CN103084290A - Nozzle unit, substrate processing device and substrate processing method - Google Patents
Nozzle unit, substrate processing device and substrate processing method Download PDFInfo
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- CN103084290A CN103084290A CN2012104187889A CN201210418788A CN103084290A CN 103084290 A CN103084290 A CN 103084290A CN 2012104187889 A CN2012104187889 A CN 2012104187889A CN 201210418788 A CN201210418788 A CN 201210418788A CN 103084290 A CN103084290 A CN 103084290A
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Abstract
The invention provides a nozzle unit, a substrate processing device and a substrate processing method so as to save consumption of photoresist. The substrate processing device comprises a board for supporting the substrate, the nozzle unit applying pharmaceutical liquor to the supported substrate, and a driving unit which moves the substrate or the nozzle unit, so that a relative position between the substrate and the nozzle unit on the board is enabled to change. The nozzle unit comprises a first spraying component that sprays a first pharmaceutical liquor to the substrate in a transverse direction of the first spraying component formed in a first direction, and a second spraying component that sprays a second pharmaceutical liquor to the substrate in a transverse direction of the second spraying component formed in the first direction
Description
Technical field
The present invention relates to the substrate board treatment of coating of substrates liquid, in more detail, relate to the nozzle unit and the substrate board treatment that possesses this nozzle unit of the multiple liquid of substrate ejection.
Background technology
In order to make semiconductor element or liquid crystal display, be implemented as follows multiple operation: the photoetching of supply liquid, etching, Implantation evaporation and clean on the substrate.In such operation, photo-mask process makes the required pattern of formation on the substrate.
The photoresist operation is carried out following operation successively: working procedure of coating, the liquid of coating as photoresist on the substrate; Exposure process is at the specific pattern of light-sensitive surface formation of coating; And developing procedure, remove unnecessary zone at the light-sensitive surface of exposure.
Wherein, generally speaking, substrate moves to a direction, is supplied liquid by fixing nozzle.
Among this, in the working procedure of coating that substrate can be moved, support unit makes this substrate float under the aerial state mobile at it to the bottom surface gas jet of substrate.But substrate produces vibration with the vibration of gas, because the temperature of gas produces the temperature difference between the zone of substrate.
Technical literature formerly
Patent documentation 1: Japan's special permission discloses the 2010-0221186 communique.
Summary of the invention
The present invention is used for providing a kind of nozzle unit, substrate board treatment and substrate processing method using same of saving the consumption of photoresist.
In addition, the present invention is used for providing a kind of nozzle unit, substrate board treatment and substrate processing method using same that applies equably photoresist on the substrate that be arranged in.
Substrate board treatment based on embodiments of the present invention comprises: plate, supporting substrates; Nozzle unit is to the described coating of substrates liquid that is supported by described plate; Driver element moves described substrate or described nozzle unit, so that place substrate and the relative position between the described nozzle unit on the described plate to change; Described nozzle unit comprises: first the ejection parts, along first direction form this first the ejection parts transverse direction, this first the ejection parts spray the first liquid to described substrate; Second the ejection parts, along first direction form this second the ejection parts transverse direction, this second the ejection parts spray the second liquid to described substrate.
In addition, substrate processing method using same according to the embodiment of the present invention utilizes the substrate board treatment treatment substrate, and this substrate board treatment comprises: plate, supporting substrates; Nozzle unit is to the described coating of substrates liquid that is supported by described plate; Driver element moves described substrate or described nozzle unit, so that place substrate and the relative position between the described nozzle unit on the described plate to change; Described nozzle unit comprises: first the ejection parts, along first direction form this first the ejection parts transverse direction, this first the ejection parts spray the first liquid to described substrate; Second the ejection parts, along first direction form this second the ejection parts transverse direction, this second the ejection parts spray the second liquid to described substrate.In described method, change the relative position between described substrate and the described nozzle unit, spray described the first liquid and the second ejection parts from described the first ejection parts to described substrate to described second liquid of surface ejection of described first liquid of ejection.
In addition, nozzle unit according to the embodiment of the present invention comprises: main body, provide the transverse direction of this main body along first direction, and this main body is formed with: first flow, spray the first liquid to substrate, form the transverse direction of this first flow along described first direction; The second runner sprays the second liquid to substrate, forms the transverse direction of this second runner along described first direction; Described first flow is formed along the second direction vertical with described first direction isolated with described the second runner.
The invention effect
According to the present invention, can save the photoresist amount that the photoresist film that forms at substrate consumes.
In addition, according to the present invention, on substrate, can be formed uniformly photoresist film.
In addition, according to the present invention, when when substrate forms the photoresist film of multiple kind, can shorten the required time.
Description of drawings
Fig. 1 is the figure of expression based on the substrate board treatment of an embodiment of the present invention;
Fig. 2 is the figure of expression in conjunction with the cross section of the nozzle unit of supporting station;
Fig. 3 is the figure of expression nozzle unit to the process of coating of substrates liquid;
Fig. 4 sprays the figure of the state of the first liquid to substrate by the first ejection parts for expression;
Fig. 5 is the figure in the cross section of the nozzle unit of the other embodiment of expression;
Fig. 6 is the figure in the cross section of the nozzle unit of the other embodiment of expression;
Fig. 7 is that the nozzle unit of another embodiment of expression is in conjunction with the sectional view of the form of supporting station;
Fig. 8 is that the nozzle unit of another embodiment of expression is in conjunction with the sectional view of the form of supporting station;
Fig. 9 is the sectional view of the nozzle unit of another embodiment of expression;
Figure 10 is the sectional view of the nozzle unit of another embodiment of expression;
Figure 11 is the figure of the form of the bonded block of another embodiment of expression.
Symbol description
10 ... plate
20 ... the base plate transfer parts
30 ... nozzle unit
40 ... the nozzle transfer member
41 ... supporting station
50 ... nozzle unit standby section
The specific embodiment
Below, describe embodiments of the present invention in detail with reference to Fig. 1 to Fig. 5 of accompanying drawing.Embodiments of the present invention can be deformed into various ways, may not be interpreted as scope of the present invention and are limited by following embodiment.Present embodiment illustrates more completely that for the practitioner who has average knowledge in this area the present invention provides.Therefore, the shape of important document to some extent exaggeration in order to emphasize more particularly bright among the figure.
Fig. 1 is the schematic diagram based on the substrate s treating apparatus of one embodiment of the present invention.With reference to Fig. 1, substrate s treating apparatus comprises: plate 10, nozzle unit 30, base plate transfer parts 20, nozzle transfer member 40 and nozzle unit standby section 50.
Plate 10 can have the width that is set in first direction 101, and has when seeing from top the shape that prolongs in the second direction 102 vertical with first direction 101.After substrate s is positioned on the plate 10, can move to second direction 102.
Form gas supply orifice 11 at plate 10.Gas supply orifice 11 links gas supply department (not shown) by gas supply line (not shown).The gas of supplying from gas supply department sprays by gas supply orifice 11.The gas that sprays from gas supply orifice 11 floats the substrate s that is positioned on the plate 10.
Two sides at the first direction 101 of plate 10 arrange base plate transfer parts 20.Base plate transfer parts 20 comprise base plate transfer track 21 and hold assembly 22.
Base plate transfer prolongs and forms along second direction 102 with the two sides of track 21 at plate 10.Hold assembly 22 is positioned at each base plate transfer with on the track 21.Hold assembly 22 is set to and can moves to second direction 102 with track 21 along base plate transfer.Substrate s is held parts 22 supportings under the state that floats by the gas that sprays from gas supply orifice 11.If hold assembly 22 moves to second direction 102, then substrate s is transferred to second direction 102.
Supporting station 41 forms the rod that prolongs more longways and touches sample on first direction 101.Nozzle unit 30 at least one face and supporting station 41 combinations, and be set to slave plate 10 to third direction 103 isolation.In addition, by the bonded block 60 of following explanation, nozzle unit 30 is with removable mode and supporting station 41 combinations.
The end of the first direction 101 of supporting station 41 links vertical frame 42.Vertical frame 42 prolongs and forms to the below of third direction 103.Vertical frame 42 can be integrally formed with supporting station 41, links with supporting station 41 after perhaps forming respectively again.
Nozzle unit standby section 50 has the width of second direction of being arranged at 102 in the inboard of guide rail 43, and is set to the shape in first direction 101 prolongations.Nozzle unit standby section 50 is configured on the path of moving nozzle unit 30.That is, vertical frame 42 moves along guide rail 43, makes nozzle unit 30 can be positioned at the top of nozzle unit standby section 50.
When nozzle unit standby section 50 was positioned at the top of plate 10, nozzle unit standby section 50 was set to slave plate 10 and separates in the 3rd direction.Therefore, can between plate 10 and nozzle unit standby section 50, move at the substrate s on the plate 10.
Can make a plurality of nozzle units 30 be positioned at this place at nozzle unit standby section 50 places.In addition, can possess not nozzle unit 30 with supporting station 41 combinations at nozzle unit standby section 50 places.Therefore, after being arranged to separate with supporting station 41 conjugate nozzle units 30 and being positioned at nozzle unit standby section 50, can arrange so that be positioned at other the nozzle unit 30 and supporting station 41 combinations at nozzle unit standby section 50 places, thereby realize the replacing of nozzle unit 30.Therefore, can be according to the kind of the liquid that sprays from nozzle unit 30, the nozzle unit 30 of replacing and use and supporting station 41 combinations.
Fig. 2 is the figure of expression with the cross section of the conjugate nozzle unit of supporting station.
See figures.1.and.2, nozzle unit 30 comprises: the first ejection parts, second spray parts, take out and draw parts 340 and grate flow channel 330.
Take out and draw parts 340 and can be attached to side of main body 300 or be formed in the main body 300 as runner.First flow 310 draws between parts 340 and the second runner 320 taking out.In addition, first flow 310 draws between parts 340 and the grate flow channel 330 taking out.Take out and draw parts 340 and decompression member 372 bindings.If decompression member 372 work is then taken out and is drawn 340 pairs of liquids from first flow 310 ejections of parts suction pressure is provided.Therefore, Yi Bian the first liquid on one side draw parts 340 these sides and be attracted and be ejected to taking out.
Have attachment 60 at supporting station 41.Attachment 60 can comprise sucting 61.Sucting 61 be formed at supporting station 41 below.Sucting 61 can comprise the negative pressure section 610 that links with decompression member 373.If decompression member 373 work and gas around the negative suction section 610 then produces negative pressure at negative pressure section 610 places makes to engage with supporting station 41 with nozzle unit 30 that the mode of negative pressure section 610 adjacency arranges.In addition, if decompression member 373 stops, then nozzle unit 30 separates from supporting station 41.
Fig. 3 is the figure of expression nozzle unit to the process of coating of substrates liquid.
With reference to Fig. 3, the relative position of substrate s and nozzle unit 30 changes along second direction 102, simultaneously to substrate s coating liquid.After substrate s was held parts 22 supportings, hold assembly 22 moved with track 21 along base plate transfer, can change the relative position between substrate s and the nozzle unit 30 simultaneously.In addition, vertical frame 42 moves along guide rail 43, can change the relative position between substrate s and the nozzle unit 30 simultaneously.That is the relative position that, changes between substrate s and the nozzle unit 30 by base plate transfer parts 20 or nozzle transfer member 40.Therefore, base plate transfer parts 20 and nozzle transfer member 40 are called driver element.
Below, illustrate the situation that substrate s moves.But, can nozzle unit 30 move or nozzle unit 30 and substrate s move, come simultaneously to substrate s coating liquid.According to an example, the first liquid 318 is organic solvent, the second liquid 328 sensitization liquid.Organic solvent can be diluent (Thinner), and sensitization liquid can be photoresist.
From gas supply orifice 11 ejection gases, hold assembly 22 moves to second direction 102 with track 21 along base plate transfer under the floating state of substrate s.At this moment, substrate s moves to a side of the second ejection parts at the first ejection parts place.
Fig. 4 sprays the figure of the state of the first liquid by the first ejection parts for expression.
With reference to Fig. 3 and Fig. 4, before the work of the first ejection parts or in the work, to take out and draw parts and start working, the first liquid 318 can be ejected when taking out the suction pressure of drawing the parts direction being subject to.Therefore, the first liquid 318 is guided to take out to the place that substrate s applies and draws the parts direction.And, apply the second liquid 328 to the substrate s that is coated with the first liquid 318.
Fig. 5 is the figure of expression based on the cross section of the nozzle unit of other embodiment.
With reference to Fig. 5, nozzle unit 30 comprises first flow 310, the second runner 320 and grate flow channel 330.Therefore, nozzle unit can not provide to take out and draw parts.
Fig. 6 is the figure of expression based on the cross section of the nozzle unit of other embodiment.
With reference to Fig. 6, nozzle unit 30 comprises first flow 310 and the second runner 320.Therefore, nozzle unit can not provide to take out and draw parts and grate flow channel.
The sectional view of the state that Fig. 7 and Fig. 8 are combined with supporting station based on the nozzle unit of other embodiment for expression.
With reference to Fig. 7 and Fig. 8, nozzle unit 30 comprises the first main body 301 and the second main body 302.The first main body 301 and the second main body 302 form along first direction 101.The first ejection parts can comprise first flow 310 in the first main body 301.In addition, the second ejection parts can comprise the second runner 320 in the second main body 302.
In the first main body 301 or the second main body 302, can form grate flow channel 330.When grate flow channel 330 is formed in the first main body 301, form this grate flow channel 330 in that side in abutting connection with the second main body 302 along first direction 101.In addition, when grate flow channel 330 is formed in the second main body 302, form this grate flow channel 330 in that side in abutting connection with the first main body 301 along first direction 101.
Supporting station 41 can comprise the first supporting station 410 and the second supporting station 420.The first supporting station 410 and 301 combinations of the first main body, the second supporting station 420 and 302 combinations of the second main body.The first supporting station 410 or the second supporting station 420 are set to and can move up at upper and lower, thereby the relative altitude of the lower end of the first main body 301 and the second main body 302 can be regulated.In addition, the first supporting station 410 or the second supporting station 420 can move to second direction 102, and the interval between the first main body 301 and the second main body 302 can be regulated.
Fig. 9 is the sectional view of expression based on the nozzle unit of other embodiment.
With reference to Fig. 9, in the first main body 301, provide first flow 310, the second runner 320 is provided in the second main body 302.In addition, take out and draw the side that parts 340 can be attached to the first main body 301, perhaps be formed in the first main body 301 as runner.Therefore, that works that grate flow channel is not provided for nozzle unit.
Figure 10 is the sectional view of expression based on the nozzle unit of other embodiment.
With reference to Figure 10, in the first main body 301, provide in first flow 310, the second main bodys 302 the second runner 320 is provided.Therefore, nozzle unit can not provide grate flow channel and take out and draw parts.
Figure 11 is the figure of expression based on the form of the bonded block 60 of other embodiment.
With reference to Figure 11, bonded block 60 comprises electromagnet 640.Electromagnet 640 can be arranged at supporting station 41 lower surfaces, and links with power supply 641 and switch 642.On nozzle unit 30, can metallic plate 650 be set at the face that joins with supporting station 41.Therefore, if starting switch 642 and power supply is put on electromagnet 640, then metallic plate 650 is attached to electromagnet 640, thus nozzle unit 30 and supporting station 41 combinations.In addition, if the stopcock 642 and blocking-up power supply puts on electromagnet 640, then nozzle unit 30 separates from supporting station 41.
More than detailed explanation only be to the present invention's illustration in addition.In addition, aforementioned content of the present inventionly preferred embodiment describes for illustrating, and the present invention can use under multiple other combinations, change and environment.That is the scope of the concept of the invention that, discloses in this manual, with the scope of the technology of the scope of aforesaid disclosure equalization and/or this area or knowledge in can change or revise.Aforesaid embodiment is illustrated the preferably state of the idea that realizes technology of the present invention, also can carry out numerous variations in the situation of concrete suitable application area of the present invention and purposes.Therefore, more than the detailed explanation of invention is not to be the present invention to be limited to the enforcement state that discloses.In addition, must be noted that subsidiary claims also comprise other enforcement state.
Claims (26)
1. a substrate board treatment is characterized in that, comprising:
Plate, supporting substrates;
Nozzle unit is to the described coating of substrates liquid that is supported by described plate;
Driver element moves described substrate or described nozzle unit, so that place substrate and the relative position between the described nozzle unit on the described plate to change;
Described nozzle unit comprises:
First the ejection parts, along first direction form this first the ejection parts transverse direction, this first the ejection parts spray the first liquid to described substrate;
Second the ejection parts, along first direction form this second the ejection parts transverse direction, this second the ejection parts spray the second liquid to described substrate.
2. substrate board treatment according to claim 1 is characterized in that,
Described nozzle unit also comprises: main body forms the transverse direction of this main body along described first direction;
Described the first ejection parts are provided as the first flow that is formed in the described main body;
The second ejection parts are provided as the second runner that is formed in the described main body.
3. substrate board treatment according to claim 2 is characterized in that,
In described main body, also form the grate flow channel that sucks from the flue gas of described substrate generation.
4. substrate board treatment according to claim 3 is characterized in that,
Described grate flow channel is formed between described first flow and described the second runner.
5. substrate board treatment according to claim 4 is characterized in that, described first flow and the following section of the second runner form to the mode of described grate flow channel lopsidedness.
6. substrate board treatment according to claim 2 is characterized in that, also comprises:
Take out and draw parts, provide suction pressure to described the first liquid from described the first ejection parts ejection.
7. substrate board treatment according to claim 6 is characterized in that,
Described taking out drawn parts and formed in the mode that comprises its runner in described main body and provide, and described first flow is between described runner and described the second runner.
8. substrate board treatment according to claim 2 is characterized in that,
Described first flow separates with the perpendicular second direction of described the second runner edge and described first direction.
9. substrate board treatment according to claim 1 is characterized in that,
Described driver element comprises: supporting station, and described supporting station is combined with described nozzle unit;
Vertical frame, described supporting station is supported in the both sides that are arranged at described supporting station;
Guide rail, the mode that can move to the second direction vertical with described first direction with described vertical frame supports this vertical frame;
Described substrate board treatment also comprises:
Bonded block, described bonded block make described nozzle unit be combined with described supporting station in removable mode.
10. substrate board treatment according to claim 9 is characterized in that, also comprises:
Nozzle unit standby section, the nozzle unit that separates from described supporting station places this nozzle unit standby section, and described nozzle unit standby section is disposed on the path that described nozzle unit moves.
11. substrate board treatment according to claim 9 is characterized in that,
Described bonded block comprises: sucting, be formed at the lower surface of described supporting station, and suction pressure is provided.
12. substrate board treatment according to claim 11 is characterized in that,
Described bonded block also comprises: the joint portion, be arranged at the outer surface of the described nozzle unit that joins with described supporting station, and when described supporting station was combined, described sucting was inserted in described joint portion at described nozzle unit.
13. substrate board treatment according to claim 1 is characterized in that,
Described nozzle unit comprises: the first main body forms the transverse direction of this first main body along described first direction; The second main body forms the transverse direction of this second main body along described first direction;
Described the first ejection parts are provided as the first flow that is formed in described the first main body;
Described the second ejection parts are provided as the second runner that is formed in described the second main body.
14. substrate board treatment according to claim 13 is characterized in that,
Described nozzle unit also forms grate flow channel in described the first main body or described the second main body, this grate flow channel sucks the flue gas that produces at described substrate.
15. substrate board treatment according to claim 1 is characterized in that,
Form the gas supply orifice at described plate, this gas supply orifice is set to spray gas and described substrate is supported by described plate under floating state.
16. substrate board treatment according to claim 1 is characterized in that, described the first liquid is organic solvent, and described the second liquid is photoresist.
17. a substrate processing method using same is characterized in that, in the method for the substrate board treatment treatment substrate that utilizes claim 1 or claim 2,
Change the relative position between described substrate and the described nozzle unit, and spray described the first liquid by the first ejection parts to described substrate, described the second ejection parts spray described the second liquid on the surface of described first liquid of ejection.
18. substrate processing method using same according to claim 17 is characterized in that,
After described the first ejection parts were started working, described the second ejection parts began action.
19. substrate processing method using same according to claim 17 is characterized in that,
Also form grate flow channel in described main body, this grate flow channel sucks the flue gas that produces from described substrate,
Described the first ejection parts and described grate flow channel are worked jointly, spray described the first liquid and suck the flue gas that produces from described substrate.
20. substrate processing method using same according to claim 17 is characterized in that,
Form the gas supply orifice at described plate, this gas supply orifice is set to spray gas and described substrate is supported by described plate under floating state,
Spray described gas by described gas supply orifice, under the floating state of described substrate, spray described the first liquid and the second liquid to described substrate.
21. a nozzle unit is characterized in that, comprising:
Main body provides the transverse direction of this main body along first direction, and this main body is formed with:
First flow sprays the first liquid to substrate, forms the transverse direction of this first flow along described first direction;
The second runner sprays the second liquid to substrate, forms the transverse direction of this second runner along described first direction;
Described first flow is formed along the second direction vertical with described first direction isolated with described the second runner.
22. nozzle unit according to claim 21 is characterized in that,
Also form grate flow channel in described main body, this grate flow channel sucks the flue gas that produces from described substrate.
23. nozzle unit according to claim 22 is characterized in that,
Described grate flow channel is formed between described first flow and described the second runner.
24. nozzle unit according to claim 23 is characterized in that, described first flow and the following section of described the second runner form to the mode of described grate flow channel lopsidedness.
25. nozzle unit according to claim 21 is characterized in that, also comprises:
Take out and draw parts, provide suction pressure to described the first liquid from described first flow ejection.
26. nozzle unit according to claim 25 is characterized in that,
Described taking out drawn parts and be configured to: its runner is positioned at described main body, and described first flow is between described runner and described the second runner.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2011-0111869 | 2011-10-31 | ||
| KR20110111869 | 2011-10-31 | ||
| KR1020110129094A KR101350950B1 (en) | 2011-10-31 | 2011-12-05 | Nozzle unit, substrate treating apparatus and substrate treating method |
| KR10-2011-0129094 | 2011-12-05 |
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| Publication Number | Publication Date |
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| CN103084290A true CN103084290A (en) | 2013-05-08 |
| CN103084290B CN103084290B (en) | 2015-10-28 |
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| JP5733636B2 (en) | 2015-06-10 |
| CN103084290B (en) | 2015-10-28 |
| JP2013098569A (en) | 2013-05-20 |
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