CN103144208A - Fretsaw cutting method - Google Patents
Fretsaw cutting method Download PDFInfo
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- CN103144208A CN103144208A CN2013100522168A CN201310052216A CN103144208A CN 103144208 A CN103144208 A CN 103144208A CN 2013100522168 A CN2013100522168 A CN 2013100522168A CN 201310052216 A CN201310052216 A CN 201310052216A CN 103144208 A CN103144208 A CN 103144208A
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Abstract
The invention discloses a fretsaw cutting method which comprises following steps: wiring on a guide wheel of a fretsaw cutting machine to an extent that the distance between every two adjacent steel wires is equal to the thickness of a target seed crystal; and carrying out fretsaw cutting. According to the invention, when the method is used for cutting the seed crystals, the saw kerf loss is small, the silicon rod utilization rate is high, the manufacturing cost of the seed crystals is low, the flatness of the end surfaces of the cut seed crystals is better, and the seed crystal qualification rate is high. Therefore, the cutting method can improve the production efficiency of seed crystal cutting by increasing the seed crystal amount generated in each cutting.
Description
Technical field
The invention belongs to area of solar cell, relate in particular to a kind of wiresaw cutting method.
Background technology
Extensive use along with solar cell, the demand of crystalline silicon material increases gradually, due to monocrystal material with respect to polycrystalline material, have superiority at aspects such as electrical property, thermal imagery energy, magnetic properties, therefore can attempt increasing the size of crystal grain in the crystal growth, reduce crystal grain quantity, and claim this type of to have large crystalline size, seldom the crystal of crystal grain quantity is the class monocrystalline, with in outstanding monocrystalline performance, makes the application diversification of crystalline silicon material.Afterwards, expert in the industry and scholar have developed the method for foundry monocrystalline, the class single crystal casting be with monocrystalline as seed crystal, be positioned over crucible bottom, polycrystalline silicon material and boron foundry alloy are positioned on seed crystal.Then charged crucible is positioned in ingot furnace, casts out the class monocrystal silicon.
Compare with conventional polycrystalline silicon ingot casting, the operation of one seed crystal processing that class monocrystalline ingot casting is many, it is 156mm * 156mm that the operation of seed crystal processing need to be cut into silicon single crystal rod area, thickness is the silico briquette of 20mm～30mm, as the seed crystal of foundry monocrystalline.The method that existing seed crystal commonly used is processed is the band saw cutting, and the process of band saw cutting drives saw blades by two belt wheels and cuts.
But band saw cutting exist processing consuming time many, production cost is high, the silicon rod loss is large, and cuts the problems such as the seed crystal that obtains is second-rate.
Summary of the invention
In view of this, the invention provides a kind of wiresaw cutting method, this kind wiresaw cutting method can reduce process time, when reducing production costs with the silicon rod loss, improves the quality of seed crystal.
For achieving the above object, the embodiment of the present invention provides following technical scheme:
The enterprising row wiring of guide wheel of the online saw cutting machine of a kind of wiresaw cutting method makes the spacing of adjacent two steel wires in the wiring region of guide wheel equal the thickness of target seed crystal; Carry out the scroll saw cutting.
Preferably, the slot pitch of the wiring region of the guide wheel of described scroll saw cutting machine is greater than the slot pitch of line inlet port and the line outlet of guide wheel, and the slot pitch in the wiring region of guide wheel is uniform.
Preferably, the width of described line inlet port and described line outlet is 15mm.
Preferably, the direction of the slot pitch of described line inlet port and line outlet along the wiring region of guide wheel to guide wheel both sides reduces gradually.
Preferably, the slot pitch of described wiring region is 5mm, and described line inlet port and line outlet are 345 μ m near the minigroove distance at guide wheel edge.
Preferably, the slot pitch of described line inlet port and line outlet is uniform.
Preferably, the slot pitch of described wiring region is 5mm, and the slot pitch of described line inlet port and line outlet is 345 μ m.
Preferably, the process of the enterprising row wiring of guide wheel of online saw cutting machine is: at line inlet port and each groove cloth single line of line outlet of guide wheel, at every four the groove cloth single lines of the middle wiring region of guide wheel.
Preferably, described scroll saw cutting process adopts the reciprocating cutting method.
Preferably, the loop line rate of described reciprocating cutting method is 80%.
Preferably, the workbench decrease speed of the scroll saw cutting machine of described scroll saw cutting process is 0.3mm/min ~ 0.5mm/min, comprises endpoint value.
Preferably, when the steel wire diameter of described scroll saw cutting was 0.13mm, the steel wire speed of service of described scroll saw cutting was 13m/s, the steel wire tension force of line inlet port side is 24N, line outlet side steel wire tension force is 22N, and the workbench decrease speed is 0.5mm/min, and slurry flow is 150kg/min.Compared with prior art, technique scheme has the following advantages:
Wiresaw cutting method provided by the invention, the wire laying mode of the gauze of the guide wheel by changing the scroll saw cutting machine makes the scroll saw cutting machine can be used for the cutting seed crystal.Because the cut quality of scroll saw cutting machine is stable, the end face flatness of therefore using the seed crystal that the cutting of scroll saw cutting machine obtains is better, has improved the quality of seed crystal.The scroll saw cutting machine is to adopt steel wire to drive mortar to cut, and the diameter of steel wire is less, can make the saw kerf loss less therefore use scroll saw cutting machine cutting seed crystal, has reduced the loss of silicon rod, improves the utilization rate of silicon rod, has reduced the production cost of seed crystal.In addition, because the scroll saw cutting machine is to adopt the gauze cutting, improve the seed crystal quantity that each cutting produces, therefore improved the production efficiency of cutting seed crystal.
Description of drawings
Shown in accompanying drawing, above-mentioned and other purpose of the present invention, Characteristics and advantages will be more clear.Reference numeral identical in whole accompanying drawings is indicated identical part.Deliberately do not draw accompanying drawing by actual size equal proportion convergent-divergent, focus on illustrating purport of the present invention.
Fig. 1 is the flow chart of wiresaw cutting method provided by the invention;
Fig. 2 is guided wheel slot distance and the wiring method of a kind of scroll saw cutting machine provided by the invention;
Fig. 3 is guided wheel slot distance and the wiring method of another kind of scroll saw cutting machine provided by the invention.
The specific embodiment
Just as described in the background section, the cutting of existing band saw exist processing consuming time many, production cost is high, the silicon rod loss is large, and cuts the problems such as the seed crystal that obtains is second-rate.
The inventor studies discovery, the cutting of existing band saw exist processing consuming time many, production cost is high, the silicon rod loss is large, and the reason of the problems such as the cut end surface evenness is poor comprises: at first, due to the restriction with saw equipment itself, seed crystal of band saw equipment cutting needs 12 minutes, produces 25 seed crystals that an ingot casting needs, need 5 hours altogether, process consuming time many; Secondly, what existing band saw cutting was used is that thickness is the diamond saw blade of 0.5mm, and the knife edge loss that cutting produces reaches 1mm, has increased the loss of silicon rod, has indirectly increased the production cost of seed crystal; In addition, because the band saw cutting is cut by two belt wheel bands for bands, saw blade can produce small vibration in cutting process, causes the end face out-of-flatness of seed crystal blocks, affects the seed crystal quality.
Can overcome the above-mentioned shortcoming of band saw cutting by transforming existing silicon ingot excavation machine.The structure of existing silicon ingot excavation machine comprises: be arranged on wire spool, the work plate of bottom in the equipment cutting chamber, wherein guide wheel is arranged on the top in cutting chamber, and steel wire is laid on the axial plane of described guide wheel and described wire spool, and work plate is placed on the equipment workbench.For being wound with the cutting head uniform descent of steel wire, workpiece is fixed on the work plate that is positioned at the cutting head below cutting process of silicon ingot excavation machine, and steel wire is carrying cutting blade material and running up workpiece is cut.
In the process of using the cutting of silicon ingot excavation machine, the bearing that needs wire spool will be installed is fixed on the bearing box that is positioned on lathe, and squarely is being arranged four identical bearings below cutting head, an and wherein end demand motive part of each axle, driving bearing by drive motors by belt rotates, rotate thereby drive wire spool, can place a plurality of seed crystal blocks (1 ~ 5) in cutting process on the work plate that is positioned at below cutting head and cut simultaneously.
But because the design of silicon ingot excavation machine is used for cutting silicon ingot, the wire spool spacing is 156mm, once can cut 25 silico briquettes, and six wire spools are wherein arranged on each axle, walks around the steel wire of a subsidiary 80N tension force on each wire spool.If therefore use silicon ingot excavation machine cutting seed crystal blocks, the wire spool spacing need to be transferred to 20mm, to increase by 7 times to the wire spool number of design flow, the power that the tension force of adding steel wire appends to bearing has indirectly also increased, directly cause the drive motors load to strengthen, in the situation that long time running has increased the load of equipment guide wheel motor, make servomotor move in the high load capacity situation, greatly reduce the service life of motor.This external due to common silicon ingot excavation machine lathe can only be more than the 30mm of cut place the silico briquette seed crystal, so when the silicon ingot excavation machine is the seed crystal of 20mm for cutting thickness, need the structure of redesign wire spool and work plate, thereby increased the expense of transformation lathe, increased equipment cost.
The inventor studies discovery, is used for cutting the shortcoming that seed crystal not only can overcome existing band saw cutting by transformation scroll saw cutting machine, can also overcome the problem that silicon ingot excavation machine cutting seed crystal brings.
For these reasons, the embodiment of the present invention provides a kind of wiresaw cutting method, as shown in Figure 1, comprises the following steps:
Step S101: the enterprising row wiring of guide wheel of online saw cutting machine makes the spacing of adjacent two steel wires in the wiring region of guide wheel equal the thickness of target seed crystal.
Step S102: carry out the scroll saw cutting.
Wiresaw cutting method provided by the invention makes the scroll saw cutting machine can be used for the cutting seed crystal by the wire laying mode of the gauze of the guide wheel of change scroll saw cutting machine.This kind wiresaw cutting method can improve the end face flatness of seed crystal, improves the qualification rate of seed crystal; Reduce to cut the saw kerf loss of seed crystal, improve the utilization rate of silicon rod, reduce the production cost of seed crystal; Improved the production efficiency of cutting seed crystal.In addition, except the wire laying mode of the gauze of the guide wheel that changes the scroll saw cutting machine, need not other parts of scroll saw cutting machine are transformed, saved the cost of reforming equipment.
For the purpose, technical solutions and advantages of the present invention can be become apparent more, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is carried out clear, complete description, described embodiment is the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making other embodiment that obtain under the creative work prerequisite.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the present invention is described in detail in detail; for ease of explanation; the profile of indication device structure can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three-dimensional space that should comprise in addition, length, width and the degree of depth in actual fabrication.
Below in conjunction with specific embodiment, wiresaw cutting method provided by the invention is specifically described.
As shown in Figure 1, the embodiment of the present invention provides a kind of wiresaw cutting method, comprises the following steps:
Step S101: the enterprising row wiring of guide wheel of online saw cutting machine makes the spacing of adjacent two steel wires in the wiring region of guide wheel equal the thickness of target seed crystal.
The thickness of the seed crystal that class monocrystalline ingot casting is required, connects up on the guide wheel of online saw cutting machine according to the thickness of target seed crystal preferably at 20mm～30mm, makes the scroll saw cutting machine can be used for the seed crystal of cutting thickness in 20mm～30mm scope.When connecting up on the guide wheel of online saw cutting machine, consider that the scroll saw cutting machine is is the silicon chip of 180 about μ m for cutting thickness, the guided wheel slot distance of existing scroll saw cutting machine is to be generally 335 μ m, so when connecting up, can be in wiring region every steel wire of 60 ~ 90 groove cloth, make the spacing of adjacent steel wire equal the thickness of target seed crystal.
How online the guide wheel wiring region wiring of saw cutting machine is relevant to the slot pitch of guide wheel, and the guided wheel slot of scroll saw cutting machine is the V-type groove, and the slot pitch of described guide wheel is the horizontal range of two adjacent V-type trench bottoms.Due to the thickness compared to the target seed crystal, the slot pitch of existing scroll saw cutting machine is less, the present invention can also slot again to the guide wheel of scroll saw cutting machine, make the slot pitch of guide wheel wiring region greater than the slot pitch of line inlet port and the line outlet of guide wheel, and guarantee that the interior slot pitch of wiring region of guide wheel is uniform.
The guide wheel of scroll saw cutting machine provided by the invention comprises line outlet, line inlet port and wiring region, after the guide wheel of scroll saw cutting machine was slotted again, the slot pitch of guide wheel wiring region was larger, made when the wiring region wiring of guide wheel, the negligible amounts of the groove between adjacent steel wire, the simplified wiring process.The slot pitch of line inlet port and line outlet is less, makes guide wheel can keep comparatively stable state at the steel wire that line inlet port and line outlet go out, and guarantees that the online sawing of steel wire cuts the stable operation in process.
In one embodiment of the invention, as shown in Figure 2, the slot pitch of described guide wheel distributes and to be specially: the direction of the slot pitch of described line inlet port and line outlet along the wiring region of guide wheel to guide wheel both sides reduces gradually.When to be also steel wire entered from the line inlet port of guide wheel, slot pitch had the process of a gradual change, and steel wire is from less slot pitch L
minBe transitioned into gradually larger slot pitch L
max, steel wire is during from the line outlet outlet of guide wheel, and slot pitch also has the process of a gradual change, makes steel wire from larger slot pitch L
maxBe transitioned into less slot pitch L
min, to reduce the wire jumper risk of steel wire in running, guarantee the stability of scroll saw cutting machine operation.
Preferably, when the thickness of our required seed crystal was 20mm, the line outlet of described guide wheel and the width of line inlet port were 15mm, described line inlet port and line outlet near the minigroove at guide wheel edge apart from L
minBe 345 μ m, the slot pitch L in described wiring
maxBe 5mm, then when wiring region connects up every steel wire of 4 groove cloth, equal the thickness 20mm of target seed crystal to guarantee the distance W between the two adjacent steel wires in the guide wheel wiring region.
In another embodiment of the present invention, as shown in Figure 3, the slot pitch of described guide wheel distributes and is specially: the slot pitch in described line inlet port, line outlet and wiring region is all uniform.Be also that the line inlet port of guide wheel and the slot pitch of line outlet have uniform the first slot pitch L
1, the wiring region of guide wheel has uniform the second slot pitch L
2, and the first slot pitch L
1Be not more than the second slot pitch L
2Because the guide wheel of scroll saw cutting machine need to be slotted by the utilization groover, slot pitch in line inlet port, line outlet and wiring region all is set to uniformly so, just can be when guaranteeing the transition of steel wire between line outlet and wiring region, between wiring region and line outlet, reduce the fluting difficulty of the guide wheel of scroll saw cutting machine, simplify to a certain extent the technique of scroll saw cutting machine cutting seed crystal.
Preferably, when the thickness of our required seed crystal was 20mm, the line inlet port of described guide wheel and line outlet width were 15mm, the slot pitch L of described line inlet port and line outlet
1Be 345 μ m, the slot pitch L of described wiring region
2Be 5mm, the slot pitch that the guide wheel wiring region also can be set is 4mm, then when wiring region connects up every steel wire of 5 groove cloth, equal the thickness 20mm of target seed crystal to guarantee the distance W between the two adjacent steel wires in the guide wheel wiring region.
Need to prove, the width of the line inlet port of scroll saw cutting machine of the present invention and the slot pitch of line inlet port need to satisfy makes the steel wire can be by the line inlet port smooth transition to wiring region, the width of the line outlet of scroll saw cutting machine of the present invention and slot pitch need to satisfy steel wire and can be got final product to line outlet by the wiring region smooth transition, and the present invention is not construed as limiting this.
In addition, the slot pitch of the wiring region of scroll saw cutting machine of the present invention is to set according to actual needs, the thickness of the seed crystal that existing class single crystal casting is required is preferably in 20mm ~ 30mm scope, comprise endpoint value, when selecting slot pitch according to the thickness of target seed crystal, the interior slot pitch of wiring region that guide wheel can be set is the integral multiple of target seed crystal thickness/one so.For example, when the thickness of our required seed crystal is 24mm, the slot pitch that the guide wheel wiring region can be set is 6mm, then in wiring region when wiring every steel wire of 4 groove cloth, the slot pitch that the guide wheel wiring region also can be set is 4mm, then above two kinds of methods all can make the scroll saw cutting machine directly cut out seed crystal to satisfy target thickness every steel wire of 6 groove cloth when wiring in wiring region.
It is emphasized that, when the slot pitch of guide wheel is set, the slot pitch that should be noted that guide wheel can not be excessive, because between upper lower tumbler, every steel wire has a transition, steel wire need to be transitioned into next groove from a groove, so if slot pitch is excessive, just may cause steel wire can't be stabilized in cutting process in a groove, take off the groove phenomenon thereby steel wire occurs, cause steel wire at the cutting process interrupt line, affect the stability of scroll saw cutting machine.
Because the scroll saw cutting machine is to adopt the less steel wire of diameter to drive mortar to cut, and cut quality is stable, therefore use the loss of scroll saw cutting machine cutting seed crystal saw kerf little, the utilization rate of silicon rod is high, the production cost of seed crystal is low, and the end face flatness of the seed crystal that cutting obtains is better, and the seed crystal qualification rate is high, and the cutting mode of scroll saw cutting machine silk screen wiring can also increase the seed crystal quantity that each cutting produces, the production efficiency of raising cutting seed crystal.In addition, the shortcoming of relatively broken ingot machine cutting guide wheel motor overload work, the design broaching load of scroll saw is far longer than the requirement of cutting seed crystal blocks, and equipment can safer more stable operation.
By the wire laying mode on the guide wheel that changes the scroll saw cutting machine, the scroll saw cutting machine is used for the cutting seed crystal, need not the scroll saw cutting machine is transformed, only need before cutting, the wire laying mode of guide wheel to be adjusted just can realize the scroll saw cutting machine is applied to cut seed crystal, implementation is simple and convenient.
Step S102: carry out the scroll saw cutting.
After wiring on the guide wheel of online saw cutting machine is completed, carry out the scroll saw cutting.
In the process of carrying out the scroll saw cutting, described scroll saw cutting process preferably adopts the reciprocating cutting method, the loop line rate of reciprocating cutting method is preferably 80%, when also namely carrying out the scroll saw cutting under the reciprocating cutting method, every cutting one saw only uses the steel wire of 20km, and what steel wire adopted when reciprocating cutting is the old sand slurry of section, therefore adopts the reciprocating cutting method can reduce to a great extent raw-material consumption, has further reduced the production cost of seed crystal.
Also should be noted that in the process of carrying out the scroll saw cutting, because existing scroll saw cutting machine is to be applied to cutting silicon wafer, when therefore using it for the cutting seed crystal, also need to adjust accordingly the work in every parameter of scroll saw cutting machine, need to increase especially the workbench drawdown parameter of scroll saw cutting machine, preferably, the workbench drawdown parameter of described scroll saw cutting machine is 0.3mm/min ~ 0.5mm/min, comprises endpoint value.With this understanding, when the scroll saw cutting machine adopts diameter to be the steel wire cutting seed crystal of 0.13mm, the steel wire speed of service of described scroll saw cutting is 13m/s, the steel wire tension force of line inlet port side is 24N, line outlet side steel wire tension force is 22N, the workbench decrease speed is 0.5mm/min, and slurry flow is 150kg/min.
Although the class single crystal technology is a kind of project that has development potentiality, but its required too high production cost has limited the popularization of this technology, account for most of class single crystal technology cost due to the seed crystal cost, therefore how producing better class monocrystalline with thinner seed crystal becomes the problem that present urgent need solves, and provides larger development space therefore the present invention uses the method for scroll saw cutting seed crystal for the later thinner seed crystal blocks of cutting thickness.
The above embodiment is only preferred embodiment of the present invention, is not the present invention is done any pro forma restriction.
Although the present invention discloses as above with preferred embodiment, yet is not to limit the present invention.Any those of ordinary skill in the art, do not breaking away from technical solution of the present invention scope situation, all can utilize method and the technology contents of above-mentioned announcement to make many possible changes and modification to technical solution of the present invention, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification made for any of the above embodiments, equivalent variations and modification according to technical spirit of the present invention.
Claims (12)
1. a wiresaw cutting method, is characterized in that, comprising:
The enterprising row wiring of guide wheel of online saw cutting machine makes the spacing of adjacent two steel wires in the wiring region of guide wheel equal the thickness of target seed crystal; Carry out the scroll saw cutting.
2. cutting method according to claim 1, is characterized in that, the slot pitch of the wiring region of the guide wheel of described scroll saw cutting machine is greater than the slot pitch of line inlet port and the line outlet of guide wheel, and the slot pitch in the wiring region of guide wheel is uniform.
3. cutting method according to claim 1, is characterized in that, the width of described line inlet port and described line outlet is 15mm.
4. cutting method according to claim 1, is characterized in that, the direction of the slot pitch of described line inlet port and line outlet along the wiring region of guide wheel to guide wheel both sides reduces gradually.
5. cutting method according to claim 4, is characterized in that, the slot pitch of described wiring region is 5mm, and described line inlet port and line outlet are 345 μ m near the minigroove distance at guide wheel edge.
6. cutting method according to claim 1, is characterized in that, the slot pitch of described line inlet port and line outlet is uniform.
7. cutting method according to claim 6, is characterized in that, the slot pitch of described wiring region is 5mm, and the slot pitch of described line inlet port and line outlet is 345 μ m.
8. according to claim 5 or 7 described cutting methods, is characterized in that, the process of the enterprising row wiring of guide wheel of online saw cutting machine is: at line inlet port and each groove cloth single line of line outlet of guide wheel, at every four the groove cloth single lines of the middle wiring region of guide wheel.
9. cutting method according to claim 1, is characterized in that, described scroll saw cutting process adopts the reciprocating cutting method.
10. cutting method according to claim 9, is characterized in that, the loop line rate of described reciprocating cutting method is 80%.
11. cutting method according to claim 1 is characterized in that, the workbench decrease speed of the scroll saw cutting machine of described scroll saw cutting process is 0.3mm/min ~ 0.5mm/min, comprises endpoint value.
12. cutting method according to claim 1, it is characterized in that, when the steel wire diameter of described scroll saw cutting is 0.13mm, the steel wire speed of service of described scroll saw cutting is 13m/s, the steel wire tension force of line inlet port side is 24N, line outlet side steel wire tension force is 22N, and the workbench decrease speed is 0.5mm/min, and slurry flow is 150kg/min.
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| CN2013100522168A CN103144208A (en) | 2013-02-17 | 2013-02-17 | Fretsaw cutting method |
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|---|---|---|---|
| CN2013100522168A CN103144208A (en) | 2013-02-17 | 2013-02-17 | Fretsaw cutting method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103496043A (en) * | 2013-10-16 | 2014-01-08 | 内蒙古中环光伏材料有限公司 | Linear cutting sheave for solar silicon wafers |
| CN113829530A (en) * | 2021-08-24 | 2021-12-24 | 隆基绿能科技股份有限公司 | Cutting method and silicon wafer |
| US20220040882A1 (en) * | 2018-12-17 | 2022-02-10 | Siltronic Ag | Method for producing semiconductor wafers using a wire saw, wire saw, and semiconductor wafers made of monocrystalline silicon |
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| CN113829530A (en) * | 2021-08-24 | 2021-12-24 | 隆基绿能科技股份有限公司 | Cutting method and silicon wafer |
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Application publication date: 20130612 |