CN103259069B - Transmission line capable of reducing loss - Google Patents
Transmission line capable of reducing loss Download PDFInfo
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- CN103259069B CN103259069B CN201310125749.4A CN201310125749A CN103259069B CN 103259069 B CN103259069 B CN 103259069B CN 201310125749 A CN201310125749 A CN 201310125749A CN 103259069 B CN103259069 B CN 103259069B
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- signal core
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- transmission line
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- 230000005540 biological transmission Effects 0.000 title claims abstract description 40
- 239000010410 layer Substances 0.000 claims abstract description 51
- 239000011241 protective layer Substances 0.000 claims abstract description 17
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- 239000000853 adhesive Substances 0.000 claims description 12
- 230000006872 improvement Effects 0.000 claims description 8
- 230000008054 signal transmission Effects 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 5
- 230000015572 biosynthetic process Effects 0.000 claims description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
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- 239000003989 dielectric material Substances 0.000 claims description 3
- 239000011810 insulating material Substances 0.000 claims description 2
- 239000000463 material Substances 0.000 abstract description 4
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- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
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- 238000000034 method Methods 0.000 description 2
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- 238000009489 vacuum treatment Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
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- 229910052759 nickel Inorganic materials 0.000 description 1
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- 229920000647 polyepoxide Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
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Abstract
The invention provides a transmission line capable of reducing loss. The transmission line capable of reducing the loss comprises a transmission portion and connector portions which are arranged at two ends of the transmission portion respectively and are connected with mobile terminals. The transmission portion comprises a signal core which is used for transmitting a signal, signal ground layers which are arranged on one side or two sides of the signal core, dielectric layers, a protective layer and a bonding structure, wherein the dielectric layers are arranged on one side or two sides of the signal core and located between the signal ground layers and the signal core, the protective layer is arranged on the outer surface of the transmission portion, the bonding structure is used for bonding one dielectric layer on the upper side of the signal core and one dielectric layer on the lower side of the signal core, the bonding structure comprises a plurality of bonding bridges, the bonding bridges and the signal core intersect, and the intersecting places of the plurality of bonding bridges and the signal core are separated from one another to form a plurality of first gaps. Due to the adoption of the bonding structure with special patterns, contacting faces of the bonding structure and the signal core are reduced, the influence of bonding materials on the signal core is reduced, and therefore inserting loss of the transmission line is effectively reduced.
Description
Technical field
The present invention relates to the design field of antenna for mobile phone, particularly relates to a kind of transmission line improving loss.
Background technology
Antenna is a kind of device utilizing frequency characteristic to receive and transmit.In recent years, for design and the performance of the mobile terminal antenna of radio communication, the developing direction of mobile communication is more and more affected.Particularly portable mobile termianl is as mobile phone, PDA(Personal Digital Assistance), MP3/MP4.Several leading indicators of Antenna Design are: have suitable multifrequency resonance, antenna realize signal propagate and energy emission all based on the resonance of certain frequency.If antenna can resonance in multiple frequency, so antenna can at multiple frequency operation.
In recent years, more and more wireless terminal adopts the structural design of low section.Namely the thickness of terminal is more and more less, and " thin " is the target that a lot of mobile phone is pursued.In order to reach this target, a lot of mobile phone have employed the pcb board design of discrete, namely two pieces of pcb boards are adopted to lay respectively at the two ends of mobile phone, we can refer to wherein with mainboard one piece, usually radio-frequency module is had above, platelet refers to other one piece, have some simply to connect and match circuits above, normally antenna above platelet.The coaxial line that diameter is very thin connects platelet and mainboard, is used for a radiofrequency signal to be directed to platelet from mainboard.The diameter of coaxial line is less, and the loss in unit length is larger.But because the space integrated level of mobile phone is more and more higher, require the coaxial line using minor diameter as far as possible, this and reduction loss are just in time contradiction.How when not increasing loss, reducing the space shared by this section of coaxial line as much as possible, is our facing challenges.In recent years, realizing transmission line with microstrip line is a possible selection.But microstrip line is one, and for signal semi-open structure, the shielding of signal has problem, easily produces the interference of signal.A good selection with the transmission line that strip lines configuration realizes.Holding wire is positioned at the centre on two-layer ground, and signal obtains good shielding, is not easy to produce interference.On the other hand, in order to the stability of radio-frequency performance and manufacture, the width of holding wire is not generally less than 0.1 millimeter.This just has certain requirement to the thickness of strip line.Meanwhile, the transmission line such as strip line, microstrip line all relies on the medium of at least one deck and the pressing of at least one layer signal line, and medium and holding wire can not directly pressings, will inevitably occur the adhesive linkage of at least one deck adhesive properties.Due to the relative dielectric constant of adhesives and loss angle higher, this phenomenon is at high band, and it is particularly evident that such as more than 3Ghz shows, thus causes the insertion loss of transmission line to become deterioration at high band.
Accompanying drawing 1-2 is the schematic diagram of prior art, and in Fig. 1,10 is transmission line, and 11 and 12 is the blank area of transmission line 50 ohm, is connected with impedance devices such as mobile terminal 50 ohm such as mobile phones.13 for transmission line is except the local transmission part of joint 11,12, and 13-1 is front view, and 13-2 is end view.Can find out that from 13-2 the adhesive-layer of prior art intactly covered holding wire and there is with holding wire 21 coincidence, because viscose glue has the characteristic of flowing, by the extruding of viscose glue and holding wire, holding wire be imbedded among viscose glue completely.Fig. 2 is the transmission line without via hole, and adhesive structure is identical with Fig. 1.Because viscose glue directly covers holding wire, the loss angle of viscose glue directly affects the insertion loss of holding wire, thus causes the insertion loss of transmission line to increase.
Summary of the invention
The present invention aims to provide a kind of transmission line improving loss, worsens technical matters to solve insertion loss in transmission line prior art.
The present invention is a kind of transmission line improving loss, it is characterized in that, the transmission line of this improvement loss comprises hop and is arranged at the blank area at described hop two ends, and described blank area is connected with the impedance device of mobile terminal; Wherein, described hop comprises:
Signal core, for signal transmission, described signal core is made up of one or more metallic conductor;
At least one layer signal stratum, be a metallic plate, described signal stratum is arranged at the one or both sides of described signal core;
At least one deck dielectric layer, is arranged at the one or both sides of described signal core, and between described signal stratum and described signal core, described dielectric layer is mutually bonding with between described signal core and described signal stratum;
Bonded structure, for the two layer medium layer of the bonding upper and lower both sides of described signal core, described bonded structure comprises some adhesion bridges, and described some adhesion bridges are crossing with described signal core, and each intersection of described some adhesion bridges and described signal core is spaced from each other and forms some first gaps.
In some embodiments, described bonded structure also comprises separate and lays respectively at the bonding portion of described signal core horizontal direction both sides, and formation second gap that is spaced from each other between described bonding portion and described signal core; Described adhesion bridge is through described signal core crossing with described signal core, and described adhesion bridge connects two adhesive segment of described signal core both sides.
In some embodiments, the outer surface of described hop is provided with protective layer, described protective layer and described signal ground or described dielectric layer mutually bonding.
In some embodiments, described protective layer adopts anti-oxidant insulating material.
In some embodiments, described dielectric layer adopts non-conductive dielectric material.
In some embodiments, the upper and lower both sides of described signal core are equipped with signal stratum, and are equipped with dielectric layer between described signal core and described signal stratum.
In some embodiments, described hop is provided with several via holes, described via hole is for connecting the signal stratum of the upper and lower both sides of described signal core.
The present invention is owing to adopting above technical scheme, make it compared with prior art, the advantage had and good effect are: the present invention adopts the bonded structure being provided with the crossing bonded bridge of some and described signal core, and between described each bonded bridge, be spaced from each other the some gaps of formation, efficiently reduce the insertion loss of transmission line.
Accompanying drawing explanation
By reference to the accompanying drawings, by hereafter state detailed description, more clearly can understand above-mentioned and other feature and advantage of the present invention, wherein:
Fig. 1 is prior art one;
Fig. 2 is prior art two;
Fig. 3 is the embodiment of the present invention;
Fig. 4 is that the present invention converts embodiment one;
Fig. 5 is that the present invention converts embodiment two;
Fig. 6 is the citing of bonded structure pattern.
Symbol description:
10-transmission line
11,12-blank area
13-hop
21-signal core
22-bonding portion
23-via hole
24,25-protective layer
26,27-dielectric layer
28,29-signal stratum
30-second gap
31-adhesion bridge
32-first gap
Embodiment
See the accompanying drawing that the embodiment of the present invention is shown, hereafter in more detail the present invention will be described.But the present invention can realize in many different forms, and should not be construed as by the restriction in the embodiment of this proposition.On the contrary, it is abundant and complete open in order to reach for proposing these embodiments, and makes those skilled in the art understand scope of the present invention completely.In these accompanying drawings, for clarity sake, may be exaggerated size and the relative size in layer and region.
Shown in figure 3-6, the invention provides a kind of transmission line improving loss, this transmission line 10 comprises hop 13 and blank area 11,12, and blank area 11,12 is arranged at the two ends of hop 13, and blank area 11,12 is connected with the impedance device of the mobile terminals such as mobile phone.Wherein, hop 13 comprises signal core 21, at least one layer signal stratum, at least one deck dielectric layer and bonded structure, and as shown in Figure 3,13-1 is the front view of transmission line, and 13-2 is the cutaway view of transmission line.
In the present embodiment, signal core 21 is for signal transmission, signal core 21 can be made up of jointly one or more conductor, the shape of signal core 21 can be straight line or folding line etc., each conductor of signal core 21 is metallic conductor, as copper, silver, nickel etc., determine as the case may be, be not restricted herein.
In the present embodiment, as shown in Figure 3, hop 13 is provided with two-layer signal stratum 28,29, and signal stratum 28,29 is arranged at the both sides up and down of signal core 21 respectively.Concrete, signal stratum 28,29 is metallic plate, and signal stratum 28,29 binding signal core 21 carries out the transmission of signal jointly.Two layer medium layer 26,27 is also bonded with respectively between signal stratum 28,29 and signal core 21, namely the upper surface of signal core 21 successively with dielectric layer 26 and signal stratum 28 mutually bonding, the lower surface of signal core 21 successively with dielectric layer 27 and signal stratum 29 mutually bonding.Dielectric layer 26,27 for by signal stratum 28,29 and signal core 21 spaced apart and play the effect of impedance, support signal stratum 28,29 simultaneously, dielectric layer 26,27 adopts non-conductive dielectric material, as polytetrafluoroethylene, epoxy resin etc., and the material that dielectric layer 26,27 adopts can be hardboard or soft board, be not restricted herein, can determine as the case may be, these materials have the advantages that relative dielectric constant is low and loss is little, thus have the effect reduced the wastage.
In the present embodiment, the upper and lower two-layer outer surface of hop 13 is also provided with protective layer 24,25, protective layer adopts anti-oxidant Ins. ulative material, as ink etc., plays and prevents transmission line to be oxidized, and the effect of insulation.Concrete, protective layer 25,24 is arranged on the outer surface on signal stratum 28,29 respectively, and protective layer 25,24 respectively with signal stratum 28,29 mutually bonding.
Concrete, dielectric layer 26,27 is mutually bonding by adhesive structure 22 with between signal core 21.In the present embodiment, adhesive structure comprises separate and lays respectively at the bonding portion 22 of signal core 21 horizontal direction both sides, and is spaced from each other formation second gap 30 between two bonding portions 22 and signal core 21; Also be provided with some adhesion bridges 31 between the bonding portion of both sides, some adhesion bridges 31 pass signal core 21, and crossing with signal core 21, and two adhesive segment of adhesion bridge 31 connection signal core 21 both sides; Some adhesion bridges 31 are alternate with signal core 21 intersection to be separated, and forms some periodic intermittent, as shown in Figure 3.In bonding processes, due to the mobility of viscose glue, as the prior art, signal core 21 can imbed adhesion bridge 31 part crossing with it, but due to periodic intermittent, signal core 21 periodically part imbeds adhesion bridge 31.Simultaneously, due to temperature and the vacuum treatment of pressing, the signal core 21 be in periodic intermittent will be closely linked with dielectric layer 26,27 under vacuum treatment, which reduce the contact of adhesives and signal core, thus adhesives is reduced the impact of signal core 21, the insertion loss of signal transmission also reduces.
In the present embodiment, hop 13 is also provided with some via holes 23, metalized is made in via hole 23 inside, for the two-layer signal stratum 28,29 of connection signal core 21 upper and lower sides, because metalized will be made in via hole 23 inside, via hole can not be positioned among the gap of bonded structure 22.Certainly, the quantity of via hole 23 and arrangement position can be determined as the case may be, are not restricted herein.Certainly, the transmission line of above-described improvement loss is a kind of embodiment, in specific implementation process, hop 13 also can not arrange via hole.Only be provided with one deck when signal stratum and be positioned at the side of signal core; after the opposite side of signal core is bonding with dielectric layer; dielectric layer is directly mutually bonding with protective layer; it is a kind of embodiment herein; the number of plies of signal stratum and dielectric layer is determined as the case may be; be not restricted herein, now on hop 13 also without the need to arranging via hole.
The above bonded structure is a kind of embodiment, be illustrated in figure 4 alternate embodiment one, adhesive structure comprises some bonding portions crossing with signal core, the rectangular strip of some bonding portions is also periodically crossing with signal core 21, and through the top of signal core 21, each bonding portion is alternate with signal core 21 intersection to be separated, and forms some periodic intermittent.Be conversion embodiment two as described in Figure 5; adopt the bonded structure of conversion described in embodiment one, but now signal stratum is only provided with one deck and is positioned at the side of signal core, after the opposite side of signal core is bonding with dielectric layer; dielectric layer is directly mutually bonding with protective layer, without the need to arranging via hole on hop 13.
Certain bonded structure also can be other shapes, as shown in Figure 6, bonded structure can be some slanted bar shapes crossing with signal core, also can be some cross-like etc. be connected with signal core, do not limit herein, as long as ensure that signal core is not exclusively imbedded in bonded structure, each bonding portion of guarantee bonded structure and the junction of signal core separately open form become some gaps.
In sum, the invention provides a kind of transmission line improving loss, comprise hop and the blank area being arranged at hop two ends, blank area is connected with the impedance device of mobile terminal.Wherein, hop comprises signal core, at least one layer signal stratum, at least one deck dielectric layer, at least layer protective layer and bonded structure.Signal core is used for the signal core of signal transmission; Signal stratum is arranged at the one or both sides of signal core; Dielectric layer is arranged at the one or both sides of signal core, and between signal stratum and signal core, dielectric layer is mutually bonding with between signal core and signal stratum; Protective layer is arranged on the outer surface with transmission line, plays insulation, oxidation resistant effect; Bonded structure is used for bonding signal core and dielectric layer, and bonded structure comprises some adhesion bridges, and some adhesion bridges are crossing with signal core, and each intersection of some adhesion bridges and signal core is spaced from each other and forms some first gaps.The present invention adopts the bonded structure with special pattern, decreases the contact-making surface of bonded structure and signal core, reduces the impact of adhesives on signal core, thus efficiently reduce the insertion loss of transmission line.
Those skilled in the art should be understood that the present invention can realize with other concrete forms many and not depart from the spirit or scope of the present invention.Although also have been described embodiments of the invention, the present invention should be understood and should not be restricted to these embodiments, within the spirit and scope of the invention that those skilled in the art can define as appended claims, make change and amendment.
Claims (6)
1. improve a transmission line for loss, it is characterized in that, the transmission line of this improvement loss comprises hop and is arranged at the blank area at described hop two ends, and described blank area is connected with the impedance device of mobile terminal; Wherein, described hop comprises:
Signal core, for signal transmission, described signal core is made up of one or more metallic conductor;
At least one layer signal stratum, be a metallic plate, described signal stratum is arranged at the one or both sides of described signal core;
At least one deck dielectric layer, is arranged at the one or both sides of described signal core, and between described signal stratum and described signal core, described dielectric layer is mutually bonding with between described signal core and described signal stratum;
Bonded structure, for the two layer medium layer of the bonding upper and lower both sides of described signal core, described bonded structure comprises some adhesion bridges, and described some adhesion bridges are crossing with described signal core, and each intersection of described some adhesion bridges and described signal core is spaced from each other and forms some first gaps; Described bonded structure also comprises separate and lays respectively at the bonding portion of described signal core horizontal direction both sides, and formation second gap that is spaced from each other between described bonding portion and described signal core; Described adhesion bridge is through described signal core crossing with described signal core, and described adhesion bridge connects two adhesive segment of described signal core both sides.
2. the transmission line of improvement loss according to claim 1, is characterized in that, the outer surface of described hop is provided with protective layer, described protective layer and described signal ground or described dielectric layer mutually bonding.
3. the transmission line of improvement loss according to claim 2, is characterized in that, described protective layer adopts anti-oxidant insulating material.
4. the transmission line of improvement loss according to claim 1, is characterized in that, described dielectric layer adopts non-conductive dielectric material.
5. the transmission line of improvement loss according to claim 1, is characterized in that, the upper and lower both sides of described signal core are equipped with signal stratum, and is equipped with dielectric layer between described signal core and described signal stratum.
6. the transmission line of improvement loss according to claim 5, is characterized in that, described hop is provided with some via holes, and described via hole is for connecting the signal stratum of the upper and lower both sides of described signal core.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310125749.4A CN103259069B (en) | 2013-04-12 | 2013-04-12 | Transmission line capable of reducing loss |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310125749.4A CN103259069B (en) | 2013-04-12 | 2013-04-12 | Transmission line capable of reducing loss |
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| CN103259069A CN103259069A (en) | 2013-08-21 |
| CN103259069B true CN103259069B (en) | 2015-06-24 |
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| CN201310125749.4A Expired - Fee Related CN103259069B (en) | 2013-04-12 | 2013-04-12 | Transmission line capable of reducing loss |
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| CN104779013B (en) * | 2015-04-22 | 2017-01-25 | 上海安费诺永亿通讯电子有限公司 | Low-loss transmission line |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08288718A (en) * | 1995-04-14 | 1996-11-01 | Murata Mfg Co Ltd | Production of strip line cable |
| CN1136209A (en) * | 1995-03-03 | 1996-11-20 | 株式会社村田制作所 | Antenna-integrated strip line cable |
| CA2184022A1 (en) * | 1995-08-23 | 1997-02-24 | Yoshihiko Goto | Thin-Film Multilayered Electrodes and Method of Fabricating Same |
| EP0812025A1 (en) * | 1996-06-03 | 1997-12-10 | Murata Manufacturing Co., Ltd. | Multi-layer thin-film electrode, high-frequency transmission line, high-frequency resonator, and high-frequency filter |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| CN102986308A (en) * | 2010-12-03 | 2013-03-20 | 株式会社村田制作所 | High-frequency signal line |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1225401C (en) * | 2002-05-16 | 2005-11-02 | 华东师范大学 | Production method of millimetric wave voltage-controlled phase shifter for microelectronic machine |
| KR100987191B1 (en) * | 2008-04-18 | 2010-10-11 | (주)기가레인 | printed circuit board removing bonding sheet around signal transmission line |
-
2013
- 2013-04-12 CN CN201310125749.4A patent/CN103259069B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1136209A (en) * | 1995-03-03 | 1996-11-20 | 株式会社村田制作所 | Antenna-integrated strip line cable |
| JPH08288718A (en) * | 1995-04-14 | 1996-11-01 | Murata Mfg Co Ltd | Production of strip line cable |
| CA2184022A1 (en) * | 1995-08-23 | 1997-02-24 | Yoshihiko Goto | Thin-Film Multilayered Electrodes and Method of Fabricating Same |
| EP0812025A1 (en) * | 1996-06-03 | 1997-12-10 | Murata Manufacturing Co., Ltd. | Multi-layer thin-film electrode, high-frequency transmission line, high-frequency resonator, and high-frequency filter |
| CN101925996A (en) * | 2008-01-24 | 2010-12-22 | 布鲁尔科技公司 | Device wafer reversibly is installed in method on the carrier substrate |
| CN102986308A (en) * | 2010-12-03 | 2013-03-20 | 株式会社村田制作所 | High-frequency signal line |
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Effective date of registration: 20191126 Address after: 314305 No.158 Zhonggang Road, Xitangqiao Street (Haiyan Economic Development Zone), Haiyan County, Jiaxing City, Zhejiang Province Patentee after: Amphenol Yongyi (Haiyan) Communication Electronics Co.,Ltd. Address before: 201108 No. 689 Shen Nan Road, Shanghai, Minhang District Patentee before: SHANGHAI AMPHENOL AIRWAVE COMMUNICATION ELECTRONICS Co.,Ltd. |
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