CN201473483U

CN201473483U - Conducting foam

Info

Publication number: CN201473483U
Application number: CN2009201848648U
Authority: CN
Inventors: 陈先锋
Original assignee: LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Current assignee: LONG YOUNG ELECTRONICS (KUNSHAN) CO Ltd
Priority date: 2009-04-30
Filing date: 2009-04-30
Publication date: 2010-05-19
Anticipated expiration: 2019-04-30

Abstract

The utility model discloses conducting foam, which comprises a foam body and a copper and nickel foil composite body coating the foam body. Nickel which is inertia metal has high antioxidant capacity, the copper and nickel foil comprises a substrate, a copper metal layer and a nickel metal layer, wherein the copper metal layer is splashed on the inner surface of the substrate under vacuum, and the nickel metal layer is splashed on the outer surface of the substrate, thereby being capable of preventing copper from being oxidized. The copper is excellent in conducting property and can not magnetize, the nickel is excellent in magnetic conducting property but poor in electric conducting property, and then the composite body combined by the nickel and the copper can make up shortages of single metal property. Compared with the existing conducting cloth coated foam, the conducting foam has excellent shielding property and heat transmission functions of pure metal, and finished products do not have burrs easy to be generated in textile fabric. Compared with aluminum foil conducting foam, the conducting foam is fine in shielding and absorption effect during low and high frequency electromagnetic wave interference due to magnetic conduction characteristics.

Description

Conducting foam

Technical field

The utility model relates to a kind of conducting foam.

Background technology

Along with development of electronic technology, electromagnetic radiation brings harm more and more serious for environment and human body, how to reduce electromagnetic radiation and becomes the countries in the world question of common concern.In the concrete EMC design, usually need in electrical equipment/motor, settle conducting foam, the hertzian wave that this conducting foam produces when being used on the one hand shielding the work of electrical equipment internal circuit, also can reduce of the influence of external electromagnetic ripple on the other hand, and the static that electrical equipment can be produced produces too much static to external world's derivation and pre-anti-electricity device to electrical equipment work itself.The most frequently used metal foam has conductive aluminum foil foam, copper-foil conducting electricity foam etc. in the existing electronic product industry, the conductive aluminum foil foam comprises the foam body, is wrapped in the aluminium foil on the foam body, similar therewith, the Copper Foil conducting foam comprises the foam body, is wrapped in the Copper Foil on the foam body.Copper Foil, aluminium foil have good conductivity, but magnetic diffusivity is very poor, and be very undesirable for the clutter shield effectiveness of high frequency, and Copper Foil is adopted on the surface of Copper Foil conducting foam, copper is oxidized easily, so this conducting foam uses after for some time the electroconductibility can variation, thereby reduces shield effectiveness.

Summary of the invention

The purpose of this utility model is to provide a kind of conducting foam of cupric nickel clad.

In order to reach above purpose, the technical solution adopted in the utility model is: a kind of conducting foam, comprise the foam body, it also comprises the copper nickel complex that wraps up described foam body, and described copper nickel complex comprises base material, copper metal layer arranged, at the outside surface vacuum sputtering of described base material nickel metal layer is arranged at the internal surface vacuum sputtering of described base material.

Described base material is selected polyethylene terephthalate for use.

Described foam body is a polyurethane foam.

Because the utility model has adopted above technical scheme, its advantage is: the internal surface vacuum sputtering of base material has copper metal layer, the outside surface vacuum sputtering of base material has nickel metal layer, nickel is inert metal, its resistance of oxidation height, copper metal layer is at the internal surface of base material, can prevent that copper is oxidized, the conductivity of copper is excellent, magnetic conduction not, the magnetic property of nickel is excellent, poor electric conductivity, the complex body that nickel and copper are combined to form, can remedy the defective of independent metal self performance, complex body has good heat conduction, conduction, permeance, the existing relatively common conductive fabric of conducting foam of the present utility model wraps up foam, and is not only with low cost, taken into account the softness of cloth, characteristic such as be difficult for tearing, but also possessed the good shielding properties of pure metal, heat transmission function, the burr phenomenon that finished product does not have fabric to occur easily in appearance yet, relative aluminium foil conducting foam is because of it possesses the characteristic of magnetic conduction, so no matter during in low high-frequency electromagnetic wave excitation, its shielding assimilation effect is all preferable, and environmental protection more, with respect to the Copper Foil conducting foam, because of it can be anti-oxidant, so after long-time the use, can keep good conduction, permeance, shield effectiveness is good.

Description of drawings

Accompanying drawing 1 is a structure iron of the present utility model;

Accompanying drawing 2 is for using the synoptic diagram of cabinet of the present utility model.

Embodiment

Further set forth concrete structure of the present utility model below in conjunction with accompanying drawing.

A kind of conducting foam is made up of the copper nickel complex 2 of foam body 1, parcel foam body 1.Copper nickel complex 2 comprises that base material 3, vacuum sputtering are at the copper metal layer 10 on base material 3 internal surfaces, vacuum sputtering nickel metal layer 4 compositions on base material 3 outside surfaces, as shown in Figure 1, copper metal layer 10 is bonded on the foam body 1, base material 3, foam body 1 all can be selected material well-known to those skilled in the art for use, in the present embodiment, base material 3 is polyphenyl dioctyl phthalate glycol ester (being commonly called as PET) fibers, and foam body 1 is polyurethane foam (being called for short the PU foam).The PU foam is a microvoid structure, and the mean sizes of micropore is 100 microns, and PU foam product is when pressurized, and the slow resilience of meeting is until returning to ortho states.PU foam density height, anti-aging, still keep super screen resilience after weight is pressed for a long time, and can keep spatial stability.Vacuum sputtering has formed nickel metal layer 4 and copper metal layer 10 on the surfaces externally and internally of base material 3, the relatively thinner and uniform and delicate of this metal layer thickness.Nickel metal layer 4 is positioned at the outside surface of base material 3, and copper metal layer 10 is positioned at the internal surface of base material 3, can prevent that copper metal layer 10 is oxidized, and the conductivity of copper metal layer 10 is excellent, magnetic conduction not, and the magnetic property of nickel metal layer 4 is excellent, poor electric conductivity, the complex body that nickel metal layer 4 and copper metal layer 10 are combined to form, as the main body of conduction, magnetic conduction, its various performances and other metallographic phase are compared as follows shown in the table:

As can be seen from the above table, nickel is inert metal, its resistance of oxidation height, the complex body 2 that nickel and copper form, can remedy the defective of independent metal self performance, complex body 2 has good heat conduction, conduction, permeance, the existing relatively common conductive fabric parcel foam of conducting foam of the present utility model, not only with low cost, taken into account the softness of cloth, characteristic such as be difficult for tearing, but also possessed the good shielding properties of pure metal, heat transmission function, relative aluminium foil conducting foam is because of it possesses the characteristic of magnetic conduction, so no matter during in low high-frequency electromagnetic wave excitation, its shielding assimilation effect is all preferable, and environmental protection more, with respect to the Copper Foil conducting foam, because of it can be anti-oxidant, so after long-time the use, can keep good conduction, permeance, shield effectiveness is good.

Conducting foam of the present utility model can be used on the electromagnetic wave shielding of IT product such as electronic cabinet, shielding barrier, computer, mobile equipment, in Fig. 2, casing 5 comprises

lower casing

6 and 7, the slit place of last lower casing 6 when 7 are connected is filled with conducting foam 9 of the present utility model, casing 5 forms a shielding, this shielding is surrounded the interfering source of the component in the cabinet, circuit, subassembly, cable or total system, prevents that interfere with electromagnetic field is to external diffusion; Casing 5 is surrounded circuit, equipment or system simultaneously, casing 5 prevents that they are subjected to the influence of external electromagnetic field, because can all play a part to absorb energy, reflected energy and counteracting energy to interference hertzian wave and the internal electrical magnetic wave from outsides such as lead, cable, component, circuit or systems.A most important factor that influences casing 5 effectiveness of shielding is that must to make the surface of shielding be the conduction successive, the different piece junction can form non-conductive slit on shielding, in casing 5, last

lower casing

6 and 7 places of combining can form a lot of non-conductive slits, these places, non-conductive slit have just produced electromagnetic leakage, can leak on the slit from container as fluid.A method that solves this leakage is at place, slit filled conductive resilient material, eliminates non-conductive point.The conducting foam 9 compacted places, slit that are filled in lower casing utilize its good shield effectiveness, have stoped electromagnetic leakage effectively.Moreover, conducting foam 9 of the present utility model can also be done ground connection processing, and in Fig. 2, conducting foam is connected on the pcb board 8, and the static on the pcb board 8 is imported the earth.

Claims

1. conducting foam, comprise the foam body, it is characterized in that: it also comprises the copper nickel complex that wraps up described foam body, and described copper nickel complex comprises base material, the nickel metal layer of vacuum sputtering on the copper metal layer on the internal surface of described base material, the outside surface of vacuum sputtering at described base material.

2. conducting foam according to claim 1 is characterized in that: described base material is selected polyethylene terephthalate for use.

3. conducting foam according to claim 1 is characterized in that: described foam body is a polyurethane foam.