CN103117440A - Low-loss flat transmission line - Google Patents
Low-loss flat transmission line Download PDFInfo
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- CN103117440A CN103117440A CN2013100495476A CN201310049547A CN103117440A CN 103117440 A CN103117440 A CN 103117440A CN 2013100495476 A CN2013100495476 A CN 2013100495476A CN 201310049547 A CN201310049547 A CN 201310049547A CN 103117440 A CN103117440 A CN 103117440A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
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Abstract
A low-loss flat transmission line comprises a plurality of solder mask layers, a plurality of bonding layers, a plurality of dielectric layers and a plurality of connecting layers, wherein the solder mask layers are used for preventing oxidization of a metal area and contact of a shielded transmission line structure and a peripheral good conductor, the bonding layers are used for physical vertical bonding, and the dielectric layers are used for an energy transmission area. A first signal pad and a first gap surrounding the first signal pad are arranged on at least one end of the first connecting layer, at least one signal line via hole is arranged on the first signal pad, a signal transition area and a plurality of gaps on the signal transition area are arranged on at least one end of the second connecting layer, a second signal pad and a second gap surrounding the second signal pad are arranged on at least one end of the third connecting layer, the signal line via holes of the first connecting layer are communicated with signals of the first signal pad, the second signal pad and the signal transition area, and the signal transition area is connected with signal lines. By the aid of the connecting structure, L1 and C1 are optimized, the influence of discontinuity is greatly reduced, and insertion loss of the transmission line structure is furthest reduced.
Description
Technical field
The present invention relates to a communication antenna, relate in particular to the relevant flat transmission line of low-loss of a kind of communication antenna.
Background technology
Antenna is a kind of device that utilizes frequency characteristic to receive and transmit.In recent years, be used for design and the performance of the mobile terminal antenna of radio communication, more and more affect the developing direction of mobile communication.Particularly portable mobile termianl such as mobile phone, PDA(Personal Digital Assistance), MP3/MP4.Several leading indicators of Antenna Design are: suitable multifrequency resonance is arranged, antenna realize that signal is propagated and energy emission all based on the resonance of certain frequency.If antenna can resonance in a plurality of frequencies, antenna can be in a plurality of frequency work so.
In recent years, more and more wireless terminals adopt the structural design of low section.The thickness that is to say terminal is more and more less, and " thin " is the target that a lot of mobile phones are pursued.In order to reach this target, a lot of mobile phones have adopted the pcb board design of discrete, namely adopt two pcb boards to lay respectively at the two ends of mobile phone, can refer to wherein one with mainboard, the above has radio-frequency module usually, and platelet refers to other one, and the above has some simple connections and match circuit.Platelet top is antenna normally.The very thin coaxial line of diameter connects platelet and mainboard, is used for radiofrequency signal is directed on platelet from mainboard.The diameter of coaxial line is less, and the loss on unit length is larger.But, because the space integrated level of mobile phone is more and more higher, require to use the coaxial line of minor diameter as far as possible.This is just in time contradiction with reducing loss.How in the situation that do not increase loss, reduce as much as possible this section coaxial line shared space, be the challenge that we face.In recent years, realize that with microstrip line transmission line is a possible selection.The shielding of signal has problem for the semi-open structure of signal but microstrip line is one, easily produces the interference of signal.The transmission line of realizing with strip lines configuration is a good selection.Holding wire is positioned at the centre on two-layer ground, and signal has obtained good shielding, is not easy to produce to disturb.On the other hand, for the stability of radio-frequency performance and manufacturing, the width of holding wire generally is not less than 0.1 millimeter.This just has certain requirement to the thickness of strip line.And connection radio frequency connector and strip line need to design via hole, and the common via hole here is the blind hole that connects holding wire and surface conductor, and namely via hole just passes the thickness of part strip line.The thickness of strip line is thicker, and the making of blind hole is more difficult, can have a strong impact on the yield of product.There is certain restriction in manufacturing of blind hole, supposes that R is the radius of blind hole, and h is the height of blind hole, and R/h must meet some requirements so, and in order to reach reliable and stable conducting, R/h must be greater than 0.9.But because R can not be large arbitrarily, for example be subjected to the restriction of dimensional space.So at this time, h is necessary can not be too large, that is to say, the height in hole is that certain restriction is arranged, and for example h is no more than 50 microns.And the making in hole need to be used laser machine, and cost is high.Simultaneously, due to SMT(Surface Mounted Technology) connector be connected to the two ends of transmission line, although the connector of SMT is the impedance of 50 ohm, the characteristic impedance of transmission line is also 50 ohm, still at the position of connector connection transmission line, structural discontinuity is arranged, thereby cause characteristic impedance to depart from 50 ohm.This phenomenon is at high band, and for example the above performance of 3Ghz is particularly evident, thereby the insertion loss that causes transmission line is in the high band deterioration that becomes.
That is to say, connector connects the discontinuity at transmission line position, the defective generation that characteristic impedance departs from 50 ohm occurs.
Summary of the invention
The object of the present invention is to provide the flat transmission line of a kind of low-loss, especially can be applicable to high band, to solve the discontinuity at connector connection transmission line position in prior art, the defective that characteristic impedance departs from 50 ohm occurs and occur, thus the technical problem that causes the insertion loss of transmission line to become and worsen at high band.The flat transmission line of a kind of low-loss, comprise be used to prevent some solder masks that metallic region oxidation and strip line structure contact with good conductor on every side, be used to up and down adhesive effect physically some adhesive linkages, be used for some dielectric layers, some articulamentums in Energy Transfer zone, described articulamentum comprises the first articulamentum, the second articulamentum and the 3rd articulamentum at least, wherein
On at least one end of the first articulamentum signalization island one and around the signal island the first gap of one, and on signal island one, holding wire via hole at least is set, described signal island one and the first gap are used for regulating the first capacitance characteristic of transmission line,
Signalization transitional region and some gaps of arranging on the signal transition zone at least one end of the second articulamentum, and on the regional correspondence position of signal transition, corresponding holding wire via hole is set, described signal transition zone and some gaps thereof are used for regulating the inductance characteristic of transmission line
On at least one end of the 3rd articulamentum signalization island two and around the signal island the second gap of two, and on two correspondence positions of signal island, corresponding holding wire via hole is set, signal island two and the second gap are used for regulating the first capacitance characteristic of transmission line,
The holding wire via hole of the first articulamentum is the signal in messenger island one, signal island two and signal transition zone repeatedly, and the signal transition zone is connected with holding wire.
Preferably, on the signal transition zone, three gaps are set: the 3rd gap, Fpir Crevices gap and the 5th gap, the inductance characteristic of transmission line is regulated in the 3rd gap, Fpir Crevices gap and the 5th gap.
Preferably, the 3rd gap, Fpir Crevices gap and the 5th gap are arranged side by side respectively, and the gap opening in the 3rd gap and the 5th gap in the same way, and is opposite with the gap opening of Fpir Crevices gap, and the Fpir Crevices gap is between the 3rd gap and the 5th gap.
Preferably, annular can be around the signal island two be arranged in the second gap, perhaps can be around the signal island two be arranged to the semi-surrounding type, and annular can be around the signal island one be arranged in the first gap, perhaps can be around the signal island one be arranged to the semi-surrounding type.
Preferably, the shape of the shape of signal island two and the second gap formation and signal island one and the first gap formation is unanimous on the whole.
Preferably, some solder masks comprise top layer and bottom, top layer comprises the non-conductive zone of strip line structure, and some connecting sewings for connector welded disc position are set on non-conductive zone, and one of them connecting sewing physically connects connector holding wire conductor.
Preferably, some serial via holes and periodicity via hole also are set on the first articulamentum, and serial via hole and serial via hole can be symmetrical up and down about center line, and serial via hole can be parallel with center line, and mirror image is to the center line opposite side, and the described repetition period is the center spacing between via hole.
Preferably, adhesive linkage is two layers, and one is positioned at the below of top layer, its two top that is positioned at bottom.
Preferably, dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.
Preferably, connector is 50 ohm of joints.
Compared with prior art, the present invention has following technological merit:
The transmission line theory of reportedly uniting, with periodicity L0, C0 directly is connected with 50 ohm of connectors, and the discontinuity of introducing in the loss of high frequency is very large.Introduce syndeton of the present invention, optimize L1, C1 reduces the impact of discontinuity greatly, reduces to greatest extent the insertion loss of transmission line structure.Fact proved, adopt transmission line structure that this mode processes, reduced 5dB in the return loss of 6GHz, reduced by 20 percent at the 6GHz insertion loss than open product.
Description of drawings
Fig. 1 is an embodiment assembly drawing of the flat transmission line of low-loss of the present invention;
Fig. 2 is the top layer one exemplifying embodiment figure of the flat transmission line of low-loss of the present invention;
Fig. 3 is the exemplifying embodiment figure of the present invention's the first articulamentum;
Fig. 4 is the exemplifying embodiment figure of the present invention's the second articulamentum;
Fig. 5 is the exemplifying embodiment figure of the present invention's the 3rd articulamentum;
Fig. 6 is the exemplifying embodiment figure of bottom of the present invention;
Fig. 7 is the distributed equivalent inductance of holding wire of syndeton of the present invention and the equivalent electric circuit connection layout of electric capacity.
Embodiment
Below in conjunction with accompanying drawing, illustrate the present invention.
See also Fig. 1 to Fig. 6, the flat transmission line of a kind of low-loss, comprise be used to prevent some solder masks that metallic region oxidation and strip line structure contact with good conductor on every side, be used to up and down adhesive effect physically some adhesive linkages, be used for some dielectric layers and some articulamentums in Energy Transfer zone.
Some solder masks comprise top layer 11 and bottom 19.Top layer 11 and bottom 19 are solder mask, and it prevents the metallic region oxidation, and the strip line structure contacts with good conductor on every side.
Adhesive linkage is two layers, and one is positioned at the below of top layer, its two top that is positioned at bottom.Be that intermediate layer 12 and intermediate layer 18 are adhesive linkage, Main Function is adhesive effect up and down physically.Intermediate layer 12 and intermediate layer 18 have certain thickness, and according to the difference of adhesives characteristic, the transmission characteristic of the whole transmission line structure of the corresponding impact of meeting for reaching optimum transmission performance, reduces loss, and syndeton and holding wire need to be done optimization process.
Dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.Dielectric layer is the Energy Transfer zone.The characteristic parameter of dielectric layer material such as thickness are great on whole transmission line structure impact with relative dielectric loss, and the dielectric material of less loss is the first-selection that commercial Application is produced.Intermediate layer 14 and intermediate layer 16 are dielectric layer.
That is to say, a kind of transmission line structure as shown in Figure 1, comprise top layer 11, intermediate layer 12-18, bottom 19 and bindiny mechanism, described intermediate layer 13 is connected with 50 ohm of joints, intermediate layer 13(i.e. the first articulamentum), intermediate layer 15(i.e. the second articulamentum), intermediate layer 17(i.e. the 3rd articulamentum) upper signalization line and bindiny mechanism respectively.Wherein, intermediate layer 13, intermediate layer 17 comprise that the via hole 21 of some and specific dimensions is connected to via hole 28, and via hole 21 runs through intermediate layer 13 to via hole 28, and intermediate layer 17 has centrosymmetric structure.Intermediate layer 13 and intermediate layer 15 signalization lines, this holding wire and intermediate layer 13 and intermediate layer 17 common formation transmission line structure agent structure.
Top layer comprises the non-conductive zone of strip line structure, and some connecting sewings for connector welded disc position are set on non-conductive zone, and one of them connecting sewing physically connects connector holding wire conductor.See also Fig. 2, it is depicted as top layer 11 concrete structure figure, and the hatched example areas shown in 101 is non-conductive zone, insulating material, strip line structure.Seam 102 to 105 is 50 ohm of connector pad locations, and seam 102,103 and 105 exposes 302 zones that the position is positioned at intermediate layer 13, interconnects on electric.Seam 104 exposes 304 zones that the position is positioned at intermediate layer 13.The holding wire conductor that physically connects 50 ohm of connectors.
The first articulamentum 13(is intermediate layer 13) at least one end on signalization island 1 and around the signal island the first gap 303 of one, and on signal island 1, at least one holding wire via hole 29 being set, signal island 1 and the first gap 303 are used for regulating the first capacitance characteristic of transmission line.See also Fig. 7, it is the equivalent electric circuit of articulamentum, and the shape on signal island 1 is transformable, and the first gap 303 of one is also transformable around the signal island.Signal island shape variable, the closure property in gap can extend to semi-surrounding according to actual conditions, as along center line A opening to transmission line edge.That is to say, the shape in signal island 1 and the first gap 303 is relevant to the characteristic of size and the first electric capacity, concrete shape is also relevant with the material that adopt in signal island 1 and the first gap 303 with size, only need through many experiments, just can obtain being fit to shape corresponding to this material and size.
Specifically see also figure Fig. 3, shown in intermediate layer 13, comprise and cover copper zone 302, serial via hole 21 to 28, holding wire island 1, holding wire via hole 29, and around the signal island one gap 303.The spacing distance of zone 301 signal median surfaces and transmission line outward flange and median surface 13.Series via hole 21,22 is symmetrical up and down about center line A with via hole 23,24.Via hole 25,26 is parallel with center line A, and mirror image is to the center line opposite side.In addition, transmission line structure also has periodically via hole 27,28, the repetition period be via hole 27 to the center spacing of via hole 28, and about center line A mirror image to opposite side.Via hole 27 to 28 repetition periods of via hole according to optimal design much smaller than 1/4th of this transmission line structure work highest frequency.Holding wire via hole 29 is different from serial via hole, and holding wire via hole 29 quantity are far fewer than serial via hole, and the position of holding wire via hole needs optimization process.As can be seen from Figure 3, on the two ends in intermediate layer 13 respectively signalization island 1 and around the signal island the first gap 303 of one, it is a kind of implementation.
The second articulamentum 15(is intermediate layer 15) at least one end on signalization transitional region 502 and some gaps of arranging on signal transition zone 502, and on the regional correspondence position of signal transition, corresponding holding wire via hole 29 is set, regional 502 inductance characteristics of signal transition.See also Fig. 7, with the second articulamentum 15, signal transition zone 502 and the some gaps that arrange on signal transition zone 502 can equivalence be the first inductance L 1.The shape in signal transition zone 50 is transformable, and the shape in some gaps and size also transformable.Only need through many experiments, just can obtain being fit to shape corresponding to this material and size.
On at least one end of the 3rd articulamentum 17 signalization island 2 703 and around the signal island the second gap 704 of 2 703, and corresponding holding wire via hole 29 is set on 2 703 correspondence positions of signal island, signal island 2 703 and the second gap 704 are used for regulating the first capacitor C 1.
The holding wire via hole 29 of the first articulamentum is the signal in messenger island 1, signal island 2 703 and signal transition zone 502 repeatedly, and signal transition zone 502 is connected with holding wire 506.
Fig. 2 to Fig. 5 illustrates syndeton.Syndeton comprise the signal island 1 in intermediate layer 13 and around the signal island one gap 303, the signal transition zone 502 to 505 in intermediate layer 15, and the signal island shown in intermediate layer 17 2 703 and two the irregular slit gap structure 704 around the signal island.Gap 303 is used for regulating the first capacitor C 1.That is to say gap 303, common first capacitor C 1 of regulating in gap 704.C1 as shown in Figure 7.
According to traditional transmission line theory, with periodicity L0, C0 directly is connected with 50 ohm of connectors, and the discontinuity of introducing in the loss of high frequency is very large.Introduce syndeton of the present invention, optimize L1, C1 reduces the impact of discontinuity greatly, reduces to greatest extent the insertion loss of transmission line structure.Fact proved, adopt the return loss of the transmission line structure that this mode processes to reduce 5dB at 6GHz,, reduced by 20 percent at the 6GHz insertion loss than open product.
In Fig. 4,501 are illustrated in median surface 15 non-metallic regions.The non-metallic regions of 701 expression median surfaces 17 in Fig. 5, oblique line shown in 702 is partly metallic region.Figure 6 shows that fabric figure, hatched example areas is non-conductive zone, the strip line structure.Transmission line realizes that technology mode do not limit, and the embodiment of the present invention is the circuit board mode, adopts lamination, and light is painted the etching depositing process.
Also need to illustrate, the material of median surface 14,16 can be hardboard or soft board.
The preferred embodiment of the present invention just is used for helping to set forth the present invention.Preferred embodiment does not have all details of detailed descriptionthe, does not limit this invention yet and only is described embodiment.Obviously, according to the content of this specification, can make many modifications and variations.These embodiment are chosen and specifically described to this specification, is in order to explain better principle of the present invention and practical application, thereby under making, the technical field technical staff can utilize the present invention well.The present invention only is subjected to the restriction of claims and four corner and equivalent.
Claims (10)
1. flat transmission line of low-loss, it is characterized in that, comprise be used to prevent some solder masks that metallic region oxidation and strip line structure contact with good conductor on every side, be used to up and down adhesive effect physically some adhesive linkages, be used for some dielectric layers, some articulamentums in Energy Transfer zone, described articulamentum comprises the first articulamentum, the second articulamentum and the 3rd articulamentum at least, wherein
On at least one end of the first articulamentum signalization island one and around the signal island the first gap of one, and on signal island one, holding wire via hole at least is set, described signal island one and the first gap are used for regulating the first capacitance characteristic of transmission line,
Signalization transitional region and some gaps of arranging on the signal transition zone at least one end of the second articulamentum, and on the regional correspondence position of signal transition, corresponding holding wire via hole is set, described signal transition zone and some gaps thereof are used for regulating the inductance characteristic of transmission line
On at least one end of the 3rd articulamentum signalization island two and around the signal island the second gap of two, and on two correspondence positions of signal island, corresponding holding wire via hole is set, signal island two and the second gap are used for regulating the first capacitance characteristic of transmission line,
The holding wire via hole of the first articulamentum is the signal in messenger island one, signal island two and signal transition zone repeatedly, and the signal transition zone is connected with holding wire.
2. the flat transmission line of low-loss as claimed in claim 1, is characterized in that, signal transition arranges three gaps on the zone: the 3rd gap, Fpir Crevices gap and the 5th gap, the inductance characteristic of transmission line is regulated in the 3rd gap, Fpir Crevices gap and the 5th gap.
3. the flat transmission line of low-loss as claimed in claim 2, it is characterized in that, the 3rd gap, Fpir Crevices gap and the 5th gap are respectively side by side, the gap opening in the 3rd gap and the 5th gap in the same way, opposite with the gap opening of Fpir Crevices gap, and the Fpir Crevices gap is between the 3rd gap and the 5th gap.
4. the flat transmission line of low-loss as claimed in claim 1, it is characterized in that, annular can be around the signal island two be arranged in the second gap, perhaps can be around the signal island two be arranged to the semi-surrounding type, annular can be around the signal island one be arranged in the first gap, perhaps can be around the signal island one be arranged to the semi-surrounding type.
5. the flat transmission line of low-loss as claimed in claim 4, is characterized in that, the shape of the shape of signal island two and the second gap formation and signal island one and the first gap formation is unanimous on the whole.
6. the flat transmission line of low-loss as claimed in claim 1, it is characterized in that, some solder masks comprise top layer and bottom, top layer comprises the non-conductive zone of strip line structure, and some connecting sewings for connector welded disc position are set on non-conductive zone, and one of them connecting sewing physically connects connector holding wire conductor.
7. the flat transmission line of low-loss as claimed in claim 1, it is characterized in that, some serial via holes and periodicity via hole also are set on the first articulamentum, series via hole and serial via hole can be symmetrical up and down about center line, the series via hole can be parallel with center line, and mirror image is to the center line opposite side, and the described repetition period is the center spacing between via hole.
8. the flat transmission line of low-loss as claimed in claim 6, is characterized in that, adhesive linkage is two layers, and one is positioned at the below of top layer, its two top that is positioned at bottom.
9. the flat transmission line of low-loss as claimed in claim 8, is characterized in that, dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.
10. the flat transmission line of low-loss as claimed in claim 1, is characterized in that, connector is 50 ohm of joints.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049547.6A CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
| PCT/CN2013/076224 WO2014121568A1 (en) | 2013-02-07 | 2013-05-24 | Low-loss flat transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049547.6A CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
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| CN103117440A true CN103117440A (en) | 2013-05-22 |
| CN103117440B CN103117440B (en) | 2015-05-27 |
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| CN201310049547.6A Active CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
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| WO (1) | WO2014121568A1 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014121568A1 (en) * | 2013-02-07 | 2014-08-14 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN104779013A (en) * | 2015-04-22 | 2015-07-15 | 上海安费诺永亿通讯电子有限公司 | Novel low-loss transmission line |
| CN104934670A (en) * | 2015-07-02 | 2015-09-23 | 上海安费诺永亿通讯电子有限公司 | A low-loss flat transmission line |
| CN105140609A (en) * | 2015-07-13 | 2015-12-09 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN105514733A (en) * | 2016-01-12 | 2016-04-20 | 上海安费诺永亿通讯电子有限公司 | Hinge structure with signal transmission line |
| CN108550969A (en) * | 2018-05-25 | 2018-09-18 | 深圳市深大唯同科技有限公司 | A kind of tunable dielectric integrated RF transmission line, coupler and feeding network |
| CN108601204A (en) * | 2018-05-25 | 2018-09-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN113161312A (en) * | 2021-01-25 | 2021-07-23 | 博微太赫兹信息科技有限公司 | Gradual-change gold belt interconnection structure between chip and transmission line and assembling method thereof |
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| CN116095943B (en) * | 2022-12-19 | 2024-04-16 | 深圳市金晟达电子技术有限公司 | Multilayer impedance HDI circuit board |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014121568A1 (en) * | 2013-02-07 | 2014-08-14 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN104779013B (en) * | 2015-04-22 | 2017-01-25 | 上海安费诺永亿通讯电子有限公司 | Low-loss transmission line |
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| CN104934670B (en) * | 2015-07-02 | 2018-04-27 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN105140609A (en) * | 2015-07-13 | 2015-12-09 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN105140609B (en) * | 2015-07-13 | 2019-05-24 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN105514733A (en) * | 2016-01-12 | 2016-04-20 | 上海安费诺永亿通讯电子有限公司 | Hinge structure with signal transmission line |
| CN105514733B (en) * | 2016-01-12 | 2018-06-22 | 上海安费诺永亿通讯电子有限公司 | A kind of hinge arrangement of band signal transmission line |
| CN108550969A (en) * | 2018-05-25 | 2018-09-18 | 深圳市深大唯同科技有限公司 | A kind of tunable dielectric integrated RF transmission line, coupler and feeding network |
| CN108601204A (en) * | 2018-05-25 | 2018-09-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN113161312A (en) * | 2021-01-25 | 2021-07-23 | 博微太赫兹信息科技有限公司 | Gradual-change gold belt interconnection structure between chip and transmission line and assembling method thereof |
| CN113161312B (en) * | 2021-01-25 | 2023-07-18 | 博微太赫兹信息科技有限公司 | Gradual-change gold-strip interconnection structure between chip and transmission line and assembly method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014121568A1 (en) | 2014-08-14 |
| CN103117440B (en) | 2015-05-27 |
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