CN103118487A - 超高导热金属基线路板及其制备方法 - Google Patents
超高导热金属基线路板及其制备方法 Download PDFInfo
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- CN103118487A CN103118487A CN2013100313270A CN201310031327A CN103118487A CN 103118487 A CN103118487 A CN 103118487A CN 2013100313270 A CN2013100313270 A CN 2013100313270A CN 201310031327 A CN201310031327 A CN 201310031327A CN 103118487 A CN103118487 A CN 103118487A
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Images
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- Laminated Bodies (AREA)
Abstract
Description
1 | 电子元器件 | 2 | 表面处理层 | 3 | 导电线路层 |
4 | 复合导热绝缘层缺陷 | 5 | 复合导热绝缘层 | 6 | 基材层 |
Claims (9)
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CN201310031327.0A CN103118487B (zh) | 2013-01-28 | 2013-01-28 | 超高导热金属基线路板及其制备方法 |
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CN201310031327.0A CN103118487B (zh) | 2013-01-28 | 2013-01-28 | 超高导热金属基线路板及其制备方法 |
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CN103118487A true CN103118487A (zh) | 2013-05-22 |
CN103118487B CN103118487B (zh) | 2016-02-17 |
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105101682A (zh) * | 2014-05-22 | 2015-11-25 | 严敏 | 一种物理气相淀积制备复合led积层无机电路板的方法 |
CN105246244A (zh) * | 2014-06-05 | 2016-01-13 | 英飞凌科技股份有限公司 | 印刷电路板及制造其的方法 |
CN105611717A (zh) * | 2016-01-22 | 2016-05-25 | 江西宝盛半导体能源科技有限公司 | 一种超高导热的金属基线路板及其制备方法 |
CN107761060A (zh) * | 2017-09-27 | 2018-03-06 | 南京工业大学 | 电池用金属极板表面耐蚀导电复合涂层、电池用金属极板及其制备方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1614770A (zh) * | 2003-11-04 | 2005-05-11 | 技嘉科技股份有限公司 | 高散热性的芯片模块及其基板 |
US20090323300A1 (en) * | 2006-04-25 | 2009-12-31 | Daisuke Fujimoto | Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board |
CN101916731A (zh) * | 2010-07-12 | 2010-12-15 | 深圳大学 | 一种陶瓷绝缘膜导热基板及其制作方法 |
CN202307889U (zh) * | 2011-10-25 | 2012-07-04 | 深圳市立洋光电子有限公司 | 一种大功率led集成封装结构 |
CN203167426U (zh) * | 2013-01-28 | 2013-08-28 | 苏州热驰光电科技有限公司 | 超高导热金属基线路板 |
-
2013
- 2013-01-28 CN CN201310031327.0A patent/CN103118487B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1614770A (zh) * | 2003-11-04 | 2005-05-11 | 技嘉科技股份有限公司 | 高散热性的芯片模块及其基板 |
US20090323300A1 (en) * | 2006-04-25 | 2009-12-31 | Daisuke Fujimoto | Conductor Foil with Adhesive Layer, Conductor-Clad Laminate, Printed Wiring Board and Multilayer Wiring Board |
CN101916731A (zh) * | 2010-07-12 | 2010-12-15 | 深圳大学 | 一种陶瓷绝缘膜导热基板及其制作方法 |
CN202307889U (zh) * | 2011-10-25 | 2012-07-04 | 深圳市立洋光电子有限公司 | 一种大功率led集成封装结构 |
CN203167426U (zh) * | 2013-01-28 | 2013-08-28 | 苏州热驰光电科技有限公司 | 超高导热金属基线路板 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105101682A (zh) * | 2014-05-22 | 2015-11-25 | 严敏 | 一种物理气相淀积制备复合led积层无机电路板的方法 |
CN105101682B (zh) * | 2014-05-22 | 2018-02-23 | 环视先进数字显示无锡有限公司 | 一种物理气相淀积制备复合led积层无机电路板的方法 |
CN105246244A (zh) * | 2014-06-05 | 2016-01-13 | 英飞凌科技股份有限公司 | 印刷电路板及制造其的方法 |
US9986636B2 (en) | 2014-06-05 | 2018-05-29 | Infineon Technologies Ag | Printed circuit boards having a dielectric layer which includes a polymer and methods of manufacturing such printed circuit boards |
CN105611717A (zh) * | 2016-01-22 | 2016-05-25 | 江西宝盛半导体能源科技有限公司 | 一种超高导热的金属基线路板及其制备方法 |
CN105611717B (zh) * | 2016-01-22 | 2019-01-22 | 江西宝盛半导体能源科技有限公司 | 一种超高导热的金属基线路板及其制备方法 |
CN107761060A (zh) * | 2017-09-27 | 2018-03-06 | 南京工业大学 | 电池用金属极板表面耐蚀导电复合涂层、电池用金属极板及其制备方法 |
CN107761060B (zh) * | 2017-09-27 | 2020-05-19 | 南京工业大学 | 电池用金属极板表面耐蚀导电复合涂层、电池用金属极板及其制备方法 |
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Effective date of registration: 20230717 Address after: 28 Yudao Street, Qinhuai District, Nanjing, Jiangsu Province, 210016 Patentee after: Nanjing Andy Industrial Technology Co.,Ltd. Address before: 215122 Plant 1, No.1 Kezhi Road, Weiting Town, Suzhou Industrial Park, Suzhou City, Jiangsu Province Patentee before: SUZHOU RECI OPTOELECTRONICS TECHNOLOGY Co.,Ltd. |