CN103151273B - 二极管封装设备 - Google Patents
二极管封装设备 Download PDFInfo
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- CN103151273B CN103151273B CN201310094160.2A CN201310094160A CN103151273B CN 103151273 B CN103151273 B CN 103151273B CN 201310094160 A CN201310094160 A CN 201310094160A CN 103151273 B CN103151273 B CN 103151273B
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- 238000005538 encapsulation Methods 0.000 title claims abstract description 34
- 239000003292 glue Substances 0.000 claims abstract description 70
- 230000033001 locomotion Effects 0.000 claims abstract description 56
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 28
- 239000000126 substance Substances 0.000 claims abstract 3
- 239000013078 crystal Substances 0.000 claims description 23
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 7
- 230000000007 visual effect Effects 0.000 claims description 7
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 2
- 206010061245 Internal injury Diseases 0.000 abstract description 7
- 238000003754 machining Methods 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- 238000010030 laminating Methods 0.000 description 3
- 230000007115 recruitment Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000010068 moulding (rubber) Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008451 emotion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Abstract
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Priority Applications (1)
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CN201310094160.2A CN103151273B (zh) | 2013-03-22 | 2013-03-22 | 二极管封装设备 |
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CN201310094160.2A CN103151273B (zh) | 2013-03-22 | 2013-03-22 | 二极管封装设备 |
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CN103151273A CN103151273A (zh) | 2013-06-12 |
CN103151273B true CN103151273B (zh) | 2016-08-10 |
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103529054B (zh) * | 2013-10-12 | 2015-08-26 | 四川蓝彩电子科技有限公司 | 二极管/三极管外观检测及封装装置 |
CN105405936B (zh) * | 2015-12-30 | 2018-10-02 | 深圳翠涛自动化设备股份有限公司 | 一种led固晶点胶系统及方法 |
CN105538315B (zh) * | 2016-01-04 | 2017-06-13 | 江苏工程职业技术学院 | 一种二极管单向导电性检测机械手系统及方法 |
CN106783679B (zh) * | 2016-12-12 | 2023-09-26 | 合肥矽迈微电子科技有限公司 | 芯片贴装设备及贴装芯片的方法 |
CN108682638B (zh) * | 2018-05-21 | 2020-12-08 | 日照亿铭科技服务有限公司 | 一种二极管引线封胶装置 |
CN111370350B (zh) * | 2020-03-19 | 2021-04-16 | 深圳新益昌科技股份有限公司 | 固晶机 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201644323U (zh) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | 自动点胶机构 |
CN102543801A (zh) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | 一种固晶机 |
CN203165867U (zh) * | 2013-03-22 | 2013-08-28 | 常熟艾科瑞思封装自动化设备有限公司 | 二极管封装设备 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101664932B (zh) * | 2009-09-23 | 2011-04-20 | 清华大学 | 一种机械臂 |
CN101664931B (zh) * | 2009-09-23 | 2011-06-22 | 清华大学 | 可调压力并带有力传感器的机械臂 |
CN102142391B (zh) * | 2010-12-24 | 2012-05-30 | 深圳市大族光电设备有限公司 | 固晶机的取晶机械手 |
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- 2013-03-22 CN CN201310094160.2A patent/CN103151273B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201644323U (zh) * | 2009-12-22 | 2010-11-24 | 全方位自动化股份有限公司 | 自动点胶机构 |
CN102543801A (zh) * | 2012-02-20 | 2012-07-04 | 常熟艾科瑞思封装自动化设备有限公司 | 一种固晶机 |
CN203165867U (zh) * | 2013-03-22 | 2013-08-28 | 常熟艾科瑞思封装自动化设备有限公司 | 二极管封装设备 |
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Address after: Changshou City Science Park Changshu Economic Development Zone, Suzhou City, Jiangsu province 215500 Room 102 Applicant after: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. Address before: Changshou City Science Park Changshu Economic Development Zone, Suzhou City, Jiangsu province 215500 Room 102 Applicant before: Changshu Aikeruis Packaging Automation Equipment Co.,Ltd. |
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Free format text: CORRECT: APPLICANT; FROM: CHANGSHU ACCURACY AUTOMATION EQUIPMENT CO., LTD. TO: JIANGSU ACCURACY ENCAPSULATION AUTOMATION EQUIPMENT CO., LTD. |
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Address after: Room 102, Kechuang Park, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee after: Suzhou Aike Ruisi intelligent equipment Limited by Share Ltd Address before: Room 102, Kechuang Park, Changshu Economic Development Zone, Suzhou City, Jiangsu Province Patentee before: JIANGSU ACCURACY ASSEMBLY AUTOMATION EQUIPMENT CO., LTD. |
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Denomination of invention: Diode packaging equipment Effective date of registration: 20200909 Granted publication date: 20160810 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY INTELLIGENT EQUIPMENT Co.,Ltd. Registration number: Y2020320010142 |
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Date of cancellation: 20211112 Granted publication date: 20160810 Pledgee: Shanghai Pudong Development Bank Co., Ltd. Changshu sub branch Pledgor: SUZHOU ACCURACY ASSEMBLY AUTOMATION Co.,Ltd. Registration number: Y2020320010142 |
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