CN103105084A - Heat pipe and capillary organization composition structure thereof - Google Patents
Heat pipe and capillary organization composition structure thereof Download PDFInfo
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- CN103105084A CN103105084A CN2011103544225A CN201110354422A CN103105084A CN 103105084 A CN103105084 A CN 103105084A CN 2011103544225 A CN2011103544225 A CN 2011103544225A CN 201110354422 A CN201110354422 A CN 201110354422A CN 103105084 A CN103105084 A CN 103105084A
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Abstract
The invention relates to a heat pipe and a capillary organization composition structure thereof. The heat pipe comprises a heat pipe main body, a capillary organization and work fluid, wherein the heat pipe main body comprises an inner wall face, the capillary organization is combined on the inner wall face, the capillary organization comprises 30 weight percentage of first capillary fine powder and 70 weight percentage of second capillary fine powder, the particle diameter of the first capillary fine powder is smaller than that of the second capillary fine powder, the work fluid is injected into the heat pipe main body, and the first fine powder and the second fine powder are evenly mixed to be sintered on the inner wall face of the heat pipe. Thus, the heat pipe can achieve the maximum work efficiency to quickly remove heat energy generated by electronic elements.
Description
Technical field
The present invention is relevant with heat pipe structure, particularly relevant for a kind of capillary tissue structure of heat pipe.
Background technology
General heat pipe (Heat pipe) is comprised of copper pipe, capillary structure (capillary wick) and the working fluid (working fluid) that is sealed in pipe.Its occupation mode is the heating end of heat pipe to be attached at the surface of heat-generating electronic elements, when the working fluid of heating end inside absorbs heat and vapour pressure increased gradually when vaporizing, and flows to form vapor stream towards the low colling end of pressure; On the other hand, when steam can regelation become liquid form after the colling end release heat, be back to heating end via capillary structure, the action that the working fluid by inside heat pipe goes round and begins again is promptly to remove the heat energy rapid moving that electronic component was produced again.
Yet, also need with it frivolous and lightweight in order to carrying therefore be used for the heat pipe of heat radiation because electronic installation requirement now is day by day frivolous, therefore, how to utilize frivolous heat pipe, make it reach maximum task performance, be this case inventor's research motivation.
Hold, can be subjected to the impact of poor and backflow resistance two factors of capillary pressure due to the service behaviour of heat pipe, this two factor changes along with the pore size of capillary structure, when hole hour, its capillary pressure is poor larger, can order about coagulating liq enters in capillary structure and refluxes to evaporation ends, yet, the capillary porosity hour, the frictional force that its hydraulic fluid refluxes and viscous force increase, be that hydraulic fluid backflow resistance increases, cause the hydraulic fluid back-flow velocity slow, easily make heat pipe in evaporation ends generation dry combustion method phenomenon; In like manner, when the capillary porosity is larger, although hydraulic fluid is subject to less backflow resistance, make coagulating liq suck interior poor the reducing of capillary pressure of capillary structure, reduce the hydraulic fluid capacity of returns, also can make heat pipe in evaporation ends generation dry combustion method phenomenon.
Summary of the invention
A purpose of the present invention is to provide a kind of composition structure of heat pipe capillary structure, can make heat pipe reach maximum task performance, with rapid moving except heat energy that electronic component was produced.
In order to reach above-mentioned purpose, the present invention is a kind of composition structure of heat pipe capillary structure, comprise one first capillary powder and one second capillary powder, the first capillary powder diameter is below 100 sieve meshes, and the first capillary powder accounts for 30 percentage by weights of capillary structure, and the second capillary powder diameter is between 80 sieve mesh to 100 sieve meshes, the second capillary powder accounts for 70 percentage by weights of capillary structure, wherein, the first capillary powder and the second capillary powder evenly mix, and sintering is at the internal face of heat pipe.
In order to reach above-mentioned purpose, the present invention is a kind of composition structure of heat pipe capillary structure, comprise the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of this first capillary powder is less than the particle diameter of the second capillary powder, this the first capillary powder and this second capillary powder evenly mix, and sintering is at the internal face of heat pipe.
In order to reach above-mentioned purpose, the present invention is a kind of heat pipe, comprise heat pipe body, capillary structure and working fluid, the heat pipe body has an internal face, capillary structure is combined on internal face, capillary structure comprises the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of the first capillary powder is less than the particle diameter of the second capillary powder, and the first capillary powder and the second capillary powder evenly mix, and sintering is at the internal face of heat pipe, working fluid is filled in the heat pipe body, and infiltrates between capillary structure.
Another object of the present invention, be to provide a kind of composition structure of heat pipe capillary structure, its the first capillary powder accounts for 30 percentage by weights of capillary structure, the second capillary powder diameter is about 70 percentage by weights, ratio according to this, can under most economical cost is considered, make heat pipe reach best task performance.
Compared to known technology, capillary structure of the present invention comprises the first capillary powder (fine powder) and the second capillary powder (meal), evenly mix according to certain particle size and percentage by weight (the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights), under this ratio, can form suitable pore size between the first capillary powder and the second capillary powder, to obtain better balance under two kinds of factors of capillary pressure and backflow resistance, make working fluid (heat pipe) reach best task performance; Moreover, due to the task performance of heat pipe not along with the percentage by weight of the second capillary powder is directly proportional, when the percentage by weight of the second capillary powder during higher than 70 percentage by weight, the task performance of heat pipe is not along with the raising of the percentage by weight of the second capillary powder and improve, but increase on the contrary the cost of heat pipe, therefore, the present invention can under most economical cost is considered, make heat pipe reach best task performance.
Description of drawings
Fig. 1 is the Pou Shi Tu ﹔ of heat pipe of the present invention
Fig. 2 is the large Shi Yi of the Fang of capillary structure of the present invention Tu ﹔
Fig. 3 is the comparison diagram of the radiating effect of heat pipe of the present invention and other heat pipes.
The main element symbol description:
1 heat pipe
10 heat pipe body 11 internal face 20 capillary structure 21 first capillary powder
22 second capillary powder 30 working fluids.
The specific embodiment
The invention will be further described below in conjunction with the drawings and specific embodiments, can be implemented so that those skilled in the art can better understand the present invention also, but illustrated embodiment is not as a limitation of the invention.
Please refer to Fig. 1 and Fig. 2, be respectively cutaway view, and the enlarged diagram of capillary structure of heat pipe of the present invention; Heat pipe 1 of the present invention comprises a heat pipe body 10, capillary structure 20, reaches working fluid 30.This capillary structure 20 is combined on the internal face 11 of this heat pipe body 10, and this working fluid 30 is filled in this heat pipe body 10.
This heat pipe body 10 is made by the good material of thermal conductivity, and as aluminium, copper etc., and the internal face of this heat pipe body 10 is pasted with capillary structure 20, and 30 of this working fluids are to inject in this heat pipe body 10, and infiltrate between capillary structure 20.
In the present embodiment, the unit of this capillary structure 20 is " sieve mesh " (mesh, sieve mesh, screen mesh), be the number of the sieve aperture that has of sieve unit are, also can be called for short " order ", the sieve mesh of the multiplex standard screen of industry represents the particle size by the powder of standard sieve, sieve mesh is less, and the expression particle diameter is larger.
This capillary structure 20 comprises one first capillary powder 21 and one second capillary powder 22.The particle diameter of this first capillary powder 21 is less than the particle diameter of the second capillary powder 22.This first capillary powder 21 and this second capillary powder 22 evenly mix, and sintering is at the internal face 11 of this heat pipe body 10.Preferably, this capillary structure 20 comprises the first capillary powder 21 of 30 percentage by weights and the second capillary powder 22 of 70 percentage by weights.
Illustrate in greater detail the composition structure of this capillary structure 20.The particle diameter of this first capillary powder 10 (fine powder) below 100 sieve meshes, and this first capillary powder 21 accounts for 30 percentage by weights of this capillary structure 20, in addition, the particle diameter of this second capillary powder 22 is between 80 sieve mesh to 100 sieve meshes (meal), and this second capillary powder 22 accounts for 70 percentage by weights of this capillary structure 20.
This first capillary powder 21 and this second capillary powder 22 are identical material, and in the present embodiment, this first capillary powder 21 and the second capillary powder 22 are all copper powder.
Please continue with reference to Fig. 3, be the comparison diagram of the radiating effect of heat pipe of the present invention and other heat pipes; In figure, straight line A, B, C represent that respectively heat pipe A, heat pipe B and heat pipe C are for the different wattage light fixtures rear measured Temperature numerical of dispelling the heat, wherein, heat pipe A, heat pipe B and the heat pipe C heat pipe for being consisted of by the first capillary powder 21 and the second capillary powder 22 of Different Weight percentage.Straight line A is heat pipe A of the present invention, and this heat pipe A comprises the first capillary powder 21 of 30 percentage by weights and the second capillary powder 22 of 70 percentage by weights; Moreover this heat pipe B comprises the first capillary powder 21 of 45 percentage by weights and the second capillary powder 22 of 55 percentage by weights; This heat pipe C comprises the first capillary powder 21 of 55 percentage by weights and the second capillary powder 22 of 45 percentage by weights.
As can be seen from Figure 3, straight line A is measured lower lamp temperatures under the light fixture of different wattages, show and use heat pipe A of the present invention can obviously have better radiating effect, that is, other heat pipes are under identical condition, and the composition structure of the capillary structure 20 of heat pipe A can reach maximum task performance.
The above embodiment is the preferred embodiment that proves absolutely that the present invention lifts, and protection scope of the present invention is not limited to this.Being equal to that those skilled in the art do on basis of the present invention substitutes or conversion, all within protection scope of the present invention.Protection scope of the present invention is as the criterion with claims.
Claims (10)
1. the composition structure of a heat pipe capillary structure, is characterized in that, comprising:
One first capillary powder, its particle diameter are below 100 sieve meshes, and this first capillary powder accounts for 30 percentage by weights of described capillary structure; And
One second capillary powder, its particle diameter are between 80 sieve mesh to 100 sieve meshes, and this second capillary powder accounts for 70 percentage by weights of described capillary structure;
Wherein, this first capillary powder and this second capillary powder evenly mix, and sintering is at the internal face of described heat pipe.
2. the composition structure of heat pipe capillary structure as claimed in claim 1, is characterized in that, this first capillary powder and this second capillary powder are identical material.
3. the composition structure of heat pipe capillary structure as claimed in claim 2, is characterized in that, this first capillary powder and this second capillary powder are copper powder.
4. the composition structure of a heat pipe capillary structure, it is characterized in that, comprise the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of this first capillary powder is less than the particle diameter of the second capillary powder, this the first capillary powder and this second capillary powder evenly mix, and sintering is at the internal face of described heat pipe.
5. the composition structure of heat pipe capillary structure as claimed in claim 4, is characterized in that, the particle diameter of this first capillary powder is below 100 sieve meshes, and the particle diameter of this second capillary powder is between 80 sieve mesh to 100 sieve meshes.
6. the composition structure of heat pipe capillary structure as claimed in claim 5, is characterized in that, this first capillary powder and the second capillary powder are identical material.
7. the composition structure of heat pipe capillary structure as claimed in claim 6, is characterized in that, this first capillary powder and this second capillary powder are copper powder.
8. a heat pipe, is characterized in that, comprises:
One heat pipe body has an internal face;
One capillary structure, be combined on this internal face, this capillary structure comprises the first capillary powder of 30 percentage by weights and the second capillary powder of 70 percentage by weights, the particle diameter of this first capillary powder is less than the particle diameter of the second capillary powder, and this first capillary powder and this second capillary powder evenly mix, and sintering is at this internal face; And
One working fluid is filled in this heat pipe body, and infiltrates between capillary structure.
9. heat pipe as claimed in claim 8, is characterized in that, the particle diameter of this first capillary powder is below 100 sieve meshes, and the particle diameter of this second capillary powder is between 80 sieve mesh to 100 sieve meshes, and this first capillary powder and the second capillary powder are identical material.
10. heat pipe as claimed in claim 9, is characterized in that, this first capillary powder and the second capillary powder are copper powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201110354422.5A CN103105084B (en) | 2011-11-10 | 2011-11-10 | The composition structure of heat pipe and capillary structure thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201110354422.5A CN103105084B (en) | 2011-11-10 | 2011-11-10 | The composition structure of heat pipe and capillary structure thereof |
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| CN103105084A true CN103105084A (en) | 2013-05-15 |
| CN103105084B CN103105084B (en) | 2015-08-12 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111531165A (en) * | 2020-05-12 | 2020-08-14 | 江苏集萃先进金属材料研究所有限公司 | Copper paste for ultrathin phase-change heat dissipation module |
| CN111761050A (en) * | 2019-04-01 | 2020-10-13 | 广州力及热管理科技有限公司 | Method for manufacturing capillary structure by using metal slurry |
| CN112484545A (en) * | 2020-12-01 | 2021-03-12 | 奇鋐科技股份有限公司 | Thin two-phase flow device |
| US11732974B2 (en) | 2021-01-06 | 2023-08-22 | Asia Vital Components Co., Ltd. | Thin-type two-phase fluid device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2773601Y (en) * | 2005-02-17 | 2006-04-19 | 徐惠群 | Multi-layer capillary tissue of hot pipe |
| CN1808044A (en) * | 2005-01-22 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Sintering type heat pipe and manufacturing method thereof |
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
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2011
- 2011-11-10 CN CN201110354422.5A patent/CN103105084B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1961191A (en) * | 2004-04-21 | 2007-05-09 | 热力公司 | Heat transfer device and method of making same |
| CN1808044A (en) * | 2005-01-22 | 2006-07-26 | 富准精密工业(深圳)有限公司 | Sintering type heat pipe and manufacturing method thereof |
| CN2773601Y (en) * | 2005-02-17 | 2006-04-19 | 徐惠群 | Multi-layer capillary tissue of hot pipe |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111761050A (en) * | 2019-04-01 | 2020-10-13 | 广州力及热管理科技有限公司 | Method for manufacturing capillary structure by using metal slurry |
| CN111761050B (en) * | 2019-04-01 | 2022-06-03 | 广州力及热管理科技有限公司 | Method for manufacturing capillary structure by using metal slurry |
| CN111531165A (en) * | 2020-05-12 | 2020-08-14 | 江苏集萃先进金属材料研究所有限公司 | Copper paste for ultrathin phase-change heat dissipation module |
| CN112484545A (en) * | 2020-12-01 | 2021-03-12 | 奇鋐科技股份有限公司 | Thin two-phase flow device |
| US11732974B2 (en) | 2021-01-06 | 2023-08-22 | Asia Vital Components Co., Ltd. | Thin-type two-phase fluid device |
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| CN103105084B (en) | 2015-08-12 |
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