CN103138151A - Temperature control method and device - Google Patents
Temperature control method and device Download PDFInfo
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- CN103138151A CN103138151A CN2011103919940A CN201110391994A CN103138151A CN 103138151 A CN103138151 A CN 103138151A CN 2011103919940 A CN2011103919940 A CN 2011103919940A CN 201110391994 A CN201110391994 A CN 201110391994A CN 103138151 A CN103138151 A CN 103138151A
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- laser
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- temperature control
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- semiconductor cooler
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Abstract
The invention discloses a temperature control method. The temperature control method is used for a packaging type tunable diode laser of a transistor outline (TO). The temperature control method comprises that a hole is formed in a semiconductor cooler, wherein the hole is used for containing a base pin of the laser; the base pin penetrates through the hole to enable the surface of the laser to be attached on a temperature control surface of the semiconductor cooler, wherein the surface of the base pin is provided with the base pin; or two or more than two semiconductor coolers are arranged at the same plane and a gap which can contain the base pin of the laser is left to enable the base pin of the laser to penetrate through the gap so as to enable the surface of the laser to be attached on temperature control surfaces of the two or more than two semiconductor coolers, wherein the surface of the laser is provided with the base pin. In addition, the invention further discloses a temperature control device corresponding to the temperature control method. The temperature control method and the temperature control device enable the surface of the laser to be in direct contact with the temperature control surface of the semiconductor cooler (TEC), thus avoiding the temperature transfer between the semiconductor cooler and the laser through heat conduction materials, so that temperature can be controlled more accurately and efficiency of the temperature control can be improved.
Description
Technical field
The present invention relates to automation field, relate in particular to a kind of temperature-controlled process and device.
Background technology
Do not contain transistor outline (TO) the encapsulation type tunable diode laser of built-in attemperating unit, because of the little advantage of its volume, be widely used in laser gas analyzer.Because its inside does not comprise attemperating unit, so need to be at its outside device that is used for controlling temperature of installing, traditional way as shown in Figure 1, laser 102 is fixed on a Heat Conduction Material 103, copper sheet for example, the pin that Heat Conduction Material has certain thickness and possesses the wire lead slot laser is drawn by wire lead slot, and the temperature control face of Heat Conduction Material with semiconductor cooler (TEC) 101 contacted, and makes TEC by Heat Conduction Material, heat be passed to laser.
Such Temp. control method conducts temperature because increased one deck Heat Conduction Material between laser and TEC, thereby the thermal resistance and the load that have increased system, when ambient temperature lower (for example 0-10 degree centigrade), will make the temperature departure set point that is transmitted to laser, and the low problem of temperature control efficiency occur.
Summary of the invention
In view of this, the invention provides a kind of temperature-controlled process, purpose is to solve traditional low problem of TO encapsulation type tunable diode laser Temp. control method temperature control efficiency.
A kind of temperature-controlled process is used for transistor outline TO encapsulation type tunable diode laser, comprising:
The hole of the pin can hold described laser is set on semiconductor cooler, described pin is passed described hole, make the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler;
Perhaps, two or more semiconductor coolers are arranged at same plane, and reserve the space of the pin that can hold described laser, the pin of described laser is passed described space, and the surface that makes described laser be provided with pin fits in the temperature control face of described two or more semiconductor coolers.
Preferably, the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
A plurality of holes are set on described semiconductor cooler, and described a plurality of holes a plurality of pins with described laser respectively are corresponding one by one.
Preferably, the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
A hole that can hold the whole pins of described laser is set on described semiconductor cooler.
Preferably, described hole comprises:
Circular port or square opening.
Preferably, describedly two or more semiconductor coolers be arranged at same plane comprise:
Two semiconductor coolers are arranged at same plane in series or in parallel.
Preferably, describedly two or more semiconductor coolers be arranged at same plane comprise:
Three semiconductor coolers are arranged at same plane in a triangle.
Preferably, describedly two or more semiconductor coolers be arranged at same plane comprise:
Become matrix pattern to be arranged at same plane four semiconductor coolers.
Preferably, the connected mode of described semiconductor cooler comprises:
Serial or parallel connection.
Preferably, also comprise:
Thermistor is close to described laser.
Preferably, also comprise:
Described thermistor is fixed on the temperature control face of described semiconductor cooler, and is close to described laser.
A kind of temperature control equipment is used for transistor outline TO encapsulation type tunable diode laser, comprising:
Semiconductor cooler, arrange porosely on the temperature control face of described semiconductor cooler, the pin that described hole can hold described laser passes described semiconductor cooler and makes the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler;
Perhaps comprise:
Two or more semiconductor coolers, described semiconductor cooler is arranged at same plane, and reserve the space of the pin that can hold described laser between adjacent semiconductor cooler, the pin that described space can hold laser passes, so that described laser is provided with the temperature control face that the surface of pin fits in described two or more semiconductor coolers.
The temperature-controlled process that the embodiment of the present invention provides, by the hole being set on TEC or two or more TEC being arranged on same plane, leave the mode of holding laser pin space between described TEC, make the pin of laser can pass hole or space, and then make the surface of laser directly to contact with the temperature control face of TEC, this has just been avoided transmitting temperature by Heat Conduction Material between TEC and laser, so temperature control is more accurate, has improved temperature controlled efficient.
Description of drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, the below will do to introduce simply to the accompanying drawing of required use in embodiment or description of the Prior Art, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skills, under the prerequisite of not paying creative work, can also obtain according to these accompanying drawings other accompanying drawing.
Fig. 1 is for the connection diagram of existing temperature-controlled process;
Fig. 2 is the described connection diagram of the disclosed a kind of temperature-controlled process of the embodiment of the present invention;
Fig. 3 is the described connection diagram of disclosed another temperature-controlled process of the embodiment of the present invention;
Fig. 4 is the described connection diagram of disclosed another temperature-controlled process of the embodiment of the present invention;
Fig. 5 is the described connection diagram of disclosed another temperature-controlled process of the embodiment of the present invention;
Fig. 6 is the described connection diagram of disclosed another temperature-controlled process of the embodiment of the present invention.
Embodiment
The invention discloses a kind of temperature-controlled process and device for TO encapsulation type tunable diode laser, for the laser gas analysis field, by the structure of improvement TEC or the connected mode of a plurality of TEC and described laser, make that in laser, the surface with pin can fit with the temperature control face of TEC, thereby improved the temperature control efficient to described laser.
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, rather than whole embodiment.Based on the embodiment in the present invention, those of ordinary skills belong to the scope of protection of the invention not making the every other embodiment that obtains under the creative work prerequisite.
A kind of temperature-controlled process disclosed by the invention is used for TO encapsulation type tunable diode laser, comprising:
The hole of the pin can hold described laser is set on semiconductor cooler, described pin is passed described hole, make the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler; Wherein, described TEC is connected with control circuit by the pin of self, realizes the control to laser temperature.
Perhaps, two or more semiconductor coolers are arranged at same plane, and reserve the space of the pin that can hold described laser, the pin of described laser is passed described space, and the surface that makes described laser be provided with pin fits in the temperature control face of described two or more semiconductor coolers.
Need to prove, two or more TEC can be connected, and also can not be connected, and can share a control circuit, also can distinguish control circuit of separate connection separately, and the present embodiment is not done restriction.
The disclosed method of the present embodiment, leave the space no matter be the hole being set on TEC or being between conplane TEC at two or more, all can pass for the pin that guarantees laser, so that laser tightly fits with the surface of pin and the temperature control face of TEC, thereby improve TEC to the temperature control efficient of laser.
In the present embodiment, the method that the hole is set on TEC has two kinds:
Further, as shown in Figure 2, wherein (a) is vertical view, is (b) front view, and the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
On described semiconductor cooler 201, a plurality of holes are set, described a plurality of holes a plurality of pins with described laser respectively are corresponding one by one.
The pin of laser 202 passes respectively corresponding with it hole, makes described laser tightly fit in the temperature control face of described TEC 201 with the surface of pin.
Further, as shown in Figure 3, wherein (a) is vertical view, is (b) front view, and the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
A hole that can hold described laser 302 whole pins is set on described semiconductor cooler 301.
Whole pins of laser 302 all pass from described hole, make laser tightly fit in the temperature control face of described TEC 301 with the surface of pin.
Be arranged at the hole on TEC, be circular port or square opening, this optimal way that to be the present embodiment adopt according to the shape of general pins can certainly be the hole of other arbitrary shapes, does not do restriction here.
Above two kinds of methods that the hole is set respectively have superiority, and arrange and pin hole one to one, pin can be separated, and make the work of laser safer and stable; A hole only is set, and technique is simple, in actual applications, can select according to different needs.
In the present embodiment, two or more TEC are arranged at same plane and comprise following several mode:
Further, as shown in Figure 4, wherein (a) is vertical view, is (b) front view, describedly two or more semiconductor coolers are arranged at same plane comprise:
Two semiconductor coolers are arranged at same plane in series or in parallel.
The one TEC 401 and the 2nd TEC 402 are arranged at same plane, adopt the mode of serial or parallel connection to connect between the two, the pin of laser 403 passes the space between a TEC 401 and the 2nd TEC 402, and is close to the temperature control face of a part separately of a TEC 401 and the 2nd TEC 402.
In this case, control circuit can be connected with a TEC separately, also can be connected with the 2nd TEC separately.
Further, as shown in Figure 5, describedly two or more semiconductor coolers be arranged at same plane comprise:
Three semiconductor coolers are arranged at same plane in a triangle.
The one TEC 501, the 2nd TEC 502 and the 3rd TEC 503 are arranged at same plane, and being isosceles triangle arranges, central point at isosceles triangle reserves the space, the pin of laser 504 is passed described space, make laser fit with the surface of pin and separately a part of temperature control face of a TEC 501, the 2nd TEC 502 and the 3rd TEC503.
Wherein a TEC 501, the 2nd TEC 502 and the 3rd TEC 503 can in parallel or series connection, connect control circuit by one of them, also can not be connected mutually, and connect separately a control circuit, realize the temperature of laser is controlled.
Further, as shown in Figure 6, describedly two or more semiconductor coolers be arranged at same plane comprise:
Become matrix pattern to be arranged at same plane four semiconductor coolers.
The one TEC 601, the 2nd TEC 602, the 3rd TEC 603 and the 4th TEC 604 are arranged at same plane, and being matrix pattern arranges, central point at matrix pattern reserves the space, the pin of laser 605 is passed described space, make laser fit with the surface of pin and separately a part of temperature control face of TEC 601, the 2nd TEC 602, the 3rd TEC 603 and the 4th TEC 604.
Similarly, wherein a TEC 601, the 2nd TEC 602, the 3rd TEC 603 and the 4th TEC 604 can serial or parallel connections, connect control circuit by one of them, also can not be connected mutually, and connect separately a control circuit, realize the temperature of laser is controlled.
The above set-up mode different to two or more TEC can be realized the temperature of laser is controlled, and only uses the mode of two TEC to implement simply, uses the method for a plurality of TEC to control more accurate.
Further, method described in the present embodiment also is included on laser or TEC thermistor is set, and two kinds of different methods to set up is arranged: thermistor is close to described laser; Perhaps, described thermistor is fixed on the temperature control face of described semiconductor cooler, and is close to described laser.
Thermistor is used for measuring the temperature of laser self, and control circuit is controlled TEC according to described temperature, so the setting of thermistor has guaranteed that temperature control is more accurate.
The invention also discloses a kind of temperature control equipment, be used for TO encapsulation type tunable diode laser, comprising:
Semiconductor cooler, arrange porosely on the temperature control face of described semiconductor cooler, the pin that described hole can hold described laser passes described semiconductor cooler and makes the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler;
Perhaps comprise:
Two or more semiconductor coolers, described semiconductor cooler is arranged at same plane, and reserve the space of the pin that can hold described laser between adjacent semiconductor cooler, the pin that described space can hold laser passes, so that described laser is provided with the temperature control face that the surface of pin fits in described two or more semiconductor coolers.
Described temperature control equipment is connected one of them TEC in use with control circuit, perhaps, different TEC is connected with a control circuit alone respectively, to realize the temperature control to laser.
Because described device can be combined with the surface label of laser with pin, so higher with its efficient of controlling laser temperature.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment that between each embodiment, same or similar part is mutually referring to getting final product.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the present invention.Multiple modification to these embodiment will be apparent concerning those skilled in the art, and General Principle as defined herein can be in the situation that do not break away from the spirit or scope of the present invention, realization in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (11)
1. a temperature-controlled process, be used for transistor outline TO encapsulation type tunable diode laser, it is characterized in that, comprising:
The hole of the pin can hold described laser is set on semiconductor cooler, described pin is passed described hole, make the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler;
Perhaps, two or more semiconductor coolers are arranged at same plane, and reserve the space of the pin that can hold described laser, the pin of described laser is passed described space, and the surface that makes described laser be provided with pin fits in the temperature control face of described two or more semiconductor coolers.
2. method according to claim 1, is characterized in that, the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
A plurality of holes are set on described semiconductor cooler, and described a plurality of holes a plurality of pins with described laser respectively are corresponding one by one.
3. method according to claim 1, is characterized in that, the described hole that the pin that can hold described laser is set on semiconductor cooler comprises:
A hole that can hold the whole pins of described laser is set on described semiconductor cooler.
4. according to claim 2 or 3 described methods, is characterized in that, described hole comprises:
Circular port or square opening.
5. method according to claim 1, is characterized in that, describedly two or more semiconductor coolers are arranged at same plane comprise:
Two semiconductor coolers are arranged at same plane in series or in parallel.
6. method according to claim 1, is characterized in that, describedly two or more semiconductor coolers are arranged at same plane comprise:
Three semiconductor coolers are arranged at same plane in a triangle.
7. method according to claim 1, is characterized in that, describedly two or more semiconductor coolers are arranged at same plane comprise:
Become matrix pattern to be arranged at same plane four semiconductor coolers.
8. according to claim 6 or 7 described methods, is characterized in that, the connected mode of described semiconductor cooler comprises:
Serial or parallel connection.
9. method according to claim 1, is characterized in that, also comprises:
Thermistor is close to described laser.
10. method according to claim 1, is characterized in that, also comprises:
Described thermistor is fixed on the temperature control face of described semiconductor cooler, and is close to described laser.
11. a temperature control equipment is used for transistor outline TO encapsulation type tunable diode laser, it is characterized in that, comprising:
Semiconductor cooler, arrange porosely on the temperature control face of described semiconductor cooler, the pin that described hole can hold described laser passes described semiconductor cooler and makes the surface that is provided with pin of described laser fit in the temperature control face of described semiconductor cooler;
Perhaps comprise:
Two or more semiconductor coolers, described semiconductor cooler is arranged at same plane, and reserve the space of the pin that can hold described laser between adjacent semiconductor cooler, the pin that described space can hold laser passes, so that described laser is provided with the temperature control face that the surface of pin fits in described two or more semiconductor coolers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103919940A CN103138151A (en) | 2011-11-30 | 2011-11-30 | Temperature control method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103919940A CN103138151A (en) | 2011-11-30 | 2011-11-30 | Temperature control method and device |
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| Publication Number | Publication Date |
|---|---|
| CN103138151A true CN103138151A (en) | 2013-06-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011103919940A Pending CN103138151A (en) | 2011-11-30 | 2011-11-30 | Temperature control method and device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223977A (en) * | 2015-09-15 | 2016-01-06 | 盐城工学院 | A kind of semiconductor laser temperature control device based on fuzzy control and control method |
| CN107505062A (en) * | 2017-08-21 | 2017-12-22 | 绵阳鑫阳知识产权运营有限公司 | The temperature sensor of anti-interference |
| CN109682365A (en) * | 2018-12-21 | 2019-04-26 | 上海航天控制技术研究所 | A kind of thermostat for oscillation gyro combination |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895884A (en) * | 1981-12-01 | 1983-06-07 | Canon Inc | Laser unit |
| JP2003188456A (en) * | 2001-12-19 | 2003-07-04 | Hitachi Ltd | Photoelectronic device |
| US20070014321A1 (en) * | 2005-07-15 | 2007-01-18 | Fuji Photo Film Co., Ltd. | Laser package and laser module |
-
2011
- 2011-11-30 CN CN2011103919940A patent/CN103138151A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5895884A (en) * | 1981-12-01 | 1983-06-07 | Canon Inc | Laser unit |
| JP2003188456A (en) * | 2001-12-19 | 2003-07-04 | Hitachi Ltd | Photoelectronic device |
| US20070014321A1 (en) * | 2005-07-15 | 2007-01-18 | Fuji Photo Film Co., Ltd. | Laser package and laser module |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105223977A (en) * | 2015-09-15 | 2016-01-06 | 盐城工学院 | A kind of semiconductor laser temperature control device based on fuzzy control and control method |
| CN105223977B (en) * | 2015-09-15 | 2017-09-26 | 盐城工学院 | A kind of control method of the semiconductor laser temperature control device based on fuzzy control |
| CN107505062A (en) * | 2017-08-21 | 2017-12-22 | 绵阳鑫阳知识产权运营有限公司 | The temperature sensor of anti-interference |
| CN109682365A (en) * | 2018-12-21 | 2019-04-26 | 上海航天控制技术研究所 | A kind of thermostat for oscillation gyro combination |
| CN109682365B (en) * | 2018-12-21 | 2021-06-08 | 上海航天控制技术研究所 | Constant temperature tank for vibrating gyroscope combination |
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Application publication date: 20130605 |