CN103049415A - Universal serial bus device and manufacture method thereof - Google Patents
Universal serial bus device and manufacture method thereof Download PDFInfo
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- CN103049415A CN103049415A CN2011103095103A CN201110309510A CN103049415A CN 103049415 A CN103049415 A CN 103049415A CN 2011103095103 A CN2011103095103 A CN 2011103095103A CN 201110309510 A CN201110309510 A CN 201110309510A CN 103049415 A CN103049415 A CN 103049415A
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- circuit board
- metal contact
- chip
- serial bus
- universal serial
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Abstract
The invention provides a universal serial bus device which comprises a circuit board assembly and a plastic package casing. The circuit board assembly comprises a circuit board, a plurality of conducting terminals and at least one integrated circuit chip. The circuit board is provided with a front end, a back end, a first surface and a second surface, wherein the first surface and the second surface are opposite, and the first surface is provided with a plurality of metal contact pads. The plurality of conducting terminals are arranged on at least parts of the plurality of metal contact pads. The integrated circuit chip is arranged on the second surface of the circuit board. The plastic package casing is at least arranged on the second surface of the circuit board and packages the integrated circuit chip. Due to the fact that the conducting terminals can be directly arranged on the metal contact pads, slotting on the circuit board is not required, the universal serial bus device is simple in structure, and the reduction of the production and manufacture cost is facilitated.
Description
Technical field
The present invention relates to a kind of USB (universal serial bus) (USB) device, relate in particular to a kind of USB flash memory driver.
The invention still further relates to a kind of method of making above-mentioned universal serial bus device.
Background technology
USB (universal serial bus) (Universal Serial Bus, USB) be a serial bus standard that connects computer system and external unit, it also is a kind of IO interface technical manual, be widely used in the information communication products such as PC and mobile device, and extend to other association areas such as photographic goods, Digital Television (set-top box), game machine.
Since releasing the USB1.0 version in 1996, experienced USB1.1, USB2.0 version, developed at present the USB3.0 version.The key distinction of each version is the difference of peak transfer rate.USB1.0 version transfer rate the earliest is 1.5Mbps (192KB/s), is mainly used in human interface device, such as keyboard, mouse, joystick etc.The USB1.1 transfer rate of releasing in 1998 has reached 12Mbps (1.5MB/s), is known as at full speed USB.And the USB2.0 transfer rate of releasing in 2000 has more obtained promoting further, reaches the high speed of 480Mbps (60MB/s).At present up-to-date USB3.0 is known as the have 5Gbps hypervelocity speed of (640MB/s), is 10 times of USB 2.0.
The USB flash memory driver (USB Flash Drive, UFD) claim again USB flash disk, is a kind of miniature high power capacity mobile storage product that need not phisical drive that adopts USB interface.The storage medium that its adopts is flash memory (Flash Memory), does not need extra driver, but driver and storage medium are united two into one, as long as connect USB interface storage read-write data independently just on the computer.With USB3.0 correspondingly, at present the UFD of latest generation is UFD3.0.
UFD3.0 equipment is shown in U.S. Patent Application Publication US2009/0093136A1.Wherein, passive device, control chip, storage chip are encapsulated on the same circuit board.This circuit board front end is provided with two row's conducting terminals, and 4 metal contact pads are drawn together in a forward package, are mainly used in the product of the following version of compatible USB3.0; 5 conducting terminals are drawn together in a package after leaning on, and USB3.0 is extra to be increased in order to adapt to.
Yet the structure of the UFD3.0 product that this U.S. Patent application discloses and production are all rather complicated.Be 5 conducting terminals of row after arranging at circuit board, need to offer 5 grooves at circuit board first that then, 5 conducting terminals pass groove and the protruding front that is exposed to circuit board from the back side of circuit board.And, when circuit board is carried out injection molding packaging, because the existence of groove need to construct to avoid injection moulding liquid to enter in the groove to the injection moulding grinding tool especially, so, obviously can increase the cost of the manufacturing.
In view of this, be necessary existing USB flash memory driver is improved to address the above problem.
Summary of the invention
One of purpose of the present invention is to provide a kind of universal serial bus device, its simple structure, and be conducive to reduce manufacturing cost.
Another object of the present invention is to provide a kind of method of making above-mentioned universal serial bus device.
One of for achieving the above object, the present invention adopts following technical scheme: a kind of universal serial bus device, and it comprises:
Circuit board assemblies, it comprises:
Circuit board, it has front-end and back-end and relative first surface and second surface, is provided with some metal contact pads on the described first surface;
Some conducting terminals are arranged at least part of described some metal contact pads;
At least one integrated circuit (IC) chip is arranged on the second surface of described circuit board;
The plastic packaging housing is arranged on the second surface of described circuit board at least, and seals the residence and state at least one integrated circuit (IC) chip.
As a further improvement on the present invention, described conducting terminal comprises the weld part that is welded on the metal contact pad, and is connected to be used for and the contact site of docking facilities cooperation with described weld part.
As a further improvement on the present invention, described contact site is the arch setting, and described welding position is in the two ends of described contact site.
As a further improvement on the present invention, described some metal contact pads are arranged to two rows at least, comprise the first metal contact pad that arranges near the circuit board front end and the second metal contact pad that arranges away from the circuit board front end; Described conducting terminal is arranged on described the second metal contact pad.
As a further improvement on the present invention, the quantity of described the first metal contact pad is 4, and the quantity of described the second metal contact pad and conducting terminal is 5.
As a further improvement on the present invention, described at least one integrated circuit (IC) chip is the bare chip that does not encapsulate.
As a further improvement on the present invention, described at least one integrated circuit (IC) chip comprises control chip and/or storage chip.
As a further improvement on the present invention, described circuit board assemblies also comprises at least one passive device that is arranged on the described circuit board second surface.
As a further improvement on the present invention, have long and wide size after described circuit board and plastic packaging housing are installed together, described wide range of size is 8 ~ 14mm, and the range of size of described length is 20 ~ 28mm.
As a further improvement on the present invention, described plastic packaging housing only is arranged on the second surface of described circuit board.
For realizing above-mentioned another goal of the invention, the present invention can also adopt following technical scheme: a kind of manufacture method of universal serial bus device, it comprises the steps:
Circuit board is provided, and described circuit board has front-end and back-end and relative first surface and second surface, and is provided with some metal contact pads at described first surface;
On at least one ic core second surface that is attached to described circuit board on chip, and be electrically connected by lead-in wire and circuit board;
Form injection-moulded housing by the second surface that is injection-moulded in described circuit board and state at least one integrated circuit (IC) chip to seal the residence; And
Some conducting terminals are welded at least part of some metal contact pads.
As a further improvement on the present invention, described at least one integrated circuit (IC) chip bare chip that is un-encapsulated; Described bare chip is attached to the second surface of described circuit board by chip on board encapsulation (Chip-on-Board, COB) technique dress.
As a further improvement on the present invention, the welding of described conducting terminal comprises that the two ends with conducting terminal are soldered on the metal contact pad, and the center section of conducting terminal then keeps at a certain distance away with metal contact pad.
As a further improvement on the present invention, described some metal contact pads are configured at least two rows, comprise 4 the first metal contact pads that arrange near the circuit board front end and 5 the second metal contact pads that arrange away from the circuit board front end; Described some conducting terminals are welded on described the second metal contact pad.
Compared with prior art, the invention has the beneficial effects as follows: owing to conducting terminal can be set directly on the metal contact pad, and need to not slot at circuit board, thereby make the structure of whole device become ground simply, and be conducive to reduce the cost of the manufacturing.
In the specific embodiment of the present invention, owing to only need to carry out plastic packaging at the single face of circuit board, thus be conducive to further reduce the cost of manufacturing.
In the specific embodiment of the present invention, the two ends of conducting terminal all are welded on the circuit board, thereby it is more reliable to make being connected of itself and circuit board become ground, to avoid making itself and circuit board junction become flexible owing to pegging graft continually.
In the specific embodiment of the present invention, integrated circuit (IC) chip is not through the bare chip of encapsulation, is attached on the circuit board by chip on board encapsulation (COB) technique dress, thereby effectively reduces the overall dimensions of product after the encapsulation.
Description of drawings
Fig. 1 is the stereographic map in universal serial bus device one embodiment of the present invention;
Fig. 2 is the schematic perspective view at another visual angle of universal serial bus device shown in Figure 1, and the passive device, control chip, the storage chip that wherein are encapsulated in the plastic packaging housing are shown in dotted line;
Fig. 3 is the three-dimensional exploded view of universal serial bus device shown in Figure 2;
Fig. 4 is the manufacturing process synoptic diagram in universal serial bus device manufacture method one embodiment of the present invention;
Fig. 5 has shown respectively the universal serial bus device made by the manufacturing process shown in Figure 4 product schematic perspective view in a plurality of fabrication phases to Figure 11.
Embodiment
Describe the present invention below with reference to each embodiment shown in the drawings.But these embodiment do not limit the present invention, and the conversion on the structure that those of ordinary skill in the art makes according to these embodiment, method or the function all is included in protection scope of the present invention.For example, the below will be take the UFD(USB flash drive) 3.0 universal serial bus device of the present invention is described as example, but what those of ordinary skill in the art can expect easily is, the present invention can be applicable on the USB flash memory driver of the Versions such as UFD1.0, UFD2.0 equally, also can be applicable to the usb driver of other types, such as USB wireless network drive etc.
As shown in Figure 1 to Figure 3, in the present embodiment, universal serial bus device 100 comprises circuit board assemblies and plastic packaging housing 20.Wherein circuit board assemblies comprises a printed circuit board (PCB) (PCB is hereinafter to be referred as " circuit board ") 10, and is arranged on some conducting terminals 30 on the circuit board 10, integrated circuit (IC) chip, passive device 50 etc.
Well known to those of ordinary skill in the art is that circuit board can be by substrate, such as copper-clad plate, forms through etching, plating and Multi-layer force fit.Be laid with the conducting wire on the circuit board, can be used for being electrically connected each electronic devices and components disposed thereon.In the present embodiment, circuit board 10 lengthwises extend, and it comprises relative first surface 11 and second surface 12, and front end 13 and rear end 14.On the first surface 11 of circuit board and near its front end 13 places, be provided with some metal contact pads, such as copper packing.These metal contact pads in fact are the part of circuit board 10 wiring, and it has defined the grafting interface of this universal serial bus device 100, contact and to realize electric connection with corresponding conducting terminal on the butt connector.
As previously mentioned, in the present embodiment, universal serial bus device 100 is UFD3.0, so above-mentioned some metal contact pads are configured to two rows, comprises near 4 the first metal contact pads 151 of circuit board front end with away from 5 the second metal contact pads 152 of circuit board front end.Because the grafting interface of the following version of USB3.0 (such as USB2.0, USB1.0) has all only defined 4 conducting terminals, so the first metal contact pad 151 is mainly used in the butt-jointed electric connector of the following version of compatible USB3.0.5 conducting terminals by a rear row then additionally increase for adapting to the USB3.0 standard.
Conducting terminal 30 is formed by metallic plate punching, and it includes 5 altogether, and configuration is identical.In the present embodiment, 5 conducting terminals 30 are fixed by welding on corresponding the second metal contact pad 152.Each conducting terminal 30 comprises weld part and contact site.Wherein, weld part 31,33 is positioned at the two ends of conducting terminal 30, and contact site 32 then is connected between two weld parts 31,33, and is the arch setting, with when pegging graft with butt connector, the corresponding conducting terminal of contact site 32 and butt connector butt on perpendicular to the direction of first surface 11.Because the two ends of conducting terminal 30 all are welded on the circuit board 10, thereby it is more reliable to make itself and being connected of circuit board become ground, to avoid making itself and circuit board junction become flexible owing to pegging graft continually.
As shown in Figures 2 and 3, be provided with integrated circuit (IC) chip 41,42 on the second surface 12 of circuit board 10, passive device 50, and realize integrated circuit (IC) chip 41,42 with circuit board 10 on the lead-in wire 60 of wiring electric connection.In the present embodiment, integrated circuit (IC) chip comprises storage chip 41 and control chip 42, and is not through the bare chip of encapsulation, can encapsulate by chip on board (COB) technique dress and be attached on the second surface 12 of circuit board 10.Certainly, in other embodiments, integrated circuit (IC) chip can only comprise storage chip 41 or control chip 42.
Because chip on board encapsulation (COB) technique is well known to those of ordinary skill in the art, so the applicant is no longer given unnecessary details at this.But need to prove, compare traditional chip with packaged and be set on the circuit board, adopt the chip on board packaging technology in the present embodiment, can effectively reduce the overall dimensions of the rear product of encapsulation.Planar dimension such as the product by the traditional handicraft manufacturing is 18 * 70 mm, be after circuit board and plastic packaging housing are installed together wide for 18mm, length be 70 mm, and the wide range of size of product that obtains by the present invention is 8 ~ 14mm, long range of size is 20 ~ 28mm, is preferably in the present embodiment 11.3 * 24.8mm.
In the present embodiment, plastic packaging housing 20 is formed on the second surface 12 of circuit board by injection moulding, and seals and live in to state integrated circuit (IC) chip 41,42, passive device 50 and connecting lead wire 60.Compared to existing technology, present embodiment be owing to only need to carry out plastic packaging at the single face of circuit board, thereby is conducive to further reduce the cost of manufacturing.Certainly, in other embodiments, also be feasible at the two-sided plastic packaging that carries out of circuit board.
Manufacture method of the present invention is described in detail to embodiment shown in Figure 11 below in conjunction with Fig. 4.
With reference to Fig. 4 and shown in Figure 5, at first provide a channel plate array (step 711), to be suitable for large-scale manufacturing.In the present embodiment, channel plate array comprises the circuit board 10 of arranging by 2 * 6, and the technique that each circuit board has identical structure and follow-up formation product is also identical, thus following only take wherein one describe as example.Stage as shown in Figure 5 has been provided with two row's metal contact pads on the circuit board 10, comprise near 4 the first metal contact pads 151 of circuit board front end with away from 5 the second metal contact pads 152 of circuit board front end.
Cooperate with reference to shown in Figure 6, passive device 50(step 712 be provided), and passive device 50 is welded on the second surface 12 of circuit board (step 715).Well known to those of ordinary skill in the art is, passive device mainly refers to not affect the signal essential characteristic for active member, only allows signal pass through and the passive device that do not changed, has generally included resistance, electric capacity, inductance etc.In the present embodiment, passive device 50 can pass through surface mounting technology (Surface Mounted Technology, SMT) and be welded on the circuit board.Namely the corresponding position on circuit board is placed scolder in advance; Then, passive device 50 mounts the relevant position of circuit board 10; Make solder fusing by Reflow Soldering equipment, thereby passive device 50 is welded on the circuit board 10 securely.Because the SMT technology is well known to those of ordinary skill in the art, so the applicant is no longer given unnecessary details at this.
Cooperate with reference to shown in Figure 7, wafer (step 713) is provided, wafer forms bare chip (step 714) after treatment, then bare chip is mounted on the second surface 12 of circuit board (step 716).The processing of wafer mainly is to make circuit and electronic component at wafer, usually after Silicon Wafer is cleaned, then carries out oxidation and Shen and amasss, and then carries out the repeatedly step such as little shadow, etching and implanted ions, to finish the circuit production on the wafer.Wafer forms the identical or different some crystal grain (Die) of specification after treatment, and (Probe) is qualified to be cut out the formation bare chip one by one afterwards and survey by pin.In the present embodiment, these bare chips comprise control chip 42 and storage chip 41, and it does not need to carry out the independent encapsulation of back segment, but are attached on the circuit board 10 by chip on board encapsulation (COB) technique dress.
Cooperate with reference to shown in Figure 8, chip 41,42 and circuit board 10 between 60 realize being electrically connected (step 717) by going between.
Cooperate with reference to shown in Figure 9, form plastic packaging housing 20(steps 718 by injection mo(u)lding at the second surface 12 of circuit board 10), be arranged on integrated circuit (IC) chip 41 on the circuit board, 42 and passive device 50 to seal by above-mentioned steps.Then, conducting terminal 30 is welded on the second metal contact pad 152 of circuit board 10 first surfaces 11 (step 719).The welding of conducting terminal can be adopted the SMT technology equally.
Cooperation is carried out laser marking with reference to Figure 10 and shown in Figure 11 at plastic packaging housing 20, such as information (step 720) such as mark exabyte, memory capacity, manufactured places.Subsequently, product array is cut into single product (step 721), and packing (step 722) behind electric performance test, thereby the manufacturing of product finished.
Be to be understood that, although this instructions is described according to embodiment, but be not that each embodiment only comprises an independently technical scheme, this narrating mode of instructions only is for clarity sake, those skilled in the art should make instructions as a whole, technical scheme in each embodiment also can through appropriate combination, form other embodiments that it will be appreciated by those skilled in the art that.
Above listed a series of detailed description only is specifying for feasibility embodiment of the present invention; they are not to limit protection scope of the present invention, allly do not break away from equivalent embodiment or the change that skill spirit of the present invention does and all should be included within protection scope of the present invention.
Claims (14)
1. a universal serial bus device is characterized in that, this device comprises:
Circuit board assemblies, it comprises:
Circuit board, it has front-end and back-end and relative first surface and second surface, is provided with some metal contact pads on the described first surface;
Some conducting terminals are arranged at least part of described some metal contact pads;
At least one integrated circuit (IC) chip is arranged on the second surface of described circuit board;
The plastic packaging housing is arranged on the second surface of described circuit board at least, and seals the residence and state at least one integrated circuit (IC) chip.
2. universal serial bus device as claimed in claim 1 is characterized in that: described conducting terminal comprises the weld part that is welded on the metal contact pad, and is connected to be used for and the contact site of docking facilities cooperation with described weld part.
3. universal serial bus device as claimed in claim 2, it is characterized in that: described contact site is the arch setting, and described welding position is in the two ends of described contact site.
4. universal serial bus device as claimed in claim 1, it is characterized in that: described some metal contact pads are arranged to two rows at least, comprise the first metal contact pad that arranges near the circuit board front end and the second metal contact pad that arranges away from the circuit board front end; Described conducting terminal is arranged on described the second metal contact pad.
5. universal serial bus device as claimed in claim 4, it is characterized in that: the quantity of described the first metal contact pad is 4, the quantity of described the second metal contact pad and conducting terminal is 5.
6. universal serial bus device as claimed in claim 1 is characterized in that: the bare chip of described at least one integrated circuit (IC) chip for not encapsulating.
7. such as claim 1 or 6 described universal serial bus devices, it is characterized in that: described at least one integrated circuit (IC) chip comprises control chip and/or storage chip.
8. universal serial bus device as claimed in claim 1, it is characterized in that: described circuit board assemblies also comprises at least one passive device that is arranged on the described circuit board second surface.
9. universal serial bus device as claimed in claim 1 is characterized in that: have long and wide size after described circuit board and plastic packaging housing are installed together, described wide range of size is 8 ~ 14mm, and the range of size of described length is 20 ~ 28mm.
10. universal serial bus device as claimed in claim 1, it is characterized in that: described plastic packaging housing only is arranged on the second surface of described circuit board.
11. the manufacture method of a universal serial bus device is characterized in that the method comprises the steps:
Circuit board is provided, and described circuit board has front-end and back-end and relative first surface and second surface, and is provided with some metal contact pads at described first surface;
On at least one ic core second surface that is attached to described circuit board on chip, and be electrically connected by lead-in wire and circuit board;
Form injection-moulded housing by the second surface that is injection-moulded in described circuit board and state at least one integrated circuit (IC) chip to seal the residence; And
Some conducting terminals are welded at least part of some metal contact pads.
12. manufacture method as claimed in claim 11 is characterized in that: described at least one integrated circuit (IC) chip is the bare chip of un-encapsulated; Described bare chip is attached to the second surface of described circuit board by chip on board encapsulation (Chip-on-Board, COB) technique dress.
13. manufacture method as claimed in claim 11 is characterized in that: the welding of described conducting terminal comprises that the two ends with conducting terminal are soldered on the metal contact pad, and the center section of conducting terminal then keeps at a certain distance away with metal contact pad.
14. manufacture method as claimed in claim 11, it is characterized in that: described some metal contact pads are configured at least two rows, comprise 4 the first metal contact pads that arrange near the circuit board front end and 5 the second metal contact pads that arrange away from the circuit board front end; Described some conducting terminals are welded on described the second metal contact pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103095103A CN103049415A (en) | 2011-10-13 | 2011-10-13 | Universal serial bus device and manufacture method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011103095103A CN103049415A (en) | 2011-10-13 | 2011-10-13 | Universal serial bus device and manufacture method thereof |
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| CN103049415A true CN103049415A (en) | 2013-04-17 |
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| CN2011103095103A Pending CN103049415A (en) | 2011-10-13 | 2011-10-13 | Universal serial bus device and manufacture method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090093136A1 (en) * | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
| CN201556729U (en) * | 2009-07-03 | 2010-08-18 | 北京爱国者存储科技有限责任公司 | USB thin connector |
| CN201805024U (en) * | 2010-03-25 | 2011-04-20 | 劲永国际股份有限公司 | Usb connector |
-
2011
- 2011-10-13 CN CN2011103095103A patent/CN103049415A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090093136A1 (en) * | 2003-12-02 | 2009-04-09 | Super Talent Electronics, Inc. | Single Shot Molding Method For COB USB/EUSB Devices With Contact Pad Ribs |
| CN201556729U (en) * | 2009-07-03 | 2010-08-18 | 北京爱国者存储科技有限责任公司 | USB thin connector |
| CN201805024U (en) * | 2010-03-25 | 2011-04-20 | 劲永国际股份有限公司 | Usb connector |
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Application publication date: 20130417 |