CN103050470A - Intelligent power module and manufacturing method thereof - Google Patents
Intelligent power module and manufacturing method thereof Download PDFInfo
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- CN103050470A CN103050470A CN201210576069XA CN201210576069A CN103050470A CN 103050470 A CN103050470 A CN 103050470A CN 201210576069X A CN201210576069X A CN 201210576069XA CN 201210576069 A CN201210576069 A CN 201210576069A CN 103050470 A CN103050470 A CN 103050470A
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- insulating barrier
- power module
- intelligent power
- wiring layer
- aluminium base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an intelligent power module and a manufacturing method thereof. The intelligent power module comprises an aluminium substrate, wherein the upper surface of the aluminium substrate is provided with an upper insulating layer; the upper insulating layer is provided with a circuit wiring layer which is provided with a plurality of circuit elements and pins; the lower surface of the aluminium substrate is provided with a lower insulating layer; the lower insulating layer is provided with a radiating plate; the aluminium substrate, the upper insulating layer, the circuit wiring layer, the plurality of circuit elements, the pins and the lower insulating layer are packaged in sealing resin; the pins penetrate through the sealing resin and extend outwards; and the side surface of the radiating plate is packaged by the sealing resin, and the lower surface of the radiating plate is exposed. The invention has the advantages that by the addition of the radiating plate, the radiating performance can be improved; since the heat conductivities of the lower insulating layer and the radiating plate are higher than that of the sealing resin, the temperature of the internal device is far lower than that of the current product when the intelligent power module is in normal working, so that the intelligent power module has higher anti-noise capability and radiating performance simultaneously, and the working stability and the service life of the intelligent power module are greatly improved and prolonged respectively.
Description
Technical field
The present invention relates to manufacture field of electronic elements, particularly a kind of Intelligent Power Module and preparation method thereof.
Background technology
IPM(Intelligent Power Module, Intelligent Power Module) be a kind of power drive series products with power electronics and integrated circuit technique combination.Intelligent Power Module integrates device for power switching and high-voltage driving circuit, and in keep overvoltage, overcurrent and the failure detector circuit such as overheated.Intelligent Power Module receives the control signal of MCU on the one hand, drives subsequent conditioning circuit work, sends the state detection signal of system back to MCU on the other hand.Compare with the discrete scheme of tradition, Intelligent Power Module wins increasing market with advantages such as its high integration, high reliability, be particularly suitable for frequency converter and the various inverter of drive motors, it is frequency control, metallurgical machinery, electric traction, servo-drive, a kind of desirable power electronic device of frequency-conversion domestic electric appliances.
As shown in Figure 1, the wiring 3 that existing Intelligent Power Module comprises an aluminium base 1, is located at described aluminium base 1 lip-deep insulating barrier 2, form at described insulating barrier 2, be fixed in some circuit elements 4 and pin 5 on the described wiring 3, and encapsulate described aluminium base 1, insulating barrier 2.The sealing resin 6 of wiring 3 and some circuit elements 4, because the Intelligent Power Module normal operation is driving blower fan, the occasions such as compressor, heating is more serious during Intelligent Power Module work, so generally all can the back side being close to radiating block, uses the aluminium base 1 of Intelligent Power Module, for fear of causing Intelligent Power Module out of control because aluminium base 1 contacts the noise that brings with radiating block, improve the antijamming capability of Intelligent Power Module, usually aluminium base 1 also is encapsulated in the sealing resin 6, only controls to such an extent that the low-down occasion mode of just using aluminium base 1 back side to expose encapsulates at some noise levels.Although aluminium base 1 sealing backside can be improved the anti-noise ability of Intelligent Power Module, the heat dispersion of Intelligent Power Module is significantly reduced, make the long term device work of Intelligent Power Module inside at high temperature, affected performance and the long term life of Intelligent Power Module.This is so that anti-noise ability and heat dispersion become a pair of implacable contradiction.
A kind of new Intelligent Power Module occurred in the recent period, it in suitable scope, disturbs sealing resin 6 THICKNESS CONTROL at aluminium base 1 back side and the double function of heat conduction so that Intelligent Power Module has noise isolation concurrently.But this Intelligent Power Module complex manufacturing technology, required precision is high, and manufacturing equipment is expensive, and rate of finished products is not high.
Summary of the invention
Main purpose of the present invention provides a kind of Intelligent Power Module and preparation method thereof, is intended to improve the anti-noise ability and the heat dispersion that improve simultaneously Intelligent Power Module.
The present invention proposes a kind of Intelligent Power Module, comprise an aluminium base, this aluminium base upper surface is provided with insulating barrier on, insulating barrier is provided with a wiring layer on this, this wiring layer is provided with some circuit elements and pin, described aluminium base lower surface is provided with insulating barrier, this time insulating barrier is provided with a heating panel, described aluminium base, upper insulating barrier, the wiring layer, some circuit elements and pin, and insulating barrier is encapsulated in the sealing resin down, and wherein, described pin runs through described sealing resin and stretches out, the side of described heating panel is encapsulated by described sealing resin, and the lower surface of described heating panel is exposed.
Preferably, described upper insulating barrier adopts and fill Al in epoxide resin material
2O
3And make, the thermal conductivity of described upper insulating barrier is 2.0W/mk.
Preferably, described lower insulating barrier adopts filling BN in epoxide resin material and makes, and the thermal conductivity of described lower insulating barrier is 5.0W/mk.
Preferably, described Intelligent Power Module also comprises some at described circuit element, wiring layer, and sets up the metal wire that is electrically connected between the aluminium base.
Preferably, described upper insulating barrier is provided with at least one for setting up the hole of exposing that is electrically connected for described aluminium base with wiring layer or circuit element.
The present invention further also proposes a kind of manufacture method of Intelligent Power Module, comprising:
Form insulating barrier and lower insulating barrier in the upper and lower surface of aluminium base respectively;
Insulating barrier forms the wiring layer on described, and at described wiring layer some circuit elements and pin is installed;
At described lower insulating barrier heating panel is set;
Encapsulate described aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin, and lower insulating barrier.
Preferably, encapsulate described aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin by transfer die or the mode of injecting mould, and lower insulating barrier.
Preferably, described upper and lower surface at aluminium base also comprises before forming respectively the step of insulating barrier and lower insulating barrier:
The upper and lower surface of described aluminium base is carried out corrosion protection to be processed.
Preferably, the described step that insulating barrier forms the wiring layer on described specifically comprises:
Copper foil on the insulating barrier on described;
The described Copper Foil of etching forms described wiring layer.
Preferably, comprise before the described step that some circuit elements and pin be installed at described wiring layer:
The described aluminium base of preheating and wiring layer.
Intelligent Power Module of the present invention can reliably realize the insulation in metal aluminum substrate and the external world by lower insulator separation, and the heating panel of setting up can improve the heat dispersion of Intelligent Power Module.Because the thermal conductivity far of lower insulating barrier and heating panel is higher than sealing resin, therefore when Intelligent Power Module works the temperature of internal components far below existing product, make Intelligent Power Module have simultaneously higher anti-noise ability and heat dispersion, significantly improved job stability and the useful life of Intelligent Power Module.
Description of drawings
Fig. 1 is the cross-sectional view of Intelligent Power Module in the prior art;
Fig. 2 is the cross-sectional view of Intelligent Power Module of the present invention;
Fig. 3 is the schematic flow sheet of manufacture method one embodiment of Intelligent Power Module of the present invention;
Fig. 4 is the schematic flow sheet that forms the wiring layer in the manufacture method of Intelligent Power Module of the present invention;
Fig. 5 is the schematic flow sheet of another embodiment of manufacture method of Intelligent Power Module of the present invention;
Fig. 6 is the schematic flow sheet of the another embodiment of manufacture method of Intelligent Power Module of the present invention.
The realization of the object of the invention, functional characteristics and advantage are described further with reference to accompanying drawing in connection with embodiment.
Embodiment
Be described further with regard to technical scheme of the present invention below in conjunction with drawings and the specific embodiments.Should be appreciated that specific embodiment described herein only in order to explain the present invention, is not intended to limit the present invention.
The present invention proposes a kind of Intelligent Power Module.
With reference to Fig. 2, Fig. 2 is the cross-sectional view of Intelligent Power Module of the present invention
In one embodiment of this invention, this Intelligent Power Module comprises an aluminium base 10, the upper and lower surface of this aluminium base 10 arranges respectively on one insulating barrier 20 and insulating barrier 60 once, upward the upper surface of insulating barrier 20 is provided with a wiring layer 30, this wiring layer 30 is provided with some circuit elements 40 and pin 50, and the lower surface of lower insulating barrier 60 is provided with a heating panel 70.This aluminium base 10, upper insulating barrier 20, wiring layer 30, some circuit elements 40, pin 50 and lower insulating barrier 60 are encapsulated in the sealing resin 80, wherein pin 50 runs through sealing resin 80 and stretches out, sealed resin 80 encapsulation in the side of heating panel 70, the lower surface of heating panel 70 is exposed to be contacted with outside air.
The rectangular plate of the aluminium alloys such as aluminium base 10 preferred employings 1100 or 5052 is made.Wiring layer 30 and heating panel 70 preferably are made of copper.The thickness of heating panel 70 is identical with the thickness of wiring layer 30.
Comprise some pads 31 on the wiring layer 30, this pad 31 is arranged on one side of aluminium base 10, and is a plurality of alignings arrangements, and pin 50 and pad 31 welding are used for the various signals of I/O.Pin 50 preferred employing aluminium etc. have the metal of certain degree of hardness to be made, and can utilize the hardness of pin 50 when molded aluminium base 10 to be fixed.
Intelligent Power Module of the present invention can reliably realize the insulation in metal aluminum substrate 10 and the external world by lower insulating barrier 60 isolation, and the heating panel 70 of setting up can improve the heat dispersion of Intelligent Power Module.Because the thermal conductivity far of lower insulating barrier 60 and heating panel 70 is higher than sealing resin 80, therefore when Intelligent Power Module works the temperature of internal components far below existing product, make Intelligent Power Module have simultaneously higher anti-noise ability and heat dispersion, significantly improved job stability and the useful life of Intelligent Power Module.
In the above-described embodiments, upper insulating barrier 20 adopts at resin material middle and high concentrations such as epoxy resin and fills Al
2O
3And make, owing to filled Al
2O
3Can effectively improve the thermal conductivity of upper insulating barrier 20, further improve the heat-sinking capability of Intelligent Power Module.The thermal conductivity of upper insulating barrier 20 is preferably 2.0W/mk, is complementary with the coefficient of expansion and the sealing resin 80 that guarantees upper insulating barrier 20, has prevented that upper insulating barrier 20 from coming off because being heated.
In the above-described embodiments, lower insulating barrier 60 adopts at resin material middle and high concentrations such as epoxy resin and fills BN and make, owing to filled the thermal conductivity that BN can effectively improve lower insulating barrier 60, has further improved the heat-sinking capability of Intelligent Power Module.The thermal conductivity of lower insulating barrier 60 is preferably 5.0W/mk, is complementary with the coefficient of expansion and the sealing resin 80 that guarantees lower insulating barrier 60, has prevented that time insulating barrier 60 from coming off because being heated.
In the above-described embodiments, Intelligent Power Module also comprises some at some circuit elements 10, wiring layer 30, and sets up the metal wire 90 that is electrically connected between the aluminium base 10.This metal wire 90 is preferably aluminum steel, gold thread or copper cash.
In the above-described embodiments, upper insulating barrier 20 is provided with at least one hole 21 of exposing, and this exposes hole 21 and is used for passing for metal wire 90, to be electrically connected wiring layer 30 and aluminium base 10 or circuit element 40.This exposes hole 21 and is arranged on the position close with the earth potential of wiring layer 30, and its degree of depth need run through insulating barrier 20 exposes aluminium base 10.This exposes the 0.5mm place that hole 21 preferably is arranged on the earth potential edge of wiring layer 30.
The present invention further also proposes a kind of manufacture method of Intelligent Power Module.
With reference to Fig. 3, Fig. 3 is the schematic flow sheet of the manufacture method of Intelligent Power Module of the present invention.
In one embodiment of this invention, the manufacture method of Intelligent Power Module comprises:
Step S10 forms insulating barrier and lower insulating barrier in the upper and lower surface of aluminium base respectively;
Circuit layout is as required prepared sizeable aluminium base, the preferred aluminium base that adopts 64mm * 30mm, the surface arranges insulating barrier thereon, and at least one hole of exposing of upper insulating barrier Drilling, this formation of exposing the hole can transfer to form by the smooth milling cutter high-speed rotary of front end.Because this exposes the hole and is used for aluminium base is connected with earth potential, so exposing the position in hole should approach with the earth potential of wiring layer, but can not be excessively near, otherwise be damaged to easily the wiring layer during boring, the beeline that preferably will expose the earth potential edge of bore edges and wiring layer is controlled at 0.5mm.This degree of depth of exposing the hole is just to run through upper insulating barrier as good, if too dark, tying up head in the time of may causing wiring can't test.Because upper insulating barrier is comparatively firm, so the wearing and tearing of milling cutter are very fast.And it is more remarkable to expose the less cutter wear of bore dia.Therefore when batch production, preferably use the thicker milling cutter of diameter, to reduce production costs.In addition, take into account the miniaturization of aluminium base, the diameter of milling cutter should not be too thick, to reduce to expose the area in hole.So preferably adopting diameter is that the milling cutter of Φ 1.5mm forms and to expose the hole.Both can reduce to expose the occupied area in hole, can significantly reduce again the wearing and tearing of milling cutter, thereby improve productivity.By methods such as application, pressings, the lower insulating barrier that will be in softening attitude is formed at the lower surface of aluminium base, because softening attitude lower has certain flowability, lower surface at aluminium base evenly distributes easily, but its flowability should not be excessively strong, otherwise is difficult to moulding, the lepidiod BN filler of preferred employing, make it be at normal temperatures semi-cured state, pine for entering molten state in follow-up adding, form cure states after the cooling.This moment, the size of formed lower insulating barrier should be slightly larger than heating panel, but slightly less than aluminium base.
Step S20 forms the wiring layer at upper insulating barrier;
Upper surface at upper insulating barrier is pasted with as the wiring layer.This wiring preferably is made of copper.
Step S30 installs some circuit elements and pin at the wiring layer;
At first, by scolders such as scolding tin circuit element and pin are installed in the assigned position of wiring layer.Secondly, the mode by pressure welding links together pin and wiring layer.The welding temperature of pressure-welding head is preferably 300 ℃, guarantees that tin cream fully melts, and the pressure welding time should not surpass 5 seconds, guarantees that aluminium base is to be locally heated.At last, utilize metal wire to carry out circuit element and be connected wiring with the wiring layer and connect, utilize metal wire that aluminium base is connected with earthy wiring, this metal wire is preferably aluminum steel, gold thread or copper cash.
Step S40 arranges heating panel at lower insulating barrier;
At lower insulating barrier heating panel is set, or under heating panel forms insulating barrier, its effect is identical, does not repeat them here.
Step S50, encapsulation aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin, and lower insulating barrier.
At first, in oxygen-free environment aluminium base is toasted, stoving time should be less than 2 hours, and baking temperature is preferably 125 ℃, to remove the aqueous vapor of aluminium base and electric component surface attachment; Under the oxygen-free environment condition, heat, to prevent aluminium base and electric component surface oxidation.Secondly, the integral body that aluminium base, upper insulating barrier, wiring layer, some circuit elements, pin, lower insulating barrier and heating panel are formed is as in the mould, and positions.At last, annotate and water sealing resin, encapsulation is finally finished in cooling.After finishing, encapsulation according to the needs that use length pin is cut off moulding.
Above-mentioned steps S40 can finish before or after any step between step S10 and the step S50, is preferably to carry out simultaneously with step S10 or finish after step S10.
The manufacture method of Intelligent Power Module of the present invention is by adopting the lower insulating barrier that is in softening attitude before encapsulation, its flowability can guarantee the uniformity between aluminium base and heating panel, again because the thermal conductivity far of lower insulating barrier is higher than sealing resin, so to the not very strict requirement of its THICKNESS CONTROL, significantly reduced the technology difficulty of molding equipment, and need not to use the patrix thimble, the special constructions such as counterdie clamping device, when molded also not to wiring, the positions such as circuit element claim, reduce manufacturing cost and the design cost of Intelligent Power Module, improved the rate of finished products of Intelligent Power Module.
In the above-described embodiments, encapsulate aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin by transfer die or the mode of injecting mould, and lower insulating barrier.
Fig. 4 is the schematic flow sheet that forms the wiring layer in the manufacture method of Intelligent Power Module of the present invention;
In the above-described embodiments, step S20 specifically comprises:
Step S21, copper foil on upper insulating barrier;
Upper surface copper foil at upper insulating barrier.
Step S22, the etching Copper Foil forms the wiring layer.
According to circuit layout etching Copper Foil, remove partly etched Copper Foil, form the wiring layer.
With reference to Fig. 5, Fig. 5 is the schematic flow sheet of another embodiment of manufacture method of Intelligent Power Module of the present invention.
Based on above-described embodiment, before step S10, also comprise:
Step S60 carries out corrosion protection to the upper and lower surface of aluminium base and processes.
Respectively the upper and lower surface of aluminium base is carried out corrosion protection and process, prevent that aluminium base is corroded, to improve the useful life of aluminium base.
Fig. 6 is the schematic flow sheet of the another embodiment of manufacture method of Intelligent Power Module of the present invention.
In the above-described embodiments, before step S30, also comprise:
Step S70, preheating aluminium base and wiring layer.
At first, aluminium base and wiring layer are placed on the plane of a heating and carry out preheating, heating plane temperature can not be too low, otherwise do not have the effect of preheating, can not be too high, otherwise the tin that has welded is melted, be preferably 100 ℃.Then, the part that pin is prepared to contact with the wiring layer is stained with tin cream, in order to improve welding quality, sometimes also can be stained with scaling powder, and be placed on the appropriate location.
The above only is the preferred embodiments of the present invention; be not so limit claim of the present invention; every equivalent structure transformation that utilizes specification of the present invention and accompanying drawing content to do; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present invention.
Claims (10)
1. Intelligent Power Module, comprise an aluminium base, this aluminium base upper surface is provided with insulating barrier on, insulating barrier is provided with a wiring layer on this, this wiring layer is provided with some circuit elements and pin, it is characterized in that, described aluminium base lower surface is provided with insulating barrier, this time insulating barrier is provided with a heating panel, described aluminium base, upper insulating barrier, the wiring layer, some circuit elements and pin, and lower insulating barrier is encapsulated in the sealing resin, wherein, described pin runs through described sealing resin and stretches out, and the side of described heating panel is encapsulated by described sealing resin, and the lower surface of described heating panel is exposed.
2. Intelligent Power Module as claimed in claim 1 is characterized in that, described upper insulating barrier adopts fills Al in epoxide resin material
2O
3And make, the thermal conductivity of described upper insulating barrier is 2.0W/mk.
3. Intelligent Power Module as claimed in claim 1 is characterized in that, described lower insulating barrier adopts filling BN in epoxide resin material and makes, and the thermal conductivity of described lower insulating barrier is 5.0W/mk.
4. such as the described Intelligent Power Module of any one in the claims 1 to 3, it is characterized in that, also comprise somely at described circuit element, wiring layer, and set up the metal wire that is electrically connected between the aluminium base.
5. Intelligent Power Module as claimed in claim 4 is characterized in that, described upper insulating barrier is provided with at least one for setting up the hole of exposing that is electrically connected for described aluminium base with wiring layer or circuit element.
6. the manufacture method of an Intelligent Power Module is characterized in that, comprising:
Form insulating barrier and lower insulating barrier in the upper and lower surface of aluminium base respectively;
Insulating barrier forms the wiring layer on described, and at described wiring layer some circuit elements and pin is installed;
At described lower insulating barrier heating panel is set;
Encapsulate described aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin, and lower insulating barrier.
7. the manufacture method of Intelligent Power Module as claimed in claim 6 is characterized in that, encapsulates described aluminium base, upper insulating barrier, wiring layer, some circuit elements and pin by transfer die or the mode of injecting mould, and lower insulating barrier.
8. the manufacture method of Intelligent Power Module as claimed in claim 7 is characterized in that, described upper and lower surface at aluminium base also comprises before forming respectively the step of insulating barrier and lower insulating barrier:
The upper and lower surface of described aluminium base is carried out corrosion protection to be processed.
9. the manufacture method of Intelligent Power Module as claimed in claim 8 is characterized in that, the described step that insulating barrier forms the wiring layer on described specifically comprises:
Copper foil on the insulating barrier on described;
The described Copper Foil of etching forms described wiring layer.
10. the manufacture method of Intelligent Power Module as claimed in claim 9 is characterized in that, comprises before the described step that some circuit elements and pin be installed at described wiring layer:
The described aluminium base of preheating and wiring layer.
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| CN201210576069.XA CN103050470B (en) | 2012-12-26 | 2012-12-26 | SPM and preparation method thereof |
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| CN201210576069.XA CN103050470B (en) | 2012-12-26 | 2012-12-26 | SPM and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104112732A (en) * | 2013-08-19 | 2014-10-22 | 广东美的集团芜湖制冷设备有限公司 | Integrated circuit module and manufacturing method thereof |
| CN104392943A (en) * | 2014-12-05 | 2015-03-04 | 常州瑞华电力电子器件有限公司 | Preparation method of low-stress high-weldability nickel-plated electrode |
| CN104716128A (en) * | 2013-12-16 | 2015-06-17 | 台达电子企业管理（上海）有限公司 | Power module, power converter and method for manufacturing power module |
| CN104767417A (en) * | 2015-03-23 | 2015-07-08 | 广东美的制冷设备有限公司 | Control circuit of intelligent power module, intelligent power module and manufacturing method thereof |
| CN104112740B (en) * | 2013-09-23 | 2017-02-15 | 广东美的制冷设备有限公司 | Intelligent power module and manufacturing method thereof |
| CN107045990A (en) * | 2017-03-13 | 2017-08-15 | 广东美的制冷设备有限公司 | Circuit module and its manufacture method |
| CN108493166A (en) * | 2018-04-23 | 2018-09-04 | 南通市索新功率电子有限公司 | A kind of power semiconductor modular encapsulating structure and packaging method |
| CN109510562A (en) * | 2019-01-02 | 2019-03-22 | 广东美的暖通设备有限公司 | Power module, air conditioner |
| CN110718470A (en) * | 2019-09-03 | 2020-01-21 | 浙江固驰电子有限公司 | Aluminum substrate aluminum wire bonding process with high reliability and low structural stress |
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| US10104797B2 (en) | 2013-12-16 | 2018-10-16 | Delta Electronics (Shanghai) Co., Ltd. | Power module, power converter and manufacturing method of power module |
| CN104392943A (en) * | 2014-12-05 | 2015-03-04 | 常州瑞华电力电子器件有限公司 | Preparation method of low-stress high-weldability nickel-plated electrode |
| CN104767417B (en) * | 2015-03-23 | 2018-10-19 | 广东美的制冷设备有限公司 | Control circuit, intelligent power module and its manufacturing method of intelligent power module |
| CN104767417A (en) * | 2015-03-23 | 2015-07-08 | 广东美的制冷设备有限公司 | Control circuit of intelligent power module, intelligent power module and manufacturing method thereof |
| CN107045990A (en) * | 2017-03-13 | 2017-08-15 | 广东美的制冷设备有限公司 | Circuit module and its manufacture method |
| CN108493166A (en) * | 2018-04-23 | 2018-09-04 | 南通市索新功率电子有限公司 | A kind of power semiconductor modular encapsulating structure and packaging method |
| CN108493166B (en) * | 2018-04-23 | 2019-11-26 | 南通市索新功率电子有限公司 | A kind of power semiconductor modular encapsulating structure and packaging method |
| CN109510562A (en) * | 2019-01-02 | 2019-03-22 | 广东美的暖通设备有限公司 | Power module, air conditioner |
| CN110718470A (en) * | 2019-09-03 | 2020-01-21 | 浙江固驰电子有限公司 | Aluminum substrate aluminum wire bonding process with high reliability and low structural stress |
| CN113088224A (en) * | 2021-02-26 | 2021-07-09 | 广东美的白色家电技术创新中心有限公司 | Protection composition applied to packaging product, power module and preparation method of power module |
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