured conductive silver paste and preparation method |
-
2017
- 2017-12-18 CN CN201711364577.0A patent/CN108130036B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101608107A (en) * | 2008-06-16 | 2009-12-23 | 华东理工大学 | Adhesive composite and contain the anisotropically conducting adhesive of this adhesive composite |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108130036A (en) | 2018-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108130036B (en) | Flexible bonding conductive adhesive and preparation method thereof | |
| CN103314066A (en) | Reactive conductive pressure-sensitive adhesive tape | |
| JP3558593B2 (en) | Heat-curable conductive paste composition | |
| CN109536078B (en) | Hot melt adhesive film preparation method of vehicle FFC wire rod and hot melt adhesive film thereof | |
| CN101828434A (en) | Adhesive composition, circuit connecting material using the adhesive composition, method for connecting circuit member, and circuit connecting body | |
| JP6287430B2 (en) | Conductive adhesive sheet, electromagnetic shielding sheet, and printed wiring board | |
| CN113563837B (en) | HJT conductive silver colloid composition, preparation method thereof and HJT solar cell | |
| CN111073574A (en) | Single-component normal-temperature curing conductive adhesive and preparation method thereof | |
| CN104822789A (en) | Conductive adhesive composition and electronic element using same | |
| WO2013094543A1 (en) | Conductive adhesive | |
| CN110240874A (en) | A kind of Antistatic type electromagnetic shielding adhesive tape and preparation method thereof | |
| CN111448670B (en) | conductive paste | |
| Mir et al. | Development of polyaniline/epoxy composite as a prospective solder replacement material | |
| US20190119533A1 (en) | Electrically conductive adhesive for connecting conductors to solar cell contacts | |
| CN103430238B (en) | One pack system, low temperature curing type polymer composition and correlation technique | |
| CN106967379B (en) | Electrophoretic display device, adhesive and preparation method thereof | |
| CN102719199A (en) | Preparation method of three-dimensional anisotropic conductive film | |
| CN110838383A (en) | Flexible outer electrode of chip component and manufacturing method thereof | |
| CN109215827B (en) | Heat-curable conductive paste composition, and solar cell module using same | |
| WO2012043493A1 (en) | Anisotropic conductive material and method for producing same | |
| CN105683327A (en) | Adhesive composition and film roll | |
| CN109943252B (en) | Silver-coated copper conductive adhesive and preparation method thereof | |
| CN113881365A (en) | Acrylic pressure-sensitive adhesive with thin coating and high viscosity solvent and synthesis method thereof | |
| JPH064790B2 (en) | Conductive paste | |
| CN109627907B (en) | Static-conducting heat-dissipating coating and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |