CN103151323A - Flip packaging structure based on anisotropy conductive glue - Google Patents
Flip packaging structure based on anisotropy conductive glue Download PDFInfo
- Publication number
- CN103151323A CN103151323A CN2011104037872A CN201110403787A CN103151323A CN 103151323 A CN103151323 A CN 103151323A CN 2011104037872 A CN2011104037872 A CN 2011104037872A CN 201110403787 A CN201110403787 A CN 201110403787A CN 103151323 A CN103151323 A CN 103151323A
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- CN
- China
- Prior art keywords
- chip
- conductive glue
- anisotropy conductiving
- conductiving glue
- anisotropy conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83191—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
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- Wire Bonding (AREA)
Abstract
The invention provides a flip packaging structure based on anisotropy conductive glue and a manufacturing process of the structure. The anisotropy conductive glue is applied to flip chip packaging, connecting performance can be efficiently improved, the process is simple and cost is lowered. The structure comprises the chip, the anisotropy conductive glue and a base board, wherein the anisotropy conductive glue is located between the chip and the base board and used as a connection. The manufacturing process of the structure comprises the steps of coating the chip and the base board with the anisotropy conductive glue with a normal temperature and putting the structure into an oven or heating and solidifying to form the even conductive connection. Another implementation way of the structure is composed of the chip and the anisotropy conductive glue, and the anisotropy conductive glue is evenly distributed on the chip. The manufacturing process of the structure comprises the steps of coating a wafer with the anisotropy conductive glue, putting the structure into the oven or solidifying on a heating table, slicing and finishing a wafer level packaging.
Description
Technical field
The present invention relates to a kind of encapsulation of electronic device, especially relate to a kind of flip-chip packaged structure and manufacturing process thereof based on anisotropy conductiving glue.
Background technology
Along with fast development and the extensive use of electronic technology, the development of encapsulation technology has proposed more and more higher requirement towards high-performance, low cost and integrated direction development to mode and the material that encapsulates.The mode of Flip-Chip Using becomes one of main packaged type, and Flip-Chip Using is about to the semiconductor chip active face and turns around by solder joint and be connected to Electronic Encapsulating Technology on substrate.Connecting material in this packaged type is generally the metal alloy scolder.
At present, a kind of environmental protection, efficient and with low cost connecting material--anisotropy conductiving glue (ACA) is applied more and more widely.Anisotropy conductiving glue is the adhesive that has certain electric conductivity after a kind of curing or drying.Comparing the metal alloy scolder that generally uses now, to have resolution high, and autologous density is little, connects spacing little; Can reduce simultaneously problem tired and stress cracking; Flexibility and fatigue durability are good, and base material that can be bonding is more; Technique is simple, can be significantly reduced to this; Pollution to human body, environment reduces greatly; Can effectively play the anti-corrosion protection effect to packing material.
The present invention proposes a kind of flip-chip packaged structure and manufacturing process thereof based on anisotropy conductiving glue, and anisotropy conductiving glue is applied to Flip-Chip Using, can effectively improve switching performance, and technique is simple simultaneously, reduces costs.
Summary of the invention
The present invention is directed to requirement more and more higher to connecting material in Flip-Chip Using, propose anisotropy conductiving glue is substituted metal alloy scolder commonly used at present.Adopt anisotropic material to replace the metal alloy scolder can make lead pin pitch little, switching performance is higher, and technique is simple, and cost is low, and very environmental protection.
One embodiment of the present invention are that described structure is comprised of chip, anisotropy conductiving glue and substrate, and anisotropy conductiving glue is between chip and substrate, as connection.Then the manufacture process of described structure is delivered to baking box or is heating and curing for to coat the anisotropy conductiving glue of normal temperature between chip and substrate, and forming uniformly, conduction connects.
The described structure of another embodiment of the invention is comprised of chip and anisotropy conductiving glue, and anisotropy conductiving glue is evenly distributed on chip.The manufacture process of described structure is delivered on baking box or heating station and is solidified for to coat anisotropy conductiving glue on wafer, and then section, complete wafer-level packaging.
The present invention relates to a kind of flip-chip packaged structure and manufacturing process thereof based on anisotropy conductiving glue, make switching performance improve, technique is simple simultaneously, and cost is low, and very environmental protection.The present invention is not only applicable to flip-chip packaged, is applicable to any connection based on the metal alloy scolder yet.
Description of drawings
Fig. 1 is a kind of embodiment of the flip-chip packaged structure based on anisotropy conductiving glue;
Fig. 2 is a kind of embodiment of the wafer level packaging structure based on anisotropy conductiving glue.
Embodiment
Fig. 1 is a kind of embodiment of the flip-chip packaged structure based on anisotropy conductiving glue, and described structure is comprised of 3 parts, is respectively chip, conducting resinl and substrate.101 is chip, and 102 is pad, and 103 is substrate, and 104 is conducting resinl.The manufacture process of described structure is sent into baking box or heating conducting resinl is solidified for to coat the anisotropy conductiving glue of normal temperature between substrate and chip, and forming uniformly, conduction connects.
Fig. 2 is a kind of embodiment of the wafer level packaging structure based on anisotropy conductiving glue, and described structure is by two parts compositing chip and conducting resinl.Then the manufacture process of described structure is sent into baking box or heating conducting resinl is solidified for to coat the anisotropy conductiving glue of normal temperature on wafer 201, forms uniform conductive layer, then cutting, completes wafer-level packaging.
The present invention proposes a kind of flip-chip packaged structure and manufacturing process thereof based on anisotropy conductiving glue, makes switching performance improve, and technique is simple simultaneously, and cost is low, and very environmental protection.The present invention is not only applicable to flip-chip packaged, is applicable to any connection based on the metal alloy scolder yet.
Above content is in conjunction with concrete execution mode further description made for the present invention, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (4)
1. propose a kind of flip-chip packaged structure based on anisotropy conductiving glue, it is characterized in that: described structure is comprised of chip, anisotropy conductiving glue and substrate, and anisotropy conductiving glue is between chip and substrate, as connection.
2. manufacture process that realizes structure claimed in claim 1, it is characterized in that: then described process is delivered to baking box or is heating and curing for to coat the anisotropy conductiving glue of normal temperature between chip and substrate, and forming uniformly, conduction connects.
3. the another kind of execution mode of structure as claimed in claim 1, it is characterized in that: the structure of the another kind of execution mode of described structure is comprised of chip and anisotropy conductiving glue, and anisotropy conductiving glue is evenly distributed on chip.
4. a manufacture process that realizes the described structure of claim 3, is characterized in that: coat anisotropy conductiving glue on wafer, deliver on baking box or heating station and solidify, then cut into slices, complete wafer-level packaging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104037872A CN103151323A (en) | 2011-12-06 | 2011-12-06 | Flip packaging structure based on anisotropy conductive glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011104037872A CN103151323A (en) | 2011-12-06 | 2011-12-06 | Flip packaging structure based on anisotropy conductive glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103151323A true CN103151323A (en) | 2013-06-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011104037872A Pending CN103151323A (en) | 2011-12-06 | 2011-12-06 | Flip packaging structure based on anisotropy conductive glue |
Country Status (1)
| Country | Link |
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| CN (1) | CN103151323A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325702A (en) * | 2013-07-04 | 2013-09-25 | 北京京东方光电科技有限公司 | Chip binding method and chip binding structure |
| CN105405825A (en) * | 2015-12-09 | 2016-03-16 | 南通富士通微电子股份有限公司 | Chip on film package structure |
| CN105551986A (en) * | 2015-12-09 | 2016-05-04 | 南通富士通微电子股份有限公司 | COF (Chip on Flex) packaging method |
| CN105551987A (en) * | 2015-12-09 | 2016-05-04 | 南通富士通微电子股份有限公司 | COF (Chip on Flex) packaging method |
| CN107403784A (en) * | 2016-05-19 | 2017-11-28 | 胡川 | Method for manufacturing circuit board and structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918113A (en) * | 1996-07-19 | 1999-06-29 | Shinko Electric Industries Co., Ltd. | Process for producing a semiconductor device using anisotropic conductive adhesive |
| US20030008133A1 (en) * | 2001-07-06 | 2003-01-09 | Korea Advanced Institute Of Science And Technology | Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG application |
| CN1848394A (en) * | 2005-04-13 | 2006-10-18 | 邹明德 | Preset conductive thin film structure and forming method thereof |
-
2011
- 2011-12-06 CN CN2011104037872A patent/CN103151323A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5918113A (en) * | 1996-07-19 | 1999-06-29 | Shinko Electric Industries Co., Ltd. | Process for producing a semiconductor device using anisotropic conductive adhesive |
| US20030008133A1 (en) * | 2001-07-06 | 2003-01-09 | Korea Advanced Institute Of Science And Technology | Anisotropic conductive film and method of fabricating the same for ultra-fine pitch COG application |
| CN1848394A (en) * | 2005-04-13 | 2006-10-18 | 邹明德 | Preset conductive thin film structure and forming method thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103325702A (en) * | 2013-07-04 | 2013-09-25 | 北京京东方光电科技有限公司 | Chip binding method and chip binding structure |
| CN105405825A (en) * | 2015-12-09 | 2016-03-16 | 南通富士通微电子股份有限公司 | Chip on film package structure |
| CN105551986A (en) * | 2015-12-09 | 2016-05-04 | 南通富士通微电子股份有限公司 | COF (Chip on Flex) packaging method |
| CN105551987A (en) * | 2015-12-09 | 2016-05-04 | 南通富士通微电子股份有限公司 | COF (Chip on Flex) packaging method |
| CN107403784A (en) * | 2016-05-19 | 2017-11-28 | 胡川 | Method for manufacturing circuit board and structure |
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| PB01 | Publication | ||
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130612 |
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| WD01 | Invention patent application deemed withdrawn after publication |