CN103075663A - High-integration radiating LED (Light Emitting Diode) lamp structure and machining method thereof - Google Patents

Abstract

The invention relates to the field of LED (Light Emitting Diode) lamps, in particular to a high-integration radiating LED lamp structure and a machining method thereof. The high-integration radiating LED lamp structure is provided with an aluminum shell, wherein a plurality of LED cups are arranged on the aluminum shell; an insulating layer and a circuit layer are arranged outside the LED cups; an LED luminous chip is fixedly arranged at the bottom end of each LED cup; and LED luminous units which are connected with the LED luminous chips through metal wires are arranged in the LED cups and are packaged in the LED cups though lenses and light transmission covers. According to the high-integration radiating LED lamp structure, the LED luminous units are directly packaged on the aluminum shell by using the aluminum shell in place of the aluminum base plate through simplified design, poor radiation caused by radiation bottle neck of heat-conducting silicone grease is removed, the radiating efficiency is greatly improved, the service life of the LED lamp is prolonged, and light attenuation is reduced. The radiating efficiency is increased, the cost of a peripheral radiating structure is reduced, the size of the LED lamp is reduced, and the product weight is reduced.

Description

A kind of radiating LED lamp lamps structure and processing method thereof of high integration

 

Technical field

The present invention relates to LED lamp field, specifically relate to a kind of radiating LED lamp lamps structure and processing method thereof of high integration.

Background technology

LED(Light-Emitting-Diode), the Chinese meaning is light emitting diode, it be a kind of can be the semiconductor of visible light with electric energy conversion, it has changed the luminous principle luminous with the electricity-saving lamp tricolor powder of incandescent lamp tungsten filament, and adopts electroluminescence.According to one's analysis, the characteristics of LED are very obvious, and the life-span is long, light efficiency is high, radiationless and low-power consumption, is widely used in the every field.

But the heat dissipation problem of LED light fixture is the technical bottleneck of restriction the sector development always.At present, mainly there are following two kinds of mounting structures in the LED light fixture:

Prior art one: traditional discrete light fixture SMT technology, see also Fig. 1, because LED luminescence unit 6 heat radiation needs could arrive aluminium shell 1 through pads 7, line layer 5, insulating barrier 4, aluminium sheet substrate 3, heat-conducting silicone grease layer 2, and very little pad 7 and heat-conducting silicone grease layer 2 can't reach the heat radiation requirement of great power LED etc. at all.

This kind radiating mode, there is following several bottleneck in the dissipation of heat that is produced by the hot zone to the aluminium shell:

1, the hot zone heat is transmitted to line layer 5 by pad 7, because the area of pad is less, heat concentrates on wafer area.

2, heat is filled insulating barrier by insulating barrier 4(epoxy resin-pottery) time, its thermal conductivity factor is 1.0～2.0w/mk.

3, heat also will be transmitted to aluminium shell 1 by heat-conducting silicone grease layer 2 after being transmitted to aluminium sheet substrate 3, and the heat-conducting silicone grease thermal conductivity factor is 1.0～4.0w/mk, and the aluminium thermal conductivity factor is 120～200w/mk.

Prior art two: novel C OB heat dissipation technology, it is the integrated form of a kind of novel light source, its higher integrated level has been improved the light efficiency of led light source, the range of application of LED is greatly expanded, especially obtained good effect in high-power outdoor lighting, but its very high integrated level is faced with the difficult problem of high heat.See also Fig. 2, LED luminescence unit 6 directly is encapsulated in (heat does not dispel the heat by insulating barrier 4) on the aluminium substrate 3, thereby strengthened the heat radiation of light source, but because degree of integration is high, caloric value on the unit are increases, being transmitted to 1 heat radiation of aluminium shell by heat-conducting silicone grease layer 2 still is the heat radiation bottleneck, and being mainly manifested in the heat conduction needs through heat-conducting silicone grease layer 2, and the heat-conducting silicone grease thermal conductivity factor is 1.0～4.0w/mk.In addition, the price of high thermal conductive silicon fat is higher, causes production cost higher.

Summary of the invention

For the technical problem that exists in the prior art, the invention provides a kind of raising radiating efficiency, prolong LED light fixture service life, reduce radiating LED lamp lamps structure and the processing method thereof of the high integration of light decay.

To achieve these goals, the technical scheme of employing is as follows:

A kind of radiating LED lamp lamps structure of high integration, it is characterized in that, has the aluminium shell, several LED bowl cups on the aluminium shell, the LED bowl cup outside is provided with insulating barrier and line layer, the LED luminescent wafer is fixed on LED bowl cup bottom, and the LED luminescence unit that is connected with the LED luminescent wafer by gold thread places in the LED bowl cup, and lens and diffuser are encapsulated in the LED luminescence unit in the LED bowl cup.

The radiating LED lamp lamps structure of high integration of the present invention, pass through simplified design, adopt the aluminium shell to replace the mode of aluminium base substrate, the LED luminescence unit is potted directly on the aluminium shell, removed because the heat radiation that heat-conducting silicone grease heat radiation bottleneck causes is bad, greatly improve radiating efficiency, prolonged the service life of LED light fixture, reduced light decay.The lifting of radiating efficiency has reduced the cost of peripheral radiator structure, dwindles the volume of LED light fixture, and product weight reduces.

Compared with prior art, the radiating LED lamp lamps structure of high integration of the present invention, its beneficial effect shows:

1., solved the hot concentration problem that the high integration high-power LED lamp exists, the heat that the hot zone is produced conducts wafer area fast timely, and (thermal conductivity factor has reduced the loss of light 120～200w/mk), has prolonged the life-span of LED wafer.

2., realize traditional LED light fixture is further integrated, the integrated number of area source is higher, illumination effect is more even.

3., adopt power and the brightness of the LED light fixture of structural design of the present invention all can further improve, thereby the application scenario of greatly having widened the LED light fixture.

4., removed the heat abstractors such as heat-conducting silicone grease, fin, reduced product weight and production cost.

The processing method of the radiating LED lamp lamps structure of high integration is characterized in that, comprises the steps:

1., die casting grid type, namely by machining aluminum profile extrusion is become shell with the heat radiation of grid type;

2., by mechanical grinding, get several LED bowl cups at the aluminium shell;

3., the employing making process of circuit board is done insulating barrier at the burnishing surface of aluminium shell, and is covered copper layout line layer;

4., on LED die bond machine, the LED luminescent wafer is fixed to LED bowl cup bottom;

5., with the LED bonding equipment gold thread is welded on the wafer, with point gum machine the LED luminescence unit is encapsulated in the LED bowl cup again;

6., diffuser is installed, it is assembled into one.

Further, step also is equipped with lens in 6., carries out secondary light-distribution.

The processing method of the radiating LED lamp lamps structure of high integration of the present invention, processing technology is comparatively simple, operates comparatively easyly, and adaptability is wider.

Description of drawings

For the ease of it will be appreciated by those skilled in the art that the present invention is further illustrated below in conjunction with accompanying drawing.

Fig. 1 is the LED fitting structure of prior art one.

Fig. 2 is the LED fitting structure of prior art two.

Fig. 3 is LED fitting structure of the present invention.

The specific embodiment

See also Fig. 3, several LED bowl cups 10 on the aluminium shell 1, LED bowl cup 10 outsides are provided with insulating barrier and line layer 8, LED luminescent wafer 9 is fixed on LED bowl cup 10 bottoms, the LED luminescence unit that is connected with LED luminescent wafer 9 by gold thread places in the LED bowl cup 10, and lens are encapsulated in the LED luminescence unit in the LED bowl cup 10.For the large power road lamp light fixture, also need mounted lens on every luminescence unit, carry out secondary light-distribution.

The processing method of the radiating LED lamp lamps structure of high integration comprises the steps:

1., die casting grid type, namely by machining aluminum profile extrusion is become shell with the heat radiation of grid type.

2., by mechanical grinding, get several LED bowl cups at the aluminium shell.

3., the employing making process of circuit board is done insulating barrier at the burnishing surface of aluminium shell, and is covered copper layout line layer.

4., on LED die bond machine, the LED luminescent wafer is fixed to LED bowl cup bottom.

5., with the LED bonding equipment gold thread is welded on the wafer, with point gum machine the LED luminescence unit is encapsulated in the LED bowl cup again.

6., diffuser and lens etc. are installed, it is assembled into one.

 

Above content only is to structure and machining method example of the present invention and explanation; under those skilled in the art described specific embodiment is made various modifications or replenish or adopt similar mode to substitute; only otherwise depart from the structure and machining method of invention or surmount this scope as defined in the claims, all should belong to protection scope of the present invention.

Claims (3)

1. the radiating LED lamp lamps structure of a high integration, it is characterized in that, has the aluminium shell, several LED bowl cups on the aluminium shell, the LED bowl cup outside is provided with insulating barrier and line layer, the LED luminescent wafer is fixed on LED bowl cup bottom, and the LED luminescence unit that is connected with the LED luminescent wafer by gold thread places in the LED bowl cup, and lens and diffuser are encapsulated in the LED luminescence unit in the LED bowl cup.

2. the processing method of the radiating LED lamp lamps structure of a kind of high integration as claimed in claim 1 is characterized in that, comprises the steps:

1., die casting grid type, namely by machining aluminum profile extrusion is become shell with the heat radiation of grid type;

2., by mechanical grinding, get several LED bowl cups at the aluminium shell;

3., the employing making process of circuit board is done insulating barrier at the burnishing surface of aluminium shell, and is covered copper layout line layer;

4., on LED die bond machine, the LED luminescent wafer is fixed to LED bowl cup bottom;

5., with the LED bonding equipment gold thread is welded on the wafer, with point gum machine the LED luminescence unit is encapsulated in the LED bowl cup again;

6., diffuser is installed, it is assembled into one.

3. the processing method of the radiating LED lamp lamps structure of a kind of high integration according to claim 2 is characterized in that, described step also is equipped with lens in 6., carries out secondary light-distribution.