CN103187346A - Fixture for clamping and corroding wafer - Google Patents
Fixture for clamping and corroding wafer Download PDFInfo
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- CN103187346A CN103187346A CN2011104501621A CN201110450162A CN103187346A CN 103187346 A CN103187346 A CN 103187346A CN 2011104501621 A CN2011104501621 A CN 2011104501621A CN 201110450162 A CN201110450162 A CN 201110450162A CN 103187346 A CN103187346 A CN 103187346A
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- holder
- wafer
- hole portion
- limited part
- anchor clamps
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Abstract
The invention provides a fixture for clamping a wafer. The fixture for clamping and corroding the wafer in the process of manufacturing of a semiconductor wafer comprises a first clamping piece and a second clamping piece, wherein the second clamping piece is connected with the first clamping piece in a pivot mode, a first hole portion is arranged in the first clamping piece, and a first sealing piece is arranged around the first hole portion. After the first clamping piece and the second clamping piece are pressed, the first hole portion forms a first channel which is used for corroding the wafer clamped between the first clamping piece and the second clamping piece, and the first sealing piece isolates a wafer area to be corroded from other areas. The fixture for clamping and corroding the wafer can clamp and corrode the wafer in the process of preparation of the wafer so that working procedures such as amplification and testing can be carried out.
Description
Technical field
The present invention relates to the semiconductor device manufacturing, but relate in particular to the gripping element of clamping wafer in the semiconductor fabrication.
Background technology
The manufacture process of semiconductor device comprises a series of inspection technology, and is whether good with the chip that judgement is formed on the wafer.Hfe(Hybrid Forward Common Emitter) test is a link that checks outbalance in the technology.The essence of Hfe test is exactly to test the current amplification factor of triode.
As everyone knows, in the production process of power transistor, the monitoring of Hfe control, VCBO, VCEO and VFBE is very important and have certain degree of difficulty, and wherein the control difficulty with Hfe is the highest again.Observing and controlling Hfe is difficult to realize substantially in real time in the preparation process of power transistor, and current mode is to remove to test Hfe again after the power transistor preparation is finished.At this, it is as follows simply to describe the Hfe test technology: select a sheet in advance from a collection of wafer, make it enter follow-up preparation flow, proceeding to the characteristic test stage (that is transistorized preparation is basically completed); Result with characteristic test feeds back to amplification control operation then, determines corresponding the amplification control time.The Hfe control deviation of sheet is bigger if first is gone ahead of the rest, and then tests with second sheet of going ahead of the rest again, so meets the control requirement up to Hfe.
Aforesaid Hfe control procedure is longer, can not monitor in real time parameters such as VCBO, VCEO and VFBE in process of production, can not the breakdown characteristic of wafer be monitored, and it is bad to find in time that soft breakdown, pipeline etc. puncture.But if in the wafer preparation process, utilize test wafer to amplify test (for example amplify in the control operation at specific adjusted Hfe wafer is tested), then lack the equipment of clamping wafer to test.
Summary of the invention
In view of this, but the invention provides a kind of anchor clamps of clamping wafer, it can be in the preparation process of wafer, for example specific adjusted Hfe amplifies and to be used for the clamping wafer in the control operation, and thereby the passage that presents wafer carries out dependence test in order to corrode wafer by this passage, solves above thus and other problem.
Of the present invention at the anchor clamps of semiconductor crystal wafer manufacture process clamping wafer so that it is corroded, comprise first holder, second holder with the pivot joint of first holder, described first holder is provided with the first hole portion, be provided with first seal around the described first hole portion, after described first holder and the described second holder pressing, the first hole portion forms the first passage that is clamped in the wafer between described first holder and described second holder in order to corrosion, and described first seal treats that with wafer corrosion area and other zone isolation open.
Preferably, described second holder is provided with the second hole portion, be provided with second seal around the described second hole portion, after described first holder and the described second holder pressing, the second hole portion forms the second channel that is clamped in the wafer between described first holder and described second holder in order to corrosion, and described second seal treats that with wafer corrosion area and other zone isolation open.
Preferably, the edge of the described first hole portion caves inward, described first seal is arranged in this depression, the edge of the described second hole portion caves inward, described second seal is arranged in this depression, after described first holder and the described second holder pressing, described first seal and described second seal fit tightly described wafer respectively.
Preferably, described first holder also comprises first limited part that is used for the restriction wafer around the described first hole portion.
Preferably, by the described first limited part area surrounded than regional low outside first limited part on described first holder.
Preferably, the described first limited part area surrounded is than the thickness of the low wafer in the zone outside first limited part on described first holder.
Preferably, described first holder also comprises first limited part that is used for the restriction wafer around the described first hole portion, and described second holder also comprises second limited part that is used for the restriction wafer around the described second hole portion.
Preferably, the first limited part area surrounded is a little less than the zone beyond first limited part, and the second limited part area surrounded is a little less than the zone beyond second limited part.
Preferably, after described first holder and the described second holder pressing, the height in the zone that is used for ccontaining wafer that the described first limited part area surrounded and described second holder institute area surrounded form is suitable with the thickness of wafer.
Preferably, described first holder comprises first clamping plate, and with the first handle that described first clamping plate are fixedlyed connected, the wherein said first hole portion, first sealing ring and first limited part are arranged at described first clamping plate.
Preferably, described second holder comprises second clamping plate, and with the second handle that described second clamping plate are fixedlyed connected, the wherein said second hole portion, second sealing ring and second limited part are arranged at described second clamping plate.
Preferably, described first holder and described second holder are symmetrical arranged.
Preferably, described first handle is provided with first locking piece, second handle is provided with second locking piece, first locking piece comprises the pin that is fixed in the first handle and exposes the hasp that the end outside first handle articulates with this pin, second locking piece comprises and being fixed in the second handle and the pin of exposed portions serve end, describedly can be overlapped on the part end that described second locking piece exposes after snapping over described first holder and the second holder pressing.
Anchor clamps of the present invention can wafer is to be corroded first passage and/or the second channel of zone by these anchor clamps expose to the open air out, in order to utilize etchant solution to corrode; The seal that is arranged on the first hole portion and the second hole portion simultaneously can prevent effectively that etchant solution from eroding to other and not needing the zone of corroding.
In all descriptions of the application, when anchor clamps were used in the specific adjusted Hfe amplification control operation, the wafer of the clamping of was the test wafer, perhaps is the sheet of going ahead of the rest.
Description of drawings
Fig. 1 is the structural representation according to an example of anchor clamps of the present invention.
Fig. 2 is the schematic diagram after first holder 10 and 20 pressings of second holder in the example of the present invention.
Embodiment
Further specify the present invention below in conjunction with accompanying drawing.It will be appreciated by those skilled in the art that, below just come purport of the present invention is described in conjunction with concrete execution mode, do not limit enforcement of the present invention at this point.The scope that the present invention advocates is determined that by appended claim any modification, change that does not break away from spirit of the present invention all should be contained by claim of the present invention.
Fig. 1 is the structural representation according to an example of anchor clamps of the present invention.These anchor clamps are used at semiconductor crystal wafer manufacture process clamping wafer so that it is corroded, and as shown in the figure, anchor clamps 1 comprise first holder 10 and second holder 20.First holder 10 and second holder 20 are articulated by link 12, and win holder 10 and second holder 20 can be relatively rotated around this link 12.On first holder, be provided with the first hole portion 101, be provided with corrosion resistant seal 102 around this first hole portion 101, after first holder 10 and 20 pressings of second holder, the first hole portion 101 forms and is used for corroding the first passage that is clamped in the wafer (not shown) between first holder 10 and second holder 20, and the seal 102 wafer area that will corrode and other zone isolation of wafer are opened.Preferably, this corrosion resistant seal 102 is arranged on the inboard of the first hole portion 101.
In this example, second holder 20 is provided with the second hole portion 201, be provided with seal 202 around this second hole portion 201, after first holder 10 and 20 pressings of second holder, 201 formation of the second hole portion are used for corroding the wafer area that is clamped between first holder 10 and second holder 20 and keep apart.
In this example, first passage and second channel correspond respectively to the different surfaces of wafer after first holder 10 and 20 pressings of second holder.
Exemplarily, corrosion resistant first seal 102 and corrosion-resistant second seal 202 are separately positioned on the inboard of the first hole portion 101 and the second hole portion 201.Alternatively, first seal 102 and second seal 202 are separately positioned on the whole inboard of the first hole portion 101 and the second hole portion 201; As an alternative, first seal 102 and second seal 202 also can only be separately positioned on the part inboard of the first hole portion 101 and the second hole portion 201, this part inboard is the inboard near wafer, such as: the edge of the first hole portion 101 and the second hole portion 201 caves inward respectively, thereby makes corrosion resistant first seal 102 and corrosion resistant second seal 202 be separately positioned in the depression of the first hole portion 101 and the second hole portion 201.No matter seal is arranged on the inboard of the first hole portion 101 and the second hole portion 201 in which way, and after first holder 10 and 20 pressings of second holder, first seal 102 and second seal 202 fit tightly wafer respectively.
Further, example but without limitation, first holder 10 comprises that also first limited part, 103, the second holders 20 that arrange around the first hole portion 101 comprise second limited part 203 that arranges around the second hole portion 102.103 region surrounded 104 of first limited part can be lower than on first holder 10 in 203 region surrounded of the zone of first limited part, 103 outsides 105, the second limited parts can be lower than on second holder 20 zone 205 in second limited part, 203 outsides.After first holder 10 and 20 pressings of second holder, the height in the zone that is used for ccontaining wafer that 103 area surrounded 104 of first limited part and 203 area surrounded of second limited part 204 form is suitable with the thickness of wafer.As an alternative, 103 region surrounded 104 of first limited part also can with first holder 10 in the zone 105 of first limited part, 103 outsides at same horizontal plane, 203 region surrounded of second limited part also can with second holder 20 in the zone 205 of second limited part, 203 outsides at same horizontal plane; After first holder 10 and 20 pressings of second holder, the height in the zone that is used for ccontaining wafer that 103 area surrounded 104 of first limited part and 203 area surrounded of second limited part 204 form is suitable with the thickness of wafer.In addition, as another replacement scheme, on second holder 20 second limited part can be set, that is wafer is accommodated in first limited part, the 103 formed spatial accommodations of first holder 10 fully, under these circumstances, on first holder 10,103 area surrounded 104 of first limited part can be lower than the thickness of zone 105 wafers of first limited part, 103 outsides, perhaps should the zone 104 with zone 105 at same horizontal plane, but it is after first holder 10 and 20 pressings of second holder, suitable by formed height and the thickness of wafer in order to the zone that holds wafer of first limited part 103 and second holder 20.
As example, first holder 10 comprises the first clamping plate 10a and the first handle 10b of fixedlying connected with the first clamping plate 10a; And second holder 20 comprises the second clamping plate 20a and the second handle 20b of fixedlying connected with second clamping plate.So, the first hole portion 101, first seal 102, first limited part 103 all are arranged on the first clamping plate 10a, and the second hole portion 201, second seal 202, second limited part 203 all are arranged on the second clamping plate 20a.The first clamping plate 10a can be fixedlyed connected by riveted way with first handle 10b, and as an alternative, first handle 10b is also extensible from the first clamping plate 10a, and under these circumstances, first handle 10b and the first clamping plate 10a can be one-body molded.Similarly, the second clamping plate 20a can be fixedlyed connected by riveted way with second handle 20b, and as an alternative, second handle 20b is also extensible from the second clamping plate 20a, and under these circumstances, second handle 20b and the second clamping plate 20a can be one-body molded.
Example but without limitation, first holder 10 and second holder 20 are to be symmetrical arranged, that is, the first hole portion 101, first seal 102, and first limited part 103 respectively with the second hole portion 102, second seal 202, and second limited part 203 be symmetrical arranged.
In above-mentioned each example, first seal 102 and second seal 202 can be corrosion resistant sealing rings, and this corrosion resistant sealing ring can be formed by fluorubber.
Alternatively, can first handle locking piece 106 be set at first handle 10b, in second handle 20b and this handle locking piece 106 corresponding positions second handle locking piece 206 be set.After first holder 10 and 20 pressings of second holder, thereby first handle locking piece 106 combines with second handle locking piece 206 first handle 10b and second handle 20b is locked together.In this example, first locking piece 106 comprises the pin that is fixed in the first handle, the hasp 1061 that is connected with this pin pivot; 206 of second locking pieces are the pins that is fixed in the second handle, wherein be fixed on pin exposed portions serve end 2061 in the second handle beyond second handle 20b, at first holder 10 when first handle 10b contacts with second handle 20b with 20 pressings of second holder, then this hasp 1061 fastens on the part end 2061 that the pin in the second handle exposes, thereby with first handle and second handle locking.When needed, hasp can be taken off from second locking piece, thereby unlock.By cooperatively interacting of first handle locking piece 106 and second handle locking piece 206, first holder 10 and second holder 20 can be locked in stitching state, and as required, remove the lock-out state of first holder 10 and second holder 20, they can be opened.
Fig. 2 is the schematic diagram after first holder 10 and 20 pressings of second holder.Under first holder 10 and second holder, 20 symmetrically arranged situations, as shown in the figure, first holder 10 combines with second holder 20, and thus, first passage is not having passage of corresponding formation under the situation of wafer with second channel.
Be example with the anchor clamps of above setting forth in conjunction with Fig. 1, when needs corrode wafer, wafer can be placed on the first area of first holder 10, the wafer regional alignment first hole portion 101 to be corroded; Then with the direction pressing of second holder 20 towards first holder 10, thereby wafer is fixed in the second area of the first area of first holder and second holder; Alternatively, the hasp of first handle locking piece 106 can be fastened to second handle locking piece 206, thereby the stitching state of first holder 10 and second holder 20 is locked.Subsequently, can splash into for example HF solution to wafer by first passage, with the oxide layer on the corrosion wafer, thereby expose the test tube core.Accordingly, can be after by first passage wafer being corroded, by second channel the another side of wafer is corroded to expose the test tube core again.
Carrying out Hfe amplification test with the power transistor wafer is that example describes.After utilizing anchor clamps of the present invention, just can amplify operation (for example emitter region diffusion) at power transistor production specific adjusted Hfe tests with wafer test, rather than as prior art, the sheet (that is, test use wafer) of will going ahead of the rest by the time proceeds to the characteristic test stage to carry out Hfe again and tests.Produce specific accent Hfe at power transistor and amplify operation (for example emitter region diffusion), test is put between first holder 10 and second holder 20 of anchor clamps with wafer, wherein, the ad-hoc location that is used for test of wafer is aimed at the first hole portion, the second hole portion is then aimed in the relevant position that is used for test of wafer another side, thereby successively by the first hole portion and second hole portion corrosion wafer.The thickness of oxide layer that depends on the wafer respective side by the etching time of the first hole portion and the second hole portion.In the process of corroding, because the setting of first seal and second seal makes wafer treat that the zone beyond the corrosion area can be kept apart effectively.In addition, the setting of first handle locking piece 106 and second handle locking piece 106 has guaranteed that the stitching state of first holder 10 and second holder 20 can arbitrarily not change, and has therefore guaranteed safe the carrying out of corrosion.
In these given all examples of the present invention, first holder and second holder can be formed by the high polypropylene of cleanliness factor, and articulated part can be made of metal.It will be appreciated by those skilled in the art that the material that constitutes the each several part of anchor clamps of the present invention can be decided according to actual conditions, more than given material only be example.
Above explanation in conjunction with Fig. 1 and Fig. 2 is exemplary and nonrestrictive, in the practical application, each parts (for example second hole portion) on each parts on first holder (for example first hole portion) and second holder can asymmetricly arrange, but arrange as required, and the pore size of this hole portion also can be decided as required.
In addition, the size of the grip block on first holder and second holder also can arrange according to actual needs, not as restriction.
Claims (13)
1. one kind is used at the anchor clamps of semiconductor crystal wafer manufacture process clamping wafer so that it is corroded, it is characterized in that, described anchor clamps comprise first holder, second holder with the pivot joint of first holder, described first holder is provided with the first hole portion, be provided with first seal around the described first hole portion, after described first holder and the described second holder pressing, the first hole portion forms the first passage that is clamped in the wafer between described first holder and described second holder in order to corrosion, and described first seal treats that with wafer corrosion area and other zone isolation open.
2. anchor clamps according to claim 1, it is characterized in that, described second holder is provided with the second hole portion, be provided with second seal around the described second hole portion, after described first holder and the described second holder pressing, the second hole portion forms the second channel that is clamped in the wafer between described first holder and described second holder in order to corrosion, and described second seal treats that with wafer corrosion area and other zone isolation open.
3. anchor clamps according to claim 2, it is characterized in that, the edge of the described first hole portion caves inward, described first seal is arranged in this depression, the edge of the described second hole portion caves inward, described second seal is arranged in this depression, and after described first holder and the described second holder pressing, described first seal and described second seal fit tightly described wafer respectively.
4. anchor clamps according to claim 3 is characterized in that, described first holder also comprises first limited part that is used for the restriction wafer around the described first hole portion.
5. anchor clamps according to claim 4 is characterized in that, by the described first limited part area surrounded than regional low outside first limited part on described first holder.
6. anchor clamps according to claim 5 is characterized in that, the described first limited part area surrounded is than the thickness of the low wafer in the zone outside first limited part on described first holder.
7. anchor clamps according to claim 3, it is characterized in that, described first holder also comprises first limited part that is used for the restriction wafer around the described first hole portion, and described second holder also comprises second limited part that is used for the restriction wafer around the described second hole portion.
8. anchor clamps according to claim 7 is characterized in that, the first limited part area surrounded is a little less than the zone beyond first limited part, and the second limited part area surrounded is a little less than the zone beyond second limited part.
9. according to claim 7 or 8 described anchor clamps, it is characterized in that, after described first holder and the described second holder pressing, the height in the zone that is used for ccontaining wafer that the described first limited part area surrounded and the described second holder area surrounded form is suitable with the thickness of wafer.
10. according to each described anchor clamps in the claim 1 to 8, it is characterized in that, described first holder comprises first clamping plate, and with the first handle that described first clamping plate are fixedlyed connected, the wherein said first hole portion, first sealing ring and first limited part are arranged at described first clamping plate.
11. anchor clamps according to claim 10, it is characterized in that, described second holder comprises second clamping plate, and with the second handle that described second clamping plate are fixedlyed connected, the wherein said second hole portion, second sealing ring and second limited part are arranged at described second clamping plate.
12., it is characterized in that described first holder and described second holder are symmetrical arranged according to each described anchor clamps in the claim 11.
13. anchor clamps according to claim 11, it is characterized in that, described first handle is provided with first locking piece, second handle is provided with second locking piece, first locking piece comprises the pin that is fixed in the first handle and exposes the hasp that the end outside first handle articulates with this pin, second locking piece comprises and being fixed in the second handle and the pin of exposed portions serve end, describedly can be overlapped on the part end that described second locking piece exposes after snapping over described first holder and the second holder pressing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110450162.1A CN103187346B (en) | 2011-12-29 | 2011-12-29 | For clamping wafer with the fixture corroded it |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110450162.1A CN103187346B (en) | 2011-12-29 | 2011-12-29 | For clamping wafer with the fixture corroded it |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103187346A true CN103187346A (en) | 2013-07-03 |
| CN103187346B CN103187346B (en) | 2016-02-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110450162.1A Active CN103187346B (en) | 2011-12-29 | 2011-12-29 | For clamping wafer with the fixture corroded it |
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| CN (1) | CN103187346B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304548A (en) * | 2015-10-13 | 2016-02-03 | 常州隆德电气有限公司 | Wafer chuck |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2258656Y (en) * | 1996-09-20 | 1997-07-30 | 西安交通大学 | Clamping holder for single crystal silicon wafer anisotropic etching |
| US6514776B1 (en) * | 1999-06-24 | 2003-02-04 | Kumiko Yanagi | Instrument and method for measuring contamination of wafer surface |
| CN1522557A (en) * | 2001-07-05 | 2004-08-18 | 目白精使煞萦邢薰司 | Fabricating method for printed circuit board |
| US20100240222A1 (en) * | 2007-07-16 | 2010-09-23 | Steve Fyten | Wafer fixture for wet process applications |
-
2011
- 2011-12-29 CN CN201110450162.1A patent/CN103187346B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2258656Y (en) * | 1996-09-20 | 1997-07-30 | 西安交通大学 | Clamping holder for single crystal silicon wafer anisotropic etching |
| US6514776B1 (en) * | 1999-06-24 | 2003-02-04 | Kumiko Yanagi | Instrument and method for measuring contamination of wafer surface |
| CN1522557A (en) * | 2001-07-05 | 2004-08-18 | 目白精使煞萦邢薰司 | Fabricating method for printed circuit board |
| US20100240222A1 (en) * | 2007-07-16 | 2010-09-23 | Steve Fyten | Wafer fixture for wet process applications |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105304548A (en) * | 2015-10-13 | 2016-02-03 | 常州隆德电气有限公司 | Wafer chuck |
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| Publication number | Publication date |
|---|---|
| CN103187346B (en) | 2016-02-10 |
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