CN203134771U - Lifting pin device for chip sorting device - Google Patents
Lifting pin device for chip sorting device Download PDFInfo
- Publication number
- CN203134771U CN203134771U CN 201320010292 CN201320010292U CN203134771U CN 203134771 U CN203134771 U CN 203134771U CN 201320010292 CN201320010292 CN 201320010292 CN 201320010292 U CN201320010292 U CN 201320010292U CN 203134771 U CN203134771 U CN 203134771U
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- CN
- China
- Prior art keywords
- lifting pin
- thimble
- mount pad
- push pin
- pin device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
Disclosed in the utility model is a lifting pin device for a chip sorting device. The lifting pin device comprises a lifting pin sleeve, a lifting pin shaft and an installation seat. The liftable lifting pin shaft is arranged in the lifting pin sleeve; a lifting pin is fixed at the top end of the lifting pin shaft; the lifting pin shaft is connected with a lifting pin shaft drive device driving the lifting pin shaft to make up-and-down motions; and a lifting pin hole for penetrating of the lifting pin is arranged on the lifting pin sleeve. An adjusting seat for adjusting the position of the lifting pin sleeve is sleeved at the outer side of the lifting pin shaft; the lifting pin sleeve is fixedly connected to the adjusting seat; and the adjusting seat is fixedly connected to the installation seat. According to the lifting pin device provided by the utility model, the position of the adjusting seat is adjusted and the lifting pin sleeve is driven to make movements, so that the axises of the lifting pin and the lifting pin hole can be adjusted to be in a basic coaxial state and thus the chip arrangement precision can be substantially improved. The lifting pin can be replaced conveniently and rapidly; and when the lifting pin is replaced, only the lifting pin sleeve is needed to be removed for the replacement; and after the replacement, the position of the adjusting seat is adjusted by the lens to drive the lifting pin sleeve to make movements, and the lifting pin and the lifting pin hole for penetrating of the lifting pin of the lifting pin sleeve are observed and adjusted, so that the lifting pin and the lifting pin hole are coaxially arranged.
Description
Technical field
The utility model belongs to semiconductor die testing sorting unit technical field, specifically, relates to a kind of die grading equipment push pin device.
Background technology
The effect of die grading equipment is with the chip discharging of classifying.In the course of work, the chip for the treatment of sorting is evenly sticked on to turn on the epitaxial, turning over epitaxial is tauted and is fixed on by on the close-fitting nylon ring of Internal and external cycle (being the primary and secondary ring), the primary and secondary ring is installed on and can the XY direction moves and do on the supply cylindrical shape platform of 30 ° of rotations around self axis, and the scanning CCD system on platform top is to turning on the epitaxial every chips and identify and locating.The chip transfer system grasps each chip, and it is placed into receiving platform according to rule, finishes die grading.
Push pin device is an important building block on the die grading equipment, it is installed in supplies with below in the cylindrical shape platform, its major function is to drive thimble up to push up from the RC below of chip, overcome chip and turn over adhesion strength between the epitaxial with chip jack-up, so that the top suction nozzle siphons away chip.The push pin device design is the key that realizes die grading technology, and the motion feature of thimble jack-up has determined the success or failure of chip pick-up.
When existing push pin device is worked, because the error that machining exists, make the axially bored line decentraction that passes for thimble on thimble and the thimble sleeve make the thimble secundly, cause the thimble can not be from the RC below of chip with chip jack-up, make arrangements of chips low precision or cause the chip pick-up failure; Because push pin device is fixed, and has limited the movement travel of supply cylindrical shape platform, but other functions but require to supply with the cylindrical shape platform bigger displacement is arranged, and makes the inwall of cylindrical shape platform and thimble sleeve interfere; Existing push pin device replacing thimble neither be very convenient in addition.
Summary of the invention
The utility model has overcome shortcoming of the prior art, a kind of die grading equipment push pin device is provided, one of its purpose is: its axial line that can adjust the centre hole that passes for thimble on the thimble sleeve makes it coaxial with the thimble axial line, improves sorting success rate and quality;
Two of its purpose is: this mechanism can make the whole decline of push pin device, avoids supplying with the cylindrical shape platform, makes that supplying with the cylindrical shape platform has bigger stroke to realize other functions;
Three of its purpose is: can conveniently change thimble.
In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions:
A kind of die grading equipment push pin device, comprise thimble sleeve, thimble axle and mount pad, liftable thimble axle is arranged in the thimble sleeve, fixedly there is thimble on thimble axle top, the thimble axial brake device that thimble axle and a driving thimble axle move up and down is connected, and the thimble sleeve is provided with the centre hole that passes for thimble, and the thimble axle outside also is arranged with for the adjustment seat of adjusting thimble sleeve position, the thimble sleeve is fixed in adjusts seat, adjusts seat and is fixed in mount pad.
Further, adjust seat and be provided with adjusting device.
Further, adjusting device is adjusted screws for being located at four of adjusting the seat four sides respectively, and the tail end of adjusting screw is connected to and adjusts the seat outside, adjusts screw and is bolted in mount pad.
Further, mount pad and drives the whole drive unit that push pin device moves up and down and is connected.
Further, whole drive unit comprises driving cylinder, guide rail and installing rack, and mount pad is fixed in installing rack, drives the air cylinder driven installing rack and slides at guide rail.
Further, the stroke top of installing rack is provided with stopping means, and stopping means is provided with buffer gear.
Preferably, buffer gear is the spring buffer plunger.
More preferred, stopping means is two.
Further, mount pad comprises mount pad and following mount pad, and last mount pad and following mount pad are affixed by screw.
Further, adjust seat and be fixed in mount pad by screw.
Compared with prior art, the beneficial effects of the utility model are:
A kind of die grading equipment push pin device described in the utility model, by adjusting the position of seat, drive the thimble sleeve and move, can regulate the axis almost coaxial of the centre hole that passes for thimble on thimble and the thimble sleeve, make the arrangements of chips precision be increased dramatically;
The replacing thimble is convenient and swift, only need pull down the thimble sleeve during replacing thimble and change, and the position drive tailstock barrel tube by camera lens adjustment adjustment seat after changing moves, and observes adjustment thimble and thimble sleeve for the centre hole that thimble passes, and makes its coaxial getting final product;
Push pin device integral body is integral elevating under whole drive unit drives, and can avoid supplying with the cylindrical shape platform, prevents that the inwall of cylindrical shape platform and thimble sleeve from interfering, and makes that supplying with the cylindrical shape platform has bigger stroke to realize other functions;
In addition, the thimble axle adopts guide rail to lead by driving cylinder as power, makes each lifting thimble XYZ three-dimensional error in ± 2 μ m, good reproducibility, and stable performance has improved sorting quality and success rate.
Description of drawings
Accompanying drawing is used to provide further understanding of the present utility model, is used from explanation the utility model with embodiment one of the present utility model, does not constitute to restriction of the present utility model, in the accompanying drawings:
Fig. 1 is the cross-sectional view of a kind of die grading equipment push pin device described in the utility model;
Fig. 2 is the perspective view of the whole drive unit of a kind of die grading equipment push pin device described in the utility model;
Fig. 3 is the plan structure schematic diagram of a kind of die grading equipment push pin device described in the utility model.
Wherein include among Fig. 1 to Fig. 3,
1---the thimble sleeve; 2---locking nut;
3---thimble; 4---the thimble axle;
5---adjust seat; 6---adjust screw;
7---centre hole; 8---go up mount pad;
9---following mount pad; 10---anti-turn screw;
11---anti-skid screw; 14---cam;
15---installing rack; 19---anti-rotation groove;
20---screw; 21---stopping means;
22---the thimble axial brake device; 23---the spring buffer plunger;
24---motor; 25---guide rail;
26---drive cylinder.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described, should be appreciated that preferred embodiment described herein only is used for description and interpretation the utility model, and be not used in restriction the utility model.
As shown in Figure 1 to Figure 3, a kind of die grading equipment push pin device described in the utility model, comprise thimble sleeve 1, thimble axle 4 and mount pad, liftable thimble axle 4 is arranged in the thimble sleeve 1, fixedly there is thimble 3 on thimble axle 4 tops, the thimble axial brake device 22 that thimble axle 4 and a driving thimble axle 4 move up and down is connected, thimble sleeve 1 is provided with the centre hole 7 that passes for thimble 3, thimble axle 4 outsides also are arranged with for the adjustment seat 5 of adjusting thimble sleeve 1 position, thimble sleeve 1 is fixed in adjusts seat 5, can take clamping, be spirally connected, connected modes such as screw connection make when changing thimble 3 convenient and swift.
Adjust seat 5 and be fixed in mount pad.Controlled and accurate adjustment when to adjust seat 5 and move in order to make, adjustment seat 5 is provided with and is located at four adjustment screws 6 adjusting seat 5 four sides respectively, as Fig. 1, shown in Figure 3, and the tail end of adjusting screw 6 is connected to adjusts seat 5 outsides, adjust screw 6 and be bolted in mount pad, adjust screws 6 and withstand and adjust around the seat 5 by rotating four, driving thimble sleeve 1 moves, the coaxial adjustment of the center line that makes on the thimble sleeve 1 centre hole 7 that stretches out for thimble 3 and thimble 3 can simple to operate and accurate control, make the arrangements of chips precision be increased dramatically, Deviation Control is in XY direction ± 38 μ m, in angle ± 3 °.
As shown in Figure 2, push pin device drives and can move up and down by whole drive unit, dodges the motion of supplying with the cylindrical shape platform, makes that supplying with the cylindrical shape platform has bigger stroke, in order to realize other functions.Concrete: mount pad is connected with the driving cylinder 26 that the driving push pin device moves up and down by installing rack 15, and installing rack 15 slides at guide rail 25.For service position after making the push pin device integral elevating also is original same position, it is the repetitive positioning accuracy height, the utility model adopts and drives the power set that cylinder 26 moves up and down for the driving push pin device, and by line slideway 25 guiding, thereby guarantee kinematic accuracy.
Positioning accuracy height when making the push pin device integral elevating, the stroke top of installing rack 15 is provided with and is respectively equipped with a spring buffer plunger 23 that is used for buffering on 21, two stopping means 21 of two stopping means, has reduced mechanical hard impact, reduce vibrations, improved positioning accuracy.
Mount pad comprises mount pad 8 and following mount pad 9, and last mount pad 8 and following mount pad 9 are affixed by screw 20.Be convenient to dismounting and installation and the maintenance of push pin device, adjust seat 5 and be fixed in mount pad by screw 20.
As shown in Figure 1, the side of thimble axial brake device 22 offers anti-rotation groove 19, offer corresponding screw hole with it on the following mount pad 9 of Pei Heing, anti-turn screw 10 passes screw hole, the tail end of anti-turn screw 10 stretches in the anti-rotation groove 19, and anti-rotation groove 19 need be greater than the stroke of thimble axial brake device 22 along the length of thimble 3 directions of motion.Prevent that thimble axial brake device 22 from producing rotation radially in motion process.
As shown in Figure 1, following mount pad 9 also is provided with anti-skid screw 11.
Change the course of work of thimble 3: as shown in Figure 2, back out thimble sleeve 1, unclamp locking nut 2, pull up thimble 3, change new thimble 3, locking locking nut 2, the thimble sleeve 1 of screwing on changes thimble 3 processes and finishes;
The adjustment process that thimble 3 and centre hole 7 are coaxial: unclamp screw 20, observe the relative position of thimble 3 and centre hole 7 by camera lens, adjust screw 6 by adjusting four, make adjustment seat 5 drive thimble sleeve XY directions and move, can make thimble 3 and centre hole 7 axis coaxles.
As shown in Figure 1 and Figure 2, the course of work of push pin device: thimble axial brake device 22 is contained on the installing rack 15, and motor 24 drives cam 14 moves up and down thimble axial brake device 22 driving thimble axles 4 and thimble 3; The push rod that drives cylinder 26 is connected on the installing rack 15, drives the push pin device integral elevating by driving cylinder 26, keeps the stable of repeatable accuracy and thimble 3 by guide rail 25.
It should be noted that at last: above only is preferred embodiment of the present utility model; be not limited to the utility model; although have been described in detail with reference to the utility model of embodiment; for a person skilled in the art; it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing; perhaps part technical characterictic wherein is equal to replacement; but it is all within spirit of the present utility model and principle; any modification of doing, be equal to replacement, improvement etc., all should be included within the protection range of the present utility model.
Claims (10)
1. die grading equipment push pin device, it is characterized in that: comprise the thimble sleeve, thimble axle and mount pad, described liftable thimble axle is arranged in the described thimble sleeve, fixedly there is thimble on described thimble axle top, the thimble axial brake device that described thimble axle and the described thimble axle of a driving move up and down is connected, described thimble sleeve is provided with the centre hole that passes for described thimble, it is characterized in that: the described thimble axle outside also is arranged with for the adjustment seat of adjusting thimble sleeve position, described thimble sleeve is fixed in described adjustment seat, and described adjustment seat is fixed in described mount pad.
2. a kind of die grading equipment push pin device according to claim 1 is characterized in that: described adjustment seat is provided with adjusting device.
3. a kind of die grading equipment push pin device according to claim 2, it is characterized in that: described adjusting device is adjusted screw for being located at described four of adjusting the seat four sides respectively, and the tail end of described adjustment screw is connected to the described adjustment seat outside, and described adjustment screw is bolted in described mount pad.
4. a kind of die grading equipment push pin device according to claim 1 is characterized in that: described mount pad and drives the whole drive unit that described push pin device moves up and down and is connected.
5. a kind of die grading equipment push pin device according to claim 4, it is characterized in that: described whole drive unit comprises driving cylinder, guide rail and installing rack, described mount pad is fixed in described installing rack, and the described installing rack of described driving air cylinder driven slides at described guide rail.
6. a kind of die grading equipment push pin device according to claim 5, it is characterized in that: the stroke top of described installing rack is provided with stopping means, and described stopping means is provided with buffer gear.
7. a kind of die grading equipment push pin device according to claim 6, it is characterized in that: described buffer gear is the spring buffer plunger.
8. a kind of die grading equipment push pin device according to claim 7, it is characterized in that: described stopping means is two.
9. according to any described a kind of die grading equipment push pin device of claim 1 to 8, it is characterized in that: described mount pad comprises mount pad and following mount pad, and described upward mount pad and following mount pad are affixed by screw.
10. a kind of die grading equipment push pin device according to claim 1 is characterized in that: described adjustment seat is fixed in described mount pad by screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010292 CN203134771U (en) | 2013-01-09 | 2013-01-09 | Lifting pin device for chip sorting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010292 CN203134771U (en) | 2013-01-09 | 2013-01-09 | Lifting pin device for chip sorting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203134771U true CN203134771U (en) | 2013-08-14 |
Family
ID=48942721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320010292 Expired - Fee Related CN203134771U (en) | 2013-01-09 | 2013-01-09 | Lifting pin device for chip sorting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203134771U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103077918A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Ejector pin device of die grading equipment |
| WO2019000295A1 (en) * | 2017-06-29 | 2019-01-03 | 深圳市汇顶科技股份有限公司 | Chip pickup device |
-
2013
- 2013-01-09 CN CN 201320010292 patent/CN203134771U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103077918A (en) * | 2013-01-09 | 2013-05-01 | 广东志成华科光电设备有限公司 | Ejector pin device of die grading equipment |
| CN103077918B (en) * | 2013-01-09 | 2016-03-09 | 广东志成华科光电设备有限公司 | A kind of die grading equipment push pin device |
| WO2019000295A1 (en) * | 2017-06-29 | 2019-01-03 | 深圳市汇顶科技股份有限公司 | Chip pickup device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130814 Termination date: 20140109 |