CN103090326A - LED chip light source module substrate - Google Patents
LED chip light source module substrate Download PDFInfo
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- CN103090326A CN103090326A CN2011103417376A CN201110341737A CN103090326A CN 103090326 A CN103090326 A CN 103090326A CN 2011103417376 A CN2011103417376 A CN 2011103417376A CN 201110341737 A CN201110341737 A CN 201110341737A CN 103090326 A CN103090326 A CN 103090326A
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- substrate
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- pcb board
- upper substrate
- infrabasal plate
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Abstract
The invention discloses a LED (Light Emitting Diode) chip source module substrate consisting of an upper substrate, a lower substrate and a PCB (Printed Circuit Board), wherein the upper substrate is fixedly connected to the lower substrate, the PCB embedded between the upper and lower substrates is positioned on gap area between the upper and lower substrates, a substrate bowl, a chip welding pad through hole, a riveting column through hole and a PCB-shaped groove are punched on the upper substrate coated with a reflective material layer, an external circuit welding pad through hole and a riveting column are punched on the lower substrate, the PCB provided with a chip welding pad and the external circuit welding pad is positioned on the PCB-shaped groove, the chip welding pad on the PCS directs into the substrate bowl, the external circuit welding pad on the PSB is arranged in the through hole of the external circuit welding pad on the lower substrate, the riveting column through hole on the upper substrate is fixedly connected to the riveting column on the lower substrate. The LED chip light source module substrate has advantages of being high in light extraction efficiency, convenient to connect power supply in using lamps and good in light emitting effect.
Description
Technical field
The present invention relates to LED light source module group substrates technical field, is a kind of improvement technology of LED chip light source die group substrate specifically.
Background technology
At present more common LED chip light source die group substrate is not all specially done reflecting surface on the market, part has been done the reflecting surface processing, it is also little that reflecting surface accounts for the ratio of exiting surface, the treatment effect of reflecting surface is also undesirable, cause product to get optical efficiency limited, and the external lead wire pad position of common LED chip light source die group substrate is all in that side of finished product exiting surface, affected finished product whole go out light effect, in being applied to light fixture manufacturing process, inconvenience is arranged more.
Summary of the invention
The purpose of this invention is to provide a kind of optical efficiency of getting high, connect power supply when being applied to light fixture convenient, and the effective LED chip light source die group substrate of bright dipping.
Above-mentioned purpose is achieved through the following technical solutions.
A kind of LED chip light source die group substrate, it is characterized in that: described LED chip light source die group substrate comprises upper substrate, infrabasal plate and pcb board, upper substrate, infrabasal plate are fixedly connected with, and pcb board is embedded between upper substrate and infrabasal plate and in the gap area between upper substrate and infrabasal plate.
Described upper substrate front is coated with high layer of reflective material, in the upper substrate upper punch, substrate bowl cup, chip bonding pad position through hole, riveting position post through hole, pcb board shaped recesses and locating hole are arranged, chip bonding pad position through hole is positioned at the pcb board shaped recesses of upper substrate bottom, and locating hole is at the upper substrate edge.
Described infrabasal plate upper punch has external lead wire pad position through hole, riveting position post and locating hole, and external lead wire pad position through hole is positioned at the pcb board shaped recesses, and locating hole is positioned at the infrabasal plate edge.
Be printed on two parts circuit structure on described pcb board, a part is the pad position of chip lead, and another part is external lead wire pad position, and pad position and external lead wire pad position are printed on a pcb board or are dispersed on the polylith pcb board; Described pcb board is single sided board or dual platen.
described upper substrate is just being worn the bowl cup, leave chip bonding pad position through hole in the bowl cup, bowl cup is outer leaves riveting position post through hole, be positioned at the upper substrate bottom with the pcb board shaped recesses of the quantity such as pcb board, riveting position post is left in the infrabasal plate front, the back side is smooth, its external lead wire pad position through hole is near the substrate outer, the through hole of chip bonding pad on pcb board in upper substrate bowl cup, the external lead wire pad position through hole of external lead wire pad on pcb board on infrabasal plate, riveting position post through hole on upper substrate and the riveting position post riveting of infrabasal plate be fixedly connected with, the locating hole of upper substrate and infrabasal plate coincides with substrate edges.
The present invention compared with prior art has the following advantages.
The present invention is because circuit is drawn by pcb board, the external lead wire pad is positioned at base plate bottom, whole substrate exiting surface all is coated with high layer of reflective material, and the common LED chip light source die group substrate in more present market has large-area reflecting surface, therefore encapsulate finished product to get optical efficiency high; Because chip is that directly to be fixed on the metal bowl cup be that in substrate bowl cup, its heat dissipation channel is short, and has the good capacity of heat transmission, therefore effectively guaranteed the derivation of product heat; The substrate heat-sinking capability is strong, can select the chip package of the LED of different capacity to become the LED of different capacity, and the circuit of pcb board can do different designs such as different capacity, different series-parallel circuit, single sided board or dual platen etc. as required, so the substrate applicability is wide; The pad that substrate connects external lead wire is positioned at base plate bottom, has facilitated the processing of lamp power lead-in wire, and the outer of the close substrate in pad position of external lead wire, does not substantially affect the secondary heat dissipation design of product.In addition, the substrate exiting surface is without any object that is in the light, and the light fixture bright dipping is effective.
Description of drawings
Fig. 1 is the front view of LED chip light source die group substrate of the present invention;
Fig. 2 is the rearview of LED chip light source die group substrate of the present invention;
Fig. 3 is the front view of upper substrate in LED chip light source die group substrate of the present invention;
Fig. 4 is the rearview of upper substrate in LED chip light source die group substrate of the present invention;
Fig. 5 is the front view of pcb board in LED chip light source die group substrate of the present invention;
Fig. 6 is the rearview of pcb board in LED chip light source die group substrate of the present invention;
Fig. 7 is the front view of infrabasal plate in LED chip light source die group substrate of the present invention;
Fig. 8 is the rearview of infrabasal plate in LED chip light source die group substrate of the present invention;
The specific embodiment
Below in conjunction with accompanying drawing, LED chip light source die group substrate of the present invention is described in further detail.
As extremely shown in Figure 8 in Fig. 1, LED chip light source die group substrate of the present invention, LED chip light source die group substrate, comprise that two substrates are upper substrate 1, infrabasal plate 2 and pcb board 3, pcb board 3 is embedded between upper substrate 1 and infrabasal plate 2 and in the gap area between upper substrate and infrabasal plate, and two substrates are that the mode by the riveted screens is fixed together.Upper substrate 1,2 two substrates of infrabasal plate adopt high heat-conducting, and pcb board 3 is single sided board or dual platen, can be designed to as required one or two.
In Fig. 1, substrate surface 11 is coated with high reflecting material, and pcb board 3 is provided with chip bonding pad 31 and external lead wire pad 32, chip bonding pad 31 is in substrate bowl cup 12, external lead wire pad 32 is at base plate bottom, and locating hole 4 is at substrate edges, thus the basic external appearance characteristic of formation the present invention.
By Fig. 1-2 as can be known, the present invention mainly is comprised of three parts, is respectively namely upper substrate 1, pcb board 3 and infrabasal plate 2.In Fig. 3-8, respectively upper substrate 1, pcb board 3 and infrabasal plate 3 are described, upper substrate 1 is the main body of substrate front side, and punching has substrate bowl cup 12, chip bonding pad position through hole 13, riveting position post through hole 14 and pcb board shaped recesses 15, and chip bonding pad position through hole 13 is positioned at pcb board shaped recesses 15.Pcb board 3 is cores of the circuit structure of whole substrate, is two-sided, and one side is chip bonding pad 31, and another side is external lead wire pad 32; Infrabasal plate 2 is main bodys of substrate back, and punching has external lead wire pad position through hole 21 and riveting position post 22.In making process of the present invention, first high reflecting material being done on the surface of upper substrate 1 processes, again pcb board 3 is put into the pcb board shaped recesses 15 of upper substrate, allow chip bonding pad 31 one facing to namely exposing in substrate bowl cup 12, then the riveting position post 22 of the riveting position post through hole 14 by upper substrate and infrabasal plate upper substrate and infrabasal plate riveting be in the same place, whole product has just been completed.
Claims (5)
1. LED chip light source die group substrate, it is characterized in that: described LED chip light source die group substrate comprises upper substrate, infrabasal plate and pcb board, upper substrate, infrabasal plate are fixedly connected with, and pcb board is embedded between upper substrate and infrabasal plate and in the gap area between upper substrate and infrabasal plate.
2. LED chip light source die group substrate according to claim 1, it is characterized in that: described upper substrate front is coated with high layer of reflective material, in the upper substrate upper punch, substrate bowl cup, chip bonding pad position through hole, riveting position post through hole, pcb board shaped recesses and locating hole are arranged, chip bonding pad position through hole is positioned at the pcb board shaped recesses of upper substrate bottom, and locating hole is at the upper substrate edge.
3. LED chip light source die group substrate according to claim 1, it is characterized in that: described infrabasal plate upper punch has external lead wire pad position through hole, riveting position post and locating hole, external lead wire pad position through hole is positioned at the pcb board shaped recesses, and locating hole is positioned at the infrabasal plate edge.
4. LED chip light source die group substrate according to claim 1, it is characterized in that: be printed on two parts circuit structure on described pcb board, a part is the pad position of chip lead, another part is external lead wire pad position, and pad position and external lead wire pad position are printed on a pcb board or are dispersed on the polylith pcb board; Described pcb board is single sided board or dual platen.
5. LED chip light source die group substrate according to claim 1, it is characterized in that: described upper substrate is just being worn the bowl cup, leave chip bonding pad position through hole in the bowl cup, bowl cup is outer leaves riveting position post through hole, be positioned at the upper substrate bottom with the pcb board shaped recesses of the quantity such as pcb board, riveting position post is left in the infrabasal plate front, the back side is smooth, its external lead wire pad position through hole is near the substrate outer, the through hole of chip bonding pad on pcb board in upper substrate bowl cup, the external lead wire pad position through hole of external lead wire pad on pcb board on infrabasal plate, riveting position post through hole on upper substrate and the riveting position post riveting of infrabasal plate be fixedly connected with, the locating hole of upper substrate and infrabasal plate coincides with substrate edges.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103417376A CN103090326A (en) | 2011-11-01 | 2011-11-01 | LED chip light source module substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103417376A CN103090326A (en) | 2011-11-01 | 2011-11-01 | LED chip light source module substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103090326A true CN103090326A (en) | 2013-05-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011103417376A Pending CN103090326A (en) | 2011-11-01 | 2011-11-01 | LED chip light source module substrate |
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| CN (1) | CN103090326A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880544A (en) * | 2018-09-06 | 2020-03-13 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122727A1 (en) * | 2003-12-08 | 2005-06-09 | Machi Nicolo F. | Multi-platform aircraft forward position light utilizing led-based light source |
| CN101446393A (en) * | 2008-12-30 | 2009-06-03 | 史杰 | Novel LED light source module |
| CN201731349U (en) * | 2010-08-06 | 2011-02-02 | 上海嘉塘电子有限公司 | High-power LED luminescent lamp |
-
2011
- 2011-11-01 CN CN2011103417376A patent/CN103090326A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050122727A1 (en) * | 2003-12-08 | 2005-06-09 | Machi Nicolo F. | Multi-platform aircraft forward position light utilizing led-based light source |
| CN101446393A (en) * | 2008-12-30 | 2009-06-03 | 史杰 | Novel LED light source module |
| CN201731349U (en) * | 2010-08-06 | 2011-02-02 | 上海嘉塘电子有限公司 | High-power LED luminescent lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880544A (en) * | 2018-09-06 | 2020-03-13 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
| CN110880544B (en) * | 2018-09-06 | 2021-09-03 | 深圳市斯迈得半导体有限公司 | Chip for glass substrate and manufacturing method thereof |
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Application publication date: 20130508 |