CN103185476B - The radiator structure of heat-sink unit - Google Patents
The radiator structure of heat-sink unit Download PDFInfo
- Publication number
- CN103185476B CN103185476B CN201110456133.6A CN201110456133A CN103185476B CN 103185476 B CN103185476 B CN 103185476B CN 201110456133 A CN201110456133 A CN 201110456133A CN 103185476 B CN103185476 B CN 103185476B
- Authority
- CN
- China
- Prior art keywords
- heat
- sink unit
- meter level
- section
- level thread
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention discloses a kind of radiator structure of heat-sink unit, comprise: a heat-sink unit body, it has a chamber, described chamber is provided with at least one how meter level thread like body structure sheaf and a working fluid, how meter level thread like body structure series of strata are located at this chamber inner wall for this, through this is set in this chamber, how meter level thread like body structure series of strata can significantly promote capillarity, and then strengthen the steam-condensate circulating efficiency of the working fluid of heat sink interior, use lifting heat biography and imitate able one.
Description
Technical field
The present invention relates to a kind of radiator structure of heat-sink unit, espespecially one can heat radiation deviceThe radiator structure of the heat-sink unit of internal work fluid steam-condensate circulating efficiency.
Background technology
Existing electronic equipment internal for stress high cooling efficiency select in a large number heat pipe, temperature-uniforming plate,The thermal transmission element such as loop circuit heat pipe, heat exchanger carries out hot conduction work.
And its pyroconductivity of these thermal transmission elements is several times to tens times left side of the metal such as copper, aluminiumRight and suitable excellence, is applied to various hot countermeasures and is correlated with as cooling with elementMachine. From shape, heat pipe can be divided into heat pipe, flat pattern and the D type shape of round tube shapeThe heat pipe of shape. For cooling CPU or other produce the electronics zero of heat because carrying out computing or workThe part to be cooled of the e-machine of part etc., based on being easily installed on part to be cooled and can obtainingThe viewpoint of broad contact area, also adopts temperature-uniforming plate or platypelloid type heat pipe or thin-type heat interchangerDispel the heat. Along with miniaturization, the save space of cooling body, at the cooler that uses heat pipeThe situation of structure, more has the necessity of utmost point slimming of being strict with this heat pipe.
When described these thermal transmission element internal work fluids are wanted to carry out steam-condensate circulating, its inside need be establishedPut the capillary structure (groove, metal grill body structure, sintering structure etc.) with capillary force,Make to make working fluid to be able to carry out in this thermal transmission element smoothly the work of steam-condensate circulating.
If these thermal transmission elements need be used in comparatively narrow part, certainly will make slimming,The capillary structure of this inside will be except the thickness problem of thermal transmission element own, makes this heatPass assembly and cannot make the main problem of slimming.
Moreover, make capillary structure after slimming can because of its capillary force after slimming also underFall, affect within this thermal transmission element working fluid steam-condensate circulating efficiency and then make heat conduction efficiencySignificantly reduce, therefore known techniques has following shortcoming:
1, hot transfer efficiency is not good
2, thermal transmission element slimming is limited.
Summary of the invention
Therefore,, for addressing the above problem, the invention provides one and can promote heat conduction and radiating efficiencyThe radiator structure of heat-sink unit.
The present invention also provides a kind of its internal work fluid vapour-liquid of heat abstractor that promotes slimmingThe radiator structure of the heat-sink unit of circulation.
For reaching above-mentioned object, the present invention system provides the radiator structure of a heat-sink unit, is to comprise:One heat-sink unit body has a chamber, and described chamber is provided with at least one how meter level thread like body structureLayer and a working fluid, how this chamber inner wall is located in the extension of meter level thread like body structure sheaf for this.
Described heat-sink unit body series can be heat pipe and loop circuit heat pipe and flat plate heat tube and sammingPlate and heat exchanger are wherein arbitrary.
It is described that how meter level thread like body structure series of strata can significantly promote this heat-sink unit body interior workMake the efficiency of the steam-condensate circulating of fluid, and careful because of its structure, while making this heat abstractor slimmingStill can maintain its capillary force, make the smooth vapour-liquid of heat-sink unit body interior working fluidCirculation.
Brief description of the drawings
Fig. 1 is the stereogram of radiator structure first embodiment of the present invention's heat-sink unit;
Fig. 2 is the A-A cutaway view of radiator structure first embodiment of the present invention's heat-sink unit;
Fig. 2 A is the 2A portion enlarged drawing of Fig. 2;
Fig. 3 is the cutaway view for radiator structure second embodiment of the present invention's heat-sink unit;
Fig. 4 is the cutaway view of radiator structure the 3rd embodiment of the present invention's heat-sink unit;
Fig. 5 is the cutaway view of radiator structure the 4th embodiment of the present invention's heat-sink unit;
Fig. 6 is the cutaway view of radiator structure the 5th embodiment of the present invention's heat-sink unit;
Fig. 7 is the cutaway view of radiator structure the 6th embodiment of the present invention's heat-sink unit;
Fig. 8 is the cutaway view of radiator structure the 7th embodiment of the present invention's heat-sink unit;
Fig. 9 is the cutaway view of radiator structure the 8th embodiment of the present invention's heat-sink unit;
Figure 10 is the cutaway view of radiator structure the 9th embodiment of the present invention's heat-sink unit;
Figure 11 is the cutaway view of radiator structure the tenth embodiment of the present invention's heat-sink unit;
Figure 12 is the cutaway view of radiator structure the 11 embodiment of the present invention's heat-sink unit.
Main element symbol description
Heat-sink unit body 1
Chamber 11
How meter level thread like body structure sheaf 111
Working fluid 112
The first section 113
The second section 114
The 3rd section 115
Plated film 2
Capillary structure 3
Detailed description of the invention
Characteristic in the present invention's above-mentioned purpose and structure thereof and function, will according to appended graphic itPreferred embodiment is explained.
Referring to Fig. 1,2 and 2A, is the radiator structure first of the present invention's heat-sink unitThe solid of embodiment and A-A cutaway view, as shown in the figure, the radiator structure of described heat-sink unit,System comprises: a heat-sink unit body 1 has a chamber 11, and described chamber 11 is provided with at least oneHow meter level thread like body structure sheaf 111 and a working fluid 112, this is meter level thread like body structure sheaf how111 is that complete or local extension is arranged at this chamber 11 inwalls, and how meter level thread like body is tied for thisStructure layer 111 is that how meter level thread like body is formed by plural number, and how this one end of meter level thread like body beFixed end is arranged on these chamber 11 inwalls, and its other end extends to form towards chamber 11 insideFree end, this free end is sharp shape and obtuse wherein arbitrary, or sharp shape and obtuse the two friendshipThe mispairing person of putting.
Described heat-sink unit body 1 is temperature-uniforming plate and flat plate heat tube and loop circuit heat pipe and heatInterchanger is wherein arbitrary, and the present invention is using flat plate heat tube as illustrating but not regarding it as and be limited,And described chamber 11 inwalls are level and smooth wall.
Referring to Fig. 3, is the cuing open of radiator structure the second embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment heat-sink unit body 1 be using heat pipe as explanation but notRegard it as and be limited, how meter level thread like body structure sheaf 111 extends axially the chamber of being located at this heat pipe for this11 inwalls.
Referring to Fig. 4, is the cuing open of radiator structure the 3rd embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment heat-sink unit body 1 be using heat pipe as explanation but notRegard it as and be limited, described chamber 11 has more at least one the first section 113 and one second section 114And one the 3rd section 115, described first, second and third section 113,114,115 interconnects,Described how meter level thread like body structure sheaf 111 is to select to be arranged at described the first section 113, secondSection 114 and the 3rd section 115 are wherein arbitrary, how meter level thread like body structure of the present embodiment systemLayer 111 is only arranged at this second section 114, but does not regard it as and be limited.
Referring to Fig. 5, is the cuing open of radiator structure the 4th embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment system is identical with aforementioned the 3rd embodiment part-structure, thereforeThis will repeat no more, and only not existing together of the present embodiment and aforementioned the 3rd embodiment is described chamber11 have more a plated film 2 (having the characteristic of Superhydrophilic and super-hydrophobicity), and this plated film 2 is choosingSelect and be arranged at described the first section 113 and the second section 114 and the 3rd section 115 and wherein appointOne, this plated film 2 of the present embodiment is to be arranged at the 3rd section 115.
Referring to Fig. 6, is the cuing open of radiator structure the 5th embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment system is identical with aforementioned the 4th embodiment part-structure, thereforeThis will repeat no more, and only not existing together of the present embodiment and aforementioned the 4th embodiment is described chamber11 have more a plated film 2, and this plated film 2 can be arranged at described the first section 113 and simultaneouslyThree sections 115 or wherein arbitrary on.
Referring to Fig. 7, is the cuing open of radiator structure the 6th embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure, thereforeThis will repeat no more, and only not existing together of the present embodiment and aforementioned the first embodiment is described chamberHow 11 inwalls and this have more a capillary structure 3, described institute between meter level thread like body structure sheaf 111Stating capillary structure 3 is sintered powder and grid body and corpus fibrosum and cellular structure body and ditchGroove is wherein arbitrary, and the present embodiment system is using groove as illustrating but not regarding it as and be limited, described grooveBe arranged with in this chamber 11 inwalls, and this how meter level thread like body structure sheaf 111 drapes over one's shoulders and invests this simultaneouslyGroove and chamber 11 inwalls.
Referring to Fig. 8, is the cuing open of radiator structure the 7th embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure, thereforeThis will repeat no more, and only not existing together of the present embodiment and aforementioned the first embodiment is described chamberHow 11 inwalls and this have more a plated film 2 between meter level thread like body structure sheaf 111.
Referring to Fig. 9, is the cuing open of radiator structure the 8th embodiment of the present invention's heat-sink unitView, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure, thereforeThis will repeat no more, and only not existing together of the present embodiment and aforementioned the first embodiment is described chamber11 have more at least one the first section 113 and one second section 114 and one the 3rd section 115,Described first, second and third section 113,114,115 interconnects, on described the second section itHow meter level thread like body structure sheaf 111 is that distribution is closeer.
Refer to Figure 10, be the present invention heat-sink unit radiator structure the 9th embodiment itCutaway view, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure, thereforeTo repeat no more at this, only not existing together of the present embodiment and aforementioned the first embodiment is described chamberChamber 11 has more at least one the first section 113 and one second section 114 and one the 3rd section115, described first, second and third section 113,114,115 interconnects, described first,Three sections 113,115 or first and third section 113,115 be the how meter level on arbitrary section whereinThread like body structure sheaf 111 is that distribution is closeer.
Refer to Figure 11, be the present invention heat-sink unit radiator structure the tenth embodiment itCutaway view, as shown in the figure, the present embodiment system is identical with aforementioned the first embodiment part-structure, thereforeTo repeat no more at this, only not existing together of the present embodiment and aforementioned the first embodiment is described looseHot cell body 1 is a temperature-uniforming plate, and how aforementioned chamber 11 internal faces of this temperature-uniforming plate be provided withMeter level thread like body structure sheaf 111.
Referring to Figure 12, is radiator structure the 11 embodiment of the present invention's heat-sink unitCutaway view, as shown in the figure, the present embodiment system is identical with aforementioned the tenth embodiment part-structure,Therefore will repeat no more at this, only described in not the existing together and be of the present embodiment and aforementioned the tenth embodimentBetween chamber 11 internal faces of temperature-uniforming plate and aforementioned how meter level thread like body structure sheaf 111, have more onePlated film 2.
In this heat pipe and temperature-uniforming plate and flat plate heat tube and loop circuit heat pipe, how its inside is arrangedMeter level thread like body structure sheaf 111, how meter level thread like body structure sheaf 111 is to change this work for thisFluid 112 is the surface tension of portion in the inner, accelerates back-flow velocity and have splendid steam-condensate circulatingEfficiency, uses and significantly promotes heat biography effect able one.
Claims (11)
1. a radiator structure for heat-sink unit, is characterized in that, comprising:
One heat-sink unit body, has a chamber, and described chamber is provided with at least one how meter level lineShape body structure layer and a working fluid, how the extension of meter level thread like body structure sheaf is located in this chamber for thisWall;
Described heat-sink unit body is a heat pipe, and this chamber has more at least one the first sectionAnd one second section and one the 3rd section, described first, second and third section interconnects, described inHow meter level thread like body structure series of strata are single or be arranged at this first, second and third section simultaneously and wherein appointOne section;
Described chamber has more a plated film, this plated film system select to be arranged at described the first section,The second section and the 3rd section are wherein arbitrary.
2. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteStating chamber inner wall is level and smooth wall.
3. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteState heat-sink unit body and be temperature-uniforming plate and heat pipe and loop circuit heat pipe and heat exchanger wherein arbitrary.
4. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteState chamber inner wall and this and how between meter level thread like body structure sheaf, have more a capillary structure.
5. the radiator structure of heat-sink unit as claimed in claim 4, is characterized in that, instituteStating capillary structure is sintered powder and grid body and corpus fibrosum and cellular structure body and grooveWherein arbitrary.
6. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteStating chamber and have more a plated film, is how setting tool has meter level thread like body structure sheaf on this plated film.
7. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteStating heat-sink unit body is a heat pipe, and how meter level thread like body structure sheaf extends axially is located at this for thisThe chamber inner wall of heat pipe.
8. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteState how meter level thread like body structure series of strata on the second section closeer person that distributes.
9. the radiator structure of heat-sink unit as claimed in claim 1, is characterized in that, instituteState the first section and or the how meter level thread like body structure series of strata of the 3rd section closeer person that distributes.
10. the radiator structure of the heat-sink unit as described in as arbitrary in claim 1 to 9, its featureBe, described this how meter level thread like body structure series of strata by plural number, how meter level thread like body is formed, shouldHow one end of meter level thread like body is that fixed end is arranged on this chamber inner wall, its other end courtChamber interior extends to form free end, and this free end is sharp shape and obtuse wherein arbitrary.
The radiator structure of 11. heat-sink units as described in as arbitrary in claim 1 to 9, its featureBe, described this how meter level thread like body structure series of strata by plural number, how meter level thread like body is formed, shouldHow one end of meter level thread like body is that fixed end is arranged on this chamber inner wall, its other end courtChamber interior extends to form free end, and this free end is sharp shape and obtuse the two interconnectedPerson.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110456133.6A CN103185476B (en) | 2011-12-30 | 2011-12-30 | The radiator structure of heat-sink unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110456133.6A CN103185476B (en) | 2011-12-30 | 2011-12-30 | The radiator structure of heat-sink unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103185476A CN103185476A (en) | 2013-07-03 |
| CN103185476B true CN103185476B (en) | 2016-05-11 |
Family
ID=48676783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110456133.6A Active CN103185476B (en) | 2011-12-30 | 2011-12-30 | The radiator structure of heat-sink unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103185476B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11131508B2 (en) | 2018-03-19 | 2021-09-28 | Asia Vital Components Co., Ltd. | Middle member of heat dissipation device and the heat dissipation device |
| CN108534574A (en) * | 2018-03-20 | 2018-09-14 | 奇鋐科技股份有限公司 | The middleware and its radiator of radiator |
| CN112484545A (en) * | 2020-12-01 | 2021-03-12 | 奇鋐科技股份有限公司 | Thin two-phase flow device |
| US11732974B2 (en) | 2021-01-06 | 2023-08-22 | Asia Vital Components Co., Ltd. | Thin-type two-phase fluid device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1624411A (en) * | 2003-12-05 | 2005-06-08 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe |
| TWI255902B (en) * | 2004-06-18 | 2006-06-01 | Hon Hai Prec Ind Co Ltd | Heat pipe and method of manufacturing |
| CN1800766A (en) * | 2005-01-07 | 2006-07-12 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
| TW200702622A (en) * | 2005-07-07 | 2007-01-16 | Ind Tech Res Inst | A heat pipe element with a capillary structure of different-sized holes in multiple stages |
| CN101410685A (en) * | 2006-03-03 | 2009-04-15 | 伊路米耐克斯公司 | Heat pipe with nanotstructured wicking material |
| CN101619947A (en) * | 2008-07-04 | 2010-01-06 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe |
| CN202747869U (en) * | 2011-12-30 | 2013-02-20 | 奇鋐科技股份有限公司 | Heat radiation structure for heat radiation unit |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4382891B2 (en) * | 1998-08-28 | 2009-12-16 | 古河電気工業株式会社 | Flat heat pipe and manufacturing method thereof |
-
2011
- 2011-12-30 CN CN201110456133.6A patent/CN103185476B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1624411A (en) * | 2003-12-05 | 2005-06-08 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe |
| TWI255902B (en) * | 2004-06-18 | 2006-06-01 | Hon Hai Prec Ind Co Ltd | Heat pipe and method of manufacturing |
| CN1800766A (en) * | 2005-01-07 | 2006-07-12 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe and manufacturing method thereof |
| TW200702622A (en) * | 2005-07-07 | 2007-01-16 | Ind Tech Res Inst | A heat pipe element with a capillary structure of different-sized holes in multiple stages |
| CN101410685A (en) * | 2006-03-03 | 2009-04-15 | 伊路米耐克斯公司 | Heat pipe with nanotstructured wicking material |
| CN101619947A (en) * | 2008-07-04 | 2010-01-06 | 鸿富锦精密工业（深圳）有限公司 | Heat pipe |
| CN202747869U (en) * | 2011-12-30 | 2013-02-20 | 奇鋐科技股份有限公司 | Heat radiation structure for heat radiation unit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103185476A (en) | 2013-07-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203934263U (en) | There is the heat abstractor of capillary member | |
| CN103185476B (en) | The radiator structure of heat-sink unit | |
| CN107278089A (en) | Heat conductive structure | |
| CN203327471U (en) | Heat radiation structure and hand-held electronic device with heat radiation structure | |
| US20130213612A1 (en) | Heat pipe heat dissipation structure | |
| CN109974495A (en) | Equalizing plate structure manufacturing method | |
| CN106981462A (en) | Liquid-cooling heat radiator | |
| TW201042435A (en) | Thin-plate type low-pressure thermal siphon plate driven by pressure gradient | |
| CN205623043U (en) | Electronic equipment | |
| CN101819001A (en) | Superconducting element structure | |
| CN202747869U (en) | Heat radiation structure for heat radiation unit | |
| TWI573521B (en) | Heat dissipation structure of handheld electronic device | |
| CN210515205U (en) | Radiating fin for notebook computer circuit board | |
| CN213152666U (en) | Heat radiator | |
| CN202614050U (en) | Heat pipe structure and thermal module and electronic device | |
| CN202565639U (en) | Heat radiation structure of heat radiation device | |
| CN204014401U (en) | Mobile device radiator structure | |
| CN203788635U (en) | Heat-dissipating module | |
| CN102778156A (en) | Thin heat tube structure and manufacturing method thereof | |
| CN105208827A (en) | Heat dissipation structure of handheld device | |
| CN103188917B (en) | Heat radiation structure of radiator | |
| CN103968692B (en) | Radiator structure | |
| CN204069600U (en) | Mobile device radiator structure | |
| CN104168739A (en) | Supporting structure of heat dissipation unit | |
| CN104034192B (en) | Heat pipe structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |