CN103008887A - Method and device for cutting machined target from two surfaces by using ultra-short pulse laser - Google Patents
Method and device for cutting machined target from two surfaces by using ultra-short pulse laser Download PDFInfo
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- CN103008887A CN103008887A CN2012102232146A CN201210223214A CN103008887A CN 103008887 A CN103008887 A CN 103008887A CN 2012102232146 A CN2012102232146 A CN 2012102232146A CN 201210223214 A CN201210223214 A CN 201210223214A CN 103008887 A CN103008887 A CN 103008887A
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Abstract
The invention relates to a method and a device for cutting a machined target from two surfaces by using ultra-short pulse laser. The method comprises the following steps of providing a first laser beam and a second laser beam; focusing the first laser beam on the surface of a first side of the machined target so as to cut the surface of the first side; focusing the second laser beam on the surface of a second side, opposite to the first side, of the machined target so as to cut the surface of the second side; simultaneously moving focal points of the first laser beam and the second laser beam to the interior of the machined target, and forming a corresponding cutting area in the machined target; and when the cutting areas of the first laser beam and the second laser beam formed in the machined target are intersected, cutting the machined target apart. The invention also relates to the device for cutting the machined target by using the method.
Description
Technical field
The present invention relates to utilize laser to processing and/or cutting that workpiece carries out, the little processing that particularly utilizes laser that the transparent materials such as the employed glass of cover-plate glass and touch screen technology field are carried out.More particularly, the present invention proposes a kind of double light path laser that utilizes ultrashort pulse carries out abnormity cutting on the two sides of Gorilla, Sodalime and Dragontrail safety glass method and apparatus.
Background technology
Gorilla, Sodalime and Dragontrail safety glass are owing to high thoroughly property and the high strength that it has is widely used in making the display screen device.When making the display screen device, need to cut glass.Traditional glass-cutting technique mainly is to utilize break bar cutting, frotton grinding and carbon dioxide laser to cut.Utilize break bar cutting can only carry out to the glass of tempering not straight cuts and the larger curvilinear cut of radius of profile, also need to carry out sliver after the cutting and just can obtain complete profile.And for the Gorilla behind the tempering, Sodalime and Dragontrail glass, break bar then is difficult to cutting.For the cutting of inside glass closed area, then can only use first a bit drills aperture, change again the size that different frottons is ground to requirement.In this case, the loss of frotton is very large, and its efficient is also very low.The carbon dioxide laser cutting technique also is only applicable to simple glass and the lower glass of toughening degree are cut, and needs equally the sliver operation after the cutting, also can't process for the enclose inside zone.
Therefore, for Gorilla, Sodalime and Dragontrail safety glass, present various processing methods all can not realize effectively stable abnormity cutting, still need to process carrying out tempering after the glass-cutting of tempering is not ground again, and cause efficient extremely low.
Laser cutting technique refers to take laser beam as thermal source, adopts the heat abstraction method to realize the separation of material, thereby forms the material processing method of Cutting Road.Particularly, laser beam is focused on material surface, reaches the evaporation vaporized state of material so that the material surface temperature sharply raises, thereby realizes the removal of material.This has wherein comprised material to the absorption of beam energy and the heat transfer process in the material.In this process, material is heated the sharply process of gasification occurs, and depends primarily on the time of laser and material effects and the intensity of laser beam.
Along with the sustainable growth of the electronical display industries such as mobile phone, panel computer, need a large amount of Gorilla, Sodalime and Dragontrail glass as the manufactured materials of high-end applications, and above-mentioned traditional processing mode can't satisfy such demand.Therefore, need especially a kind of traditional method and apparatus that Gorilla, Sodalime and Dragontrail glass are carried out abnormity processing of breaking through.Although laser is as manufacturing process advanced in the modern industry, more and more be subject to the attention of industry-by-industry, realize that by laser the feasibility of glass-cutting and practicality are also more and more verified, but also do not have a kind of device and the process that can carry out with high efficiency, high-quality and high accuracy abnormity cutting to Gorilla, Sodalime and Dragontrail safety glass at present.
Therefore, one object of the present invention is to provide a kind of double light path laser that utilizes ultrashort pulse to carry out the apparatus and method of abnormity cutting on the two sides of Gorilla, Sodalime and Dragontrail safety glass.Utilize such apparatus and method, it is lower to overcome the efficient that exists in the traditional glass processing technology, can't carry out the shortcoming that abnormity is processed to above-mentioned Gorilla, Sodalime and Dragontrail safety glass.And, use the high frequency ultrashort pulse laser to Gorilla, Sodalime and Dragontrail not the glass behind tempering and the tempering add man-hour, by cutting simultaneously on the glass two sides, the stress equilibrium on glass two sides in the time of can guaranteeing to cut, thereby improve the stability of cutting, and can significantly improve the effect of cut edge.
Summary of the invention
The light path that the present invention proposes the ultra-short pulse laser of a kind of what is called " double light path " focuses on and scanning system, it can realize workpiece (such as transparent materials such as Gorilla, Sodalime and Dragontrail glass) is cut simultaneously from the two sides, thereby obtains the processing of efficient stable that Gorilla, Sodalime and Dragontrail glass are carried out.
Generally speaking, the device of Laser cutting object (being in an embodiment of the present invention transparent material) that utilizes of the present invention mainly comprises the lasing light emitter part with the laser instrument that produces laser beam, the laser optical path part of utilizing the optical scanner focusing system workpiece to be processed from the two sides with double light path, and the Laser Processing part of clamping and handover workpiece.In addition, device of the present invention also can comprise scavenger system and dust-precipitating system, is used for the residue that removal and collection utilize the process of laser cutting transparent material to produce.
The process of utilizing the laser cutting transparent material of the present invention can be sketched and be following steps:
1, the laser (being preferably ultra-short pulse laser) that utilizes two light paths respectively laser instrument to be sent carries out optical focus, laser is focused on respectively on the surface of transparent material both sides.Can optimized mode efficiently use the energy of laser instrument at this, thereby improve working (machining) efficiency;
2, utilize the optical scanner focusing system, make the laser beam motion process needed figure, and make the focus of two-way laser inner mobile from the transparent material lateral.After a period of time, when a certain in the middle of the transparent material of Focal Point Shift crossed the position, transparent material was cut apart fully;
3, in the cutting processing process, can be aided with air blowing, dust collect plant, remove in order in time will cut residue, thereby obtain high-quality, high efficiency processing effect.
Although this specification has been done exemplary explanation with the specific embodiment to the present invention hereinafter, concrete summary of the invention of the present invention and protection domain should be limited by the specification appending claims.
Particularly, the present invention proposes a kind of method of utilizing the Laser cutting object, comprising: the first laser beam and the second laser beam are provided; The first laser beam is focused on the surface of the first side of workpiece, thus the surface of the first side is cut; The second laser beam is focused on the surface of the second side opposite with described the first side of workpiece, thus the surface of the second side is cut; The focus of the first laser beam and the second laser beam is moved to the inside of workpiece simultaneously, form corresponding cutting area in the inside of workpiece thus; The cutting area that forms in the inside of workpiece when the first laser beam and the second laser beam makes when crossing that workpiece is divided to be opened.
In the present invention, the first laser beam and the second laser beam can be modulated into two-way laser with its laser beam that sends through optical system by a lasing light emitter and produce.
Lasing light emitter of the present invention can be ultrashort pulse laser, is preferably nanosecond, psec or femto-second laser that wave-length coverage is 266-1064nm.
In one embodiment, above-mentioned workpiece is the transparent materials such as Gorilla, Sodalime or Dragontrail glass.
According to a preferred embodiment of the invention, the first laser beam and the second laser beam are with respect to workpiece cardinal principle coaxial arrangement.
According to a preferred embodiment of the invention, the first laser beam and the second laser beam are cut workpiece by its inside, lateral of workpiece layer by layer with predetermined distance.
The invention allows for a kind of device that utilizes the Laser cutting object, comprising: the lasing light emitter part comprises the laser instrument that produces laser beam; The laser optical path part, be used for to be divided into the first laser beam and the second laser beam by the laser beam that laser instrument produces, and the first laser beam and the second laser beam focused on respectively on the surface of workpiece both sides to be cut, make the motion of the first laser beam and the second laser beam process needed figure, and make by the focus of the first laser beam and the second laser beam is moved to an intersection to the inside of workpiece that workpiece is divided to be opened; The Laser Processing part, it comprises the anchor clamps of clamping workpiece and the transfer system that workpiece is moved out of after processing.
In device of the present invention, laser instrument preferably wave-length coverage is nanosecond, psec or the femto-second laser of 266-1064nm.
In one embodiment, laser optical path in the device of the present invention partly comprises the optical scanner focusing system, it makes the motion of the first laser beam and the second laser beam process needed figure, and by the focus of the first laser beam and the second laser beam is moved to intersection to the inside of workpiece.
According to a preferred embodiment of the invention, optical scanner focusing system comprises 3D dynamic scan focus lamp and 3D dynamic focusing vibration mirror.
According to a preferred embodiment of the invention, device of the present invention also comprises scavenger system and dust-precipitating system, is used for the residue that removal and collection utilize the process of Laser cutting object to produce.
In one embodiment, the workpiece of device cutting of the present invention is the transparent materials such as Gorilla, Sodalime or Dragontrail glass.
The double light path laser that utilizes ultrashort pulse of the present invention carries out two-sided cutting to workpiece technique is compared with traditional diamond-making technique has many distinctive features:
(1) range of work of technique of the present invention is not subjected to the restriction of Material Physics, mechanical performance, can process any hard, soft, crisp, heat-resisting or refractory metal and nonmetallic materials.
(2) technique of the present invention is easy to processed complex profile and fine surface.
(3) technique of the present invention is easy to obtain good cutting section quality, cuts simultaneously debris contamination, and thermal stress, residual stress, flow harden, heat affected area etc. are all smaller.
(4) utilize technique of the present invention can carry out in the closed area abnormity cutting of safety glass, and can obtain high stability.
(5) the 3D dynamic scan focus lamp in the laser cutting device of the present invention and double beam system can significantly promote working (machining) efficiency.
(6) utilize technique of the present invention, so that various processing method is easy to be compounded to form new process, easy to utilize.
Description of drawings
Below in conjunction with accompanying drawing technical scheme of the present invention is elaborated:
Fig. 1 carries out the graphical representation of exemplary of the device of two-sided cutting to safety glass for the double light path laser that utilizes ultrashort pulse according to the present invention.
The specific embodiment
Generally speaking, utilize in the device that laser cuts workpiece (transparent materials such as Gorilla, Sodalime and Dragontrail safety glass) of the present invention, used ultrashort pulse laser.Preferably, this ultrashort pulse laser can be that wave-length coverage is nanosecond of 266-1064nm and psec, femto-second laser.Because the pulse period of ultra-short pulse laser is shorter than most chemistry and physical reactions, such as machinery and thermodynamic (al) characteristic time etc., and its peak power is high, so in the interaction of ultra-short pulse laser and material, can produce unique Multiphoton Absorbtion process, so that its machining accuracy can break through the bottleneck of coherent limit, thus make nanoprocessing and corresponding little/many conceptions of nano-electron, little/receive optics become possibility.Utilize the ultrashort pulse sequence, can also control ionization process, optionally ground state rotation etc. in ionized atom, the control molecule.
Utilize laser processing device of the present invention can to Gorilla, Sodalime and Dragontrail not the transparent material such as tempering and safety glass stablize effectively processing and cutting.All in all, laser processing device of the present invention can generate two ultra-short pulse lasers, and the optical scanner focusing system that can utilize laser processing device focuses on two ultra-short pulse lasers respectively the both sides of transparent material (such as Gorilla, Sodalime and Dragontrail not tempering and safety glass).For realizing precise and stable cutting, and the stress equilibrium on glass two sides when guaranteeing cutting, focus on respectively two ultra-short pulse laser Shu Dati coaxial arrangement of glass both sides.In addition, can utilize specific interval and particular order successively transparent material to be cut.For different transparent material thickness, can form suitable cutting interval.By with the focus of two ultra-short pulse lasers by the surface of transparent material to the transparent material internal motion, so that process simultaneously and/or cut on the two sides of transparent material.When the focus of two ultra-short pulse lasers was intersected in a certain position of transparent material centre, transparent material is cut fully to be worn, thereby realized the purpose of cutting transparent material.
The double light path laser that utilizes ultrashort pulse according to the present invention carries out the device of two-sided cutting to safety glass a embodiment has been shown among Fig. 1.
Laser processing device of the present invention comprises lasing light emitter part, laser optical path part and Laser Processing part.As mentioned above, because the technical advantage of ultrashort pulse laser conduct processing laser itself, what the lasing light emitter of laser processing device of the present invention partly preferably included is ultrashort pulse laser 1.This ultrashort pulse laser can be that wave-length coverage is nanosecond of 266-1064nm and psec, femto-second laser.
The effect of the laser optical path of laser processing device of the present invention part is to be divided into the two-way laser beam by the laser beam that ultrashort pulse laser 1 produces, and by laser focusing system this two-way laser beam is focused on respectively on the surface of both sides of workpiece (for example being Gorilla, Sodalime or Dragontrail safety glass in the present embodiment) of processing to be cut.As shown in Figure 1, according to present embodiment, the laser optical path part can comprise optical gate 2, Glan prism decay module 3, beam expanding lens 4, diaphragm 5,45 degree half-reflecting half mirrors 6,45 degree completely reflecting mirror 7,3D dynamic scan focus lamp 8 and 3D dynamic focusing vibration mirrors 11.As described below, by these optics, the laser beam that is produced by ultrashort pulse laser 1 can be divided into the two-way laser beam, and this two-way laser beam be focused on respectively on the surface of safety glass both sides of processing to be cut.As shown in Figure 1, for realizing precise and stable cutting, and the stress equilibrium on glass two sides when guaranteeing cutting, focus on respectively two ultra-short pulse laser Shu Dati coaxial arrangement of glass both sides.It should be understood that, the composition of above-mentioned laser optical path and layout are the example that for convenience of explanation the present invention provides, those skilled in the art can adopt different designs according to actual conditions, as long as laser beam is focused on, and the Focal Point Shift of two bundle laser that makes in subsequent step as described below gets final product to the intersection in the workpiece.
The specifically work of laser processing device of the present invention.At first, the laser that ultrashort pulse laser 1 sends utilizes electronic optical gate 2 to control the switch of laser, and it preferably can be controlled by corresponding software control induced signal the opening and closing of optical gate 2, thereby realizes the external control laser switch of laser instrument 1.After opening the light, optical gate 2 control laser through Glan prism decay module 3, improve stability and the beam quality of laser.After this laser carries out coaxial expanding through 4 pairs of light beams of beam expanding lens, this one side can be improved the angle of divergence of beam propagation, reaches the purpose of beam path alignment, can control on the other hand the size of the final focal beam spot of laser, obtaining desirable spot size, and then realize utilizing the purpose of laser stabilization cutting.Diaphragm 5 can the laser edge quality is bad light remove, in order to further improve the quality of laser beam.Light beam forms two light paths of vertical changed course behind a slice 45 degree half-reflecting half mirrors 6 and 45 degree completely reflecting mirrors 7.This two-way light beam focuses on respectively on the surface of safety glass both sides through its corresponding 3D dynamic scan focus lamp 8 and 3D dynamic focusing vibration mirror 11.
The graphics that the control system of laser processing device of the present invention can be cut is data signal, and the reflecting optics that then drives in the 3D dynamic focusing vibration mirror 11 carries out scanning machining to this figure.Coaxial CCD 10 can be set, in order to before the processing beginning, workpiece is accurately located on 3D dynamic focusing vibration mirror 11.For example, it can utilize the witness marker of grabbing on the target program grabbing workpiece, and offset value calculation realizes the exact matching of cutting pattern and actual Cutting Road, and add man-hour also can Real Time Observation machine process and effect.
Laser processing device of the present invention also can comprise scavenger system 9 and platform dust-precipitating system 14.After the processing beginning, scavenger system 9 can be carried out at workpiece the position introducing gas of Laser Processing, thereby the material residue that cuts out is blown down, and the residue that is blown down can be collected by platform dust-precipitating system 14.In addition, blow and also can play cooling effect in the position of carrying out Laser Processing on 9 pairs of workpiece of scavenger system, thereby improve cut quality.
In process, utilize 3D dynamic scan focus lamp 8 can be automatically the focus point of two-way laser beam to be moved, make it cut from outside to inside safety glass simultaneously.Like this, during certain position in the middle of the focus point of the laser beam on safety glass two sides all moves to glass, glass is just cut fully and is worn, and has realized the cutting of safety glass 13.Utilize above-mentioned processing technology of simultaneously workpiece being cut from the two sides of workpiece of the present invention, can guarantee the stress equilibrium on safety glass two sides, safety glass can not broken in cutting process, also can improve the cut quality on the safety glass both side surface.
After processing a unit at safety glass 13,3D dynamic focusing vibration mirror 11 is movable to next Working position, and then successively the cutting of whole unit is finished.In this embodiment of the present invention, the Laser Processing of laser processing device part can comprise anchor clamps 12, is used for clamping safety glass 13, with flatness and the whole uniform stressed that guarantees safety glass 13.After machining, can utilize platform dust-precipitating system 14 to drive anchor clamps 12 and withdraw from machining area, finish the processing that continues a slice new material after the blanking.Certainly, also can adopt other special transfer system that anchor clamps 12 are withdrawed from machining area, and the platform dust-precipitating system 14 of nonessential use present embodiment.
Abovely with reference to accompanying drawing and in conjunction with the specific embodiment ultrashort pulse double light path laser that utilizes according to the present invention has been done detailed description to the apparatus and method that workpiece cuts on the two sides.It should be understood that above-mentioned specific embodiment just is used for preferred embodiment of the present invention is described, is not to limit protection scope of the present invention.For example, although with Gorilla, the Sodalime of not tempering or tempering or the Dragontrail glass example as workpiece to be cut apparatus and method of the present invention are described in the above-described embodiments, yet can understand, method and apparatus of the present invention equally also can be applicable to the cutting of other transparent material, the Gorilla that is not limited to mention among the embodiment, Sodalime or Dragontrail glass.As previously mentioned, method and apparatus of the present invention even can also be applicable to is processed various hard, soft, crisp, heat-resisting or refractory metal and nonmetallic materials.For another example, although in the above-described embodiments, realize respectively that on the workpiece two sides two laser beams that focus on and process utilize a lasing light emitter to produce by certain optical systems.Yet, it will be understood by those skilled in the art that also can adopt two independently lasing light emitter be transmitted in respectively on the workpiece two sides laser beam that focuses on processing, equally also can realize purpose of the present invention, also belong to protection scope of the present invention.Therefore, other variation that can expect after reading this specification and accompanying drawing of those skilled in the art all should be within protection scope of the present invention.And concrete protection domain of the present invention should be limited by the appended claim of this specification.
Claims (15)
1. method of utilizing the Laser cutting object comprises:
The first laser beam and the second laser beam are provided;
The first laser beam is focused on the surface of the first side of workpiece, thus the surface of the first side is cut;
The second laser beam is focused on the surface of the second side opposite with described the first side of workpiece, thus the surface of the second side is cut;
The focus of the first laser beam and the second laser beam is moved to the inside of workpiece simultaneously, form corresponding cutting area in the inside of workpiece thus;
The cutting area that forms in the inside of workpiece when the first laser beam and the second laser beam makes when crossing that workpiece is divided to be opened.
2. the method for claim 1, wherein said the first laser beam and described the second laser beam are modulated into two-way laser with its laser beam that sends through optical system by a lasing light emitter and produce.
3. method as claimed in claim 2, wherein said lasing light emitter is ultrashort pulse laser.
4. method as claimed in claim 3, wherein said ultrashort pulse laser is that wave-length coverage is nanosecond, psec or the femto-second laser of 266-1064nm.
5. the method for claim 1, wherein said workpiece is transparent material.
6. method as claimed in claim 5, wherein said transparent material is Gorilla, Sodalime or Dragontrail glass.
7. the method for claim 1, wherein said the first laser beam and described the second laser beam are with respect to described workpiece coaxial arrangement substantially.
8. the method for claim 1, wherein said the first laser beam and described the second laser beam are cut workpiece by its inside, lateral of workpiece layer by layer with predetermined distance.
9. device that utilizes the Laser cutting object comprises:
The lasing light emitter part comprises the laser instrument that produces laser beam;
The laser optical path part, be used for to be divided into the first laser beam and the second laser beam by the laser beam that laser instrument produces, and the first laser beam and the second laser beam focused on respectively on the surface of workpiece both sides to be cut, make the motion of the first laser beam and the second laser beam process needed figure, and make by the focus of the first laser beam and the second laser beam is moved to an intersection to the inside of workpiece that workpiece is divided to be opened;
The Laser Processing part, it comprises the anchor clamps of clamping workpiece and the transfer system that workpiece is moved out of after processing.
10. device as claimed in claim 9, wherein said laser instrument is that wave-length coverage is nanosecond, psec or the femto-second laser of 266-1064nm.
11. device as claimed in claim 9, wherein said laser optical path partly comprises the optical scanner focusing system, it makes the motion of the first laser beam and the second laser beam process needed figure, and by the focus of the first laser beam and the second laser beam is moved to described intersection to the inside of workpiece.
12. device as claimed in claim 11, wherein said optical scanner focusing system comprises 3D dynamic scan focus lamp and 3D dynamic focusing vibration mirror.
13. device as claimed in claim 9 also comprises scavenger system and dust-precipitating system, is used for the residue that removal and collection utilize the process of Laser cutting object to produce.
14. device as claimed in claim 9, wherein said workpiece are transparent material.
15. device as claimed in claim 9, wherein said transparent material are Gorilla, Sodalime or Dragontrail glass.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012102232146A CN103008887A (en) | 2012-06-29 | 2012-06-29 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
| TW101131610A TWI462793B (en) | 2012-06-29 | 2012-08-30 | Method of cutting workpiece from both sides by ultrashort laser pulse light and apparatus by same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2012102232146A CN103008887A (en) | 2012-06-29 | 2012-06-29 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
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| CN103008887A true CN103008887A (en) | 2013-04-03 |
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| CN2012102232146A Pending CN103008887A (en) | 2012-06-29 | 2012-06-29 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
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| TW (1) | TWI462793B (en) |
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| CN114700637B (en) * | 2022-04-28 | 2024-03-12 | 大族激光科技产业集团股份有限公司 | Laser cutting device, equipment and method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201400225A (en) | 2014-01-01 |
| TWI462793B (en) | 2014-12-01 |
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Address after: 215021 No. 77 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 No. 77 Middle Road, Suzhou Industrial Park, Suzhou, Jiangsu, China Applicant before: Suzhou Delphi Laser Co., Ltd. |
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Application publication date: 20130403 |