CN103098574A - Conductive grounding pad - Google Patents
Conductive grounding pad Download PDFInfo
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- CN103098574A CN103098574A CN2011800436918A CN201180043691A CN103098574A CN 103098574 A CN103098574 A CN 103098574A CN 2011800436918 A CN2011800436918 A CN 2011800436918A CN 201180043691 A CN201180043691 A CN 201180043691A CN 103098574 A CN103098574 A CN 103098574A
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- China
- Prior art keywords
- conductor layer
- adhesive phase
- face
- froth bed
- conductor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
- H05K9/0016—Gaskets or seals having a spring contact
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
Abstract
Compressible grounding pads with two conductor layers separated by a compressible foam layer comprise: a first conductor layer, e.g., copper foil; a first adhesive layer in direct contact with a part of the first conductor layer, the first conductor layer extending beyond the first adhesive layer; a foam layer in direct contact with one facial side of the first adhesive layer; a second adhesive layer in direct contact with the opposite facial side of foam layer; a second conductor layer, e.g., copper foil, in direct contact with the second adhesive layer, the second conductor layer extending beyond the second adhesive layer such that the second conductor layer joins with the first conductor layer; an electrically conductive third adhesive layer in direct contact with the facial surface opposite the facial surface that is in direct contact with the second conductor layer; and an optional release liner in direct contact with the third adhesive layer.
Description
Cross reference to related application
The application requires the priority of No. 61/365837, the U.S. Patent application submitted on July 20th, 2010, and the full content of this application comprises in this application by reference.
Technical field
The present invention relates to ground mat.In one aspect, the present invention relates to comprise the ground mat of single conductor layer and single compressibility froth bed, and in yet another aspect, the present invention relates to comprise the ground mat of two conductor layers that separated by single compressibility froth bed.Aspect another one, the present invention relates to comprise one or the other the electric device in these ground mats, and in yet another aspect, the present invention relates to construct the method for these ground mats.
Background technology
Ground mat also referred to as electromagnetic interference (electromagnetic interference, EMI) pad, is used in various application, and electromagnetic radiation may be disturbed the operation of electric devices such as cell phone, television set, monitor in these are used.These pads typically comprise for example electric conductor of Copper Foil, and it has the means that this conductor are attached to the one or more electric components in the residing device of this pad.These means comprise machanical fastener, welding (weld), soldering (solder) and electroconductive binder.Some pay somebody's debt and expect repayment later for example compressibility feature of foam so that they meet they for example in cellular boundary with the interior space that is assembled into.
Fig. 1 is the schematic diagram of a this pad.Ground mat 10 comprises the copper conductor 11 that is folded into Z-shaped structure.Top horizontal leg or layer 11a are by diagonal angle leg 11b and end horizontal leg or layer 11c electrical connection.In the space of compressible foam 12a between conductor leg 11a and 11b, and in the space of compressible foam 12b between conductor leg 11b and 11c.This foam can conduct electricity, and can be also nonconducting.Optional adhesive 13a and 13b lay respectively on the outer face surface of conductor leg 11a and 11c.This adhesive is contact adhesive (PSA) typically, and conduct electricity typically.In operation, typically, a horizontal leg of this Z-shaped folding conductor is attached to conductive shielding part by PSA, simultaneously another horizontal leg of this Z-shaped folding conductor be attached to printed circuit board (PCB) by PSA for example ground connection trace electrically.Alternatively, conductor leg 11a and 11c can be attached to this shielding part and ground by other means such as welding, soldering, machanical fastener respectively.In the situation that for example the electromagnetic radiation of static exists, electric current is captured by this shielding part and is transmitted to this ground connection by this Z-shaped folding conductor, thereby protects the residing device of this pad to be without prejudice.
Although possess function, current pad with Z-shaped folding conductor manufactures difficulty and costliness.Foam is difficult to be inserted in space between the leg of this folded conductors, and this connection diagonal angle leg has increased manufacturing cost.Therefore, the ground mat that has the Design and manufacture technique of more expensive efficient is to use the various industries of ground mat interested.
Summary of the invention
In an embodiment of first aspect present invention, a kind of compressible ground mat with two conductor layers that separated by the compressible foam layer is provided, described pad comprises:
The first conductor layer, Copper Foil for example, described the first conductor layer have first relative (top) and second (end) face surface (facial surface);
The first adhesive phase, described the first adhesive phase has first relative (top) and second (end) face is surperficial, the described end face surface of described the first adhesive phase directly contacts with the part of the described bottom surface of described the first conductor layer, and described the first conductor layer extends to outside described the first adhesive phase;
Froth bed, described froth bed have first relative (top) and second (end) face is surperficial, and the described end face of described froth bed is surperficial directly to be contacted with the described bottom surface of described the first adhesive phase;
The second adhesive phase, described the second adhesive phase have first relative (top) and second (end) face is surperficial, and the described end face of described the second adhesive phase is surperficial directly to be contacted with the described bottom surface of described froth bed;
The second conductor layer, Copper Foil for example, described the second conductor layer has first relative (top) and second (end) face is surperficial, the part on the described end face surface of described the second conductor layer directly contacts with the described bottom surface of described the second adhesive phase, described the second conductor layer extends to outside described the second adhesive phase, makes the part of the described bottom surface of the part on described end face surface of described the second conductor layer and described the first conductor layer connect;
The 3rd adhesive phase of conduction, described the 3rd adhesive phase have first relative (top) and second (end) face is surperficial, and the described end face of described the 3rd adhesive phase is surperficial directly to be contacted with the described bottom surface of described the second conductor layer; And
(optional) release liner (release liner) of choosing wantonly, described release liner has first relative (top) and second (end) face is surperficial, and the described end face of described release liner is surperficial directly to be contacted with the described bottom surface of described the 3rd adhesive phase.
Described the first and second conductor layers can connect each other by any in a plurality of means of different such as welding, soldering, electroconductive binder, machanical fastener.Described the first and second adhesives and described foam are typically and preferably nonconducting.
In another embodiment of a first aspect of the present invention, a kind of compressible ground mat with a conductor layer and a compressible foam layer is provided, described pad comprises:
Conductor layer, Copper Foil for example, described conductor layer have first relative (top) and second (end) face surface;
The first adhesive phase, described the first adhesive phase has first relative (top) and second (end) face is surperficial, the described end face surface of described the first adhesive phase directly contacts with the part of the described bottom surface of described conductor layer, and described conductor layer extends to outside described the first adhesive phase;
Froth bed, described froth bed have first relative (top) and second (end) face is surperficial, and the described end face of described froth bed is surperficial directly to be contacted with the described bottom surface of described the first adhesive phase;
The second adhesive phase of conduction, described the second adhesive phase has first relative (top) and second (end) face is surperficial, the part on the described end face surface of described the second adhesive phase directly contacts with the described bottom surface of described froth bed, described the second adhesive phase extends to outside described froth bed, makes the part of the described bottom surface of the part on described end face surface of described the second adhesive phase and described conductor layer connect; And
Optional release liner, described release liner have first relative (top) and second (end) face is surperficial, and the described end face of described release liner is surperficial directly to be contacted with the described bottom surface of described the second adhesive phase.
Described conductor and the second adhesive phase connect each other by the operation of nature of described the second adhesive phase.Described the first adhesive and described foam are typically and preferably nonconducting.
In an embodiment of a second aspect of the present invention, provide a kind of structure to have the method for the compressible ground mat of two conductor layers that separated by the compressible foam layer, said method comprising the steps of:
First conductor layer that will have first and second relative surfaces is attached to the compressible foam layer that also has first and second relative surfaces, make described second surface of (1) described first conductor layer be attached to the described first surface surface of described froth bed, and (2) described the first conductor layer extends to outside described froth bed, to form the extension of described the first conductor layer that is not attached to described froth bed;
Second conductor layer that will have first and second relative surfaces is attached to described compressible foam layer, make the described first surface surface of (1) described second conductor layer be attached to described second surface of described froth bed, and (2) described the second conductor layer extends to outside described froth bed, to form the extension of described the second conductor layer that is not attached to described froth bed; And
The described first surface surface of the described extension of described second surface of the described extension of described the first conductor layer and described the second conductor layer is connect.
Described the first and second conductor layers preferably are attached to described froth bed by PSA.The described extension of described the first and second conductor layers preferably connects each other by welding, soldering, adhesive or machanical fastener.
In another embodiment of a second aspect of the present invention, provide a kind of structure to have the method for the compressible ground mat of a conductor layer and a compressible foam layer, said method comprising the steps of:
The conductor layer that will have first and second relative surfaces is attached to the compressible foam layer that also has first and second relative surfaces, make described second surface of (1) described conductor layer be attached to the described first surface surface of described froth bed, and (2) described conductor layer extends to outside described froth bed, to form the extension of the described conductor layer that is not attached to described froth bed;
The conductive adhesive layer that will have first and second relative surfaces is attached to described compressible foam layer, make the described first surface surface of (1) described conductive adhesive layer be attached to described second surface of described froth bed, and (2) described conductive adhesive layer extends to outside described froth bed, to form the extension of the described conductive adhesive layer that is not attached to described froth bed; And
The described first surface surface of the described extension of described second surface of the described extension of described conductor layer and described conductive adhesive layer is connect.
Described conductor layer preferably is attached to described froth bed by PSA, and the described extension of described conductor layer.
Description of drawings
Fig. 1 is the schematic diagram of the compressible ground mat of prior art.
Fig. 2 is the schematic diagram of an embodiment of the compressible ground mat with two conductor layers of the present invention.
Fig. 3 is the schematic diagram of an embodiment of the compressible ground mat with a conductor layer of the present invention.
Fig. 4 comprises that the sheet material of ground mat of two conductor layers that separate by the compressible foam layer and this sheet material are die cut to the schematic diagram of an embodiment before a plurality of independent ground mats.
Fig. 5 comprises that the sheet material of ground mat of a conductor layer and a compressible foam layer and this sheet material are die cut to the schematic diagram of an embodiment before a plurality of independent ground mats.
Embodiment
Suggest unless otherwise indicated, from the context or this area in convention, otherwise all parts and percentage all are based on weight, and all method of testings are all the universal method of the disclosure when submitting to day.According to the United States Patent (USP) convention, the full content of any patent, patent application or the communique of quoting (perhaps its United States version that is equal to), particularly about the general knowledge in synthetic technology, product and Treatment Design, polymer, catalyst, definition (with the inconsistent scope of the definition that specifically provides in the disclosure) and this area, comprise in this application by reference.
Numeral and digital scope in the disclosure are similar to, and therefore unless otherwise noted, otherwise can comprise this scope value in addition.If there is the interval of at least two units between any lower limit and any higher value, digital scope comprise from lower limit and higher limit and comprise higher limit and lower limit itself, with all values of an incremented.As an example, if composition, physics or other characteristics, for example, thickness, percentage by weights etc. are from 100 to 1000, are intended that to enumerate clearly as all individual values such as 100,101,102, and as 100 to 144,155 to 170,197 to 200 subranges such as grade.For comprising less than 1 value or comprising scope (for example, 0.01,0.1,1.1 etc.) greater than 1 mark, a unit according to circumstances is considered to 0.001,0.01 or 0.1.For the scope (for example, 1 to 5) that comprises less than 10 unit numbers, a unit example ground is considered to 0.1.These are only the examples that provides expressly, and all possible combinations of values all is considered to clearly be explained in the disclosure between the minimum of enumerating and peak.In addition, the digital scope in the disclosure and value are to provide for the size of pad with layer.
No matter whether open especially, the terms such as " comprising ", " comprising ", " having " are not intended to get rid of the existence of supplementary element, step or program.For fear of query, unless otherwise indicated, otherwise by using term " to comprise " that all the components of advocating can comprise one or more supplementary element contents, part and/or material.On the contrary, term " must by ... consist of " got rid of any other parts, step or program from any scope of enumerating subsequently, will not be that operability is necessary except those.Term " by ... consist of " got rid of any parts, step or the program that do not specifically describe or list.Unless otherwise indicated, otherwise the term "or" refers to individual or any combination of listed member.
" face surface ", " flat surfaces ", " top surface ", " basal surface " etc. use with " edge surface " with distinguishing.If the shape of rectangle or configuration, layer will comprise that two relative faces that connect by four edge surfaces (relative two edges surfaces, every pair with another to intersecting at a right angle) are surperficial.If circular configuration, this layer will comprise two relative face surfaces that connect by a continuous edge surface.Described layer can be any size and dimension, and therefore described flat surfaces and edge surface can be also any size and dimensions, for example, thin or thick, polygonal or circular, flat or wavy etc.
The meaning of the term such as " contact adhesive ", " PSA " is: engages and form contrast, join to as the result of applied pressure and apply surperficial adhesive to form solid material with evaporation or lyosoption.
The meaning of the terms such as " directly contact ", " close contact " is: two surfaces or layer be physical contact each other, thus form do not have in the middle of or the interface of intermediary layer or material.
The ground mat that comprises two conductor layers
Fig. 2 is the schematic diagram with compressible ground mat of two conductor layers that separated by the compressible foam layer.Compressible ground mat 20 comprises the first conductor layer 21, and this first conductor layer 21 has relative first or end face surface 21a and second or bottom surface 21b.Conductor 21 can comprise any electric conducting material, but typically comprises copper or aluminium.Typically and preferably, conductor 21 is Copper Foils.Typically and preferably, conductor 21 have 5 to 100 microns (μ m), more typically be 20 to 50 microns, be more typically the thickness of 18 to 25 microns again.
First or the end face surface 22a of the part of bottom surface 21b and the first adhesive phase 22 directly contacts, and this first adhesive phase 22 can comprise any adhesive that the first conductor 21 and foam 23 is both all shown excellent bonds.Typically, this adhesive is PSA.These adhesives are well known in the art, can extensively obtain, and include but not limited to based on elastomeric PSA, based on the PSA of natural rubber with based on the PSA of acrylic acid (acrylic).The use of can using separately or be bonded to each other of these adhesives.Preferred PSA is based on acrylic acid, comprises the polymer as the alkane ester of the acrylic or methacrylic acid of main component.This adhesive typically but must not be nonconducting.Typically and preferably, the first adhesive phase have 10 to 100 microns (μ m), more typically be 35 to 80 microns, be more typically the thickness of 35 to 50 microns again.
The part of the end face surface 25a of bottom surface 24b and the second conductor 25 directly contacts, and this second conductor 25 typically but must not have identical composition and thickness with the first conductor layer 21.The first and second conductor layers 21 and 25 both all extend to outside their adjacent adhesive phases 22 and 24 separately enough far away, to such an extent as to form such extension: this extension (1) does not directly contact with 24 with adhesive phase 22, and any means easily that (2) can pass through for example welding, soldering, electroconductive binder, machanical fastener (for example, rivet, clip etc.) connect each other.The connection of these two conductor layers makes the bottom surface 21b of (1) first conductor layer 21 be attached to the end face surface 25a of the second conductor layer 25, and (2) electric current can flow to another conductor from a conductor substantially unblockedly.
Before ground mat 20 was ready to use, adhesive phase 26 randomly and was preferably protected by release liner.Bottom surface 26b typically and preferably directly contacts with the end face of release liner (not shown) is surperficial.Release liner is as known in the art, and representational example includes but not limited to utilize such as based on glassine paper and plastic film after the release-agent-treated (for example spraying) of the releasing agent of silicone.
The ground mat that comprises a conductor layer
Fig. 3 is the schematic diagram with compressible ground mat of a conductor layer and a compressible foam layer.Compressible ground mat 30 comprises having relative first or end face surface 31a and second or the conductor layer 31 of bottom surface 31b.Conductor 31 can comprise any electric conducting material, but typically comprises copper or aluminium.Typically and preferably, conductor 31 is Copper Foils.Typically and preferably, conductor 31 have 5 to 100 microns (μ m), more typically be 20 to 50 microns, be more typically the thickness of 18 to 25 microns again.
First or the end face surface 32a of the part of bottom surface 31b and the first adhesive phase 32 directly contacts, and this first adhesive phase 32 can comprise any adhesive that the first conductor 31 and foam 33 is both all shown excellent bonds.Typically, this adhesive is PSA, and is used for adhesive phase 22,24 and 26 as mentioned above.This adhesive is nonconducting typically.Typically and preferably, adhesive phase 32 have 10 to 100 microns (μ m), more typically be 35 to 80 microns, be more typically the thickness of 35 to 50 microns again.
Bottom surface 32b directly contacts with first or the end face surface 33a of foam 33, and as foam 23, foam 33 can comprise any material that shows the good compression characteristic.Representational foam includes but not limited to polyurethane, polyolefin (for example, polyethylene, polypropylene, polyisoprene etc.), natural and synthetic rubber etc.This foam is nonconducting typically, typically and preferably has the precommpression thickness of 0.3 to 10 micron (μ m), is more typically 0.5 to 2 micron, then is more typically 0.5 to 1 micron.Compress that the required power of this foam is at least part of depends on the grade of foam and the final application of this ground mat.Typically, this foam can be defeated half that is reduced to less than its precommpression thickness by minimal compression.
The bottom surface 33b of foam 33 directly contacts with the end face of electrically-conducting adhesive layer 34 surface 34a.The composition of this adhesive can be identical with adhesive phase 32, but be filled with conductive particles such as copper or aluminum metal, conducting polymer materials.Adhesive phase 34 enough conducts electricity, to such an extent as to will be from any current delivery of the second conductor layer to it by the accompanying substrate surface (not shown) that arrives of bottom surface 34b.Adhesive phase 34 typically and preferably have 10 to 100 microns (μ m), more typically be 35 to 80 microns, be more typically the thickness of 35 to 50 microns again.
Before ground mat 30 was ready to use, adhesive phase 34 randomly and was preferably protected by release liner.Bottom surface 34b typically and preferably directly contacts with the end face of release liner (not shown) is surperficial.
The structure that comprises the ground mat of two conductor layers
Shown in Fig. 4, structure has a method of the compressible ground mat of two conductor layers that separated by the compressible foam layer.The method comprises the following steps:
The first surface surface of the extension of second surface of the extension of the first conductor layer 21 and the second conductor layer 25 is connect.
Use any in numerous technology as known in the art, by any suitable means, typically be welding, these two conductor layers are attached to this froth bed by the adhesive (not shown), and these two conductor layers are connect each other.Can also this adhesive be applied to described conductor and/or foam by any in numerous distinct methods, but typically, at first by applying or spraying is applied to this foam with this adhesive, described conductor is contacted with the adhesive on this foam.For conductor layer 25, can before or after being attached to foam 23 and/or conductor layer 21, its (conductor layer 25) apply electroconductive binder (26 in Fig. 2).Typically, the release liner (not shown) covers this electroconductive binder, and then it is applied to conductor layer 25.In case the sheet material of ground mat 20A is configured out, just by producing a plurality of independent ground mats (20 in Fig. 2) along this sheet material of die cut lines 27 cross cuttings.These ground mats can be cut into any size and the configuration of the layer configuration that keeps Fig. 2.
The structure that comprises the ground mat of a conductor layer
Shown in Fig. 5, structure has a method of the compressible ground mat of a conductor layer and a compressible foam layer, and the method comprises the following steps:
The conductor layer 31 that will have first and second relative surfaces is attached to the compressible foam layer 33 that also has first and second relative surfaces, make second surface of (1) conductor layer 31 be attached to the first surface surface of froth bed 33, and (2) conductor layer 31 extends to outside froth bed 33, to form the extension of the conductor layer 31 that is not attached to froth bed 33;
The conductive adhesive layer 34 that will have first and second relative surfaces is attached to compressible foam layer 33, make the first surface surface of (1) conductive adhesive layer 34 be attached to second surface of froth bed 33, and (2) conductive adhesive layer 34 extends to outside froth bed 33, to form the extension of the conductive adhesive layer 34 that is not attached to froth bed 33; And
The first surface surface of the extension of second surface of the extension of conductor layer 31 and conductive adhesive layer 34 is connect.
This conductor layer is attached to this froth bed by the adhesive (not shown), and the effect of this conductor layer by this adhesive is attached to this electroconductive binder.Can this adhesive be applied to described conductor and/or foam by any in numerous distinct methods, but typically, at first by applying or spraying is applied to this foam with this adhesive, described conductor is contacted with the adhesive on this foam.Can before or after being attached to foam 33, conductor layer 31 apply electroconductive binder 34.Typically, the release liner (not shown) covers this electroconductive binder, and then it is applied to froth bed 33.In case the sheet material of ground mat 30A is configured out, just by producing a plurality of independent ground mats (30 in Fig. 3) along this sheet material of die cut lines 27 cross cuttings.These ground mats can be cut into any size and the configuration of the layer configuration that keeps Fig. 3.
Comprise that for structure the method for the present invention of the ground mat of one or two conductor layer and a compressible foam is very efficiently and has very expensive efficient.They minimize the conductor waste, and for example, they have exempted the diagonal angle leg 11b in Fig. 1, and they allow to produce a large amount of ground mats with relatively few step.They also allow to produce very thin product, and this is because the hardness of the compressibility of this pad and conductor layer or thickness are irrelevant.On the contrary, compressibility is the function of foam.This allows the physical characteristic by changing foam rather than changing this pad by changing the tool of production conversely.
Ground mat of the present invention especially is used to the shielding part of conduction is connected to electrically.When the matching surface of the electronic equipment that size is not met just (size for example just do not meet two surfaces in gap, space and space and this together with form) when coordinating, usually needs this conductive interface.This is common in the electric devices such as cell phone, calculator, instant message transrecieving device, camera.Compressible ground mat of the present invention is filled these gaps, space etc. when compression.In addition, when compression, the conductivity of this electroconductive binder increases, because the conductive particle in this adhesive is close to each other.
Although utilize specific detail to describe the present invention by above-mentioned specific embodiment, this details is mainly used in exemplary purpose.In the situation that do not depart from the spirit and scope of the present invention defined in the appended claims, those skilled in the art can carry out variations and modifications.
Claims (15)
1. compressible ground mat with a conductor layer and a compressible foam layer, described pad comprises:
Conductor layer, described conductor layer have first relative (top) and second (end) face is surperficial;
The first adhesive phase, described the first adhesive phase has first relative (top) and second (end) face is surperficial, the described end face surface of described the first adhesive phase directly contacts with the part of the described bottom surface of described conductor layer, and described conductor layer extends to outside described the first adhesive phase;
Froth bed, described froth bed have first relative (top) and second (end) face is surperficial, and the described end face of described froth bed is surperficial directly to be contacted with the described bottom surface of described the first adhesive phase;
The second adhesive phase of conduction, described the second adhesive phase has first relative (top) and second (end) face is surperficial, the part on the described end face surface of described the second adhesive phase directly contacts with the described bottom surface of described froth bed, described the second adhesive phase extends to outside described froth bed, makes the part of the described bottom surface of the part on described end face surface of described the second adhesive phase and described conductor layer connect; And
Optional release liner, described release liner have first relative (top) and second (end) face is surperficial, and the described end face of described release liner is surperficial directly to be contacted with the described bottom surface of described the second adhesive phase.
2. ground mat according to claim 1, wherein, each in described the first and second conductor layers comprises at least one in copper and aluminium.
3. ground mat according to claim 1 and 2, wherein, each in described the first and second adhesive phases comprises contact adhesive.
4. compressible ground mat with two conductor layers that separated by the compressible foam layer, described pad comprises:
The first conductor layer, described the first conductor layer have first relative (top) and second (end) face is surperficial;
The first adhesive phase, described the first adhesive phase has first relative (top) and second (end) face is surperficial, the described end face surface of described the first adhesive phase directly contacts with the part of the described bottom surface of described the first conductor layer, and described the first conductor layer extends to outside described the first adhesive phase;
Froth bed, described froth bed have first relative (top) and second (end) face is surperficial, and the described end face of described froth bed is surperficial directly to be contacted with the described bottom surface of described the first adhesive phase;
The second adhesive phase, described the second adhesive phase have first relative (top) and second (end) face is surperficial, and the described end face of described the second adhesive phase is surperficial directly to be contacted with the described bottom surface of described froth bed;
The second conductor layer, described the second conductor layer has first relative (top) and second (end) face is surperficial, the part on the described end face surface of described the second conductor layer directly contacts with the described bottom surface of described the second adhesive phase, described the second conductor layer extends to outside described the second adhesive phase, makes the part of the described bottom surface of the part on described end face surface of described the second conductor layer and described the first conductor layer connect;
The 3rd adhesive phase of conduction, described the 3rd adhesive phase have first relative (top) and second (end) face is surperficial, and the described end face of described the 3rd adhesive phase is surperficial directly to be contacted with the described bottom surface of described the second conductor layer; And
Optional release liner, described release liner have first relative (top) and second (end) face is surperficial, and the described end face of described release liner is surperficial directly to be contacted with the described bottom surface of described the 3rd adhesive phase.
5. ground mat according to claim 4, wherein, each in described the first and second conductor layers comprises at least one in copper and aluminium.
6. according to claim 4 or 5 described ground mats, wherein, each in described first, second, and third adhesive phase comprises contact adhesive.
7. the described ground mat of any one according to claim 4 to 6, wherein, described the first and second conductor layers connect each other by at least one in welding, soldering and adhesive.
8. a structure has the method for the compressible ground mat of a conductor layer and a compressible foam layer, said method comprising the steps of:
The conductor layer that will have first and second relative surfaces is attached to the compressible foam layer that also has first and second relative surfaces, make described second surface of (1) described conductor layer be attached to the described first surface surface of described froth bed, and (2) described conductor layer extends to outside described froth bed, to form the extension of the described conductor layer that is not attached to described froth bed;
The conductive adhesive layer that will have first and second relative surfaces is attached to described compressible foam layer, make the described first surface surface of (1) described conductive adhesive layer be attached to described second surface of described froth bed, and (2) described conductor layer extends to outside described froth bed, to form the extension of the described conductor layer that is not attached to described froth bed; And
The described first surface surface of the described extension of described second surface of the described extension of described conductor layer and described conductive adhesive layer is connect.
9. method according to claim 8, wherein, described conductor layer arrives described froth bed by adhesive attachment.
10. according to claim 8 or 9 described methods, wherein, whole described adhesives are contact adhesives.
11. a structure has the method for the compressible ground mat of two conductor layers that separated by the compressible foam layer, said method comprising the steps of:
First conductor layer that will have first and second relative surfaces is attached to the compressible foam layer that also has first and second relative surfaces, make described second surface of (1) described first conductor layer be attached to the described first surface surface of described froth bed, and (2) described the first conductor layer extends to outside described froth bed, to form the extension of described the first conductor layer that is not attached to described froth bed;
Second conductor layer that will have first and second relative surfaces is attached to described compressible foam layer, make the described first surface surface of (1) described second conductor layer be attached to described second surface of described froth bed, and (2) described the second conductor layer extends to outside described froth bed, to form the extension of described the second conductor layer that is not attached to described froth bed; And
The described first surface surface of the described extension of described second surface of the described extension of described the first conductor layer and described the second conductor layer is connect.
12. method according to claim 11, wherein, described the first conductor and the second conductor layer arrive described foam by adhesive attachment.
13. according to claim 11 or 12 described methods, wherein, described the first and second conductor dbus are crossed a connection each other in welding, soldering and use adhesive.
14. electronic equipment that comprises the described ground mat of any one according to claim 1 to 7.
15. electronic equipment according to claim 14, as to be cell phone, calculator or instant message transrecieving device form.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36583710P | 2010-07-20 | 2010-07-20 | |
| US61/365,837 | 2010-07-20 | ||
| PCT/EP2011/062424 WO2012010623A1 (en) | 2010-07-20 | 2011-07-20 | Conductive grounding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103098574A true CN103098574A (en) | 2013-05-08 |
Family
ID=44534320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011800436918A Pending CN103098574A (en) | 2010-07-20 | 2011-07-20 | Conductive grounding pad |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US8481867B2 (en) |
| CN (1) | CN103098574A (en) |
| WO (1) | WO2012010623A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109892031A (en) * | 2016-11-02 | 2019-06-14 | 阿莫绿色技术有限公司 | Shielding case electromagnetic wave shielding sheet |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9531853B2 (en) * | 2013-03-14 | 2016-12-27 | Htc Corporation | Electronic module and electronic device |
| US9258906B2 (en) | 2013-04-15 | 2016-02-09 | Apple Inc. | Liquid-based pressure sensitive adhesive for grounding applications |
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| US20060272855A1 (en) * | 2005-03-11 | 2006-12-07 | Schroff Gmbh | HF sealing strips |
| US20090114438A1 (en) * | 2007-11-07 | 2009-05-07 | Laird Technologies, Inc. | Fabric-Over-Foam EMI Gaskets Having Transverse Slits and Related Methods |
| CN201473483U (en) * | 2009-04-30 | 2010-05-19 | 隆扬电子（昆山）有限公司 | Conducting foam |
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| US5028739A (en) * | 1989-04-13 | 1991-07-02 | Chomerics, Inc. | EMI/REI shielding gasket |
| JP2510404Y2 (en) * | 1990-11-29 | 1996-09-11 | 北川工業株式会社 | Electromagnetic shield gasket |
| US5115104A (en) | 1991-03-29 | 1992-05-19 | Chomerics, Inc. | EMI/RFI shielding gasket |
| WO1992017888A1 (en) | 1991-04-04 | 1992-10-15 | W.L. Gore & Associates, Inc. | Electrically conductive gasket materials |
| US5401901A (en) * | 1991-09-19 | 1995-03-28 | W. L. Gore & Associates, Inc. | Weather-resistant electromagnetic interference shielding for electronic equipment enclosures |
| US5367123A (en) * | 1993-03-15 | 1994-11-22 | The Zippertubing Co. | Electrically conductive sheath for ribbon cable |
| JP2690684B2 (en) * | 1994-04-14 | 1997-12-10 | 北川工業株式会社 | Sewing electromagnetic wave shield material |
| US5656795A (en) * | 1995-04-03 | 1997-08-12 | Schlegel Corporation | Segmented shielding structure for connector panels |
| US5712449A (en) * | 1995-05-24 | 1998-01-27 | Schlegel Corporation | Wide area emi gasket with conductors traversing core |
| US5804762A (en) * | 1996-03-22 | 1998-09-08 | Parker-Hannifin Corporation | EMI shielding gasket having shear surface attachments |
| US6455770B2 (en) * | 1997-07-03 | 2002-09-24 | Lee J. Pulver | Electromagnetic radiation shield for attenuating electromagnetic radiation from an active electronic device |
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| US6388893B1 (en) | 1999-01-22 | 2002-05-14 | Sony Corporation | Foam cushion with conductive foil for grounding in an EMI shield and method of using the same |
| US6541698B2 (en) * | 2001-03-13 | 2003-04-01 | Schlegel Systems, Inc. | Abrasion resistant conductive film and gasket |
| US6900383B2 (en) * | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
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| TW200426023A (en) * | 2003-05-19 | 2004-12-01 | Li-Hsien Yen | Multilayer structure for absorbing electromagnatic wave and manufacturing method thereof |
-
2011
- 2011-07-20 US US13/186,562 patent/US8481867B2/en not_active Expired - Fee Related
- 2011-07-20 CN CN2011800436918A patent/CN103098574A/en active Pending
- 2011-07-20 WO PCT/EP2011/062424 patent/WO2012010623A1/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060272855A1 (en) * | 2005-03-11 | 2006-12-07 | Schroff Gmbh | HF sealing strips |
| US20090114438A1 (en) * | 2007-11-07 | 2009-05-07 | Laird Technologies, Inc. | Fabric-Over-Foam EMI Gaskets Having Transverse Slits and Related Methods |
| CN201473483U (en) * | 2009-04-30 | 2010-05-19 | 隆扬电子（昆山）有限公司 | Conducting foam |
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| CN109892031A (en) * | 2016-11-02 | 2019-06-14 | 阿莫绿色技术有限公司 | Shielding case electromagnetic wave shielding sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2012010623A1 (en) | 2012-01-26 |
| US8481867B2 (en) | 2013-07-09 |
| US20120018211A1 (en) | 2012-01-26 |
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