CN103186252A - Sensor module of optical mouse and manufacturing method for sensor module of optical mouse - Google Patents
Sensor module of optical mouse and manufacturing method for sensor module of optical mouse Download PDFInfo
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- CN103186252A CN103186252A CN2011104537676A CN201110453767A CN103186252A CN 103186252 A CN103186252 A CN 103186252A CN 2011104537676 A CN2011104537676 A CN 2011104537676A CN 201110453767 A CN201110453767 A CN 201110453767A CN 103186252 A CN103186252 A CN 103186252A
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- optical mouse
- sensor module
- substrate
- encapsulation body
- chip encapsulation
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Abstract
The invention provides a sensor module of an optical mouse. The sensor module of the optical mouse comprises a substrate, an image sensing component and a surface mount device-packaged (SMD-packaged) light-emitting chip packaging body, wherein the substrate is provided with a lower surface; the image sensing component is arranged on the lower surface of the substrate; the light-emitting chip packaging body is electrically connected with the lower surface of the substrate; a light beam is generated by the light-emitting chip packaging body to be projected to an outside surface, and the light beam is reflected to the image sensing component by the outside surface. The invention also provides a manufacturing method for the sensor module of the optical mouse. According to the sensor module of the optical mouse, the light loss of the light beam on a whole optical path can be reduced, and further, the sensitivity of the optical mouse is increased, and the production qualification ratio is increased.
Description
The present invention relevant a kind of optical mouse, particularly a kind of optical mouse sensor module and preparation method thereof.
Background technology
The image on the surface that optical mouse is placed with its inner image sensor acquisition optical mouse moves the change situation that causes pick-up image via mouse, and makes the vernier (cursor) on the display screen do a relevant movement.
The optics sensing module of traditional a kind of optical mouse is to make luminescence chip carry out transistor external form (TO) encapsulation or lamp type (lamp) encapsulation, wherein transistor external form (TO) encapsulates the price height, though and the lamp type encapsulates low price, but qualification rate and degree of accuracy are not good, and encapsulation volume is big, be illustrated in figure 1 as known a kind of with the optics sensing module 30 of lamp type encapsulated LED as light source, wherein LED 32 is arranged on the circuit board 34, and Image Sensor 36 is to be arranged at a holder 38 inboards, one lens component 40 also is set between LED 32 and the Image Sensor 36, use the light beam 42 that LED 32 is produced and be projected to desktop 44 via converging of lens component 40, desktop 44 beam reflected 42 image in Image Sensor 36 via converging of lens component 40 again, in this kind design, because the encapsulation volume of LED 32 is big, the light beam 42 that makes LED 32 produce needs to reflex to Image Sensor 36 again through the light path arrival desktop 44 of long distance, therefore, cause light loss on the whole light path easily.
The optics sensing module of traditional another kind of optical mouse is with light structures such as luminescence chip, Image Sensor and lens, be encapsulated in same the IC element, make an IC element namely have the function of optical mouse sensing module, yet the packaging cost height of this kind design, in case and the luminescence chip in the IC element, Image Sensor or lens are when bad, can't only change one of them bad member, again encapsulate again and need to change all elements, therefore cause component loss and can't reduce cost of manufacture.
Summary of the invention
In order to address the above problem, one of the object of the invention provides a kind of optical mouse sensor module and preparation method thereof, it uses the luminous chip encapsulation body of surface adhesion components (SMD) encapsulation type, and luminous chip encapsulation body and Image Sensor are arranged on the same substrate, the component size of whole optical mouse sensor module is dwindled, can effectively dwindle the optical mouse sensor module to the distance on extraneous surface, reduce the light loss of light beam on whole light path, and then the sensitivity of increase optical mouse, and increase the production qualification rate.
One of the object of the invention provides a kind of optical mouse sensor module, and it has power saving, energy-conservation and ensure the effect of eye-safe.
One of the object of the invention provides a kind of optical mouse sensor module, and the luminous chip encapsulation body of its surface adhesion components (SMD) encapsulation type has the advantage that qualification rate is good and degree of accuracy is high of changing easily and making the optical mouse sensor module.
In order to achieve the above object, the optical mouse sensor module of one embodiment of the invention comprises: one has the substrate of a lower surface; One Image Sensor is arranged at the lower surface of substrate; And the luminous chip encapsulation body of surface adhesion components (SMD) encapsulation type, be electrically connected at the lower surface of substrate, luminous chip encapsulation body produces a light beam and is projected to an extraneous surface, extraneous surface with beam reflection to Image Sensor.
The method for making of one embodiment of the invention optical mouse sensor module comprises: encapsulating a luminescence chip with a surface mount technology is a luminous chip encapsulation body; And a lower surface that electrically connects luminous chip encapsulation body and Image Sensor to a substrate.
Description of drawings
Figure 1 shows that known a kind of with the optics sensing module of lamp type encapsulated LED as light source.
Figure 2 shows that the structural representation of one embodiment of the invention optical mouse sensor module.
Figure 3 shows that the light path synoptic diagram in one embodiment of the invention optical mouse sensor module.
Figure 4 shows that the method for making schematic flow sheet of one embodiment of the invention optical mouse sensor module.
[main element symbol description]
10 optical mouse sensor modules
12 substrates
121 lower surfaces
14 Image Sensors
16 luminous chip encapsulation bodies
161 solder joints
18 extraneous surfaces
20 light beams
30 optics sensing modules
32 LED
34 circuit boards
36 Image Sensors
38 holders
40 lens components
42 light beams
44 desktops
S50, S52 step
Embodiment
Figure 2 shows that the structural representation of one embodiment of the invention optical mouse sensor module.In the present embodiment, as shown in the figure, an optical mouse sensor module 10 comprises a substrate 12, and substrate is a circuit board in one embodiment, and it has a lower surface 121; One Image Sensor 14 is arranged at the lower surface 121 of substrate 12, and Image Sensor 14 for example is a charge coupled cell or a complementary metal oxide semiconductor Image Sensor; And a luminous chip encapsulation body 16, be electrically connected at the lower surface 121 of substrate 12, wherein luminous chip encapsulation body 16 is a surface adhesion components (SMD) packaging body, and several solder joints 161 of packaging body is arranged at the lower surface 121 of substrate 12 with welding manner.In one embodiment, luminous chip encapsulation body 16 carries out SMD encapsulation by a vertical cavity surface emitting laser (VCSEL) (VCSEL) chip and is constituted.
Above-mentioned explanation continues, as shown in Figure 3, the optical mouse (not shown) of using optical mouse sensor module 10 of the present invention is to be positioned on 18 (as the desktops) of an extraneous surface, luminous chip encapsulation body 16 produces a light beam 20 and is projected to extraneous surface 18, extraneous surface 18 reflexes to Image Sensor 14 with light beam 20, so that the image via the extraneous surface 18 of Image Sensor 14 acquisitions, so when user's mobile optical mouse, 14 picked image of Image Sensor just can change thereupon.
Figure 4 shows that the method for making schematic flow sheet of one embodiment of the invention optical mouse sensor module, as shown in the figure, the method for making of optical mouse sensor module comprises: encapsulate a luminescence chip with a surface mount technology, to constitute a luminous chip encapsulation body, this is step S50, in one embodiment, luminescence chip is a vertical cavity surface emitting laser (VCSEL) (VCSEL) chip; Afterwards, electrically connect a lower surface of this chip packing-body and Image Sensor to a substrate, this is step S52, and wherein substrate is a circuit board, and chip packing-body is the lower surface that welding manner is electrically connected at substrate.
In the present invention, light source uses the luminous chip encapsulation body 16 that constitutes through the SMD encapsulation, and luminous chip encapsulation body 16 is arranged on the lower surface 121 of same substrate 12 with Image Sensor 14, wherein because the microminiaturized characteristics of luminous chip encapsulation body 16, the component size of whole optical mouse sensor module 10 is dwindled, can dwindle optical mouse sensor module 10 to the distance on extraneous surface 18, reduce the light loss of light beam 20 on whole light path, and then the sensitivity of increase optical mouse, so that different extraneous surfaces (being different desktops) is all applicable, wherein more because the dwindling of whole light path, for luminous chip encapsulation body 16 and the installation of Image Sensor 14 on substrate 12, precisely the demand degree can reduce, and increasing the production qualification rate, dwindling of light path also can be omitted traditional use as light constitutive element parts such as lens simultaneously; In addition, the minimizing of light loss more can reduce light source output power, reach power saving, effect of saving energy, again when luminous chip encapsulation body 16 be when carrying out SMD encapsulation and constituted by a vertical cavity surface emitting laser (VCSEL) (VCSEL), its lower powered use more can ensure user's eye-safe and meet the product safety.
On the other hand, because each luminous chip encapsulation body 16 has detected and screening after producing all, the qualification rate of luminous chip encapsulation body 16 obtains to ensure, so luminous chip encapsulation body 16 and Image Sensor 14 are installed on and constitute optical mouse sensor module 10 on the substrate 12 and namely obtain suitable qualification rate assurance.In addition.In case when the luminous chip encapsulation body 16 in the optical mouse sensor module 10 needs to change, only need the solder joint 161 of the luminous chip encapsulation body 16 on the tip-off substrate 12 to change and get final product, do not need to change simultaneously the Image Sensor 14 that does not have damage.With respect to tradition with luminescence chip, Image Sensor and lens simultaneously with packaging technology constitute an encapsulation wherein element that IC was caused bad but need all to change and the designs of encapsulation again for, the present invention has and changes easily and the good advantage of qualification rate of optical mouse sensor module.In the optical mouse sensor module of another embodiment of the present invention, one lens still can be set in the below of Image Sensor and luminous chip encapsulation body according to deviser's demand, when wherein in case the bad needs of luminous chip encapsulation body are changed, also unlikely dismounting and the replacing that influences lens.
Comprehensively above-mentioned, the present invention uses the luminous chip encapsulation body of SMD encapsulation type as the light source of optical mouse, makes the optical mouse sensor module have microminiaturized advantage; And, luminous chip encapsulation body and Image Sensor arrange same circuit board, can dwindle the optical mouse sensor module to the distance on extraneous surface, reduce the light loss of light beam on whole light path, and then increase the sensitivity of optical mouse, and reach power saving, energy-conservation and ensure the effect of eye-safe.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose is to make the personage who has the knack of this skill can understand content of the present invention and implements according to this, when can not with restriction claim of the present invention, namely the equalization of doing according to disclosed spirit generally changes or modifies, and must be encompassed in the claim of the present invention.
Claims (9)
1. an optical mouse sensor module is characterized in that, comprises:
One substrate has a lower surface;
One Image Sensor is arranged at this lower surface of this substrate; And
One luminous chip encapsulation body, it is a surface adhesion components (SMD) packaging body, and be electrically connected at this lower surface of this substrate, this luminous chip encapsulation body produces a light beam and is projected to an extraneous surface, this surface, external world with this beam reflection to this Image Sensor.
2. optical mouse sensor module as claimed in claim 1 is characterized in that, this luminous chip encapsulation body is the packaging body of a vertical cavity surface emitting laser (VCSEL) (VCSEL).
3. optical mouse sensor module as claimed in claim 1 is characterized in that, this substrate is a circuit board.
4. optical mouse sensor module as claimed in claim 1 is characterized in that, also comprises lens, is arranged at the below of this Image Sensor and this luminous chip encapsulation body.
5. optical mouse sensor module as claimed in claim 1 is characterized in that, this luminous chip encapsulation body is electrically connected at this lower surface of this substrate with welding manner.
6. the method for making of an optical mouse sensor module is characterized in that, comprises:
Encapsulating a luminescence chip with a surface mount technology is a luminous chip encapsulation body; And
Electrically connect a lower surface of this luminous chip encapsulation body and Image Sensor to a substrate.
7. the method for making of optical mouse sensor module as claimed in claim 6 is characterized in that, this luminescence chip is a vertical cavity surface emitting laser (VCSEL) (VCSEL) chip.
8. the method for making of optical mouse sensor module as claimed in claim 6 is characterized in that, this luminous chip encapsulation body is electrically connected at this lower surface of this substrate with welding manner.
9. the method for making of optical mouse sensor module as claimed in claim 6 is characterized in that, this substrate is a circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104537676A CN103186252A (en) | 2011-12-30 | 2011-12-30 | Sensor module of optical mouse and manufacturing method for sensor module of optical mouse |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104537676A CN103186252A (en) | 2011-12-30 | 2011-12-30 | Sensor module of optical mouse and manufacturing method for sensor module of optical mouse |
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| CN103186252A true CN103186252A (en) | 2013-07-03 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2560031Y (en) * | 2002-06-25 | 2003-07-09 | 陈淑芬 | Improved optical mouse |
| TW200732948A (en) * | 2006-02-17 | 2007-09-01 | Pixon Technologies Corp | Optical mouse system with illumination guide having a light spreading lens |
| CN101086692A (en) * | 2006-06-07 | 2007-12-12 | 安华高科技Ecbuip(新加坡)私人有限公司 | Utilizing an internal reflection surface to reflect and collimate sidelight in an optical navigation device |
| TW200928882A (en) * | 2007-12-25 | 2009-07-01 | Myson Century Inc | Optical navigator sensor and optical navigator apparatus using the same |
| TW201022992A (en) * | 2008-12-04 | 2010-06-16 | Elan Microelectronics Corp | A COB module for optical mouse and the optical mouse |
| CN202443423U (en) * | 2011-12-30 | 2012-09-19 | 禧通科技股份有限公司 | Sensor module of optical mouse |
-
2011
- 2011-12-30 CN CN2011104537676A patent/CN103186252A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2560031Y (en) * | 2002-06-25 | 2003-07-09 | 陈淑芬 | Improved optical mouse |
| TW200732948A (en) * | 2006-02-17 | 2007-09-01 | Pixon Technologies Corp | Optical mouse system with illumination guide having a light spreading lens |
| CN101086692A (en) * | 2006-06-07 | 2007-12-12 | 安华高科技Ecbuip(新加坡)私人有限公司 | Utilizing an internal reflection surface to reflect and collimate sidelight in an optical navigation device |
| TW200928882A (en) * | 2007-12-25 | 2009-07-01 | Myson Century Inc | Optical navigator sensor and optical navigator apparatus using the same |
| TW201022992A (en) * | 2008-12-04 | 2010-06-16 | Elan Microelectronics Corp | A COB module for optical mouse and the optical mouse |
| CN202443423U (en) * | 2011-12-30 | 2012-09-19 | 禧通科技股份有限公司 | Sensor module of optical mouse |
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Application publication date: 20130703 |