CN104779013A - Novel low-loss transmission line - Google Patents
Novel low-loss transmission line Download PDFInfo
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- CN104779013A CN104779013A CN201510192738.7A CN201510192738A CN104779013A CN 104779013 A CN104779013 A CN 104779013A CN 201510192738 A CN201510192738 A CN 201510192738A CN 104779013 A CN104779013 A CN 104779013A
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Abstract
The invention discloses a novel low-loss transmission line which comprises an insulation layer, adhesive layers, a dielectric layer and a connection layer, wherein the connection layer comprises at least three layers; a first signal island and a first gap surrounding the first signal island are arranged on a first connection layer unit; a second gap is arranged on a third connection layer unit; a second connection layer unit is arranged between the first connection layer unit and the third connection layer unit; a signal line is arranged on the second connection layer unit; a through hole is formed in the second connection layer unit, penetrates through the first connection layer unit and the third connection layer unit, and is used for communicating the signal island of the first connection layer unit and the signal island of the third connection layer unit; the dielectric layer is arranged between the adjacent connection layer units; the adhesive layers are arranged between the dielectric layer and the connection layer units and/or between two adjacent dielectric layers, and are low-temperature adhesive layers; the insulation layer is arranged outside the outermost connection layer unit. The novel low-loss transmission line adopts a low-temperature lamination manner, and is high in performance and low in cost.
Description
Technical field
The present invention relates to communications electronics field of signal transmissions, particularly a kind of novel low loss line.
Background technology
Low loss line (Flat cable) is the part of a kind of signal transmission and energy, is widely used in the communications electronics fields such as mobile phone, panel computer and computer.
Conventional low loss line adopts the dielectric layer of hot properties and the adhesive layer of hot properties to be manufactured by the mode of high-temperature laminating, and this pressing mode needs to continue just can complete pressing in 3 hours under 300 DEG C of high temperature.In order to reach pressing condition during high-temperature laminating, need to utilize special high temperature furnace to realize, its heat up needed for time long, and temperature is high, wastes energy greatly, makes the cost of manufacture of Flat cable very expensive.
But along with the development trend that electronic product is lightening, demand and the application of Flat cable get more and more, and are badly in need of a kind of transmission line of low cost to meet large batch of demand.
Summary of the invention
The present invention is directed to above-mentioned problems of the prior art, propose a kind of novel low loss line, adopt the mode of low temperature pressing, transmission line performance is high, and cost is low.
For solving the problems of the technologies described above, the present invention is achieved through the following technical solutions:
The invention provides a kind of novel low loss line, it comprises: insulating barrier, adhesive layer, dielectric layer and articulamentum; Wherein:
Described articulamentum at least comprises three articulamentum unit, be respectively the first articulamentum unit, the second articulamentum unit and the 3rd articulamentum unit, described first articulamentum unit is provided with the first signal island and the first gap around the first signal island, described 3rd articulamentum is provided with the second gap;
Described second articulamentum unit is arranged between described first articulamentum unit and described 3rd articulamentum unit, described second articulamentum unit is provided with holding wire, and described second articulamentum unit is provided with the first via and the second via, the through described first articulamentum unit of described first via, for being communicated with described first signal island and described holding wire, the through described first articulamentum unit of described second via and described 3rd articulamentum unit, for the ground on the ground and described 3rd articulamentum unit that are communicated with described first articulamentum unit;
Described dielectric layer is arranged between two adjacent described articulamentum unit;
Described adhesive layer to be arranged between described dielectric layer and described articulamentum unit and/or described in adjacent two between dielectric layer, and described adhesive layer is low temperature adhesion layer;
Described insulating barrier is arranged at the outside of outermost described articulamentum unit.
Preferably, the pressing-in temp of described low temperature adhesion layer is lower than 220 degrees Celsius, and required pressing-in temp is low, and pressing time is short, saves energy, reduces the cost of transmission line.
Preferably, described 3rd articulamentum unit is provided with secondary signal island, and described secondary signal island is positioned at described second gap; Through described first articulamentum of described first via and the 3rd articulamentum, for being communicated with described first signal island, described holding wire and described secondary signal island.
Preferably, the single or double of described dielectric layer is provided with layers of copper, and at least one described dielectric layer is one side is provided with layers of copper, comprises described adhesive layer between the one side not being provided with layers of copper of described dielectric layer and described articulamentum unit; When described dielectric layer two-sided is all provided with layers of copper, between itself and described articulamentum unit, do not comprise described adhesive layer.Dielectric layer is two-sided is all provided with layers of copper, saves the quantity of adhesive layer, simplifies the structure of transmission line, reduces cost.
Preferably, when the quantity of described dielectric layer is at least three layers, middle the two-sided of described dielectric layer is not provided with layers of copper, and it is two-sided is all connected with adhesive layer.Laminated layer is set, adds the thickness between articulamentum, make its transmission performance better.
Preferably, the quantity of the holding wire on described second articulamentum unit is at least two, is provided with described second via between adjacent two described holding wires.Intermediate connecting layer unit arranges many signal line, improve the inner space utilance of transmission line, the ground of the ground of the first articulamentum and the 3rd articulamentum is connected together by the second via, shield the interference between two signal line, while transmission line space availability ratio is provided, improve the transmission performance of transmission line.
Preferably, the quantity of described second via between every two signal line is multiple, reaches better shield effectiveness.
Preferably, described first via and/or described second via are that circular metalized via hole or oval metal cross groove.
Preferably, the edge of described second articulamentum unit is provided with edge via, described edge via is for the ground on the ground and described 3rd articulamentum unit that are communicated with described first articulamentum unit, if arrange circular hole to be communicated with ground wire, distance between the edge of circular hole and articulamentum unit and holding wire has certain requirement, arrange after edge via is communicated with ground wire, the distance between edge via and holding wire has requirement, saves the width of transmission line.
Preferably, described edge via is half-round metal groove or metallization limit.
Preferably, the quantity on described first signal island is multiple, and the quantity in described first gap is corresponding with the quantity on described first signal island; The quantity on described secondary signal island is also multiple, and the quantity in described second gap is corresponding with the quantity on described secondary signal island, can improve the inner space utilance of transmission line, reduces the space shared by transmission line.
Compared to prior art, the present invention has the following advantages:
Novel low loss line provided by the invention, adhesive layer adopts low temperature pressing material, while the transmission performance ensureing transmission line, reduce the cost of transmission line, and low temperature pressing more easily realizes, simple to operate.
Certainly, implement arbitrary product of the present invention might not need to reach above-described all advantages simultaneously.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, embodiments of the present invention are described further:
Fig. 1 is the sectional view of the low loss line of embodiments of the invention 1;
Fig. 2 is the schematic diagram of the first insulating barrier unit of the low loss line of embodiments of the invention 1;
Fig. 3 is the schematic diagram of the first articulamentum unit of the low loss line of embodiments of the invention 1;
Fig. 4 is the first medium layer unit of the low loss line of embodiments of the invention 1 or the schematic diagram of second medium layer unit or low temperature adhesion layer;
Fig. 5 is the schematic diagram of the second articulamentum unit of the low loss line of embodiments of the invention 1;
Fig. 6 is the schematic diagram of the 3rd articulamentum unit of the low loss line of embodiments of the invention 1;
Fig. 7 is the schematic diagram of the second insulating barrier unit of the low loss line of embodiments of the invention 1;
Fig. 8 is the sectional view of the low loss line of embodiments of the invention 2;
Fig. 9 is the schematic diagram of the first insulating barrier unit of the low loss line of embodiments of the invention 2;
Figure 10 is the schematic diagram of the first articulamentum unit of the low loss line of embodiments of the invention 2;
Figure 11 is the first medium layer unit of the low loss line of embodiments of the invention 2 or the schematic diagram of second medium layer unit or low temperature adhesion layer;
Figure 12 is the schematic diagram of the second articulamentum unit of the low loss line of embodiments of the invention 2;
Figure 13 is the schematic diagram of the 3rd articulamentum unit of the low loss line of embodiments of the invention 2;
Figure 14 is the schematic diagram of the second insulating barrier unit of the low loss line of embodiments of the invention 2;
Figure 15 is a kind of implementation of the via of low loss line of the present invention;
Figure 16 is the another kind of implementation of the via of low loss line of the present invention;
Figure 17 is a kind of implementation of the edge via of low loss line of the present invention;
Figure 18 is the another kind of implementation of the edge via of low loss line of the present invention;
Figure 19 is the return loss plot of the low loss line of embodiments of the invention 2;
Figure 20 is the insertion loss figure of the low loss line of embodiments of the invention 2.
Label declaration: 1-first insulating barrier unit, 2-first articulamentum unit, 3-first medium layer unit, 4-second articulamentum unit, 5-low temperature adhesion layer, 6-second medium layer unit, 7-the 3rd articulamentum unit, 8-second insulating barrier unit;
21-first signal island, 22-first gap;
41-holding wire one, 42-holding wire two, 43-first via, 44-second via, 45-edge via;
71-secondary signal island, 72-second gap.
Embodiment
Elaborate to embodiments of the invention below, the present embodiment is implemented under premised on technical solution of the present invention, give detailed execution mode and concrete operating process, but protection scope of the present invention is not limited to following embodiment.
embodiment 1:
Composition graphs 1-Fig. 7, describes an embodiment of low loss line of the present invention in detail, for three layers of articulamentum unit, is respectively the first articulamentum unit 2, second articulamentum unit 4 and the 3rd articulamentum unit 7; Correspondingly, insulating barrier comprises two-layer, is respectively the first insulating barrier unit 1, second insulating barrier unit 8; Dielectric layer comprises two-layer, is respectively first medium layer unit 3, second medium layer unit 6; Low temperature adhesion layer 5 comprises one deck.Be illustrated in figure 1 the sectional view of the low loss line of the present embodiment, second articulamentum unit 4 is between the first articulamentum unit 2 and the 3rd articulamentum unit 7, first insulating barrier unit 1 is positioned at the top of the first articulamentum unit 2, second insulating barrier unit 8 is positioned at the below of the 3rd articulamentum unit 7, first medium layer unit 3 is between the first articulamentum unit 2 and the second articulamentum unit 4, second medium layer unit 6 is between the second articulamentum unit 4 and the 3rd articulamentum unit 7, low temperature adhesion layer 5 is between the second articulamentum unit 4 and second medium layer unit 6.Low temperature adhesion layer 5 is for being bonded together up-down structure; Two dielectric layers and three articulamentum unit are Energy Transfer region.
In the present embodiment, first medium layer unit 3 is doubling plate, its both sides are all provided with layers of copper, itself and do not need to arrange low temperature adhesion layer 5 between the first articulamentum unit 2 and the second articulamentum unit 4, second medium layer unit 6 is lamina, downside is only had to be provided with layers of copper, do not need to arrange low temperature adhesion layer 5 between itself and the 3rd articulamentum unit 7, and be provided with low temperature adhesion layer 5 between the second articulamentum unit 4, use doubling plate can simplify the structure of transmission line, only need one deck low temperature adhesion layer 5, reduce the cost of manufacture of transmission line.The schematic diagram of first medium layer unit 3 as shown in Figure 4, on it, via is corresponding with the via of upper and lower articulamentum unit, the structure of second medium layer unit 6 and low temperature adhesion layer 5 and the similar of first medium layer 3, also as shown in Figure 4, repeat no more herein.
In different embodiment, the side being provided with layers of copper of dielectric layer also can arrange adhesive layer; Dielectric layer can be also all lamina, now need three layers of dielectric layer, the articulamentum unit that the side being provided with layers of copper of three layers of dielectric layer is different from three respectively connects, now need two-layer low temperature adhesion layer 5, as: be followed successively by the first insulating barrier, the first articulamentum unit, first medium layer unit from top to bottom, the first low temperature adhesion layer unit, second medium layer unit, the second articulamentum unit, the second low temperature adhesion layer unit, the 3rd dielectric layer unit, the 3rd articulamentum unit and the second insulating barrier unit; Also can first medium layer unit 3 be doubling plate, second medium layer unit 6 be lamina.When dielectric layer comprises at least three layers, be positioned at middle dielectric layer and also two-sidedly layers of copper can be set, now two-sidedly all connect low temperature adhesion layer.
The two ends of the first articulamentum unit 2 are respectively arranged with one first signal island 21 and one first gap 22, gap 22, first is arranged around the first signal island 21, as shown in Figure 3; The two ends of the 3rd articulamentum unit 7 are respectively arranged with a secondary signal island 71 and one second gap 72, gap 72, second is arranged around gap 71, as shown in Figure 6.The schematic diagram of the second articulamentum unit 4 as shown in Figure 5, be provided with a signal line 1, and be provided with the first via 43 and the second via 44, first via 43 and the through first articulamentum unit 2 of the second via 44 and the 3rd articulamentum unit 7, first via 43 is for connecting the first signal island 21 and secondary signal island 71, second via 44 ground for the ground and the 3rd articulamentum unit 7 that connect the first articulamentum unit 2.
In preferred embodiment, the edge of the second articulamentum unit 4 is provided with edge via 45, through first articulamentum unit 2 and the 3rd articulamentum unit 7, and for the ground on the ground and the 3rd articulamentum unit 7 that are communicated with the first articulamentum unit 2, shield effectiveness is better.
First insulating barrier unit 1 is corresponding with the shape of articulamentum unit and dielectric layer with the shape of the second insulating barrier unit 8, respectively as shown in Figure 2 and Figure 7.
In different embodiment, 3rd articulamentum unit 7 also can not arrange secondary signal island 71, only retain the second gap 72, now the first via 43 does not need through 3rd articulamentum unit 7, only need be communicated with the first signal island 21 of the first articulamentum unit 2 and the holding wire of the second articulamentum unit 4.
embodiment 2:
Composition graphs 8-Figure 14, describes another embodiment of low loss line of the present invention in detail, and it is also for three layers of articulamentum unit, and the position relationship of insulating barrier, adhesive layer, dielectric layer and articulamentum unit is identical with embodiment, repeats no more herein.
As different from Example 1, second articulamentum unit 4 is provided with two signal line, be respectively holding wire 1 and holding wire 2 42, as shown in Figure 8, the second via 44 is provided with between holding wire 1 and holding wire 2 42, holding wire both sides are provided with the first via 43, as shown in figure 12, secondary signal island 71, second via 44 that first via 43 is communicated with on the first signal island 21 of the first articulamentum unit 2 and the 3rd articulamentum unit 7 is communicated with the ground of the first articulamentum unit 2 and the ground of the 3rd articulamentum unit 7.Therefore, the second via 44 is set between holding wire 41 and holding wire 42, can influencing each other between shielded signal line 1 and holding wire 42, avoid the interference between two signal line.
Accordingly, corresponding two the first signal islands 21 of every signal line and secondary signal island 71, therefore, in the present embodiment, the first articulamentum unit 2 comprises four ends, is respectively arranged with one first signal island 41, as shown in Figure 10; 3rd articulamentum unit 7 also comprises four ends, is respectively arranged with a secondary signal island 71, as shown in figure 13.
In preferred embodiment, the edge of the second articulamentum unit 4 is provided with edge via 45, through first articulamentum unit 2 and the 3rd articulamentum unit 7, and for the ground on the ground and the 3rd articulamentum unit 7 that are communicated with the first articulamentum unit 2, shield effectiveness is better.
In the present embodiment, the first insulating barrier unit 1 is corresponding with the shape of articulamentum unit and dielectric layer with the shape of the second insulating barrier unit 2, respectively as shown in Fig. 9 and Figure 14.
In above-described embodiment, the implementation of the first via 43 and the second via 44 can have a variety of, and this sentences two kinds for example, is its a kind of implementation as shown in figure 15, and it is circular metallization via hole; Be its another kind of implementation as shown in figure 16, its be oval metallization groove; The implementation of edge via also can have a variety of, and this sentences two kinds for example, and be its a kind of implementation as shown in figure 17, it is semicircular metallization groove; Be its another kind of implementation as shown in figure 18, it is metallization limit.
In different embodiment, the quantity of articulamentum unit differs and is decided to be three layers, can depend on the circumstances, and can be four layers or more; The shape of holding wire, also not necessarily as described in above-described embodiment, can be straight line, curve or the shape needed for other.
The adhesive layer of the low loss line of the present embodiment adopts low temperature adhesion material, and pressing-in temp is low, is less than 220 degrees Celsius, intensification required time is short, has saved energy, reduces the cost of transmission line, and transmission performance is good, respectively as illustrated in figures 19 and 20, this sentences intermediate connecting layer, and to arrange a signal line be example, as can be seen from Figure for its return loss and insertion loss, the return loss of holding wire is less than-25dB, port match is better, and insertion loss is also very little, and transmission performance is more excellent.
Disclosed herein is only the preferred embodiments of the present invention, and this specification is chosen and specifically described these embodiments, and being to explain principle of the present invention and practical application better, is not limitation of the invention.The modifications and variations that any those skilled in the art do within the scope of specification, all should drop in scope that the present invention protects.
Claims (11)
1. a novel low loss line, is characterized in that, comprising: insulating barrier, adhesive layer, dielectric layer and articulamentum; Wherein:
Described articulamentum at least comprises three articulamentum unit, be respectively the first articulamentum unit, the second articulamentum unit and the 3rd articulamentum unit, described first articulamentum unit is provided with the first signal island and the first gap around the first signal island, described 3rd articulamentum is provided with the second gap;
Described second articulamentum unit is arranged between described first articulamentum unit and described 3rd articulamentum unit, described second articulamentum unit is provided with holding wire, and described second articulamentum unit is provided with the first via and the second via, the through described first articulamentum unit of described first via, for being communicated with described first signal island and described holding wire, the through described first articulamentum unit of described second via and described 3rd articulamentum unit, for the ground on the ground and described 3rd articulamentum unit that are communicated with described first articulamentum unit;
Described dielectric layer is arranged between two adjacent described articulamentum unit;
Described adhesive layer to be arranged between described dielectric layer and described articulamentum unit and/or described in adjacent two between dielectric layer, and described adhesive layer is low temperature adhesion layer;
Described insulating barrier is arranged at the outside of outermost described articulamentum unit.
2. low loss line according to claim 1, is characterized in that, the pressing-in temp of described low temperature adhesion layer is lower than 220 degrees Celsius.
3. low loss line according to claim 1, is characterized in that, described 3rd articulamentum unit is provided with secondary signal island, and described secondary signal island is positioned at described second gap;
Through described first articulamentum of described first via and the 3rd articulamentum, for being communicated with described first signal island, described holding wire and described secondary signal island.
4. low loss line according to claim 1, it is characterized in that, the single or double of described dielectric layer is provided with layers of copper, and at least one described dielectric layer is one side is provided with layers of copper, comprises described adhesive layer between the one side not being provided with layers of copper of described dielectric layer and described articulamentum unit;
When described dielectric layer two-sided is all provided with layers of copper, between itself and described articulamentum unit, do not comprise described adhesive layer.
5. the low loss line according to right 1, is characterized in that, when the quantity of described dielectric layer is at least three layers, middle the two-sided of described dielectric layer is not provided with layers of copper, and it is two-sided is all connected with adhesive layer.
6. low loss line according to claim 1, is characterized in that, the quantity of the holding wire on described second articulamentum unit is at least two, is provided with described second via between adjacent two described holding wires.
7. low loss line according to claim 6, is characterized in that, the quantity of the described via between every two signal line is multiple.
8. low loss line according to claim 1, is characterized in that, described first via and/or described second via are that circular metalized via hole or oval metal cross groove.
9. the low loss line according to any one of claim 1 to 8, it is characterized in that, the edge of described second articulamentum unit is provided with edge via, and described edge via is for the ground on the ground and described 3rd articulamentum unit that are communicated with described first articulamentum unit.
10. low loss line according to claim 9, is characterized in that, described edge via is half-round metal groove or metallization limit.
11. low loss lines according to claim 3, is characterized in that, the quantity on described first signal island is multiple, and the quantity in described first gap is corresponding with the quantity on described first signal island;
The quantity on described secondary signal island is also multiple, and the quantity in described second gap is corresponding with the quantity on described secondary signal island.
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| CN201510192738.7A CN104779013B (en) | 2015-04-22 | 2015-04-22 | Low-loss transmission line |
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| CN201510192738.7A CN104779013B (en) | 2015-04-22 | 2015-04-22 | Low-loss transmission line |
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| CN104779013A true CN104779013A (en) | 2015-07-15 |
| CN104779013B CN104779013B (en) | 2017-01-25 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1192061A (en) * | 1997-02-28 | 1998-09-02 | 安德鲁公司 | Strip-type radiating cable for communications system |
| EP2456005A1 (en) * | 2009-07-13 | 2012-05-23 | Murata Manufacturing Co., Ltd. | Signal line and circuit board |
| CN103117440A (en) * | 2013-02-07 | 2013-05-22 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN103259069A (en) * | 2013-04-12 | 2013-08-21 | 上海安费诺永亿通讯电子有限公司 | Transmission line capable of reducing loss |
| CN104393392A (en) * | 2015-01-04 | 2015-03-04 | 中国电子科技集团公司第十研究所 | Preparation method of microwave and millimeter-wave strip transmission line |
| CN204596531U (en) * | 2015-04-22 | 2015-08-26 | 上海安费诺永亿通讯电子有限公司 | A kind of novel low loss line |
-
2015
- 2015-04-22 CN CN201510192738.7A patent/CN104779013B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1192061A (en) * | 1997-02-28 | 1998-09-02 | 安德鲁公司 | Strip-type radiating cable for communications system |
| EP2456005A1 (en) * | 2009-07-13 | 2012-05-23 | Murata Manufacturing Co., Ltd. | Signal line and circuit board |
| CN103117440A (en) * | 2013-02-07 | 2013-05-22 | 上海安费诺永亿通讯电子有限公司 | Low-loss flat transmission line |
| CN103259069A (en) * | 2013-04-12 | 2013-08-21 | 上海安费诺永亿通讯电子有限公司 | Transmission line capable of reducing loss |
| CN104393392A (en) * | 2015-01-04 | 2015-03-04 | 中国电子科技集团公司第十研究所 | Preparation method of microwave and millimeter-wave strip transmission line |
| CN204596531U (en) * | 2015-04-22 | 2015-08-26 | 上海安费诺永亿通讯电子有限公司 | A kind of novel low loss line |
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