CN103077918A - Ejector pin device of die grading equipment - Google Patents

Ejector pin device of die grading equipment Download PDF

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Publication number
CN103077918A
CN103077918A CN201310007480XA CN201310007480A CN103077918A CN 103077918 A CN103077918 A CN 103077918A CN 201310007480X A CN201310007480X A CN 201310007480XA CN 201310007480 A CN201310007480 A CN 201310007480A CN 103077918 A CN103077918 A CN 103077918A
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CN
China
Prior art keywords
thimble
ejector pin
mount pad
pin device
push pin
Prior art date
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Granted
Application number
CN201310007480XA
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Chinese (zh)
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CN103077918B (en
Inventor
朱国文
吴涛
龚时华
朱文凯
贺松平
李斌
吴磊
宋宪振
黄惠
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GUANGDONG ZHICHENG HUAKE PHOTOELECTRIC EQUIPMENT CO Ltd
Original Assignee
GUANGDONG ZHICHENG HUAKE PHOTOELECTRIC EQUIPMENT CO Ltd
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Application filed by GUANGDONG ZHICHENG HUAKE PHOTOELECTRIC EQUIPMENT CO Ltd filed Critical GUANGDONG ZHICHENG HUAKE PHOTOELECTRIC EQUIPMENT CO Ltd
Priority to CN201310007480.XA priority Critical patent/CN103077918B/en
Publication of CN103077918A publication Critical patent/CN103077918A/en
Application granted granted Critical
Publication of CN103077918B publication Critical patent/CN103077918B/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses an ejector pin device of die grading equipment, which comprises an ejector pin sleeve, an ejector pin shaft and an installing seat, wherein the liftable ejector pin shaft is arranged in the ejector pin sleeve; an ejector pin is fixedly arranged on a top end of the ejector pin shaft; the ejector pin shaft is connected with an ejector pin shaft drive device for driving the ejector pin shaft to move up and down; an ejector pin hole for the ejector pin to penetrate through is arranged in the ejector pin sleeve; an adjusting seat for adjusting the position of the ejector pin sleeve is also sleeved on an outer side of the ejector pin shaft; the ejector sleeve is fixedly connected with the adjusting seat; and the adjusting seat is fixedly connected with the installing seat. According to the ejector pin device, through adjusting the position of the adjusting seat, the ejector pin sleeve is driven to move, so that axial lines of the ejector pin and the ejector pin hole can be adjusted to be coaxial basically, and the array accuracy of chips is greatly improved; and the ejector pin can be replaced conveniently and quickly, the ejector pin can be replaced through disassembling the ejector pin sleeve, after the ejector pin is replaced, the position of the adjusting seat is adjusted through a lens so as to drive the ejector pin sleeve to move, and the ejector pin and the ejector pin hole for the ejector pin to penetrate through of the ejector pin sleeve are observed to be adjusted so as to be coaxial.

Description

A kind of die grading equipment push pin device
Technical field
The invention belongs to semiconductor die testing sorting unit technical field, specifically, relate to a kind of die grading equipment push pin device.
Background technology
The effect of die grading equipment is that chip is carried out classified emission.In the course of work, the chip for the treatment of sorting is evenly sticked on to turn on the epitaxial, turning over epitaxial is tauted and is fixed on by on the close-fitting nylon ring of Internal and external cycle (being the primary and secondary ring), the primary and secondary ring is installed on and can the XY direction moves and do on the supply cylindrical shape platform of 30 ° of rotations around self axis, and the scanning CCD system on platform top is to turning on the epitaxial every chips and identify and locating.The chip transfer system grasps each chip, and it is placed into receiving platform according to rule, finishes die grading.
Push pin device is an important building block on the die grading equipment, it is installed in supplies with below in the cylindrical shape platform, its major function is to drive thimble up to push up from the RC below of chip, overcome chip and turn over adhesion strength between the epitaxial with chip jack-up, so that the top suction nozzle siphons away chip.The push pin device design is the key that realizes die grading technique, and the motion feature of thimble jack-up has determined the success or failure of chip pick-up.
During existing push pin device work, because the error that machining exists, so that the axially bored line decentraction that passes for thimble on thimble and the thimble sleeve makes the thimble secundly, cause the thimble can not be from the RC below of chip with chip jack-up, so that arrangements of chips low precision or cause the chip pick-up failure; Because push pin device is fixed, and has limited the movement travel of supply cylindrical shape platform, but other functions but require to supply with the cylindrical shape platform larger displacement is arranged, so that the inwall of cylindrical shape platform and thimble sleeve interfere; Existing push pin device replacing thimble neither be very convenient in addition.
Summary of the invention
The present invention has overcome shortcoming of the prior art, a kind of die grading equipment push pin device is provided, one of its purpose is: its axial line that can adjust the centre hole that passes for thimble on the thimble sleeve makes it coaxial with the thimble axial line, improves sorting success rate and quality;
Two of its purpose is: this mechanism can make the whole decline of push pin device, avoids supplying with the cylindrical shape platform, larger stroke is arranged to realize other functions so that supply with the cylindrical shape platform;
Three of its purpose is: can conveniently change thimble.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions:
A kind of die grading equipment push pin device, comprise thimble sleeve, thimble axle and mount pad, liftable thimble axle is arranged in the thimble sleeve, thimble axle top is fixed with thimble, the thimble axial brake device that thimble axle and a driving thimble axle move up and down is connected, and is provided with the centre hole that passes for thimble on the thimble sleeve, and the thimble axle outside also is arranged with for the adjusting seat of adjusting thimble sleeve position, the thimble sleeve is fixed in adjusting seat, and adjusting seat is fixed in mount pad.
Further, adjusting seat is provided with adjusting device.
Further, adjusting device is adjusted screws for being located at respectively four of adjusting seat four sides, and the tail end of adjusting screw is connected to the adjusting seat outside, adjusts screw and is bolted in mount pad.
Further, mount pad and drives the whole drive unit that push pin device moves up and down and is connected.
Further, whole drive unit comprises driving cylinder, guide rail and installing rack, and mount pad is fixed in installing rack, drives the air cylinder driven installing rack and slides at guide rail.
Further, the stroke top of installing rack is provided with stopping means, and stopping means is provided with buffer gear.
Preferably, buffer gear is the spring buffer plunger.
More preferred, stopping means is two.
Further, mount pad comprises mount pad and lower mount pad, and upper mount pad and lower mount pad are affixed by screw.
Further, adjusting seat is fixed in mount pad by screw.
Compared with prior art, the invention has the beneficial effects as follows:
A kind of die grading equipment push pin device of the present invention, by adjusting the position of adjusting seat, drive the thimble sleeve and move, can regulate the axis almost coaxial of the centre hole that passes for thimble on thimble and the thimble sleeve, so that the arrangements of chips precision is increased dramatically;
The replacing thimble is convenient and swift, only need pull down the thimble sleeve when changing thimble and change, and the position drive tailstock barrel cylinder by camera lens adjustment adjusting seat after the replacing moves, and observes adjustment thimble and thimble sleeve for the centre hole that thimble passes, and makes its coaxial getting final product;
Push pin device integral body is integral elevating under whole drive unit drives, and can avoid supplying with the cylindrical shape platform, prevents that the inwall of cylindrical shape platform and thimble sleeve from interfering, and larger stroke is arranged to realize other functions so that supply with the cylindrical shape platform;
In addition, the thimble axle adopts guide rail to lead by driving cylinder as power, so that each lifting thimble XYZ three-dimensional error is in ± 2 μ m, and good reproducibility, stable performance has improved sorting quality and success rate.
Description of drawings
Accompanying drawing is used to provide a further understanding of the present invention, is used for together with embodiments of the present invention explaining the present invention, be not construed as limiting the invention, in the accompanying drawings:
Fig. 1 is the cross-sectional view of a kind of die grading equipment push pin device of the present invention;
Fig. 2 is the perspective view of the whole drive unit of a kind of die grading equipment push pin device of the present invention;
Fig. 3 is the plan structure schematic diagram of a kind of die grading equipment push pin device of the present invention.
Wherein include among Fig. 1 to Fig. 3,
1---the thimble sleeve; 2---locking nut;
3---thimble; 4---the thimble axle;
5---adjusting seat; 6---adjust screw;
7---centre hole; 8---upper mount pad;
9---lower mount pad; 10---anti-turn screw;
11---anti-skid screw; 14---cam;
15---installing rack; 19---anti-rotation groove;
20---screw; 21---stopping means;
22---the thimble axial brake device; 23---the spring buffer plunger;
24---motor; 25---guide rail;
26---drive cylinder.
Embodiment
Below in conjunction with accompanying drawing the preferred embodiments of the present invention are described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the present invention, is not intended to limit the present invention.
As shown in Figure 1 to Figure 3, a kind of die grading equipment push pin device of the present invention, comprise thimble sleeve 1, thimble axle 4 and mount pad, liftable thimble axle 4 is arranged in the thimble sleeve 1, thimble axle 4 tops are fixed with thimble 3, the thimble axial brake device 22 that thimble axle 4 and a driving thimble axle 4 move up and down is connected, be provided with the centre hole 7 that passes for thimble 3 on the thimble sleeve 1, thimble axle 4 outsides also are arranged with for the adjusting seat 5 of adjusting thimble sleeve 1 position, thimble sleeve 1 is fixed in adjusting seat 5, can take clamping, be spirally connected, the connected modes such as screw connection are so that convenient and swift when changing thimble 3.
Adjusting seat 5 is fixed in mount pad.Controlled and accurate adjustment when adjusting seat 5 is moved, adjusting seat 5 is provided with four adjustment screws 6 being located at respectively adjusting seat 5 four sides, such as Fig. 1, shown in Figure 3, and the tail end of adjusting screw 6 is connected to adjusting seat 5 outsides, adjust screw 6 and be bolted in mount pad, adjust screws 6 and withstand around the adjusting seat 5 by rotating four, driving thimble sleeve 1 moves, the coaxial adjustment of the center line that makes on the thimble sleeve 1 centre hole 7 that stretches out for thimble 3 and thimble 3 can simple to operate and accurate control, so that the arrangements of chips precision is increased dramatically, Deviation Control is in XY direction ± 38 μ m, in angle ± 3 °.
As shown in Figure 2, push pin device drives and can move up and down by whole drive unit, dodges the motion of supplying with the cylindrical shape platform, so that supply with the cylindrical shape platform larger stroke is arranged, in order to realize other functions.Concrete: mount pad is connected with the driving cylinder 26 that the driving push pin device moves up and down by installing rack 15, and installing rack 15 slides at guide rail 25.For service position after making the push pin device integral elevating also is original same position, be that repetitive positioning accuracy is high, the present invention adopts and drives the power set that cylinder 26 moves up and down for driving push pin device, and by line slideway 25 guiding, thereby guarantee kinematic accuracy.
Positioning accuracy when making the push pin device integral elevating is high, the stroke top of installing rack 15 is provided with and is respectively equipped with a spring buffer plunger 23 that is used for buffering on 21, two stopping means 21 of two stopping means, has reduced mechanical hard impact, reduce vibrations, improved positioning accuracy.
Mount pad comprises mount pad 8 and lower mount pad 9, and upper mount pad 8 and lower mount pad 9 are affixed by screw 20.Be convenient to dismounting and installation and the maintenance of push pin device, adjusting seat 5 is fixed in mount pad by screw 20.
As shown in Figure 1, the side opening of thimble axial brake device 22 is provided with anti-rotation groove 19, offer corresponding screw hole on the lower mount pad 9 that cooperates with it, anti-turn screw 10 passes screw hole, the tail end of anti-turn screw 10 stretches in the anti-rotation groove 19, and anti-rotation groove 19 need to be greater than the stroke of thimble axial brake device 22 along the length of thimble 3 directions of motion.Prevent that thimble axial brake device 22 from producing rotation radially in motion process.
As shown in Figure 1, lower mount pad 9 also is provided with anti-skid screw 11.
Change the course of work of thimble 3: as shown in Figure 2, back out thimble sleeve 1, unclamp locking nut 2, pull up thimble 3, change new thimble 3, locking locking nut 2, the thimble sleeve 1 of screwing on changes thimble 3 processes and finishes;
The adjustment process that thimble 3 and centre hole 7 are coaxial: unclamp screw 20, observe the relative position of thimble 3 and centre hole 7 by camera lens, adjust screw 6 by adjusting four, make adjusting seat 5 drive thimble sleeve XY direction and move, can make thimble 3 and centre hole 7 axis coaxles.
As shown in Figure 1 and Figure 2, the course of work of push pin device: thimble axial brake device 22 is contained on the installing rack 15, and motor 24 band moving cams 14 make thimble axial brake device 22 drive thimble axle 4 and thimble 3 moves up and down; The push rod that drives cylinder 26 is connected on the installing rack 15, drives the push pin device integral elevating by driving cylinder 26, keeps the stable of repeatable accuracy and thimble 3 by guide rail 25.
It should be noted that at last: above only is the preferred embodiments of the present invention; be not limited to the present invention; although with reference to embodiment the present invention is had been described in detail; for a person skilled in the art; it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing; perhaps part technical characterictic wherein is equal to replacement; but within the spirit and principles in the present invention all; any modification of doing, be equal to replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (10)

1. die grading equipment push pin device, it is characterized in that: comprise the thimble sleeve, thimble axle and mount pad, described liftable thimble axle is arranged in the described thimble sleeve, described thimble axle top is fixed with thimble, the thimble axial brake device that described thimble axle and the described thimble axle of a driving move up and down is connected, be provided with the centre hole that passes for described thimble on the described thimble sleeve, it is characterized in that: the described thimble axle outside also is arranged with for the adjusting seat of adjusting thimble sleeve position, described thimble sleeve is fixed in described adjusting seat, and described adjusting seat is fixed in described mount pad.
2. a kind of die grading equipment push pin device according to claim 1, it is characterized in that: described adjusting seat is provided with adjusting device.
3. a kind of die grading equipment push pin device according to claim 2, it is characterized in that: described adjusting device is for being located at respectively four adjustment screws at described adjusting seat four sides, and the tail end of described adjustment screw is connected to the described adjusting seat outside, and described adjustment screw is bolted in described mount pad.
4. a kind of die grading equipment push pin device according to claim 1 is characterized in that: described mount pad and drives the whole drive unit that described push pin device moves up and down and is connected.
5. a kind of die grading equipment push pin device according to claim 4, it is characterized in that: described whole drive unit comprises driving cylinder, guide rail and installing rack, described mount pad is fixed in described installing rack, and the described installing rack of described driving air cylinder driven slides at described guide rail.
6. a kind of die grading equipment push pin device according to claim 5, it is characterized in that: the stroke top of described installing rack is provided with stopping means, and described stopping means is provided with buffer gear.
7. a kind of die grading equipment push pin device according to claim 6, it is characterized in that: described buffer gear is the spring buffer plunger.
8. a kind of die grading equipment push pin device according to claim 7, it is characterized in that: described stopping means is two.
9. according to claim 1 to the described a kind of die grading equipment push pin device of 8 any one, it is characterized in that: described mount pad comprises mount pad and lower mount pad, and described upper mount pad and lower mount pad are affixed by screw.
10. a kind of die grading equipment push pin device according to claim 1, it is characterized in that: described adjusting seat is fixed in described mount pad by screw.
CN201310007480.XA 2013-01-09 2013-01-09 A kind of die grading equipment push pin device Expired - Fee Related CN103077918B (en)

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Application Number Priority Date Filing Date Title
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CN103077918B CN103077918B (en) 2016-03-09

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799432A (en) * 2016-09-06 2018-03-13 中芯国际集成电路制造(上海)有限公司 Tube core sorting equipment
CN107845604A (en) * 2017-12-13 2018-03-27 苏州聚进顺自动化科技有限公司 A kind of push pin device for bonder
CN108855966A (en) * 2018-06-12 2018-11-23 浙江捷仕泰电子有限公司 A kind of pressing machine examination needle mechanism
CN111128846A (en) * 2019-12-24 2020-05-08 颀中科技(苏州)有限公司 Ejector pin device for chip packaging
CN114121771A (en) * 2021-11-18 2022-03-01 深圳新益昌科技股份有限公司 Thimble mechanism and top brilliant equipment
CN114933167A (en) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 Ejector pin mechanism of laser chip testing and sorting machine and working method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201449396U (en) * 2009-03-23 2010-05-05 常州新区爱立德电子有限公司 Thimble lifting platform adjustment device
CN101740451A (en) * 2009-12-23 2010-06-16 东莞华中科技大学制造工程研究院 Ejector pin mechanism of chip sorting equipment
CN202221753U (en) * 2011-09-19 2012-05-16 广东宝丽华服装有限公司 Adjustable thimble seat used for chip mounter
CN203134771U (en) * 2013-01-09 2013-08-14 广东志成华科光电设备有限公司 Lifting pin device for chip sorting device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201449396U (en) * 2009-03-23 2010-05-05 常州新区爱立德电子有限公司 Thimble lifting platform adjustment device
CN101740451A (en) * 2009-12-23 2010-06-16 东莞华中科技大学制造工程研究院 Ejector pin mechanism of chip sorting equipment
CN202221753U (en) * 2011-09-19 2012-05-16 广东宝丽华服装有限公司 Adjustable thimble seat used for chip mounter
CN203134771U (en) * 2013-01-09 2013-08-14 广东志成华科光电设备有限公司 Lifting pin device for chip sorting device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107799432A (en) * 2016-09-06 2018-03-13 中芯国际集成电路制造(上海)有限公司 Tube core sorting equipment
US10734260B2 (en) 2016-09-06 2020-08-04 Semiconductor Manufacturing International (Shanghai) Corporation Die sorting apparatus and die sorting method
CN107845604A (en) * 2017-12-13 2018-03-27 苏州聚进顺自动化科技有限公司 A kind of push pin device for bonder
CN108855966A (en) * 2018-06-12 2018-11-23 浙江捷仕泰电子有限公司 A kind of pressing machine examination needle mechanism
CN108855966B (en) * 2018-06-12 2023-10-27 浙江捷仕泰电子有限公司 Needle checking mechanism of needle pressing machine
CN111128846A (en) * 2019-12-24 2020-05-08 颀中科技(苏州)有限公司 Ejector pin device for chip packaging
CN111128846B (en) * 2019-12-24 2022-02-22 颀中科技(苏州)有限公司 Ejector pin device for chip packaging
CN114121771A (en) * 2021-11-18 2022-03-01 深圳新益昌科技股份有限公司 Thimble mechanism and top brilliant equipment
CN114933167A (en) * 2022-04-27 2022-08-23 泉州兰姆达仪器设备有限公司 Ejector pin mechanism of laser chip testing and sorting machine and working method thereof

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Termination date: 20170109