CN103182576A - Improved LED welding technique - Google Patents
Improved LED welding technique Download PDFInfo
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- CN103182576A CN103182576A CN2011104613294A CN201110461329A CN103182576A CN 103182576 A CN103182576 A CN 103182576A CN 2011104613294 A CN2011104613294 A CN 2011104613294A CN 201110461329 A CN201110461329 A CN 201110461329A CN 103182576 A CN103182576 A CN 103182576A
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Abstract
The invention provides an improved LED welding technique. The method comprises that the use of a spacing belt and a down pressing jig is added during the welding process of an LED element, so that, when the welding technology to the LED element is finished, each LED element welded on a copper circuit layer is enabled to be have the same height, therefore, the efficient light utilization efficiency of an LED backlight module is increased; according to the method, during the welding process of the LED element, the first insulating and heat conducting glue is attached to the bottom of a cover body, a second insulating and heat conducting glue arranged on the copper foil circuit layer is attached to the first insulating and heat conducting glue, in this way, a copper foil circuit layer is arranged at the bottom of the cover body, and the phenomenon of glue overflow can be avoided; besides, the spacing belt has the function of limiting the moving of the LED element. Therefore, when welding technology is performed on the LED element, the problem of shifting of the LED element is not required to be worried.
Description
Technical field
The present invention relates to a kind of welding technique, particularly relate to a kind of LED welding technique at the designed a kind of improvement of LED-backlit module and LED light fixture.
Background technology
(Light-Emitting Diode LED) is the light-emitting component of present extensive use to light emitting diode, because it has advantages such as volume is little, long service life, thereby is widely used in the human daily life.
The most normal lighting device that is applied to of light emitting diode (LED), and, except be applied to lighting device, be applied in the backlight module to the light emitting diode greater amount, see also Fig. 1, be the stereogram of existing a kind of LED-backlit module of commonly using, as shown in Figure 1, this LED-backlit module 1 ' comprising: a cover body 11 ', a copper wire layer 12 ', a plurality of LED element 13 ', a heat-conducting layer 18 ', a reflecting element 14 ', a LGP 15 ' and an end reflector plate 16 '.Wherein this cover body 11 ' has cover body bottom 111 ', and this copper wire layer 12 ' then is arranged at by an insulating heat-conductive glue (not graphic) in this cover body bottom 111 '.
Consulting Fig. 1 unceasingly, and please consult Fig. 2 simultaneously, is the welding procedure schematic diagram of the LED element of this LED-backlit module.As shown in Figure 2, when this a plurality of LED element of welding 13 ', be to use one to put tool 2 ' and carry this a plurality of LED elements 13 ' on the technology, LED element 13 ' put into this cover body 11 ' and to be positioned on this copper wire layer 12 '; Then, carrying out the reflow process of scolding tin, and then molten prepolymer is located at the scolding tin on the copper wire layer 12 ', makes that these a plurality of LED elements 13 ' can be welded on the copper wire layer 12 ' by the mode of heating cover body 11 '.
Above-mentioned this LED-backlit module 1 ' is present one of the backlight module commonly used that has now, and it has the simple advantage of framework; Yet this LED-backlit module 1 ' still has following shortcoming with not enough:
1. molten prepolymer is located at scolding tin on the copper wire layer 12 ' by reflow process, though can simultaneously all LED elements 13 ' be welded on the copper wire layer 12 ', owing to default in all scolding tin on the copper wire layer 12 ', its volume and thickness are not identical; Therefore, after finishing reflow process, be welded in the LED element 13 ' on the copper wire layer 12 ', its whole height is also inequality, is the influence that effective light utilization efficiency of LED-backlit module 1 ' is caused certain degree.
2. seeing also Fig. 3, is the schematic side view of cover body, insulating heat-conductive glue and the copper wire layer of this LED-backlit module.As shown in Figure 3, in this LED-backlit module 1 ', this copper wire layer 12 ' then is arranged at by the insulating heat-conductive glue 17 ' with specific thicknesses in this cover body bottom 111 ', therefore, when copper wire layer 12 ' be placed on this insulating heat-conductive glue 17 ' go up and be subjected to one press down strength the time, insulating heat-conductive glue 17 ' then can be overflowed by the slit between copper wire layer 12 ' and cover body bottom 111 ', and such phenomenon is the excessive glue phenomenon that is commonly called as.
3. hold above-mentioned the 1st point, in addition, when carrying out reflow process, because this LED element 13 ' only is placed on the copper wire layer 12 ', and be not subjected to spacing, therefore, in case LED element 13 ' is subjected to slight vibrations, partial L ED element 13 ' namely can produce skew, and the LED element 13 ' of those skews can cause the influence of certain degree equally to effective light utilization efficiency of LED-backlit module 1 '.
This shows that above-mentioned existing LED welding technique obviously still has inconvenience and defective, and demands urgently further being improved in manufacture method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and general manufacture method does not have appropriate manufacture method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of LED welding technique of new improvement, replace real one of current important research and development problem that belongs to of welding technique of the LED that commonly uses, also becoming the current industry utmost point needs improved target.
Summary of the invention
Main purpose of the present invention, be to provide a kind of LED welding manufacturing method thereof of improvement, wherein, be in the welding process of LED element, increase the use that a spacing band and presses down tool, so, behind the welding processing procedure of finishing the LED element, can make each the LED element that is welded on the copper wire layer have identical height, promote effective light utilization efficiency of LED-backlit module by this.
Another object of the present invention, be to provide a kind of LED welding manufacturing method thereof of improvement, wherein, be in the welding process of LED element, one first insulating heat-conductive sticker is invested the cover body bottom, and on attached this first insulating heat-conductive glue of the one second insulating heat-conductive sticker that will be provided with the copper foil circuit layer, and then mode is arranged at the copper foil circuit layer on the cover body bottom by this, and can avoid taking place the phenomenon of excessive glue.
The object of the invention to solve the technical problems realizes by the following technical solutions.The LED welding technique of a kind of improvement that proposes according to the present invention, it may further comprise the steps: (1) arranges one first insulating heat-conductive glue on the cover body bottom of a cover body; (2) a copper foil circuit layer is arranged on the one second insulating heat-conductive glue; (3) this second insulating heat-conductive sticker that will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue; (4) a spacing band is arranged on the copper foil circuit layer, wherein, this spacing band has a plurality of spacing holes, and has pre-seted scolding tin on a plurality of pads of copper foil circuit layer; (5) a plurality of LED elements are inserted respectively in these a plurality of spacing holes; And (6) heat this cover body, is arranged at scolding tin on these a plurality of pads with molten prepolymer, make these a plurality of LED elements be welded in the copper foil circuit layer on.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The LED welding technique of aforesaid improvement wherein is applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
The LED welding technique of aforesaid improvement, wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
The LED welding technique of aforesaid improvement, wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
The LED welding technique of aforesaid improvement, it also comprises: a step (5A) presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
The LED welding technique of aforesaid improvement, it also comprises: a step (7) removes this and presses down tool.
The LED welding technique of aforesaid improvement, it also comprises a step (8), removes this spacing band.
The LED welding technique of aforesaid improvement, wherein this spacing material with 2 is same as this cover body.
The LED welding technique of aforesaid improvement, wherein this step (5) utilizes a LED element tool to reach.
The LED welding technique of aforesaid improvement, wherein this step (5) is further comprising the steps of: (51) use this LED element tool to carry this a plurality of LED elements; And (52) use this LED element tool should to insert in these a plurality of spacing holes by a plurality of LED elements respectively.
The LED welding technique of aforesaid improvement, wherein this step (5) is further comprising the steps of: (51a) use a material all in one piece to put tool and take out arbitrary LED element on the strip; (52a) use this LED element tool to carry this LED element; (53a) use this LED element tool that this LED element is inserted in arbitrary spacing hole; And (54a) judge whether all to be placed with in all spacing holes a LED element, if, then carry out this step (6), if not, repeated execution of steps (51a) then.
The object of the invention to solve the technical problems also realizes by the following technical solutions.The LED welding technique of a kind of improvement that proposes according to the present invention, it may further comprise the steps: (1 ') arranges one first insulating heat-conductive glue on the cover body bottom of a cover body; (2 ') is arranged at a copper foil circuit layer on the one second insulating heat-conductive glue; This second insulating heat-conductive sticker that (3 ') will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue; (4 ') uses a material all in one piece to put tool and takes out this LED element on the strip; (5 ') places a spacing band on the one LED element on the tin device, and wherein, the tin device has a plurality of LED element holding parts on this LED element; A plurality of spacing holes that (6 ') has by this spacing band are put this material all in one piece the LED element that tool takes out respectively and are inserted this a plurality of LED element holding parts; The suction that (7 ') produces by an air draught unit of tin device on this LED element is fixed this LED element and this spacing band with absorption; (8 ') goes up tin cream in the welding foot of these a plurality of LED elements; (9 ') should place on the copper foil circuit layer by a plurality of LED elements; And (10 ') heat this cover body, be arranged at scolding tin on these a plurality of pads with molten prepolymer, make that these a plurality of LED elements are welded on the copper foil circuit layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The LED welding technique of aforesaid improvement wherein is applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
The LED welding technique of aforesaid improvement, wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
The LED welding technique of aforesaid improvement, wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
The LED welding technique of aforesaid improvement, it also comprises: a step (9A ') presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
The LED welding technique of aforesaid improvement, it also comprises: a step (11 ') removes this and presses down tool.
The LED welding technique of aforesaid improvement, it also comprises a step (12 '), removes this spacing band.
The LED welding technique of aforesaid improvement, wherein the material of this spacing band is same as this cover body.
The LED welding technique of aforesaid improvement wherein between this step (4 ') and this step (5 '), also comprises following steps: (41 ') will place on the little sticking tool from this LED element that takes out on this strip.
The LED welding technique of aforesaid improvement wherein between this step (7 ') and this step (8 '), also comprises following steps: (71 ') removes this little sticking tool.
The object of the invention to solve the technical problems realizes in addition more by the following technical solutions.The LED welding technique of a kind of improvement that proposes according to the present invention, it may further comprise the steps: (1 ") one first insulating heat-conductive glue is set on the cover body bottom of a cover body; (2 ") a copper foil circuit layer is arranged on the one second insulating heat-conductive glue; This second insulating heat-conductive sticker that (3 ") will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue; (4 ") are used a material all in one piece to put tool and are taken out this LED element on the strip; (5 ") place a spacing band on the one LED element on the tin device, and wherein, the tin device has a plurality of LED element supporting parts on this LED element, and the surface of each LED element supporting part is equipped with the one dimension adhesion coating; (6 ") by a plurality of spacing holes that this spacing band has, and respectively this material all in one piece are put the LED element that tool takes out and are placed on these a plurality of LED element supporting parts; (7 ") by the adhesion of this dimension adhesion coating, so that being adsorbed, this LED element is fixed on this LED element supporting part; (8 ") go up tin cream in the welding foot of these a plurality of LED elements; (9 ") should go up the tin device and place on the processing platform, and wherein this processing platform has a plurality of extensible members; (10 ") mobile this processing platform and last tin device, and feasiblely be positioned at that a plurality of LED elements of this on tin device are placed on the surface that places the copper foil circuit layer on this; (11 ") use these a plurality of extensible members upwards to eject with this spacing band by a plurality of LED elements, make the LED element separate tin device on this with spacing band; (12 ") remove this processing platform and last tin device; And (13 ") heat this cover body, is arranged at scolding tin on these a plurality of pads with molten prepolymer, makes that these a plurality of LED elements are welded on the copper foil circuit layer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The LED welding technique of aforesaid improvement wherein is applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
The LED welding technique of aforesaid improvement, wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
The LED welding technique of aforesaid improvement, wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
The LED welding technique of aforesaid improvement, it also comprises: a step (12A ") presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
The LED welding technique of aforesaid improvement, it also comprises: a step (14 "), remove this and press down tool.
The LED welding technique of aforesaid improvement, it also comprises a step (15 "), removes this spacing band.
The LED welding technique of aforesaid improvement, wherein the material of this spacing band is same as this cover body.
The present invention compared with prior art has tangible advantage and beneficial effect.By technique scheme, the LED welding technique of the present invention's improvement has following advantage and beneficial effect at least:
1. the LED welding technique of improvement provided by the present invention, be in the welding process of LED element, increase the use that a spacing band and presses down tool, so, after the welding procedure of finishing the LED element, can make each the LED element that is welded on the copper wire layer have identical height, promote effective light utilization efficiency of LED-backlit module by this.
2. hold above-mentioned the 1st point, in addition, in the welding process of LED element, be that one first insulating heat-conductive sticker is invested the cover body bottom, and on attached this first insulating heat-conductive glue of the one second insulating heat-conductive sticker that will be provided with the copper foil circuit layer, and then mode is arranged at the copper foil circuit layer on the cover body bottom by this, and can avoid taking place the phenomenon of excessive glue.
3. hold above-mentioned the 1st point, moreover this spacing band has the function that restriction LED elements moves, and therefore, when carrying out the welding procedure of LED element, can worry the problem of LED element skew.
4. the LED welding technique of improvement of the present invention can be applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
5. hold above-mentioned the 4th point, in order to make spacing band can be used in the cover body of various different external forms accordingly, in the present invention, the design of multiple spacing band more is provided, for example: the spacing band of ㄇ type, plate spacing band or the spacing band of rondelle, so, spacing band then can be corresponding to the cover body of different external forms, and is used in the LED welding technique of improvement of the present invention.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the stereogram of existing a kind of LED-backlit module of commonly using;
Fig. 2 is the welding procedure schematic diagram of a plurality of LED elements of LED-backlit module;
Fig. 3 is the schematic side view of a cover body, an insulating heat-conductive glue and a copper wire layer of LED-backlit module;
Fig. 4 is the flow chart of the LED welding technique of a kind of improvement of the present invention;
Fig. 5 A is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 5 B is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 5 C is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 5 D is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 5 E is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 5 F is the processing step schematic diagram of the LED welding technique of improvement;
Fig. 6 A is to use in the stereogram of a ㄇ type cover body of a LED-backlit module;
Fig. 6 B is to use in the stereogram of a L type cover body of LED-backlit module;
Fig. 6 C is to use in the stereogram of a plate cover body of LED-backlit module;
Fig. 6 D is to use the stereogram that squeezes the type cover body in one of LED-backlit module;
Fig. 7 A is to use in the stereogram of a long strip type cover body of a LED light fixture;
Fig. 7 B is to use the stereogram that has the bell cover body of radiating fin in one of LED light fixture;
Fig. 8 A is to use in the stereogram of the spacing band of a ㄇ type of the LED welding technique of improvement;
Fig. 8 B is to use in the stereogram of a plate spacing band of the LED welding technique of improvement;
Fig. 8 C is to use in the stereogram of the spacing band of a rondelle of the LED welding technique of improvement;
Fig. 9 is the flow chart of first group of detailed step of step (S05);
Figure 10 is the flow chart of second group of detailed step of step (S05);
Figure 11 is the process schematic representation of second group of detailed step of step (S05);
Figure 12 A and Figure 12 B are the method flow diagrams of second embodiment of the LED welding technique of a kind of improvement of the present invention;
Figure 13 is the processing step schematic diagram of the LED welding technique of improvement;
Figure 14 A and Figure 14 B are the processing step schematic diagrames of the LED welding technique of improvement;
Figure 15 A and Figure 15 B are the method flow diagrams of the 3rd embodiment of the LED welding technique of a kind of improvement of the present invention;
Figure 16 is the stereogram of tin device on a spacing band and; And
Figure 17 is spacing band, the stereogram of going up tin device and a processing platform.
11: cover body 12: the copper foil circuit layer
18: the second insulating heat-conductive glue of 13:LED element
111: cover body bottom 122: pad
2: spacingly be with 21: spacing hole
3:LED element tool 4: press down tool
5: strip 6: material all in one piece is put tool
7: tin device on little sticking tool 8:LED element
81:LED element holding part 82: air draught unit
18a: the first insulating heat-conductive glue 3a:LED element tool
8 ': go up tin device 81 ': LED element supporting part
82 ': dimension adhesion coating 9 ': processing platform
91 ': extensible member S01-S05: method step
S05A: method step S051-S052: method step
S06-S08: method step S051a-S054a: method step
S01 '-S07 ': method step S08 '-S09 ': method step
S09A ': method step S10 '-S12 ' method step
S01 "-S07 ": method step S08 "-S12 ": method step
S12A ": method step S13 "-S15 ": method step
1 ': LED-backlit module 11 ': cover body
12 ': copper wire layer 13 ': the LED element
14 ': reflecting element 15 ': LGP
16 ': end reflector plate 17 ': insulating heat-conductive glue
18 ': heat-conducting layer 111 ': the cover body bottom
2 ': put tool
The specific embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, its specific embodiment of LED welding technique, manufacture method, step, feature and the effect thereof of the improvement that foundation the present invention is proposed, describe in detail as after.
The LED welding technique of improvement of the present invention can be applied to seeing also Fig. 4 in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture, is the flow chart of the LED welding technique of a kind of improvement of the present invention; Simultaneously, seeing also Fig. 5 A to Fig. 5 F, is the processing step schematic diagram of the LED welding technique of this improvement.Wherein, as shown in Figure 4, the LED welding technique of improvement of the present invention is mainly to comprise 8 steps flow charts.
Shown in Fig. 4 and Fig. 5 A, the LED welding technique of this improvement is execution in step (S01), step (S02) and step (S03) at first, wherein, in step (S01), be that one first insulating heat-conductive glue 18a is arranged on the cover body bottom 111 of a cover body 11, wherein, this cover body 11 is to be made by the metal with good heat conductive character, for example: aluminium, stainless steel and copper.Then, in step (S02), be that a copper foil circuit layer 12 is arranged on the one second insulating heat-conductive glue 18; Then, at step (S03), be that this second insulating heat-conductive glue 18 that will be provided with this copper foil circuit layer 12 is pasted on this cover body bottom 111 that is provided with this first insulating heat-conductive glue 18a.
Completing steps (S01), step (S02) and step (S03) are afterwards, then continue execution in step (S04), wherein, shown in Fig. 5 B, at step (S04), be spacingly to be with 2 to be arranged on the copper foil circuit layer 12 with one, wherein, this spacing material with 2 is same as the material of this cover body, and spacingly is with 2 to have a plurality of spacing holes 21, in addition, pre-seted scolding tin on a plurality of pads 122 of copper foil circuit layer 12.Subsequent steps (S04) afterwards, execution in step (S05) then, shown in Fig. 5 C and Fig. 5 D, step (S05) is that a plurality of LED elements 13 are inserted respectively in these a plurality of spacing holes 21.
Then, continue execution in step (S05A) and step (S06), wherein, shown in Fig. 5 E, step (S06) is to press down tool 4 with one to place on these a plurality of LED elements 13, and presses down tool 4 by this and press down LED element 13; And, in step (S06), heat this cover body 11, be arranged at scolding tin on these a plurality of pads 122 with molten prepolymer, make that these a plurality of LED elements 13 are welded on the copper foil circuit layer 12.At last, then execution in step (S07) and step (S08) will press down tool 4 and be with 2 to remove (shown in Fig. 5 F) with spacing.
Therefore, must specify and be, for the LED-backlit module with ad hoc structure, spacingly be with 2 one of for its necessary composed component, therefore, implement the LED welding technique of improvement of the present invention when those have the LED-backlit module of ad hoc structure, then can omit step (S08), spacingly be with 2 to keep.In addition, when implementing the LED welding technique of improvement of the present invention, also can consider not use to press down tool 4, so, then can omit this step (S05A) and this step (S07) again, accelerate the overall execution speed of LED welding procedure in mode by this.
Above-mentionedly the main process step of the LED welding technique of improvement of the present invention is described in detail.Below, will remark additionally for employed element, device and equipment in the LED welding technique of this improvement.Wherein, because the LED welding technique of improvement of the present invention can be applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture, therefore, this cover body 11 can be following any: the cover body that is used in the LED-backlit module and the cover body that is used in the LED light fixture.See also Fig. 6 A, Fig. 6 B, Fig. 6 C and Fig. 6 D, be respectively the stereogram of the ㄇ type cover body, L type cover body, plate cover body and the crowded type cover body that are used in the LED-backlit module.Shown in Fig. 6 A, Fig. 6 B, Fig. 6 C and Fig. 6 D, the cover body 11 that is used in the LED-backlit module can comprise ㄇ type cover body, L type cover body, plate cover body and crowded type cover body, and each cover body 11 all has in order to the cover body bottom 111 of this copper foil circuit layer 12 to be set.In addition, see also Fig. 7 A and Fig. 7 B, be respectively the long strip type cover body that is used in the LED light fixture and the stereogram with bell cover body of radiating fin, wherein, shown in Fig. 7 A and Fig. 7 B, the cover body 11 that is used in the LED light fixture also can comprise long strip type cover body and the bell cover body with radiating fin, and each cover body 11 all has in order to the cover body bottom 111 of this copper foil circuit layer 12 to be set.
And, spacing with 2 cover bodies that can be used in various different external forms accordingly in order to make, in the LED of this improvement welding technique, spacingly be with 2 optionally to be designed to the spacing band of a ㄇ type, a plate spacing band or the spacing band of a rondelle.See also Fig. 8 A, Fig. 8 B and Fig. 8 C, be respectively the stereogram of the spacing band of ㄇ type of the LED welding technique that is used in improvement, plate spacing band and the spacing band of rondelle.Wherein, shown in Fig. 8 A, the spacing of ㄇ type is in order to be used in the cover body 11 of ㄇ type with 2 with arranging in pairs or groups, and, especially, the spacing spacing hole 21 with 2 of this ㄇ type is not only and is located at the spacing with on 2 the lower surface of ㄇ type, and it is spacing with 2 dual-side that it more extends to this ㄇ type.In addition, Fig. 8 B and Fig. 8 C are then graphic respectively plate spacingly is with 2 with 2 with the spacing of rondelle.
In addition, in the LED of improvement of the present invention welding technique, this step (S05) can utilize a LED element tool to reach, and step (S05) has two groups of detailed steps.Seeing also Fig. 9, is the flow chart of first group of detailed step of step (S05), and wherein, shown in Fig. 9 and Fig. 5 C, first group of detailed step of step (S05) comprises step (S051) and step (S052).In step (S051), use a LED element tool 3 to carry this a plurality of LED elements 13 simultaneously; Then, in step (S052), use this LED element tool 3 should to insert in these a plurality of spacing holes 21 by a plurality of LED elements 13 respectively.
Moreover, see also Figure 10, be the flow chart of second group of detailed step of step (S05); In addition, please consulting Figure 11 simultaneously, is the process schematic representation of second group of detailed step of step (S05).As Figure 10 and shown in Figure 11, second group of detailed step of step (S05) comprises step (S051a), step (S052a), step (S053a) and step (S054a).Wherein, in step (S051a), use a material all in one piece to put arbitrary LED element 13 that tool 6 takes out on the strip 5; Then, step (S052a) then uses a LED element tool 3a to carry this LED element 13; Then, in step (S053a), use this LED element tool 3a that this LED element 13 is inserted in arbitrary spacing hole 21; At last, in step (S054a), be to judge whether all to be placed with in all spacing holes 21 a LED element 13, if then carry out this step (S06), if not, then repeated execution of steps (S051a) to be taking out the LED element 13 in the strip 5 unceasingly, and LED element 13 is put into spacing hole 21.
So, by above-mentioned explanation, the LED welding technique of improvement of the present invention is complete and clearly disclosed, and interior employed element, device and the equipment of this LED welding technique is also clearly introduced and explanation simultaneously; Therefore, via above-mentioned, can learn that the present invention has following advantage:
1. the LED welding technique of improvement provided by the present invention, be in the welding process of LED element, increase the use that a spacing band and presses down tool, so, after the welding procedure of finishing the LED element, can make each the LED element that is welded on the copper wire layer have identical height, promote effective light utilization efficiency of LED-backlit module by this.
2. hold above-mentioned the 1st point, in addition, in the welding process of LED element, be that one first insulating heat-conductive sticker is invested the cover body bottom, and on attached this first insulating heat-conductive glue of the one second insulating heat-conductive sticker that will be provided with the copper foil circuit layer, and then mode is arranged at the copper foil circuit layer on the cover body bottom by this, and can avoid taking place the phenomenon of excessive glue.
3. hold above-mentioned the 1st point, moreover this spacing band has the function that restriction LED elements moves, and therefore, when carrying out the welding procedure of LED element, can worry the problem of LED element skew.
4. the LED welding technique of improvement of the present invention can be applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
5. hold above-mentioned the 4th point, in order to make spacing band can be used in the cover body of various different external forms accordingly, in the present invention, the design of multiple spacing band more is provided, for example: the spacing band of ㄇ type, plate spacing band or the spacing band of rondelle, so, spacing band then can be corresponding to the cover body of different external forms, and is used in the LED welding technique of improvement of the present invention.
In addition, the LED welding technique of improvement of the present invention more comprises one second embodiment.Seeing also Figure 12 A and Figure 12 B, is the method flow diagram of second embodiment of the LED welding technique of this improvement, and shown in Figure 12 A and Figure 12 B, second embodiment mainly comprises 12 steps:
At first, shown in Fig. 5 A, this method is execution in step (S01 ') and step (S02 '), one first insulating heat-conductive glue 18a is set on the cover body bottom 111 of a cover body 11, and a copper foil circuit layer 12 is arranged on the one second insulating heat-conductive glue 18; Then, and execution in step (S03 '), this second insulating heat-conductive glue 18 that is provided with this copper foil circuit layer 12 is pasted on this cover body bottom 111 that is provided with this first insulating heat-conductive glue 18a.
Consult Figure 12 A and Figure 12 B unceasingly, and please consult Figure 13 simultaneously, it is the processing step schematic diagram of the LED welding technique of improvement, as shown in the figure, this method is to continue execution in step (S04 ') and step (S05 '), uses a material all in one piece to put this LED element 13 that tool 6 takes out on the strip 5, and spacingly is with 2 to place on the LED element on the tin device 8 with one, wherein, tin device 8 has a plurality of LED element holding parts 81 on this LED element.Completing steps (S05 ') then continues execution in step (S06 ') afterwards, and is spacing with the 2 a plurality of spacing holes 21 that have by this, respectively this material all in one piece put the LED element 13 that tool 6 takes out and inserted this a plurality of LED element holding parts 81.Unceasingly, then execution in step (S07 ') and step (S08 ') by the suction that an air draught unit 82 of tin device 8 on this LED element produces, are fixed this LED element 13 and should spacingly be with 2 with absorption, and on tin cream in the welding foot of these a plurality of LED elements 13.
Completing steps (S08 ') afterwards, then continue execution in step (S09 '), should place on the copper foil circuit layer 12 by a plurality of LED elements 13, further, then execution in step (S09A ') and step (S10 '), pressing down tool 4 with one places on these a plurality of LED elements 13, and press down tool 4 by this and press down LED element 13 (shown in Fig. 5 E), while is also heated this cover body 11, be arranged at scolding tin on these a plurality of pads 122 with molten prepolymer, make that these a plurality of LED elements 13 are welded on the copper foil circuit layer 12.At last, then execution in step (S11 ') and step (S12 ') remove and press down tool 4 and spacing 2 (shown in Fig. 5 F) that are with.
At this, must specify and be, for the LED-backlit module with ad hoc structure, spacingly be with 2 one of for its necessary composed component, therefore, the LED welding technique of implementing improvement of the present invention in those have ad hoc structure the LED-backlit module the time, then can omit step (S12 '), spacingly be with 2 to keep.And, when implementing the LED welding technique of improvement of the present invention, also can consider not use to press down tool 4, so, then can omit this step (S09A ') and this step (S11 ') again, accelerate the overall execution speed of LED welding procedure in mode by this.
In addition, what must remark additionally is again, for second embodiment of the LED welding technique of this improvement, it can more comprise a step (S41 ') and a step (S71 '), seeing also Figure 14 A and Figure 14 B, is the processing step schematic diagram of the LED welding technique of improvement.Shown in Figure 14 A and Figure 14 B, in the method step of second embodiment, then use a little sticking tool 7 by adding step (S41 ') and step (S71 '), and then assist to go up tin cream in the welding foot of these a plurality of LED elements 13.This step (S41 ') can be inserted between this step (4 ') and this step (5 '), step (S41 ') as following: will place on the little sticking tool 7 from this LED element 13 that takes out on this strip 5.This step (S71 ') can be inserted between this step (7 ') and this step (8 '), step (S71 ') as following: remove this little sticking tool 7.
In addition, the LED welding technique of improvement of the present invention has more one the 3rd embodiment, sees also Figure 15 A and Figure 15 B, is the method flow diagram of the 3rd embodiment of the LED welding technique of a kind of improvement of the present invention; Shown in Figure 15 A and Figure 15 B, the 3rd embodiment of the LED welding technique of improvement of the present invention may further comprise the steps:
At first, and execution in step (S01 "), one first insulating heat-conductive glue 18a is set on the cover body bottom 111 of a cover body 11; Then, and execution in step (S02 "), a copper foil circuit layer 12 is arranged on the one second insulating heat-conductive glue 18; Then, and execution in step (S03 "), this second insulating heat-conductive glue 18 that is provided with this copper foil circuit layer 12 is pasted on this cover body bottom 111 that is provided with this first insulating heat-conductive glue 18a.Unceasingly, then execution in step (S04 ") uses a material all in one piece to put this LED element 13 that tool 6 takes out on the strip 5.
Please consulting Figure 16 simultaneously, is the stereogram of spacing band and last tin device.After step (S04 ") finishes; then execution in step (S05 "), spacingly be with 2 to place on one on the tin device 8 ' with one, wherein, should go up tin device 8 ' and have a plurality of LED element supporting parts 81 ', and the surface of each LED element supporting part 81 ' is equipped with one dimension adhesion coating 82 ', wherein, spacingly is drawn on Figure 16 with 2 with the three-dimensional general diagram of last tin device 8 '.Unceasingly, then execution in step (S06 ") is spacing with the 2 a plurality of spacing holes 21 that have by this, respectively this material all in one piece is put the LED element 13 that tool 6 takes out and is placed on these a plurality of LED element supporting parts 81 '; Then, and execution in step (S07 ") tie up the adhesion of adhesion coating 82 ' by this, so that these LED element 13 absorption are fixed on this LED element supporting part 81 '.
Please consulting Figure 17 simultaneously, is spacing band, the stereogram of going up tin device and processing platform.Unceasingly, the method flow execution in step (S08 ") and step (S09 "), last tin cream is in the welding foot of these a plurality of LED elements 13, and should go up tin device 8 ' and placed on the processing platform 9 ', wherein this processing platform 9 ' has a plurality of extensible members 91 ', and the three-dimensional general diagram of processing platform 9 ' is drawn on Figure 17; Then, execution in step (S10 "), mobile this processing platform 9 ' and last tin device, and make and be positioned at that a plurality of LED elements 13 of this on tin device 8 ' are placed on the surface that places copper foil circuit layer 12 on this; Then, execution in step (S11 ") uses these a plurality of extensible members 91 ' should a plurality of LED elements 13 spacingly to be with 2 upwards to eject with this, makes LED element 13 be with 2 to separate tin device 8 ' on this with spacing.
Unceasingly, then execution in step (S12 ") is removed this processing platform 9 ' and last tin device; Then, execution in step (S12A ") presses down tool 4 with one and places on these a plurality of LED elements 13, and presses down tool 4 by this and press down LED element 13; Then, execution in step (S13 ") heats this cover body 11, is arranged at scolding tin on these a plurality of pads 122 with molten prepolymer, makes that these a plurality of LED elements 13 are welded on the copper foil circuit layer 12; At last, execution in step (S14 ") and step (S15 ") remove and press down tool 4 and be with 2 with spacing.
At this, must specify and be, for the LED-backlit module with ad hoc structure, spacingly be with 2 one of for its necessary composed component, therefore, implement the LED welding technique of improvement of the present invention when those have the LED-backlit module of ad hoc structure, then can omit step (S15 "), spacingly be with 2 to keep.And, when implementing the LED welding technique of improvement of the present invention, also can consider not use to press down tool 4, so, then can omit this step (S12A ") and this step (S14 ") again, accelerate the overall execution speed of LED welding procedure in mode by this.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, any simple modification that foundation technical spirit of the present invention is done above embodiment, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (29)
1. the LED welding technique of an improvement is characterized in that it may further comprise the steps:
(1) one first insulating heat-conductive glue is set on the cover body bottom of a cover body;
(2) a copper foil circuit layer is arranged on the one second insulating heat-conductive glue;
(3) this second insulating heat-conductive sticker that will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue;
(4) a spacing band is arranged on the copper foil circuit layer, wherein, this spacing band has a plurality of spacing holes, and has pre-seted scolding tin on a plurality of pads of copper foil circuit layer;
(5) a plurality of LED elements are inserted respectively in these a plurality of spacing holes; And
(6) heat this cover body, be arranged at scolding tin on these a plurality of pads with molten prepolymer, make that these a plurality of LED elements are welded on the copper foil circuit layer.
2. the LED welding technique of improvement according to claim 1 is characterized in that wherein being applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
3. the LED welding technique of improvement according to claim 2, it is characterized in that wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
4. the LED welding technique of improvement according to claim 3 is characterized in that wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
5. the LED welding technique of improvement according to claim 1 is characterized in that it also comprises: a step (5A) presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
6. the LED welding technique of improvement according to claim 5, it is characterized in that it also comprises: a step (7) removes this and presses down tool.
7. the LED welding technique of improvement according to claim 1 is characterized in that it also comprises a step (8), removes this spacing band.
8. the LED welding technique of improvement according to claim 7 is characterized in that wherein this spacing material with 2 is same as this cover body.
9. the LED welding technique of improvement according to claim 1 is characterized in that wherein this step (5) utilizes a LED element tool to reach.
10. the LED welding technique of improvement according to claim 7 is characterized in that wherein this step (5) is further comprising the steps of:
(51) use this LED element tool to carry this a plurality of LED elements; And
(52) use this LED element tool should to insert in these a plurality of spacing holes by a plurality of LED elements respectively.
11. the LED welding technique of improvement according to claim 7 is characterized in that wherein this step (5) is further comprising the steps of:
(51a) use a material all in one piece to put tool and take out arbitrary LED element on the strip;
(52a) use this LED element tool to carry this LED element;
(53a) use this LED element tool that this LED element is inserted in arbitrary spacing hole; And
(54a) judge whether all to be placed with in all spacing holes a LED element, if, then carry out this step (6), if not, repeated execution of steps (51a) then.
12. the LED welding technique of an improvement is characterized in that it may further comprise the steps:
(1 ') arranges one first insulating heat-conductive glue on the cover body bottom of a cover body;
(2 ') is arranged at a copper foil circuit layer on the one second insulating heat-conductive glue;
This second insulating heat-conductive sticker that (3 ') will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue;
(4 ') uses a material all in one piece to put tool and takes out this LED element on the strip;
(5 ') places a spacing band on the one LED element on the tin device, and wherein, the tin device has a plurality of LED element holding parts on this LED element;
A plurality of spacing holes that (6 ') has by this spacing band are put this material all in one piece the LED element that tool takes out respectively and are inserted this a plurality of LED element holding parts;
The suction that (7 ') produces by an air draught unit of tin device on this LED element is fixed this LED element and this spacing band with absorption;
(8 ') goes up tin cream in the welding foot of these a plurality of LED elements;
(9 ') should place on the copper foil circuit layer by a plurality of LED elements; And
(10 ') heats this cover body, is arranged at scolding tin on these a plurality of pads with molten prepolymer, makes that these a plurality of LED elements are welded on the copper foil circuit layer.
13. the LED welding technique of improvement according to claim 12 is characterized in that wherein being applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
14. the LED welding technique of improvement according to claim 12, it is characterized in that wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
15. the LED welding technique of improvement according to claim 14 is characterized in that wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
16. the LED welding technique of improvement according to claim 12 is characterized in that it also comprises: a step (9A ') presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
17. the LED welding technique of improvement according to claim 16 is characterized in that it also comprises: a step (11 ') removes this and presses down tool.
18. the LED welding technique of improvement according to claim 12 is characterized in that it also comprises a step (12 '), removes this spacing band.
19. the LED welding technique of improvement according to claim 14 is characterized in that wherein the material of this spacing band is same as this cover body.
20. the LED welding technique of improvement according to claim 12 is characterized in that wherein also comprising following steps between this step (4 ') and this step (5 '):
(41 ') will place on the little sticking tool from this LED element that takes out on this strip.
21. the LED welding technique of improvement according to claim 18 is characterized in that wherein also comprising following steps between this step (7 ') and this step (8 '):
(71 ') removes this little sticking tool.
22. the LED welding technique of an improvement is characterized in that it may further comprise the steps:
(1 ") one first insulating heat-conductive glue is set on the cover body bottom of a cover body;
(2 ") a copper foil circuit layer is arranged on the one second insulating heat-conductive glue;
This second insulating heat-conductive sticker that (3 ") will be provided with this copper foil circuit layer is attached on this cover body bottom that is provided with this first insulating heat-conductive glue;
(4 ") are used a material all in one piece to put tool and are taken out this LED element on the strip;
(5 ") place a spacing band on the one LED element on the tin device, and wherein, the tin device has a plurality of LED element supporting parts on this LED element, and the surface of each LED element supporting part is equipped with the one dimension adhesion coating;
(6 ") by a plurality of spacing holes that this spacing band has, and respectively this material all in one piece are put the LED element that tool takes out and are placed on these a plurality of LED element supporting parts;
(7 ") by the adhesion of this dimension adhesion coating, so that being adsorbed, this LED element is fixed on this LED element supporting part;
(8 ") go up tin cream in the welding foot of these a plurality of LED elements;
(9 ") should go up the tin device and place on the processing platform, and wherein this processing platform has a plurality of extensible members;
(10 ") mobile this processing platform and last tin device, and feasiblely be positioned at that a plurality of LED elements of this on tin device are placed on the surface that places the copper foil circuit layer on this;
(11 ") use these a plurality of extensible members upwards to eject with this spacing band by a plurality of LED elements, make the LED element separate tin device on this with spacing band;
(12 ") remove this processing platform and last tin device; And
(13 ") heat this cover body, are arranged at scolding tin on these a plurality of pads with molten prepolymer, make that these a plurality of LED elements are welded on the copper foil circuit layer.
23. the LED welding technique of improvement according to claim 22 is characterized in that wherein being applied in the technology of high-capacity LED backlight module, low-power LED-backlit module and LED light fixture.
24. the LED welding technique of improvement according to claim 23, it is characterized in that wherein this cover body be following any: ㄇ type cover body, L type cover body, plate cover body, long strip type cover body, the bell cover body with radiating fin and crowded type cover body.
25. the LED welding technique of improvement according to claim 24 is characterized in that wherein corresponding to this cover body, this spacing band be following any: the spacing band of ㄇ type, plate spacing band and the spacing band of rondelle.
26. the LED welding technique of improvement according to claim 22 is characterized in that it also comprises: a step (12A ") presses down tool with one and places on these a plurality of LED elements, and presses down tool by this and press down the LED element.
27. the LED welding technique of improvement according to claim 26 is characterized in that it also comprises: a step (14 "), remove this and press down tool.
28. the LED welding technique of improvement according to claim 22 is characterized in that it also comprises a step (15 "), removes this spacing band.
29. the LED welding technique of improvement according to claim 22 is characterized in that wherein the material of this spacing band is same as this cover body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104613294A CN103182576A (en) | 2011-12-28 | 2011-12-28 | Improved LED welding technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104613294A CN103182576A (en) | 2011-12-28 | 2011-12-28 | Improved LED welding technique |
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| CN103182576A true CN103182576A (en) | 2013-07-03 |
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| CN201549507U (en) * | 2009-07-28 | 2010-08-11 | 浙江迈勒斯照明有限公司 | LED integrated and encapsulated by multiple chips |
| CN201748236U (en) * | 2010-09-06 | 2011-02-16 | 苏州世鼎电子有限公司 | Improved structure of LED luminaire |
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| JPS6140040A (en) * | 1984-07-31 | 1986-02-26 | Oki Electric Ind Co Ltd | Die bonding position determining method for light emitting element |
| US20070041187A1 (en) * | 2005-08-16 | 2007-02-22 | Cheng T T | Preset welding spot structure of a backlight module |
| CN1920374A (en) * | 2005-08-23 | 2007-02-28 | 阳杰科技股份有限公司 | High-brightness LED illuminating light fitting and its manufacture |
| CN201549507U (en) * | 2009-07-28 | 2010-08-11 | 浙江迈勒斯照明有限公司 | LED integrated and encapsulated by multiple chips |
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Application publication date: 20130703 |