JP2005014157A - Multi-wire saw - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a multi-wire saw which has multi-groove rollers having a long life and a simple structure, and does not easily break down. <P>SOLUTION: The multi-wire saw runs while slurry having abrasive grains mixed therein is being supplied, and cuts a workpiece by pressing a row of wires wound around a plurality of multi-groove rollers against the workpiece. The row of wires is wound on both end portions of the multi-groove rollers so as to have a pitch closer than that of the middle portion between both end portions. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multi-wire saw, and more particularly to a wire saw in which a pitch of a wire row is made dense by a portion of a multi-groove roller.
[0002]
[Prior art]
In general, a multi-wire saw (hereinafter referred to as a wire saw) presses a workpiece such as a silicon single crystal ingot or silica glass ingot against a wire array arranged at a predetermined uniform pitch, and moves the wire and the workpiece relative to each other while pouring a slurry containing abrasive grains. This is an apparatus for cutting a large number of wafers and exposure mask substrates by a grinding action.
[0003]
For example, in order to manufacture a silicon wafer by cutting a silicon single crystal ingot which is a workpiece, a wire saw has been conventionally used, and this wire saw has a resin ring in which a wire winding groove for winding one wire is formed. It has a plurality of multi-groove rollers that are press-fitted. Usually, in the wire saw having three multi-groove rollers used, one of the three is a multi-groove roller for driving, and the other two are formed as multi-groove rollers for guide. A wire row is formed by winding a wire winding groove with a pitch of 0.3 to 20 mm or the like having a diameter of 100 to 300 μm between the groove rollers, and the wires in the wire row are reciprocated by driving the multi-groove roller on the drive side. It is designed to run. While supplying slurry to the traveling wire row, the silicon ingot is pressed against the wire row and sliced.
[0004]
In such a slicing process, the long groove use may cause a deep groove phenomenon in which the wire winding groove is abnormally worn, deforming the multi-groove roller and shortening the life of the multi-groove roller.
[0005]
Patent Document 1 proposes a multi-wire saw that is provided with a pair of tension buffering rollers to prevent the groove from being biased and deformed. Patent Document 2 proposes a multi-wire saw that is provided with a plurality of wire direction correction jigs to prevent the wire from being pressed in the side surface direction of the wire winding groove. However, since the multi-wire saws of Patent Document 1 and Patent Document 2 are both provided with a separate wire motion control mechanism, the structure becomes complicated, causes a failure, and is not for preventing deep grooves.
[0006]
[Patent Document 1]
JP 2000-42895 (paragraph numbers [0010], [0011], FIGS. 3 and 4)
[0007]
[Patent Document 2]
JP 2003-71698 A (paragraph numbers [0009], [0011], FIG. 1)
[0008]
[Problems to be solved by the invention]
The present invention has been made in consideration of the above-described circumstances, and an object thereof is to provide a multi-wire saw having a long-life multi-groove roller and having a simple structure and no failure.
[0009]
[Means for Solving the Problems]
In order to achieve the above object, according to one aspect of the present invention, a work is carried out while a slurry in which abrasive grains are dispersed is supplied and a wire row wound around a plurality of multi-groove rollers is pressed against the work. In the multi-wire saw, the multi-groove roller is provided with a wire row wound more densely at both ends of the multi-groove roller than at the center between the both ends. Thereby, a multi-wire saw having a long-life multi-groove roller and having a simple structure and no failure is realized.
[0010]
In a preferred example, the multi-groove roller is formed with wire winding grooves whose pitch is smaller at both ends than at the center. Thereby, the wire row | line | column of both ends can be easily made dense compared with the wire row | line | column of a center part.
[0011]
Further, in another preferred example, the end length _{L 1} of each of said end portions, when the length L of the Tamizo roller is (0.03 to 0.10) L.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of a multi-wire saw according to the present invention will be described with reference to the accompanying drawings.
[0013]
FIG. 1 is a conceptual diagram of an embodiment of a multi-wire saw according to the present invention.
[0014]
As shown in FIG. 1, a multi-wire saw 1 according to the present invention is formed by one wire 2, a multi-groove roller 3 for driving around the wire 2, and two multi-groove rollers 4 for guide. A wire 2 having a diameter of 100 to 300 μm is wound between the multi-groove rollers 3 and 4 at intervals of 0.3 to 20 mm to form a wire row 5, and the wire 2 in the wire row 5 is connected to the multi-groove roller 3 for driving. It is made to reciprocate by driving. In addition, a feed unit 6 is provided above the wire row 5, and a workpiece such as a silicon single crystal ingot W bonded to the feed unit 6 through the carbon base 7 is pressed against the wire row 5.
[0015]
Further, a slurry supply device 8 is provided obliquely above the wire row 5, and this slurry supply device 8 is communicated by a slurry tank 9 and a slurry supply pipe 10. When the silicon ingot W is sliced, the slurry supply device 8 is connected. A slurry in which SiC abrasive grains are dispersed from 8 to the wire row 5 is constantly supplied to the silicon ingot W, and the slurry is applied to the wire row 5 and pressed against the wire row 5 running on the silicon ingot W to slice. Is.
[0016]
The multi-groove rollers 3 and 4 are press-fitted with a resin ring 3b in which a wire winding groove 3a is formed, and both end portions 3c and 4c are not used for cutting a workpiece, and both end portions Since many deep grooves are generated in 3c and 4c, in order to increase the grip force of the wire by increasing the number of windings of the wire and to distribute the tension applied to the wire, both ends 3c and 4c have a wire The row 5 is wound more densely than the central portions 3d and 4d between the both end portions 3c and 4c. Further, since the multi-groove roller 3 and the multi-groove roller 4 have the same shape, the multi-groove roller 4 will be described by taking the multi-groove roller 4 as an example. As shown in FIG. 4, a large number of the wire winding grooves 4a are formed at both end portions 4c at a pitch smaller than that of the central portion 4d.
[0017]
Edge length _{L 1} of the end portions 4c, when the entire length of Tamizo roller is L, preferably a (0.03 to 0.10) L. If it is smaller than 0.03 L, the spreading angle of each groove (V groove) cannot be taken sufficiently, it is difficult to obtain a stable winding of the wire, and there is a possibility that a wire jumps to the adjacent groove, so-called wire jumping occurs. . On the other hand, if it exceeds 0.10 L, the effect of reducing the pitch (the wire is dense) cannot be sufficiently expected, and a deep groove phenomenon in which the wire winding groove is abnormally worn tends to occur due to long-time use. To further reduce the occurrence frequency of the deep groove phenomenon, to the end length of L ₁ below 0.07L is more preferable.
[0018]
Next, a method for slicing a silicon single crystal ingot using the multi-wire saw according to the present invention will be described.
[0019]
As shown in FIGS. 1 and 2, the wire 2 is wound around the wire winding grooves 3a and 4a of both ends 3c and 4c formed at a smaller pitch than the central portions 3d and 4d, and both ends 3c and 4c are formed. The wire row 5 of the wire row 5 is made denser than the wire row 5 of the central portions 3c and 4c, the wire 2 of the wire row 5 is reciprocated by driving the multi-groove roller 3 for driving, and the slurry is supplied to the wire 2 while feeding slurry. The silicon ingot W bonded to the unit 6 via the carbon base 7 is pressed against the wire row 5 and sliced.
[0020]
In this slicing step, since the wire rows 5 at both ends 3c and 4c are arranged denser than the central portions 3d and 4d, the number of windings of the wire increases, and the grip force of the wire 2 increases. Further, the tension applied to the wire 2 is dispersed, the slip between the wire 2 and the synthetic resin on the surface of the multi-groove roller 4 is suppressed, the formation of deep grooves is prevented, and the long life of the multi-groove roller 4 is realized. As a result, cost reduction, roller replacement labor increase due to generation of deep grooves, and stoppage of the apparatus can be prevented, and productivity can be improved.
[0021]
In the above embodiment, in order to tightly wind the wire rows at both ends, a multi-groove roller in which wire winding grooves are formed at both ends at a smaller pitch than the center is used. Even if the multi-roller roller provided with a large number of wire winding grooves formed in is wound with a wire at a smaller pitch than the center portion at both ends, the density of the wire row is formed, Similar effects can be expected.
[0022]
The multi-wire saw according to the present invention is optimal for slicing a silica glass ingot into a photomask member in addition to slicing a silicon single crystal ingot as a workpiece. In particular, the present invention is more preferably applied to a large wire saw having four multi-groove rollers suitable for manufacturing a large photomask member requiring a thickness of 5 mm or more.
[0023]
【Example】
1 except that another multi-groove roller for driving (not shown) is provided at a substantially horizontal position of the multi-groove roller 3 for driving in FIG. In order to obtain a large mask of t10 × 700 × 800 mm, the silica glass ingot was sliced and the life of the multi-groove roller was examined.
[0024]
Result: The wire row at both ends of each multi-groove roller was not made denser than the central portion, and the life span was 240 hours / set in the conventional example, which was uniform over the entire length, but extended to 1000 hours / set in the example. It was confirmed that it was possible.
[0025]
【The invention's effect】
According to the multi-wire saw according to the present invention, a multi-wire saw having a long-life multi-groove roller and having a simple structure and no failure can be provided.
[Brief description of the drawings]
FIG. 1 is a conceptual diagram of a multi-wire saw according to the present invention.
FIG. 2 is a conceptual diagram of a multi-groove roller used in a multi-wire saw according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Multi-wire saw 2 Wire 3 Drive multi-groove roller 3a Wire winding groove 3b Resin ring 3c Both ends 3d Center 4 Guide multi-groove roller 4c Both ends 4d Center 5 Wire row 8 Slurry supply device 10 Slurry supply pipe

Claims (3)

In a multi-wire saw that travels while being supplied with a slurry in which abrasive grains are dispersed and presses a wire array wound around a plurality of multi-groove rollers against the work to cut the work, wire is provided at both ends of the multi-groove roller. A multi-wire saw, wherein the row is wound more densely than the central portion between both ends. 2. The multi-wire saw according to claim 1, wherein the multi-groove roller is formed with a wire winding groove having a smaller pitch at both end portions than the center portion. 3. The multi-wire saw according to claim 1, wherein an end length L ₁ of each of the both end portions is (0.03 to 0.10) L when the length L of the multi-groove roller is set. .

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