CN103127608A - Manufacturing method of inner body injecting and molding type electronic device - Google Patents
Manufacturing method of inner body injecting and molding type electronic device Download PDFInfo
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- CN103127608A CN103127608A CN 201310022485 CN201310022485A CN103127608A CN 103127608 A CN103127608 A CN 103127608A CN 201310022485 CN201310022485 CN 201310022485 CN 201310022485 A CN201310022485 A CN 201310022485A CN 103127608 A CN103127608 A CN 103127608A
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Abstract
Provided is a manufacturing method of an inner body injecting and molding type electronic device. The molding type electronic device comprises a specific packaging area which is formed by using packaging materials to inject in a body in a solidification mode, and an electronic device element which is formed by injecting conductive metal ink, semi-conductive ink, insulation type ink, a micro scale component and a power supply form one or a plurality of electronic devices which include package and possess different shapes and different functions by controlling the injection speed and displacement of an injector. The manufacturing method of the inner body injecting and molding type electronic device has the advantages of being capable of supplementing a technical vacuum which an electronic component is directly established in a flexible object, possessing great portability, and low in cost. More importantly, a flexible and shape-applicable characteristic is possessed in softness substance, so that the inner body injecting and molding type electronic device has good application prospect, in the meantime, and development of mature of the manufacturing method of the inner body injecting and molding type electronic device can further propel improvement of an inserting type electronic technology.
Description
Technical field
The present invention relates to the Endermic implantating electronic technology field, be specifically related to be injected in a kind of body the manufacture method of pattern electronic installation.
Background technology
The development of electronic technology brings rapidly change to the modern life with reaching its maturity, convenient, as to have become fast New Times synonym, and the Internet of Things that particularly progressively rises will bring communication more easily.Important electronic installation in building as Internet of Things, RFID(radio frequency identification) can realize real-time target item is identified read-write.For the characteristic of institute's identifying object, academia and industrial quarters have developed the electronic devices such as RFID target labels (responder) of pattern and Various Functions.Wherein, Endermic implantating RFID is widely used in the management of domestic animal in animal husbandry.Yet the conditional electronic manufacture method of RFID still adopts production program from bottom to top, and the RFID electronic tag after molding carries out implant surgery to domestic animal again by encapsulation just can be realized using.Such exploration and application scheme has increased manufacturing cost on the one hand, in organism, encapsulation and implant surgery also make operation become complicated when increasing cost on the other hand, and the skin incision that usually adopts brings larger misery and risk to biological object, is unfavorable for the application extension of technique.
In addition, implantable medical device in recent years, maturation as continuous in technology such as brain pacemaker, cardiac pacemakers is benefited vast apoplexy, cardiovascular disease and diabetics.But the sky high cost that its complicated processing technology produces also makes the unable burden of a lot of patients.Particularly, the implantable medical device use procedure is loaded down with trivial details, loss is large, and general patient all needs to complete the process of the series of complexes such as operation is operated on, equipment implantation, opening stitching.Bring physical distress and stress to the patient so on the one hand, wound also easily causes large infection risk, and operation and equipment operation support (as electrical source consumption) etc. bring pressure on material to the patient again virtually on the other hand.
Therefore, if can realize electronic installation preparation method in a kind of conveniently body, will greatly advance the progress of implanted electronic technology, the invention provides the electronic device of direct injection molding.In this body, concept and the technology of injection moulding direct construction electronic device never see document and patent.
Summary of the invention
In order to overcome the shortcoming of above-mentioned prior art, the object of the present invention is to provide the manufacture method that is injected into the pattern electronic installation in a kind of body, have great portability and low cost.
In order to achieve the above object, the technical scheme taked of the present invention is:
Be injected into the manufacture method of pattern electronic installation in a kind of body, comprise the following steps: first make fluid encapsulation material 1 form in vivo the local zone 3 that makes, then conductive metal ink 2, semiconductive ink, insulated type ink, miniature scale device and power supply are injected into local the making in zone 3, by controlling injection speed and the displacement of syringe, form the electronic installation with shape and Various Functions 4 that one or more contain encapsulation, injection speed is 0.1mm/s ~ 5mm/s, and each displacement is 0.1mm ~ 5mm; Injecting apparatus adopts single cavity injection cast injecting apparatus, or adopts 2 ~ 10 layers of cavity injection cast injecting apparatus of concentric tubes.
Described encapsulating material 1 adopts silicone rubber, hydrogel, collagen, PEG(Polyethylene Glycol) or gelatin, be easy to inject and have the curing molding material of good insulation characteristic, its meet water or be heated after be easy to curing molding, can control easily the parameters such as shaping speed and shape thus.
Described encapsulating material 1 injects in subject in biomedical applications, choose have better biocompatibility, mTG enzyme modification gelatin nontoxic and controlled molding in vivo; Or use the Alginate(alginate), the GaCO3(calcium carbonate) with the GDL(gluconic acid lactone) composite material.
Described conductive metal ink 2 adopts and is easy at ambient temperature inject and controlled liquid metal or alloy material, comprises gallium, gallium indium or gallium-indium-tin alloy.
Described semiconductive ink is to be mixed with the P type of 0wt%～90wt% mass percent or Organic substance or the polymer of N-type nano semiconductor material granule, Organic substance comprises rubrene rubrene, Benzo[b pentacene, polymer comprises poly-3-hexyl thiophene P3HT, gathers 3, and 3 '-dialkyl group connects four thiophene PQT, poly-3 arylamine PTAA, ladder polymer BBL or non-ladder polymer BBB.
Described insulated type ink is Organic substance or polymer, comprises polystyrene, polyimides, polyvinyl alcohol, polymethyl methacrylate or polyvinyl phenol.
Number, shape and the size in described encapsulating material zone 3 are according to needs, by once or once realizing, or injection realizes to adopt syringe more than one piece never to exist together simultaneously, controls injector to inject speed and displacement formation ellipsoid, cylinder, cube or their combination during injection.
Described packaging area 3 can also adopt conductive material to mix as this electronic installation output electrical signals conduction interfaces 6 in vivo with selected encapsulating material 1 at regional area according to demand, and conductive material comprises Nanometer Copper, iron material.
The function of described electronic installation 4 realizes that element is according to demand, realize by above injection once or once, or adopt injecting apparatus shot molding more than one piece, control the injection speed of injecting apparatus and displacement during injection and form cylindric, strip, netted, helical form or their combination.
The function of described electronic installation 4 is according to demand, by once or once above injection, or adopts the injecting apparatus more than a piece once to inject miniature scale device and power supply, forms specific functional units.
Described electronic installation 4 is the electronic components with encapsulating structure, and electronic component can be made as electric stimulation electrode or RFID radio-frequency antenna according to the functional requirement molding.
The pattern method for making electronic device that is injected into proposed by the invention, filled up the technological gap of direct construction electronic device in flexible article, have great portability and low cost, the more important thing is possess flexibility in the flexible material subject, suitable shape feature, have a good application prospect, the full-fledged of present technique also will greatly advance the progress of implanted electronic technology simultaneously.
Description of drawings
Fig. 1 is injected into pattern RFID antenna assembly schematic diagram in body.
Fig. 2 is injected into pattern electric stimulation electrode device (bipolar electrode in body) schematic diagram in body.
Fig. 3 is injected into pattern electric stimulation electrode device (single electrode in body) schematic diagram in body.
Fig. 4 is 2 layers of cavity injection cast injecting apparatus schematic diagram of concentric tubes.
Fig. 5 is many pieces of injecting apparatus (2 ~ 10 layers of cavity injection cast injecting apparatus of single cavity or concentric tubes) one-shot forming operation charts.
The specific embodiment
The present invention will be described in more detail below in conjunction with drawings and Examples.
Embodiment 1:
As shown in Figure 1, the present embodiment is described with the example that is made as of RFID antenna assembly in object.
1, choose the encapsulating material 1 that surpasses 10min in body hardening time, described encapsulating material 1 is silicone rubber.
2, choose single cavity cast injecting apparatus suction 5ml encapsulating material 1 that diameter is 25mm, at first injection needle is inserted, the degree of depth is about 50mm; Then carry out that injection needle withdraws from and push away with identical speed along exit path according to the speed of 5mm/s putting encapsulating material 1, encapsulating material 1 is understood progressively curing molding at chance water or after after being heated, can regulate and control as required corresponding process, withdraw to stop pushing away when displacement is about 30mm at injection needle and put and withdraw from;
3,5mm is departed from translation needle injection position on horizontal level at every turn; Then repetitive process 2, finally form 80mm * 30mm * 5mm packaging area 3;
4, before encapsulation material solidifies, choosing diameter is single cavity cast injecting apparatus suction 5ml conducting metal ink 2 of 25mm, inserts syringe needle along vertical-path, and the degree of depth is about 45mm; Then carry out that injection needle withdraws from and push away with identical speed along exit path according to the speed of 5mm/s putting conducting metal ink 2; Withdraw to stop pushing away when displacement is about 20mm at injection needle and put and withdraw from; Described conducting metal ink 2 is gallium, gallium indium or gallium-indium-tin alloy.
5, utilize the single cavity cast injecting apparatus in process 4 to suck 2ml conducting metal ink 2, the needle position that level slightly departs from process 4 inserts, and the degree of depth is 45mm; Then carry out that injection needle moves horizontally and push away with identical speed along this path according to the speed of 5mm/s putting conducting metal ink 2, horizontal displacement is about 10mm and stops pushing away and put and withdraw from syringe needle;
6, use single cavity cast injecting apparatus to suck 5ml conducting metal ink 2, with injection needle on position horizontal translation 10mm, repetitive process 4;
7, use single cavity cast injecting apparatus to suck 2ml conducting metal ink 2, the needle position that level slightly departs from process 6 inserts, and the degree of depth is 25mm; Then carry out that injection needle moves horizontally and push away with identical speed along this path according to the speed of 5mm/s putting conduction technology ink 2, horizontal displacement is about 10mm and stops pushing away and put and withdraw from syringe needle;
8, order repetitive process 4,5,6 and 7 waits for that encapsulating material solidifies fully, includes the snakelike RFID antenna assembly 4 of packaging area 3 with regard to the reliable body of realizability energy.
As shown in Figure 2, the present embodiment is described with the example that is made as of electricity irritation application electrode in organism.
1, choosing diameter is that the single cavity cast injecting apparatus of 15mm sucks the encapsulating material that 1ml is mixed with conducting nano copper or Nanoscale Iron, at first injection needle is inserted, and the degree of depth is about 50mm; Then push away and put encapsulating material, form as electronic installation output electrical signals conduction interfaces 6 in vivo; Described encapsulating material 1 is silicone rubber; In the hybrid package material, conducting nano copper or nanometer iron content are 1 ~ 5mg/ml;
2, choose single cavity cast injecting apparatus suction 5ml encapsulating material 1 that diameter is 25mm, at first injection needle is inserted, the degree of depth is about 50mm; Then carry out that injection needle withdraws from and push away with identical speed along exit path according to the speed of 5mm/s putting encapsulating material, forming radius is about 5mm, highly is about 50mm cylindrical encapsulation zone 5;
3, before encapsulation material solidifies, choosing diameter is single cavity cast injecting apparatus suction 3ml conducting metal ink 2 of 25mm, inserts syringe needle along vertical-path, and the degree of depth is about 50mm; Then carry out that injection needle withdraws from and push away with identical speed along exit path according to the speed of 5mm/s putting encapsulating material, realize that the molding of signal of telecommunication input electrode 7 is made;
4, repetitive process 2 and process 3 can realize the molding making of electrode 8;
5, wait for that encapsulating material solidifies fully, can reliable internal electrode device with regard to realizability.
Be different from embodiment 2, in the present embodiment, the making of electrode is directly to inject at body surface the encapsulating material 1 that is about 2ml, then injects the conducting metal ink 2 of 1ml in packaging area, forms the electrode of point-like or strip, as shown in Figure 3.
Be different from embodiment 3, in the present embodiment, the making of electronic device is directly to inject at body surface the encapsulating material 1 that is about 2ml, then inject the conducting metal ink 2 of 1ml in packaging area 3, form the electrode of point-like or strip, inject afterwards P type and N-type semiconductor ink 21 each 1ml, then inject again the conducting metal ink 2 of 1ml, at last in above-mentioned material periphery injection insulation inks, described insulation inks is polyvinyl alcohol, form thus semiconductor device such as LED etc., can light LED when importing electric current by electrode.More complicated electronic device is progressively molding of technology according to this also.Whole process all adopts minimum wound to complete, and is less on the impact of implanting object.
Be different from embodiment 1 ~ 4, in the present embodiment, the injecting apparatus that adopts is the two-layer cavity injection of concentric tubes cast injecting apparatus.As shown in Figure 4, the outer cavity of concentric tubes is contained is encapsulating material 1, and the internal layer cavity is contained is conducting metal ink 2.It is advantageous that and with encapsulating material 1 and 2 injection moulding of electrical conductor material, when greatly saving manufacturing time, also to facilitate for the curing of encapsulating material.
Moreover, adopting 2 layers of cavity injection cast injecting apparatus of concentric tubes, outer cavity injects conducting metal ink 2, and the internal layer cavity is insulation inks 22, also can realize the making of direct injection formation type electric capacity.Further expanded the function that this method realizes electronic installation.
Be different from embodiment 5, use 2 ~ 10 layers of cavity injection cast injecting apparatus of many pieces of single cavitys or concentric tubes to carry out shot forming operation in the present embodiment, as shown in Figure 5.Conduction interfaces 6 material injections at the described electronic installation output electrical signals of embodiment 2 finish, and can use simultaneously the shot of two pieces of two-layer cavity injection cast injecting apparatus to realize the making of electric stimulation electrode, greatly save Production Time, raise the efficiency.
In addition, in the manufacturing process of RFID, many pieces of two-layer cavitys are injected the cast injecting apparatus only needs a vertical-path injection and a horizontal route injection can complete RFID antenna molding making.
Be different from embodiment 1 ~ 6, the miniature scale device of injecting in the present embodiment and power supply can be diameter at electronic device (copper constantan sensor as thread in thermocouple) and the thread power supply (as the cast lithium ion battery) of 10nm-5mm yardstick, inject by one or many, or many pieces of injecting apparatus once inject and molding, form thus the unit of specific function.
Claims (10)
1. be injected into the manufacture method of pattern electronic installation in a body, it is characterized in that, comprise the following steps: first make fluid encapsulation material (1) form in vivo the local zone (3) that makes, then with conductive metal ink (2), the semiconductive ink, the insulated type ink, miniature scale device and power supply are injected into local the making in zone (3), by controlling injection speed and the displacement of syringe, form the electronic installation with shape and Various Functions (4) that one or more contain encapsulation, injection speed is 0.1mm/s ~ 5mm/s, each displacement is 0.1mm ~ 5mm, injecting apparatus adopts single cavity injection cast injecting apparatus, or adopts 2 ~ 10 layers of cavity injection cast injecting apparatus of concentric tubes.
2. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described encapsulating material (1) adopts silicone rubber, hydrogel, collagen, PEG(Polyethylene Glycol) or gelatin, be easy to inject and have the curing molding material of good insulation characteristic, its meet water or be heated after be easy to curing molding.
3. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described conductive metal ink (2) adopts and is easy at ambient temperature inject and controlled liquid metal or alloy material, comprises gallium, gallium indium or gallium-indium-tin alloy.
4. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described semiconductive ink is to be mixed with the P type of 0wt%～90wt% mass percent or Organic substance or the polymer of N-type nano semiconductor material granule, Organic substance comprises rubrene rubrene, Benzo[b pentacene, polymer comprises poly-3-hexyl thiophene P3HT, gathers 3, and 3 '-dialkyl group connects four thiophene PQT, poly-3 arylamine PTAA, ladder polymer BBL, non-ladder polymer BBB.
5. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described insulated type ink is Organic substance or polymer, comprises polystyrene, polyimides, polyvinyl alcohol, polymethyl methacrylate or polyvinyl phenol.
6. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: number, shape and the size in described encapsulating material zone (3) are according to needs, by once or once realizing, or injection realizes to adopt syringe more than one piece never to exist together simultaneously, controls injector to inject speed and displacement formation ellipsoid, cylinder, cube or their combination during injection.
7. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described electronic installation (4) is according to appellative function, realize by above injection once or once, or adopt injecting apparatus shot molding more than one piece, control the injection speed of injecting apparatus and displacement during injection and form cylindric, strip, netted, helical form or their combination.
8. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: the function of described electronic installation (4) is according to demand, by once or once injecting, or adopt the injecting apparatus more than a piece once to inject miniature scale device and power supply, form specific functional units.
9. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described packaging area (3) according to demand, can also adopt conductive material to mix with selected encapsulating material (1) as this electronic installation output electrical signals conduction interfaces (6) in vivo at regional area, conductive material comprises Nanometer Copper, iron material.
10. be injected into the manufacture method of pattern electronic installation in a kind of body according to claim 1, it is characterized in that: described encapsulating material (1) injects in subject in biomedical applications, choose have good biocompatibility, mTG enzyme modification gelatin nontoxic and controlled molding in vivo; Or use the Alginate(alginate), the GaCO3(calcium carbonate) with the GDL(gluconic acid lactone) composite material.
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| CN 201310022485 CN103127608A (en) | 2013-01-22 | 2013-01-22 | Manufacturing method of inner body injecting and molding type electronic device |
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| CN103315945A (en) * | 2013-06-21 | 2013-09-25 | 清华大学 | Vascular embolic agent as well as injection device and application thereof |
| CN103432624A (en) * | 2013-08-13 | 2013-12-11 | 清华大学 | Injectable liquid metal bone cement, preparation method of injectable liquid metal bone cement and special injection device for injectable liquid metal bone cement |
| CN104425207A (en) * | 2013-08-20 | 2015-03-18 | 中国科学院理化技术研究所 | Multiple-tube-core electronic direct-writing ballpoint pen |
| CN105920724A (en) * | 2016-05-23 | 2016-09-07 | 云南科威液态金属谷研发有限公司 | Device adopting intraperitoneal perfusion of liquid metal and electrochemotherapy |
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| CN107803504A (en) * | 2016-09-09 | 2018-03-16 | 北京梦之墨科技有限公司 | A kind of suspension printing-forming method of liquid metal three-dimensional macro structure |
| CN110114416A (en) * | 2016-12-30 | 2019-08-09 | 伊西康公司 | At ambient temperature can Quick cross-linking silicon composition and its preparation and application |
| CN110611155A (en) * | 2018-06-15 | 2019-12-24 | 北京梦之墨科技有限公司 | Rapid antenna deployment method and narrow-band antenna |
| CN111069606A (en) * | 2019-12-06 | 2020-04-28 | 北京航空航天大学 | Continuous forming method of low-melting-point metal |
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| CN103315945A (en) * | 2013-06-21 | 2013-09-25 | 清华大学 | Vascular embolic agent as well as injection device and application thereof |
| CN103432624A (en) * | 2013-08-13 | 2013-12-11 | 清华大学 | Injectable liquid metal bone cement, preparation method of injectable liquid metal bone cement and special injection device for injectable liquid metal bone cement |
| CN103432624B (en) * | 2013-08-13 | 2014-11-26 | 清华大学 | Injectable liquid metal bone cement, preparation method of injectable liquid metal bone cement and special injection device for injectable liquid metal bone cement |
| CN104425207A (en) * | 2013-08-20 | 2015-03-18 | 中国科学院理化技术研究所 | Multiple-tube-core electronic direct-writing ballpoint pen |
| CN105920724B (en) * | 2016-05-23 | 2019-02-26 | 云南科威液态金属谷研发有限公司 | A kind of device of liquid metal intraperitoneal perfusion and electrochemotherapy |
| CN105920724A (en) * | 2016-05-23 | 2016-09-07 | 云南科威液态金属谷研发有限公司 | Device adopting intraperitoneal perfusion of liquid metal and electrochemotherapy |
| CN107803504A (en) * | 2016-09-09 | 2018-03-16 | 北京梦之墨科技有限公司 | A kind of suspension printing-forming method of liquid metal three-dimensional macro structure |
| CN107803504B (en) * | 2016-09-09 | 2018-10-16 | 北京梦之墨科技有限公司 | A kind of suspension printing-forming method of liquid metal three-dimensional macro structure |
| US11161937B2 (en) | 2016-12-30 | 2021-11-02 | Ethicon, Inc. | Silicone compositions rapidly cross-linkable at ambient temperatures and methods of making and using same |
| CN110114416A (en) * | 2016-12-30 | 2019-08-09 | 伊西康公司 | At ambient temperature can Quick cross-linking silicon composition and its preparation and application |
| US11667756B2 (en) | 2016-12-30 | 2023-06-06 | Ethicon, Inc. | Silicone compositions rapidly cross-linkable at ambient temperatures and methods of making and using same |
| US11628059B2 (en) | 2016-12-30 | 2023-04-18 | Ethicon, Inc. | Silicone foam compositions rapidly cross-linkable at ambient temperatures and methods of making and using same |
| CN110114416B (en) * | 2016-12-30 | 2022-04-29 | 伊西康公司 | Silicone composition that crosslinks quickly at ambient temperature and methods of making and using same |
| US11160648B2 (en) | 2016-12-30 | 2021-11-02 | Ethicon, Inc. | Silicone foam compositions rapidly cross-linkable at ambient temperatures and methods of making and using same |
| CN107329928A (en) * | 2017-06-15 | 2017-11-07 | 清华大学 | A kind of liquid metal computer |
| CN107329928B (en) * | 2017-06-15 | 2020-08-04 | 清华大学 | Liquid metal computer |
| CN110611155A (en) * | 2018-06-15 | 2019-12-24 | 北京梦之墨科技有限公司 | Rapid antenna deployment method and narrow-band antenna |
| CN111069606B (en) * | 2019-12-06 | 2022-02-22 | 北京航空航天大学 | Continuous forming method of low-melting-point metal |
| CN111069606A (en) * | 2019-12-06 | 2020-04-28 | 北京航空航天大学 | Continuous forming method of low-melting-point metal |
| CN111198052A (en) * | 2020-01-14 | 2020-05-26 | 清华大学 | Deformable liquid sensor |
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Application publication date: 20130605 |