CN1031912C - 电路基板 - Google Patents
电路基板 Download PDFInfo
- Publication number
- CN1031912C CN1031912C CN 94101721 CN94101721A CN1031912C CN 1031912 C CN1031912 C CN 1031912C CN 94101721 CN94101721 CN 94101721 CN 94101721 A CN94101721 A CN 94101721A CN 1031912 C CN1031912 C CN 1031912C
- Authority
- CN
- China
- Prior art keywords
- plate
- wiring
- integrated circuit
- circuit component
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000002347 injection Methods 0.000 claims abstract description 4
- 239000007924 injection Substances 0.000 claims abstract description 4
- 238000009413 insulation Methods 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- 230000002093 peripheral effect Effects 0.000 claims description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 239000002674 ointment Substances 0.000 claims 1
- 239000011505 plaster Substances 0.000 claims 1
- 239000000446 fuel Substances 0.000 abstract 8
- 238000002485 combustion reaction Methods 0.000 abstract 2
- 230000001955 cumulated effect Effects 0.000 abstract 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000007789 gas Substances 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 230000005855 radiation Effects 0.000 description 3
- 230000003321 amplification Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003199 nucleic acid amplification method Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2416093U JPH0679173U (ja) | 1993-04-12 | 1993-04-12 | 回路基板 |
JP24160/93 | 1993-04-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1093861A CN1093861A (zh) | 1994-10-19 |
CN1031912C true CN1031912C (zh) | 1996-05-29 |
Family
ID=12130593
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 94101721 Expired - Fee Related CN1031912C (zh) | 1993-04-12 | 1994-02-25 | 电路基板 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPH0679173U (ja) |
CN (1) | CN1031912C (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7273987B2 (en) * | 2002-03-21 | 2007-09-25 | General Electric Company | Flexible interconnect structures for electrical devices and light sources incorporating the same |
CN109756076B (zh) * | 2017-11-01 | 2022-05-20 | 德昌电机(深圳)有限公司 | 电机 |
-
1993
- 1993-04-12 JP JP2416093U patent/JPH0679173U/ja active Pending
-
1994
- 1994-02-25 CN CN 94101721 patent/CN1031912C/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN1093861A (zh) | 1994-10-19 |
JPH0679173U (ja) | 1994-11-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C06 | Publication | ||
PB01 | Publication | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C19 | Lapse of patent right due to non-payment of the annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |