CN103077918B - A kind of die grading equipment push pin device - Google Patents
A kind of die grading equipment push pin device Download PDFInfo
- Publication number
- CN103077918B CN103077918B CN201310007480.XA CN201310007480A CN103077918B CN 103077918 B CN103077918 B CN 103077918B CN 201310007480 A CN201310007480 A CN 201310007480A CN 103077918 B CN103077918 B CN 103077918B
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- China
- Prior art keywords
- thimble
- mount pad
- push pin
- adjusting seat
- sleeve
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of die grading equipment push pin device, comprise thimble sleeve, thimble axle and mount pad, liftable thimble axle is arranged in thimble sleeve, thimble axle top is fixed with thimble, the thimble axial brake device that thimble axle and drives thimble axle to move up and down is connected, and thimble sleeve being provided with the centre hole passed for thimble, being also arranged with the adjusting seat for adjusting thimble sleeve portion outside thimble axle, thimble sleeve is fixed in adjusting seat, and adjusting seat is fixed in mount pad.This push pin device is by the position of adjustment adjusting seat, and drive thimble sleeve to move, the axis almost coaxial of adjustable thimble and centre hole, makes arrangements of chips precision be increased dramatically; Replacing thimble is convenient and swift, only need pull down thimble sleeve and change when changing thimble, drives tailstock barrel cylinder to move, the centre hole that observation adjustment thimble and thimble sleeve pass for thimble, make it coaxially after replacing by the position of camera lens adjustment adjusting seat.
Description
Technical field
The invention belongs to semiconductor die testing sorting unit technical field, specifically, relate to a kind of die grading equipment push pin device.
Background technology
The effect of die grading equipment is that chip is carried out classified emission.In the course of work, treating that the chip of sorting is evenly pasted onto turns on epitaxial, turn over epitaxial to be tauted and to be fixed on by the close-fitting nylon ring of Internal and external cycle (i.e. primary and secondary ring), primary and secondary ring is installed on and can moves and do on 30 ° of supply cylindrical shape platforms rotated around own axes in XY direction, and the scanning CCD system of platform upper identifies turning over every chips on epitaxial and locates.Chip transfer system captures each chip, and it is placed into receiving platform according to rule, completes die grading.
Push pin device is the important building block of on die grading equipment, it is arranged on below in supply cylindrical shape platform, its major function drives thimble up to push up from the RC below of chip, the adhesion strength overcoming chip and turn between epitaxial is by chip jack-up, so that chip siphons away by top suction nozzle.Push pin device design is the key realizing die grading technique, and the motion feature of thimble jack-up determines the success or failure of chip pick-up.
During existing push pin device work, due to the error that machining exists, the axially bored line decentraction that thimble and thimble sleeve pass for thimble is made to make thimble secundly, cause thimble from the RC below of chip by chip jack-up, arrangements of chips low precision can not to be made or cause chip pick-up failure; Because push pin device is fixed, limit supply cylindrical shape Platform movement stroke, but other functions but require supply cylindrical shape, and platform there is larger displacement, and the inwall of cylindrical shape platform and thimble sleeve are interfered; Existing push pin device replacing thimble neither be very convenient in addition.
Summary of the invention
Instant invention overcomes shortcoming of the prior art, provide a kind of die grading equipment push pin device, one of its object is: its axial line that can adjust the centre hole that thimble sleeve supplies thimble to pass makes it coaxial with thimble axial line, improves sorting success rate and quality;
Two of its object is: mechanism can make push pin device entire lowering, avoids supply cylindrical shape platform, makes supply cylindrical shape platform have larger stroke to realize other functions;
Three of its object is: conveniently can change thimble.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of die grading equipment push pin device, comprise thimble sleeve, thimble axle and mount pad, liftable thimble axle is arranged in thimble sleeve, thimble axle top is fixed with thimble, the thimble axial brake device that thimble axle and drives thimble axle to move up and down is connected, and thimble sleeve being provided with the centre hole passed for thimble, being also arranged with the adjusting seat for adjusting thimble sleeve portion outside thimble axle, thimble sleeve is fixed in adjusting seat, and adjusting seat is fixed in mount pad.
Further, adjusting seat is provided with adjusting device.
Further, adjusting device is four the adjustment screws being located at adjusting seat four sides respectively, and the tail end of adjustment screw is connected to outside adjusting seat, and adjustment screw is bolted in mount pad.
Further, the overall drive unit that mount pad and drives push pin device to move up and down is connected.
Further, overall drive unit comprises driving cylinder, guide rail and installing rack, and mount pad is fixed in installing rack, drives air cylinder driven installing rack at slide on rails.
Further, the stroke top of installing rack is provided with stopping means, and stopping means is provided with buffer gear.
Preferably, buffer gear is spring buffer plunger.
More preferred, stopping means is two.
Further, mount pad comprises mount pad and lower mount pad, and it is affixed that upper mount pad and lower mount pad pass through screw.
Further, adjusting seat is fixed in mount pad by screw.
Compared with prior art, the invention has the beneficial effects as follows:
A kind of die grading equipment push pin device of the present invention, by adjusting the position of adjusting seat, drive thimble sleeve to move, the axis almost coaxial of the centre hole that adjustable thimble passes with confession thimble on thimble sleeve, makes arrangements of chips precision be increased dramatically;
Replacing thimble is convenient and swift, only need pull down thimble sleeve and change when changing thimble, drives tailstock barrel cylinder to move, the centre hole that observation adjustment thimble and thimble sleeve pass for thimble, make it coaxially after replacing by the position of camera lens adjustment adjusting seat;
Push pin device entirety integral elevating under overall drive unit drives, can avoid supply cylindrical shape platform, prevent the inwall of cylindrical shape platform and thimble sleeve from interfering, and makes supply cylindrical shape platform have larger stroke to realize other functions;
In addition, thimble axle is by driving cylinder as power, and adopt guide rail to lead, make each lift pin XYZ three-dimensional error within ± 2 μm, reproducible, stable performance, improves sorting quality and success rate.
Accompanying drawing explanation
Accompanying drawing is used to provide a further understanding of the present invention, together with embodiments of the present invention for explaining the present invention, is not construed as limiting the invention, in the accompanying drawings:
Fig. 1 is the cross-sectional view of a kind of die grading equipment push pin device of the present invention;
Fig. 2 is the perspective view of the overall drive unit of a kind of die grading equipment push pin device of the present invention;
Fig. 3 is the plan structure schematic diagram of a kind of die grading equipment push pin device of the present invention.
Wherein include in Fig. 1 to Fig. 3,
1---thimble sleeve; 2---locking nut;
3---thimble; 4---thimble axle;
5---adjusting seat; 6---adjustment screw;
7---centre hole; 8---upper mount pad;
9---lower mount pad; 10---anti-turn screw;
11---anti-skid screw; 14---cam;
15---installing rack; 19---anti-rotation groove;
20---screw; 21---stopping means;
22---thimble axial brake device; 23---spring buffer plunger;
24---motor; 25---guide rail;
26---drive cylinder.
Embodiment
Below in conjunction with accompanying drawing, the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein is only for instruction and explanation of the present invention, is not intended to limit the present invention.
As shown in Figure 1 to Figure 3, a kind of die grading equipment push pin device of the present invention, comprise thimble sleeve 1, thimble axle 4 and mount pad, liftable thimble axle 4 is arranged in thimble sleeve 1, thimble axle 4 top is fixed with thimble 3, the thimble axial brake device 22 that thimble axle 4 and drives thimble axle 4 to move up and down is connected, thimble sleeve 1 is provided with the centre hole 7 passed for thimble 3, the adjusting seat 5 for adjusting thimble sleeve 1 position is also arranged with outside thimble axle 4, thimble sleeve 1 is fixed in adjusting seat 5, clamping can be taked, be spirally connected, the connected modes such as screw connection, convenient and swift when making to change thimble 3.
Adjusting seat 5 is fixed in mount pad.Controlled and accurate adjustment when moving to make adjusting seat 5, adjusting seat 5 is provided with four the adjustment screws 6 being located at adjusting seat 5 four sides respectively, as Fig. 1, shown in Fig. 3, and the tail end of adjustment screw 6 is connected to outside adjusting seat 5, adjustment screw 6 is bolted in mount pad, adjusting seat 5 surrounding is withstood by rotating four adjustment screws 6, thimble sleeve 1 is driven to move, simple to operate and the accurate control of the adjustment enabling the center line of the centre hole 7 that thimble sleeve 1 stretches out for thimble 3 coaxial with thimble 3, arrangements of chips precision is increased dramatically, Deviation Control is within XY direction ± 38 μm, within angle ± 3 °.
As shown in Figure 2, push pin device is driven can be moved up and down by overall drive unit, dodges the motion of supply cylindrical shape platform, makes supply cylindrical shape platform have larger stroke, to realize other functions.Concrete: mount pad is connected with the driving cylinder 26 driving push pin device to move up and down by installing rack 15, and installing rack 15 slides on guide rail 25.Be also original same position to make service position after push pin device integral elevating, namely repetitive positioning accuracy is high, the present invention adopts and drives cylinder 26 to be the power set driving push pin device to move up and down, and is led by line slideway 25, thus ensures kinematic accuracy.
In order to positioning precision when making push pin device integral elevating is high, the stroke top of installing rack 15 is provided with on two stopping means, 21, two stopping means 21 and is respectively equipped with a spring buffer plunger 23 for cushioning, and reduces the hard impact of machinery, reduce vibrations, improve positioning precision.
Mount pad comprises mount pad 8 and lower mount pad 9, and it is affixed that upper mount pad 8 and lower mount pad 9 pass through screw 20.Be convenient to the dismounting of push pin device and installation and maintenance, adjusting seat 5 is fixed in mount pad by screw 20.
As shown in Figure 1, the side opening of thimble axial brake device 22 is provided with anti-rotation groove 19, the lower mount pad 9 coordinated with it offers corresponding screw hole, anti-turn screw 10 is through screw hole, the tail end of anti-turn screw 10 stretches in anti-rotation groove 19, and anti-rotation groove 19 needs along the length of thimble 3 direction of motion stroke being greater than thimble axial brake device 22.Prevent thimble axial brake device 22 from motion process, producing radial rotation.
As shown in Figure 1, lower mount pad 9 is also provided with anti-skid screw 11.
Change the course of work of thimble 3: as shown in Figure 2, back out thimble sleeve 1, unclamp locking nut 2, pull up thimble 3, change new thimble 3, locking locking nut 2, thimble sleeve 1 of screwing on, changes thimble 3 process and completes;
The adjustment process that thimble 3 is coaxial with centre hole 7: unclamp screw 20, the relative position of thimble 3 and centre hole 7 is observed by camera lens, by adjusting four adjustment screws 6, making adjusting seat 5 drive thimble sleeve XY direction to move, thimble 3 and centre hole 7 axis coaxle can be made.
As shown in Figure 1 and Figure 2, the course of work of push pin device: thimble axial brake device 22 is contained on installing rack 15, motor 24 is with moving cam 14 to make thimble axial brake device 22 drive thimble axle 4 and thimble 3 to move up and down; Drive the push rod of cylinder 26 to be connected on installing rack 15, drive push pin device integral elevating by driving cylinder 26, keep the stable of repeatable accuracy and thimble 3 by guide rail 25.
Last it is noted that these are only the preferred embodiments of the present invention; be not limited to the present invention; although with reference to embodiment to invention has been detailed description; for a person skilled in the art; it still can be modified to the technical scheme described in foregoing embodiments; or equivalent replacement is carried out to wherein portion of techniques feature; but it is within the spirit and principles in the present invention all; any amendment of doing, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (7)
1. a die grading equipment push pin device, it is characterized in that: comprise thimble sleeve, thimble axle and mount pad, liftable thimble axle is arranged in described thimble sleeve, described thimble axle top is fixed with thimble, the thimble axial brake device that described thimble axle and drives described thimble axle to move up and down is connected, described thimble sleeve is provided with the centre hole passed for described thimble, it is characterized in that: outside described thimble axle, be also arranged with the adjusting seat for adjusting thimble sleeve portion, described thimble sleeve is fixed in described adjusting seat, described adjusting seat is fixed in described mount pad, described adjusting seat is provided with adjusting device, described adjusting device is four the adjustment screws being located at described adjusting seat four sides respectively, and the tail end of described adjustment screw is connected to outside described adjusting seat, described adjustment screw is bolted in described mount pad, and described adjusting seat is fixed in described mount pad by screw.
2. a kind of die grading equipment push pin device according to claim 1, is characterized in that: the overall drive unit that described mount pad and drives described push pin device to move up and down is connected.
3. a kind of die grading equipment push pin device according to claim 2, it is characterized in that: described overall drive unit comprises driving cylinder, guide rail and installing rack, described mount pad is fixed in described installing rack, and described in described driving air cylinder driven, installing rack is at described slide on rails.
4. a kind of die grading equipment push pin device according to claim 3, is characterized in that: the stroke top of described installing rack is provided with stopping means, and described stopping means is provided with buffer gear.
5. a kind of die grading equipment push pin device according to claim 4, is characterized in that: described buffer gear is spring buffer plunger.
6. a kind of die grading equipment push pin device according to claim 5, is characterized in that: described stopping means is two.
7. a kind of die grading equipment push pin device according to claim 1 to 6 any one, is characterized in that: described mount pad comprises mount pad and lower mount pad, and it is affixed that described upper mount pad and lower mount pad pass through screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310007480.XA CN103077918B (en) | 2013-01-09 | 2013-01-09 | A kind of die grading equipment push pin device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310007480.XA CN103077918B (en) | 2013-01-09 | 2013-01-09 | A kind of die grading equipment push pin device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103077918A CN103077918A (en) | 2013-05-01 |
| CN103077918B true CN103077918B (en) | 2016-03-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310007480.XA Expired - Fee Related CN103077918B (en) | 2013-01-09 | 2013-01-09 | A kind of die grading equipment push pin device |
Country Status (1)
| Country | Link |
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| CN (1) | CN103077918B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799432B (en) | 2016-09-06 | 2020-05-05 | 中芯国际集成电路制造(上海)有限公司 | Tube core sorting device |
| CN107845604A (en) * | 2017-12-13 | 2018-03-27 | 苏州聚进顺自动化科技有限公司 | A kind of push pin device for bonder |
| CN108855966B (en) * | 2018-06-12 | 2023-10-27 | 浙江捷仕泰电子有限公司 | Needle checking mechanism of needle pressing machine |
| CN111128846B (en) * | 2019-12-24 | 2022-02-22 | 颀中科技（苏州）有限公司 | Ejector pin device for chip packaging |
| CN114121771B (en) * | 2021-11-18 | 2023-07-14 | 深圳新益昌科技股份有限公司 | Ejector pin mechanism and crystal ejection equipment |
| CN114933167A (en) * | 2022-04-27 | 2022-08-23 | 泉州兰姆达仪器设备有限公司 | Ejector pin mechanism of laser chip testing and sorting machine and working method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201449396U (en) * | 2009-03-23 | 2010-05-05 | 常州新区爱立德电子有限公司 | Thimble lifting platform adjustment device |
| CN101740451A (en) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | Ejector pin mechanism of chip sorting equipment |
| CN202221753U (en) * | 2011-09-19 | 2012-05-16 | 广东宝丽华服装有限公司 | Adjustable thimble seat used for chip mounter |
| CN203134771U (en) * | 2013-01-09 | 2013-08-14 | 广东志成华科光电设备有限公司 | Lifting pin device for chip sorting device |
-
2013
- 2013-01-09 CN CN201310007480.XA patent/CN103077918B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201449396U (en) * | 2009-03-23 | 2010-05-05 | 常州新区爱立德电子有限公司 | Thimble lifting platform adjustment device |
| CN101740451A (en) * | 2009-12-23 | 2010-06-16 | 东莞华中科技大学制造工程研究院 | Ejector pin mechanism of chip sorting equipment |
| CN202221753U (en) * | 2011-09-19 | 2012-05-16 | 广东宝丽华服装有限公司 | Adjustable thimble seat used for chip mounter |
| CN203134771U (en) * | 2013-01-09 | 2013-08-14 | 广东志成华科光电设备有限公司 | Lifting pin device for chip sorting device |
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|---|---|
| CN103077918A (en) | 2013-05-01 |
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Granted publication date: 20160309 Termination date: 20170109 |
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| CF01 | Termination of patent right due to non-payment of annual fee |