CN103117440B - Low-loss flat transmission line - Google Patents
Low-loss flat transmission line Download PDFInfo
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- CN103117440B CN103117440B CN201310049547.6A CN201310049547A CN103117440B CN 103117440 B CN103117440 B CN 103117440B CN 201310049547 A CN201310049547 A CN 201310049547A CN 103117440 B CN103117440 B CN 103117440B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
- H01P3/08—Microstrips; Strip lines
- H01P3/085—Triplate lines
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- Coupling Device And Connection With Printed Circuit (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A low-loss flat transmission line comprises a plurality of solder mask layers, a plurality of bonding layers, a plurality of dielectric layers and a plurality of connecting layers, wherein the solder mask layers are used for preventing oxidization of a metal area and contact of a shielded transmission line structure and a peripheral good conductor, the bonding layers are used for physical vertical bonding, and the dielectric layers are used for an energy transmission area. A first signal pad and a first gap surrounding the first signal pad are arranged on at least one end of the first connecting layer, at least one signal line via hole is arranged on the first signal pad, a signal transition area and a plurality of gaps on the signal transition area are arranged on at least one end of the second connecting layer, a second signal pad and a second gap surrounding the second signal pad are arranged on at least one end of the third connecting layer, the signal line via holes of the first connecting layer are communicated with signals of the first signal pad, the second signal pad and the signal transition area, and the signal transition area is connected with signal lines. By the aid of the connecting structure, L1 and C1 are optimized, the influence of discontinuity is greatly reduced, and insertion loss of the transmission line structure is furthest reduced.
Description
Technical field
The present invention relates to a communication antenna, particularly relate to the low-loss flat transmission line that a kind of communication antenna is relevant.
Background technology
Antenna is a kind of device utilizing frequency characteristic to receive and transmit.In recent years, for design and the performance of the mobile terminal antenna of radio communication, the developing direction of mobile communication is more and more affected.Particularly portable mobile termianl is as mobile phone, PDA(Personal Digital Assistance), MP3/MP4.Several leading indicators of Antenna Design are: have suitable multifrequency resonance, antenna realize signal propagate and energy emission all based on the resonance of certain frequency.If antenna can resonance in multiple frequency, so antenna can at multiple frequency operation.
In recent years, more and more wireless terminal adopts the structural design of low section.That is to say that the thickness of terminal is more and more less, " thin " is the target that a lot of mobile phone is pursued.In order to reach this target, a lot of mobile phone have employed the pcb board design of discrete, namely adopts two pieces of pcb boards to lay respectively at the two ends of mobile phone, one piece that can refer to wherein with mainboard, usually have radio-frequency module above, platelet refers to other one piece, has some simply to connect and match circuit above.Normally antenna above platelet.The coaxial line that diameter is very thin connects platelet and mainboard, is used for a radiofrequency signal to be directed to platelet from mainboard.The diameter of coaxial line is less, and the loss in unit length is larger.But, because the space integrated level of mobile phone is more and more higher, require the coaxial line using minor diameter as far as possible.This and reduction loss are just in time contradiction.How when not increasing loss, reducing the space shared by this section of coaxial line as much as possible, is our facing challenges.In recent years, realizing transmission line with microstrip line is a possible selection.But microstrip line is a semi-open structure for signal, and the shielding of signal has problem, easily produce the interference of signal.A good selection with the transmission line that strip lines configuration realizes.Holding wire is positioned at the centre on two-layer ground, and signal obtains good shielding, is not easy to produce interference.On the other hand, in order to the stability of radio-frequency performance and manufacture, the width of holding wire is not generally less than 0.1 millimeter.This just has certain requirement to the thickness of strip line.And connect radio frequency connector and strip line and need to design via hole, via hole is here the blind hole of connection signal line and surface conductor usually, and namely via hole is just through the thickness of segment striplines.The thickness of strip line is thicker, and the making of blind hole is more difficult, can have a strong impact on the yield of product.There is certain restriction in manufacturing of blind hole, assuming that R is the radius of blind hole, h is the height of blind hole, and so R/h must meet some requirements, and in order to reach reliable and stable conducting, R/h must be greater than 0.9.But because R can not be arbitrary large, such as, by the restriction of dimensional space.So at this time, h can not be too large, and that is, the height in hole has certain restriction, and such as h is no more than 50 microns.And the making in hole needs to use laser machine, and cost is high.Simultaneously, due to SMT(Surface Mounted Technology) connector be connected to the two ends of transmission line, although the connector of SMT is the impedance of 50 ohm, the characteristic impedance of transmission line is also 50 ohm, still there is structural discontinuity at the position of connector connection transmission line, thus cause characteristic impedance to depart from 50 ohm.This phenomenon is at high band, and it is particularly evident that such as more than 3Ghz shows, thus causes the insertion loss of transmission line to become deterioration at high band.
That is, connector connects the discontinuity at transmission line position, occurs that characteristic impedance departs from the defect generation of 50 ohm.
Summary of the invention
The object of the present invention is to provide a kind of low-loss flat transmission line, especially high band can be applicable to, the discontinuity at transmission line position is connected to solve connector in prior art, occur that characteristic impedance departs from the defect generation of 50 ohm, thus cause the insertion loss of transmission line to become the technical problem of deterioration at high band.A kind of low-loss flat transmission line, comprise for preventing metallic region is oxidized and strip line structure contacts with surrounding good conductor some solder masks, for some adhesive linkages, the some dielectric layers for Energy Transfer region, the some articulamentums for physically upper and lower adhesive effect, described articulamentum at least comprises the first articulamentum, the second articulamentum and the 3rd articulamentum, wherein
Signalization island one and the first gap around signal island one at least one end of first articulamentum, and at least holding wire via hole is set on signal island one, described signal island one and the first gap for regulating the first capacitance characteristic of transmission line,
Signalization transitional region and some gaps of arranging on signal transition region at least one end of second articulamentum, and corresponding holding wire via hole is set on the correspondence position of signal transition region, described signal transition region and some gaps thereof are for regulating the inductance characteristic of transmission line
Signalization island two and the second gap around signal island two at least one end of 3rd articulamentum, and corresponding holding wire via hole is set on the correspondence position of signal island two, signal island two and the second gap for regulating the first capacitance characteristic of transmission line,
The signal in the holding wire via hole of the first articulamentum messenger island one, signal island two and signal transition region repeatedly, signal transition region is connected with holding wire.
Preferably, signal transition region is arranged three articles of gaps: the 3rd gap, the 4th gap and the 5th gap, the 3rd gap, the 4th gap and the 5th gap regulate the inductance characteristic of transmission line.
Preferably, the 3rd gap, the 4th gap and the 5th gap are arranged side by side respectively, and the gap opening in the 3rd gap and the 5th gap is in the same way, contrary with the gap opening in the 4th gap, and the 4th gap is between the 3rd gap and the 5th gap.
Preferably, annular can be arranged to around signal island two in the second gap, or can be arranged to semi-surrounding type around signal island two, and annular can be arranged to around signal island one in the first gap, or can be arranged to semi-surrounding type around signal island one.
Preferably, the shape that formed of the shape that formed of signal island two and the second gap and signal island one and the first gap is unanimous on the whole.
Preferably, some solder masks comprise top layer and bottom, top layer comprises the non-conducting areas of strip line structure, and on non-conducting areas, arrange some connecting sewings for connector welded disc position, and one of them connecting sewing physically connects connector holding wire conductor.
Preferably, first articulamentum is also arranged some serial via holes and periodically via hole, serial via hole and serial via hole can be symmetrical up and down about center line, serial via hole can with centerline parallel, and mirror image is to center line opposite side, the described repetition period is the center spacing between via hole.
Preferably, adhesive linkage is two layers, and one is positioned at the below of top layer, its two top being positioned at bottom.
Preferably, dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.
Preferably, connector is 50 ohm of joints.
Compared with prior art, the present invention has following technological merit:
The transmission line theory of reportedly uniting, will periodically L0, C0 directly be connected with 50 ohm of connectors, the discontinuity introduced in the loss of high frequency is very large.Introduce syndeton of the present invention, optimize L1, C1, greatly reduce the impact of discontinuity, reduce the insertion loss of transmission line structure to greatest extent.Fact proved, the transmission line structure adopting this mode to process, reduce 5dB in the return loss of 6GHz, reduce 20 percent at 6GHz insertion loss than open product.
Accompanying drawing explanation
Fig. 1 is an embodiment assembly drawing of low-loss flat transmission line of the present invention;
Fig. 2 is the top layer one exemplifying embodiment figure of low-loss flat transmission line of the present invention;
Fig. 3 is the exemplifying embodiment figure of the present invention first articulamentum;
Fig. 4 is the exemplifying embodiment figure of the present invention second articulamentum;
Fig. 5 is the exemplifying embodiment figure of the present invention the 3rd articulamentum;
Fig. 6 is the exemplifying embodiment figure of bottom of the present invention;
Fig. 7 is the distributed equivalent inductance of the holding wire of syndeton of the present invention and the equivalent electric circuit connection layout of electric capacity.
Embodiment
Below in conjunction with accompanying drawing, illustrate the present invention.
Refer to Fig. 1 to Fig. 6, a kind of low-loss flat transmission line, comprises for preventing metallic region is oxidized and strip line structure contacts with surrounding good conductor some solder masks, for the some adhesive linkages for physically upper and lower adhesive effect, the some dielectric layers for Energy Transfer region and some articulamentums.
Some solder masks comprise top layer 11 and bottom 19.Top layer 11 and bottom 19 are solder mask, and it prevents metallic region to be oxidized, and strip line structure contacts with surrounding good conductor.
Adhesive linkage is two layers, and one is positioned at the below of top layer, its two top being positioned at bottom.Namely intermediate layer 12 and intermediate layer 18 are adhesive linkage, and Main Function is adhesive effect up and down physically.Intermediate layer 12 and intermediate layer 18 have certain thickness, and according to the difference of adhesives characteristic, the transmission characteristic of the whole transmission line structure of the corresponding impact of meeting, for reaching optimum transmission performance, reduce loss, syndeton and holding wire need to do optimization process.
Dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.Dielectric layer is Energy Transfer region.The characteristic parameter of dielectric layer material is as great on whole transmission line structure impact with relative dielectric loss in thickness, and the dielectric material of less loss is the first-selection that commercial Application is produced.Intermediate layer 14 and intermediate layer 16 are dielectric layer.
That is, a kind of transmission line structure as shown in Figure 1, comprise top layer 11, intermediate layer 12-18, bottom 19 and bindiny mechanism, described intermediate layer 13 is connected with 50 ohm of joints, intermediate layer 13(i.e. the first articulamentum), intermediate layer 15(i.e. the second articulamentum), intermediate layer 17(i.e. the 3rd articulamentum) upper signalization line and bindiny mechanism respectively.Wherein, intermediate layer 13, intermediate layer 17 comprises some and is connected to via hole 28 with the via hole 21 of specific dimensions, and via hole 21 runs through intermediate layer 13 to via hole 28, and intermediate layer 17, has centrosymmetric structure.Intermediate layer 13 and intermediate layer 15 signalization line, this holding wire and intermediate layer 13 and intermediate layer 17 form transmission line structure agent structure jointly.
Top layer comprises the non-conducting areas of strip line structure, and on non-conducting areas, arrange some connecting sewings for connector welded disc position, and one of them connecting sewing physically connects connector holding wire conductor.Refer to Fig. 2, it is depicted as top layer 11 concrete structure figure, and the hatched example areas shown in 101 is non-conducting areas, insulating material, strip line structure.Seam 102 to 105 is 50 ohm of connector pad locations, and seam 102,103 and 105 exposes 302 regions that position is positioned at intermediate layer 13, interconnects electrically.Seam 104 exposes 304 regions that position is positioned at intermediate layer 13.Physically connect the holding wire conductor of 50 ohm of connectors.
First articulamentum 13(and intermediate layer 13) at least one end on signalization island 1 and the first gap 303 around signal island one, and at least one holding wire via hole 29 is set on signal island 1, signal island 1 and the first gap 303 are for regulating the first capacitance characteristic of transmission line.Refer to Fig. 7, it is the equivalent electric circuit of articulamentum, and the shape on signal island 1 is transformable, and also transformable around first gap 303 on signal island one.Signal island shape is variable, and the closure property in gap can extend to semi-surrounding according to actual conditions, if centrally line A opening is to transmission line edge.That is, signal island 1 is relevant to the characteristic of size and the first electric capacity with the shape in the first gap 303, concrete shape and size are also relevant with the material that signal island 1 and the first gap 303 adopt, only need through many experiments, just can obtain shape corresponding to this material applicable and size.
Specifically refer to figure Fig. 3, shown intermediate layer 13, comprises and covers copper region 302, serial via hole 21 to 28, holding wire island 1, holding wire via hole 29, and around the gap 303 on signal island one.The spacing distance of median surface and transmission line outward flange and median surface 13 is illustrated in region 301.Series via hole 21,22 is symmetrical up and down about center line A with via hole 23,24.Via hole 25,26 is parallel with center line A, and mirror image is to center line opposite side.In addition, transmission line structure also has periodically via hole 27,28, and the repetition period is the center spacing of via hole 27 to via hole 28, and about center line A mirror image to opposite side.Via hole 27 arrives via hole 28 repetition period according to optimal design much smaller than 1/4th of this transmission line structure work highest frequency.Holding wire via hole 29 is different from serial via hole, and holding wire via hole 29 quantity is far fewer than serial via hole, and the position of holding wire via hole needs optimization process.As can be seen from Figure 3, difference signalization island 1 and the first gap 303 around signal island one on the two ends in intermediate layer 13, it is a kind of implementation.
Second articulamentum 15(and intermediate layer 15) at least one end on signalization transitional region 502 and on signal transition region 502 arrange some gaps, and corresponding holding wire via hole 29 is set on the correspondence position of signal transition region, signal transition region 502 inductance characteristic.Refer to Fig. 7, with the second articulamentum 15, signal transition region 502 and the some gaps arranged on signal transition region 502 can be equivalent to the first inductance L 1.The shape in signal transition region 50 is transformable, and the shape in some gaps and size are also transformable.Only need through many experiments, just can obtain shape corresponding to this material applicable and size.
Signalization island 2 703 and the second gap 704 around signal island 2 703 at least one end of 3rd articulamentum 17, and corresponding holding wire via hole 29 is set on the correspondence position of signal island 2 703, signal island 2 703 and the second gap 704 are for regulating the first electric capacity C1.
The signal in the holding wire via hole 29 of the first articulamentum messenger island 1, signal island 2 703 and signal transition region 502 repeatedly, signal transition region 502 is connected with holding wire 506.
Fig. 2 to Fig. 5 illustrates syndeton.Syndeton comprises the signal island 1 in intermediate layer 13 and the gap 303 around signal island one, the signal transition region 502 to 505 in intermediate layer 15, and the signal island 2 703 shown in intermediate layer 17 and the irregular slit gap structure 704 around signal island two.Gap 303 is for regulating the first electric capacity C1.That is, gap 303, gap 704 regulates the first electric capacity C1 jointly.C1 as shown in Figure 7.
Signal transition region 502 is irregular smooth domain, holding wire via hole 29 connection signal island 1, signal island 2 703 signal and signal transition region 502.Signal transition region 502 is connected with holding wire 506.Gap 503,504,505 for the electric parameter of conditioning signal transitional region, i.e. the inductance characteristic L1 of transmission line.Holding wire 506 is wide uniform conductor, and its distributed equivalent inductance and electric capacity are respectively L0, C0.Equivalent electric circuit as shown in Figure 7.
According to traditional transmission line theory, will periodically L0, C0 directly be connected with 50 ohm of connectors, the discontinuity introduced in the loss of high frequency is very large.Introduce syndeton of the present invention, optimize L1, C1, greatly reduce the impact of discontinuity, reduce the insertion loss of transmission line structure to greatest extent.Fact proved, the return loss of the transmission line structure adopting this mode to process reduces 5dB at 6GHz, reduce 20 percent at 6GHz insertion loss than open product.
In Fig. 4,501 represent in median surface 15 non-metallic regions.The non-metallic regions of 701 expression median surfaces 17 in Fig. 5, oblique line portion shown in 702 is metallic region.Figure 6 shows that fabric figure, hatched example areas is non-conducting areas, strip line structure.Transmission line realizes technology mode and does not limit, and the embodiment of the present invention is circuit board mode, and adopt lamination, light paints etchingization depositing process.
Also need illustrate, median surface 14, the material of 16 can be hardboard or soft board.
The preferred embodiment of the present invention just sets forth the present invention for helping.Preferred embodiment does not have all details of detailed descriptionthe, does not limit the embodiment that this invention is only described yet.Obviously, according to the content of this specification, can make many modifications and variations.This specification is chosen and is specifically described these embodiments, is to explain principle of the present invention and practical application better, thus makes art technical staff can utilize the present invention well.The present invention is only subject to the restriction of claims and four corner and equivalent.
Claims (10)
1. a low-loss flat transmission line, it is characterized in that, comprise for preventing metallic region is oxidized and strip line structure contacts with surrounding good conductor some solder masks, for some adhesive linkages, the some dielectric layers for Energy Transfer region, the some articulamentums for physically upper and lower adhesive effect, wherein:
Described tack coat is between described solder mask; Described articulamentum is between described tack coat; Described dielectric layer lays respectively between two articulamentums;
Described articulamentum at least comprises the first articulamentum, the second articulamentum and the 3rd articulamentum, wherein,
Signalization island one and the first gap around signal island one at least one end of first articulamentum, and at least one holding wire via hole is set on signal island one, described signal island one and the first gap for regulating the first capacitance characteristic of transmission line,
Signalization transitional region and some gaps of arranging on signal transition region at least one end of second articulamentum, and corresponding holding wire via hole is set on the correspondence position of signal transition region, described signal transition region and some gaps thereof are for regulating the inductance characteristic of transmission line
Signalization island two and the second gap around signal island two at least one end of 3rd articulamentum, and corresponding holding wire via hole is set on the correspondence position of signal island two, signal island two and the second gap for regulating the first capacitance characteristic of transmission line,
The signal in the holding wire via hole of the first articulamentum messenger island one, signal island two and signal transition region repeatedly, signal transition region is connected with holding wire.
2. low-loss flat transmission line as claimed in claim 1, is characterized in that, signal transition region is arranged three articles of gaps: the 3rd gap, the 4th gap and the 5th gap, and the 3rd gap, the 4th gap and the 5th gap regulate the inductance characteristic of transmission line.
3. low-loss flat transmission line as claimed in claim 2, it is characterized in that, 3rd gap, the 4th gap and the 5th gap are respectively side by side, the gap opening in the 3rd gap and the 5th gap in the same way, contrary with the gap opening in the 4th gap, further, the 4th gap is between the 3rd gap and the 5th gap.
4. low-loss flat transmission line as claimed in claim 1, it is characterized in that, annular is arranged to around signal island two in the second gap, or is arranged to semi-surrounding type around signal island two, annular is arranged to around signal island one in first gap, or is arranged to semi-surrounding type around signal island one.
5. low-loss flat transmission line as claimed in claim 4, is characterized in that, the shape that the shape that signal island two and the second gap are formed and signal island one and the first gap are formed is unanimous on the whole.
6. low-loss flat transmission line as claimed in claim 1, it is characterized in that, some solder masks comprise top layer and bottom, top layer comprises the non-conducting areas of strip line structure, and on non-conducting areas, arrange some connecting sewings for connector welded disc position, and one of them connecting sewing physically connects connector holding wire conductor.
7. low-loss flat transmission line as claimed in claim 1, it is characterized in that, first articulamentum is also arranged some serial via holes and periodicity via hole, series via hole is symmetrical up and down about center line between any two, or with centerline parallel and mirror image to center line opposite side, the repetition period of described periodicity via hole is the center spacing between via hole.
8. low-loss flat transmission line as claimed in claim 6, it is characterized in that, adhesive linkage is two layers, and one is positioned at the below of top layer, its two top being positioned at bottom.
9. low-loss flat transmission line as claimed in claim 8, it is characterized in that, dielectric layer is two layers, and one is between the first articulamentum and the second articulamentum, and it is two between the second articulamentum and the 3rd articulamentum.
10. low-loss flat transmission line as claimed in claim 1, it is characterized in that, connector is 50 ohm of joints.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049547.6A CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
| PCT/CN2013/076224 WO2014121568A1 (en) | 2013-02-07 | 2013-05-24 | Low-loss flat transmission line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310049547.6A CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
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| Publication Number | Publication Date |
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| CN103117440A CN103117440A (en) | 2013-05-22 |
| CN103117440B true CN103117440B (en) | 2015-05-27 |
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| CN201310049547.6A Active CN103117440B (en) | 2013-02-07 | 2013-02-07 | Low-loss flat transmission line |
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| WO (1) | WO2014121568A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103117440B (en) * | 2013-02-07 | 2015-05-27 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN104779013B (en) * | 2015-04-22 | 2017-01-25 | 上海安费诺永亿通讯电子有限公司 | Low-loss transmission line |
| CN104934670B (en) * | 2015-07-02 | 2018-04-27 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN105140609B (en) * | 2015-07-13 | 2019-05-24 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN105514733B (en) * | 2016-01-12 | 2018-06-22 | 上海安费诺永亿通讯电子有限公司 | A kind of hinge arrangement of band signal transmission line |
| CN108601204A (en) * | 2018-05-25 | 2018-09-28 | 上海安费诺永亿通讯电子有限公司 | A kind of low-loss flat transmission line |
| CN108550969A (en) * | 2018-05-25 | 2018-09-18 | 深圳市深大唯同科技有限公司 | A kind of tunable dielectric integrated RF transmission line, coupler and feeding network |
| CN113161312B (en) * | 2021-01-25 | 2023-07-18 | 博微太赫兹信息科技有限公司 | Gradual-change gold-strip interconnection structure between chip and transmission line and assembly method thereof |
| CN116095943B (en) * | 2022-12-19 | 2024-04-16 | 深圳市金晟达电子技术有限公司 | Multilayer impedance HDI circuit board |
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| GB2439110B (en) * | 2006-06-13 | 2009-08-19 | Thales Holdings Uk Plc | An ultra wideband antenna |
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- 2013-05-24 WO PCT/CN2013/076224 patent/WO2014121568A1/en active Application Filing
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| WO1995020829A1 (en) * | 1994-01-28 | 1995-08-03 | Motorola Inc. | Electrical circuit using low volume multilayer transmission line devices |
| CN1192061A (en) * | 1997-02-28 | 1998-09-02 | 安德鲁公司 | Strip-type radiating cable for communications system |
| TW200743254A (en) * | 2006-05-09 | 2007-11-16 | Inventec Corp | Across-trench circuitry for high-speed signal transmission |
| CN101615711A (en) * | 2009-06-10 | 2009-12-30 | 东南大学 | Folding self-die substrate integrated waveguide |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014121568A1 (en) | 2014-08-14 |
| CN103117440A (en) | 2013-05-22 |
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