CN114700637A - Laser cutting device, equipment and method - Google Patents
Laser cutting device, equipment and method Download PDFInfo
- Publication number
- CN114700637A CN114700637A CN202210455655.2A CN202210455655A CN114700637A CN 114700637 A CN114700637 A CN 114700637A CN 202210455655 A CN202210455655 A CN 202210455655A CN 114700637 A CN114700637 A CN 114700637A
- Authority
- CN
- China
- Prior art keywords
- light
- laser
- laser cutting
- emitting
- cutting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003698 laser cutting Methods 0.000 title claims abstract description 86
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000005520 cutting process Methods 0.000 claims abstract description 64
- 230000003287 optical effect Effects 0.000 claims description 17
- 239000000463 material Substances 0.000 abstract description 23
- 230000033228 biological regulation Effects 0.000 abstract description 2
- 239000002131 composite material Substances 0.000 description 21
- 230000000875 corresponding effect Effects 0.000 description 13
- 239000010410 layer Substances 0.000 description 7
- 230000001276 controlling effect Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000004383 yellowing Methods 0.000 description 4
- 239000011185 multilayer composite material Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 230000002457 bidirectional effect Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 241001268993 Heterochrosis Species 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000008542 thermal sensitivity Effects 0.000 description 1
- 230000003313 weakening effect Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the application discloses a laser cutting device, equipment and a method, wherein the laser cutting device comprises a first light-emitting part and a second light-emitting part, and the first light-emitting part is configured to be a laser emitting end; the second light-emitting portion is configured as a laser light-emitting end, and a light-emitting port of the second light-emitting portion is arranged opposite to a light-emitting port of the first light-emitting portion. The embodiment of the application has adopted and has all possessed first light-emitting portion and the second light-emitting portion that jets out the laser function, then made the light-emitting mouth of second light-emitting portion and the relative setting of light-emitting mouth of first light-emitting portion, like this, when needs cutting combined material, set up this combined material between the light-emitting mouth of second light-emitting portion and the light-emitting mouth of first light-emitting portion, carry out the cooperation cutting through corresponding regulation control second light-emitting portion and first light-emitting portion, the corresponding position of combined material's relative both sides can be respectively or simultaneously cut, and then when can solving unilateral laser cutting combined material one side, its opposite side is luminous yellow, it is luminous black, the problem of bubble etc., thereby promote the yield.
Description
Technical Field
The present application relates to the field of cutting technologies, and in particular, to a laser cutting apparatus, a laser cutting device, and a laser cutting method.
Background
At present, various products with high precision processing requirements are processed by using laser, such as steel cutting, plastic cutting, leather cutting, glass cutting and the like, and the cutting process of the single material can be finished by adopting mainstream single laser beam cutting.
For the composite material with a multi-layer structure, the materials corresponding to different layers are different, the material properties corresponding to each layer are generally different, and certain heat action can be generated in laser cutting, so that when the traditional unilateral laser cutting technology is adopted for cutting, the heat action can be transmitted to one side opposite to a processing side, and the materials on the opposite side generate adverse conditions such as different colors (such as yellowing and blackening), bubbles and the like, and the product quality is influenced.
Therefore, the yield of the existing laser cutting needs to be improved.
Disclosure of Invention
The embodiment of the application relates to a laser cutting device, equipment and a method, which are used for improving the yield of laser cutting.
The embodiment of the application discloses a laser cutting device, which comprises a first light-emitting part and a second light-emitting part, wherein the first light-emitting part is configured to be a laser emergent end; the second light-emitting portion is configured as a laser light-emitting end, and a light-emitting port of the second light-emitting portion is arranged opposite to a light-emitting port of the first light-emitting portion.
Optionally, the laser cutting device further includes a carrying fixture, and the carrying fixture is disposed between the light outlet of the second light-emitting portion and the light outlet of the first light-emitting portion.
Optionally, the object carrying jig is provided with at least one hollow positioning opening for placing a product to be cut.
Optionally, the laser cutting device further includes a laser emitter and a beam splitter, where the beam splitter includes a light input end, a first light output end, and a second light output end; the laser emitting end of the laser emitter is connected with the light inlet end, the first light outlet part is connected with the first light outlet end, and the second light outlet part is connected with the second light outlet end.
Optionally, the first light emitting portion includes a first light reflecting piece and a first switch, and the first light reflecting piece is respectively in conductive connection with the first switch and the first light emitting end optical path; and the second light reflecting piece is respectively connected with the second switch and the second light-emitting end light path in a conduction mode.
Optionally, the first light-emitting portion further includes a first galvanometer, and the first galvanometer is in conductive connection with the first switch optical path; the second light-emitting part also comprises a second vibrating mirror, and the second vibrating mirror is in conductive connection with the second switch light path; the lens of the first galvanometer is opposite to the lens of the second galvanometer.
Optionally, the first light-emitting portion further includes a first beam expander disposed between the first switch and the first galvanometer, and the second light-emitting portion further includes a second beam expander disposed between the second switch and the second galvanometer; the first beam expanding piece is respectively connected with the first switch and the first galvanometer light path in a conduction mode, and the second beam expanding piece is respectively connected with the second switch and the second galvanometer light path in a conduction mode.
The embodiment of the application also discloses laser cutting equipment, laser cutting equipment include control system and as above arbitrary laser cutting device, control system with laser cutting device connects, the processing parameter has been recorded in the control system, control system is according to processing parameter control laser cutting device corresponds the execution.
The embodiment of the application also discloses a laser cutting method, which is applied to the laser cutting device and the laser cutting equipment, and comprises the following steps:
controlling the first light emitting part to work independently;
controlling the second light emitting part to work independently;
the first light-emitting part and the second light-emitting part are controlled to work simultaneously.
Optionally, the laser cutting method further includes the steps of:
formulating a first parameter which is independently executed by the first light-emitting part;
formulating a second parameter which is independently executed by the second light-emitting part;
a third parameter is formulated for the first light emitting portion and the second light emitting portion to be executed simultaneously. .
Optionally, the first parameter and the second parameter respectively include:
the processing speed is 3000-8000 mm/s;
laser frequency, 500-1000 KHz;
the filling distance of the cutting lines is 0.005-0.02 mm;
laser power, 3-5W.
Optionally, the third parameter includes:
the processing speed is 3000-5000 mm/s;
laser frequency, 500-1000 KHz;
the filling distance of the cutting lines is 0.005-0.02 mm;
laser power, 3-5W.
Optionally, the number of the cutting lines is at least one, and each cutting line is designed in an end-to-end closed manner.
Because this application embodiment has adopted and has all possessed first light-emitting portion and the second light-emitting portion that jets out the laser function, then made the light-emitting mouth of second light-emitting portion and the relative setting of light-emitting mouth of first light-emitting portion, like this, when needs cutting combined material, only need set up this combined material between the light-emitting mouth of second light-emitting portion and the light-emitting mouth of first light-emitting portion, carry out the cooperation cutting through corresponding regulation control second light-emitting portion and first light-emitting portion, the corresponding position of the relative both sides of combined material can be cut respectively or simultaneously, and then when can solving unilateral laser cutting combined material one side, its opposite side produces the problem of bad conditions such as yellow because of laser cutting heat effect, blackened, bubble, thereby the cutting yields has been promoted, and cutting speed and cutting efficiency have still been promoted.
Drawings
The accompanying drawings, which are included to provide a further understanding of the embodiments of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
fig. 1 is a schematic structural diagram of a laser cutting device disclosed in an embodiment of the present application;
fig. 2 is a block diagram of a laser cutting apparatus according to an embodiment of the present disclosure;
FIG. 3 is a schematic illustration of a laser cutting process disclosed in an embodiment of the present application;
FIG. 4 is a schematic flow chart of a parameter preparation disclosed in an embodiment of the present application;
FIG. 5 is a schematic view of a conventional arrangement of cutting lines;
FIG. 6 is a schematic structural view of a cutting line arrangement disclosed in an embodiment of the present application;
FIG. 7 is a cut edge view resulting from a conventional single-sided laser cutting process;
FIG. 8 is a cut edge view of an opposite side laser cutting process as disclosed in an embodiment of the present application;
FIG. 9 is a cut surface view of a conventional single-sided laser cutting process for a transparent multi-layered composite material;
fig. 10 is a cut surface view of a process for laser cutting a transparent multi-layered composite material on the opposite side according to an embodiment of the present disclosure.
10, laser cutting equipment; 11. a laser cutting device; 12. a control system; 13. a first light emitting portion; 14. a second light emitting portion; 15. carrying a fixture; 16. positioning the opening; 17. a laser transmitter; 18. a light splitter; 19. a light input end; 20. a first light-emitting end; 21. a second light-emitting end; 22. a first light reflecting member; 23. a first switch; 24. a second switch; 25. a first galvanometer; 26. a second galvanometer; 27. cutting a line; 28. a first beam expander; 29. a second expansion member; 30. a second reflector.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the embodiments of the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
In addition, terms of orientation or positional relationship indicated by "vertical", "horizontal", and the like, are described based on the orientation or relative positional relationship shown in the drawings, and are only for convenience of simplifying the description of the embodiments of the present application, and do not indicate that the referred device or element must have a specific orientation, be configured and operated in a specific orientation, and thus, should not be construed as limiting the embodiments of the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meanings of the above terms in the embodiments of the present application can be understood by those of ordinary skill in the art according to specific situations.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, the embodiment of the present application discloses a laser cutting device 11, where the laser cutting device 11 includes a first light-emitting portion 13 and a second light-emitting portion 14, and the first light-emitting portion 13 is configured as a laser light-emitting end; the second light emitting portion 14 is configured as a laser light emitting end, and a light emitting port of the second light emitting portion 14 is disposed opposite to a light emitting port of the first light emitting portion 13.
Because the first light-emitting portion 13 and the second light-emitting portion 14 both having the function of emitting laser light are adopted in the embodiment of the application, and then the light-emitting port of the second light-emitting portion 14 and the light-emitting port of the first light-emitting portion 13 are oppositely arranged, when the composite material needs to be cut, only the composite material needs to be arranged between the light-emitting port of the second light-emitting portion 14 and the light-emitting port of the first light-emitting portion 13, and the second light-emitting portion 14 and the first light-emitting portion 13 are controlled to execute the matched cutting through corresponding adjustment, that is, the corresponding positions of the two opposite sides of the composite material can be respectively or simultaneously cut, so that the problem that the opposite sides of the composite material are subjected to yellowing, blackening, bubbles and other bad conditions when the composite material is cut by laser can be solved, and therefore, the cutting yield is improved, and the cutting speed and the cutting efficiency are also improved. Of course, the embodiment of the application can be used for cutting and processing a composite material with a multilayer structure and processing a material with a single-layer structure.
The embodiment of the application discloses laser cutting device 11 still carries thing tool 15, carry thing tool 15 set up in the light-emitting outlet of second light-emitting portion 14 with between the light-emitting outlet of first light-emitting portion 13. The carrying jig 15 for placing the product to be cut is arranged between the light outlet of the second light outlet part 14 and the light outlet of the first light outlet part 13, so that the product can be conveniently cut by the laser emitted by the first light outlet part 13 and the second light outlet part 14.
The object carrying jig 15 is provided with at least one hollow positioning opening 16 for placing a product to be cut. The hollow positioning port 16 can be designed to position a product, prevent the product from being rejected due to movement in the machining process, and can also be suitable for double-sided machining of the first light-emitting part 13 and the second light-emitting part 14 in the embodiment of the application. Of course, the positioning and fixing manner of the positioning opening 16 to the product to be cut in the embodiment of the present application may be by mechanical clamping, or may also be by pneumatic adsorption, or may be in other manners, and is not particularly limited, and all should be considered as belonging to the protection scope of the present application.
The laser cutting device 11 disclosed in the embodiment of the present application further includes a laser emitter 17 and an optical splitter 18, where the optical splitter 18 includes a light entrance end 19, a first light exit end 20, and a second light exit end 21; the laser emitting end of the laser emitter 17 is connected to the light entering end 19, the first light emitting portion 13 is connected to the first light emitting end 20, and the second light emitting portion 14 is connected to the second light emitting end 21. This application embodiment can adopt a laser emitter 17 cooperation beam splitter 18 to accomplish the transmission of multichannel laser, both reduces to take up an area of the space, also saves the cost, satisfies the cutting process demand simultaneously. Of course, in the embodiment of the present application, multiple laser emitters 17 may be adopted to correspondingly emit multiple laser beams, which is not particularly limited, and all of the laser emitters should be considered as belonging to the protection scope of the present application as long as the requirements of corresponding laser beams can be met.
Further, in order to control each laser, the first light-emitting portion 13 disclosed in this embodiment of the present application includes a first light-reflecting member 22 and a first switch 23, where the first light-reflecting member 22 is respectively in optical path conduction connection with the first switch 23 and the first light-emitting end 20; the second light reflecting element 30 is respectively connected to the second switch 24 and the second light emitting end 21 in an optical path conduction manner. Namely, each laser adjusts the light path through the corresponding light reflecting piece, and then controls the on or off of the laser through the corresponding switch, so that each laser is controllable, and the cutting is convenient. The first switch 23 and the second switch 24 in the embodiment of the present application are not limited to the positions corresponding to the first reflecting member 22 and the second reflecting member 30, and the first switch 23 and the second switch 24 may be optical gates or other designs capable of controlling the conduction of the optical path, and the first reflecting member 22 and the second reflecting member 30 may be optical turning mirrors or other designs capable of guiding the optical path, as long as the corresponding effect can be satisfied, and all of them should be regarded as belonging to the protection scope of the present application.
The first light emitting portion 13 disclosed in the embodiment of the present application may further include a first galvanometer 25, and the first galvanometer 25 is in optical path conduction connection with the first switch 23; the second light emitting portion 14 may further include a second galvanometer 26, and the second galvanometer 26 is electrically connected to the second switch 24; the lens of the first galvanometer 25 is arranged opposite to the lens of the second galvanometer 26. The adoption of the galvanometer (also called laser galvanometer) can realize accurate cutting processing control and effectively improve the yield of laser cutting.
The first light emitting portion 13 of the embodiment of the present application may further include a first beam expander 28 disposed between the first switch 23 and the first galvanometer 25, and the second light emitting portion 14 may further include a second beam expander 29 disposed between the second switch 24 and the second galvanometer 26; the first beam expander 28 is respectively connected to the first switch 23 and the first galvanometer 25 in an optical path conduction manner, and the second beam expander 29 is respectively connected to the second switch 24 and the second galvanometer 26 in an optical path conduction manner. The first beam expander 28 and the second beam expander 29 are arranged to facilitate adjustment and control of the laser beam diameter and the laser divergence angle. Of course, the first beam expander 28 and the second beam expander 29 may be beam expanders, or may be other designs meeting the requirements, and are not limited and should be regarded as belonging to the protection scope of the present application.
As shown in fig. 2, an embodiment of the present application further discloses a laser cutting apparatus 10, where the laser cutting apparatus 10 includes a control system 12 and the laser cutting device 11 as described above, the control system 12 is connected to the laser cutting device 11, processing parameters are recorded in the control system 12, and the control system 12 controls the laser cutting device 11 to perform correspondingly according to the processing parameters. The control system 12 in the embodiment of the present application may include a PLC system, and control the relevant controllable components in the laser cutting device 11 by inputting the corresponding control program to automatically complete the laser cutting work. Of course, the laser cutting apparatus 10 according to the embodiment of the present application may further include a mechanical arm and other related machines to complete the loading and unloading operation.
As shown in fig. 3, the embodiment of the present application further discloses a laser cutting method, which is applied to the laser cutting device and the laser cutting apparatus, and includes the steps of:
s1, controlling the first light emitting part to work independently;
s2, controlling the second light emitting part to work independently; and
and S3, controlling the first light emitting part and the second light emitting part to work simultaneously.
In the embodiment of the application, when the composite material with a multilayer structure is required to be cut by laser, one side of the composite material is firstly cut by one end depth independently, the opposite side of the composite material is then cut by the opposite side of the composite material independently, and finally the two sides of the composite material are cut synchronously, of course, the cutting positions are communicated along a straight line, so that after the composite material is cut independently for the first time, the opposite side of the composite material can slightly change color due to heat conduction, the slightly color-changed area can be cut off by the independent cutting for the second time, then the opposite sides of the composite material are continuously and simultaneously cut by the laser for the third time until the composite material is opened, the occurrence of bad conditions such as yellowing, blackening and air bubbles can be effectively prevented, the problem that the composite material cannot be cut through during the unidirectional cutting can be solved by the bidirectional cutting, and the cutting efficiency and the yield are increased.
In this embodiment, the sequential execution of the steps S1 and S2 is not limited, but the step S3 should be executed after the steps S1 and S2, because if bidirectional simultaneous cutting is adopted for starting cutting, the generated higher temperature may cause serious adverse conditions inside the composite material, resulting in unrepairable material.
As shown in fig. 4, each laser is executed by the automatic emission controlled by the control system, so the laser cutting method disclosed in the embodiment of the present application further includes the steps of:
s4, formulating a first parameter executed by the first light emitting part;
s5, formulating a second parameter to be executed by the second light emitting portion alone;
and S6, establishing a third parameter which is executed by the first light emitting part and the second light emitting part at the same time.
Since the action is performed after the parameter formulation, the step S4 in the embodiment of the present application is performed before the step S1, the step S5 is performed before the step S2, and the step S6 is performed before the step S3, however, if all the parameter formulations are formulated before the first cut, the execution sequence of the steps S4, S5, and S6 is not limited.
Specifically, the first parameter, the second parameter, and the third parameter disclosed in the embodiment of the present application respectively include a processing speed, a laser frequency, a cut line filling pitch, and a laser power.
The processing speed of the first parameter and the second parameter is set within the range of 3000-8000 mm/s, the laser frequency is set within the range of 500-1000 KHz, the filling distance L of the cutting lines is set within the range of 0.005-0.02 mm, and the laser power is set within the range of 3-5W.
And the processing speed of the third parameter is set within the range of 3000-5000 mm/s, the laser frequency is set within the range of 500-1000 KHz, the filling interval L of the cutting lines is set within the range of 0.005-0.02 mm, and the laser power is set within the range of 3-5W.
Since the influence of the temperature generated by the laser is large in the steps S1 and S2, the processing speed range is large to facilitate the adjustment of the heat dissipation speed, and the processing speed range is small in the step S3. The specific implementation parameters vary with the material and the corresponding thickness, and are not specifically referred to herein, and should be considered to fall within the scope of the present application.
As shown in fig. 5 and fig. 6, at least one cutting line 27 is provided in the cutting line filling space, each cutting line 27 is designed to be closed end to end, the number of the cutting lines 27 disclosed in this embodiment is greater than or equal to two, and the space between two adjacent cutting lines 27 is the cutting line 27 filling space. The conventional cutting line 27 is designed as a line segment as shown in fig. 5, so that when the product is cut, the edge opening of the product is dense and the edge is easily broken. Therefore, the cutting line 27 used in the embodiment of the present application is designed as shown in fig. 6, and the filling pitch L is set in the range of 0.005 to 0.02mm, so that the chipping phenomenon in cutting can be prevented.
Fig. 7 shows a cut edge pattern obtained by using a conventional single-sided laser cutting process.
Fig. 8 is a diagram of a cut edge obtained by the contralateral laser cutting process disclosed in the embodiments of the present application.
As can be clearly seen in the dotted line frame comparing fig. 7 and fig. 8, the cutting edge obtained by the conventional single-sided laser cutting process has a significant and large color variation range. The cutting edge obtained by the opposite-side laser cutting process disclosed by the embodiment of the application basically has no heterochrosis, the process progress is obvious, and the yield is greatly improved.
More specifically, the laser cutting technology disclosed in the embodiments of the present application can also be used for cutting a composite material with a transparent multi-layer structure, as shown in fig. 9, which is a cut surface diagram obtained by using a conventional process for cutting a transparent multi-layer composite material with a single-sided laser.
Fig. 10 is a cut surface diagram obtained by the process of laser cutting a transparent multi-layer composite material on the opposite side according to the embodiment of the present application.
The extinction characteristic of each layer material in transparent multi-level structure's combined material is general different, and each material layer thermal sensitivity is strong, the inside bottom of the combined material and the back of transparent multi-level structure after traditional single laser beam processing can't effectively avoid cutting blacken, the yellow problem, use even this multilayer material of the unable complete cut-through of accomplishing of lower power, can clearly see out in the dotted line frame through contrast figure 9 and figure 10, there are blackening and the dust that the firing leads to in the transparent multi-level combined material cutting plane that adopts traditional unilateral laser cutting technology to obtain, the level is fuzzy. The transparent multi-layer composite material obtained by the opposite-side laser cutting process disclosed by the embodiment of the application has smooth cut surface, distinct material layers and obvious process progress, and the cutting quality is greatly improved.
Fig. 7 and 8 correspondingly use the same laser emitter 17, and fig. 9 and 10 also correspondingly use the same laser emitter 17, wherein both picosecond lasers, specifically, ultraviolet picosecond lasers, are used, so that high-precision cutting can be realized, and no heat or low heat is generated, thereby weakening the influence of heat on cutting. The embodiment of the application combines the picosecond laser and the laser cutting technology, can realize accurate, rapid and high-quality cutting, and solves the problem that the unprocessed part of the material caused by the traditional single-side laser cutting technology generates bad conditions such as different colors (such as yellowing and blackening) and bubbles.
Of course, the laser emitter 17 in the embodiment of the present application may also use other types of lasers, and then the cutting technique described above may be combined to improve the cutting quality.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be considered as belonging to the protection scope of the present application.
Claims (13)
1. A laser cutting device, characterized in that the laser cutting device comprises:
a first light emitting section configured as a laser light emitting end; and
and a second light emitting portion configured as a laser light emitting end, wherein a light emitting port of the second light emitting portion is disposed opposite to a light emitting port of the first light emitting portion.
2. The laser cutting device according to claim 1, further comprising a loading jig disposed between the light outlet of the second light outlet portion and the light outlet of the first light outlet portion.
3. The laser cutting device according to claim 2, wherein the carrying fixture is provided with at least one hollow positioning opening for placing a product to be cut.
4. The laser cutting device of claim 1, wherein the laser cutting device further comprises a laser emitter and an optical splitter, the optical splitter comprising an input end, a first output end, and a second output end;
the laser emitting end of the laser emitter is connected with the light inlet end, the first light outlet part is connected with the first light outlet end, and the second light outlet part is connected with the second light outlet end.
5. The laser cutting device according to claim 4, wherein the first light-emitting portion includes a first light-reflecting member and a first switch, and the first light-reflecting member is respectively connected to the first switch and the first light-emitting end optical path in a conducting manner;
the second light reflecting piece is respectively connected with the second switch and the second light-emitting end light path in a conduction mode.
6. The laser cutting apparatus according to claim 5, wherein the first light emergent portion further comprises a first galvanometer, and the first galvanometer is in conductive connection with the first switch optical path;
the second light-emitting part also comprises a second vibrating mirror, and the second vibrating mirror is in conductive connection with the second switch light path;
the lens of the first galvanometer is opposite to the lens of the second galvanometer.
7. The laser cutting apparatus according to claim 6, wherein the first light exiting portion further includes a first beam expander disposed between the first switch and the first galvanometer, and the second light exiting portion further includes a second beam expander disposed between the second switch and the second galvanometer;
the first beam expanding piece is respectively connected with the first switch and the first galvanometer light path in a conduction mode, and the second beam expanding piece is respectively connected with the second switch and the second galvanometer light path in a conduction mode.
8. A laser cutting device, characterized in that, the laser cutting device of claim 1-7, the laser cutting device of characterized in that, the laser cutting device of control system including, the control system is connected with the laser cutting device, the processing parameter has been recorded in the control system, the control system is according to processing parameter control the corresponding execution of laser cutting device.
9. A laser cutting method, characterized in that the laser cutting method is applied to the laser cutting device of claims 1-7 and the laser cutting apparatus of claim 8, comprising the steps of:
controlling the first light emitting part to work independently;
controlling the second light emitting part to work independently;
the first light-emitting part and the second light-emitting part are controlled to work simultaneously.
10. The laser cutting method of claim 9, further comprising the steps of:
formulating a first parameter to be executed by the first light-emitting part alone;
formulating a second parameter which is independently executed by the second light-emitting part;
and formulating a third parameter which is simultaneously executed by the first light-emitting part and the second light-emitting part.
11. The laser cutting method of claim 10, wherein the first parameter and the second parameter each comprise:
the processing speed is 3000-8000 mm/s;
laser frequency, 500-1000 KHz;
the filling distance of cutting lines is 0.005-0.02 mm;
laser power, 3-5W.
12. The laser cutting method of claim 10, wherein the third parameter comprises:
the processing speed is 3000-5000 mm/s;
laser frequency, 500-1000 KHz;
the filling distance of the cutting lines is 0.005-0.02 mm;
laser power, 3-5W.
13. Laser cutting method according to claim 11 and/or 12, characterised in that the cutting line is at least one, each cutting line being of closed end-to-end design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210455655.2A CN114700637B (en) | 2022-04-28 | 2022-04-28 | Laser cutting device, equipment and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210455655.2A CN114700637B (en) | 2022-04-28 | 2022-04-28 | Laser cutting device, equipment and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114700637A true CN114700637A (en) | 2022-07-05 |
| CN114700637B CN114700637B (en) | 2024-03-12 |
Family
ID=82176532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210455655.2A Active CN114700637B (en) | 2022-04-28 | 2022-04-28 | Laser cutting device, equipment and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114700637B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| RU2634338C1 (en) * | 2016-05-23 | 2017-10-25 | Лев Семенович Гликин | Method and device for laser cutting of materials |
| WO2019119853A1 (en) * | 2017-12-20 | 2019-06-27 | 广东工业大学 | Laser impact forging and laser cutting combined additive manufacturing device and method |
| WO2020239133A1 (en) * | 2019-05-31 | 2020-12-03 | 大族激光科技产业集团股份有限公司 | Laser cutting device and laser cutting method |
-
2022
- 2022-04-28 CN CN202210455655.2A patent/CN114700637B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008887A (en) * | 2012-06-29 | 2013-04-03 | 苏州德龙激光有限公司 | Method and device for cutting machined target from two surfaces by using ultra-short pulse laser |
| CN104014936A (en) * | 2013-02-28 | 2014-09-03 | 深圳市大族激光科技股份有限公司 | Laser processing method and laser cutting systems of high molecular workpieces |
| RU2634338C1 (en) * | 2016-05-23 | 2017-10-25 | Лев Семенович Гликин | Method and device for laser cutting of materials |
| WO2019119853A1 (en) * | 2017-12-20 | 2019-06-27 | 广东工业大学 | Laser impact forging and laser cutting combined additive manufacturing device and method |
| WO2020239133A1 (en) * | 2019-05-31 | 2020-12-03 | 大族激光科技产业集团股份有限公司 | Laser cutting device and laser cutting method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114700637B (en) | 2024-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9346130B2 (en) | Method for laser processing glass with a chamfered edge | |
| EP1500484B1 (en) | Method and system for machining fragile material | |
| KR100864863B1 (en) | Multi laser system | |
| KR102176313B1 (en) | Laser system and method for processing sapphire | |
| US20110132885A1 (en) | Laser machining and scribing systems and methods | |
| US20090045179A1 (en) | Method and system for cutting solid materials using short pulsed laser | |
| JP2004528991A (en) | Partial processing by laser | |
| US6818858B2 (en) | Laser processing unit and processing apparatus comprising laser processing unit | |
| CN109434307A (en) | A kind of laser cutting method and laser cutting device of flexible screen | |
| KR20120004426A (en) | Improved method and apparatus for laser machining | |
| KR20170096812A (en) | Multi-functional laser processing apparatus and laser processing method using the laser processing apparatus | |
| US20050150254A1 (en) | Method and device for processing fragile material | |
| JP5994168B2 (en) | X, Y independent drive type laser processing equipment | |
| CN109604838A (en) | Semiconductor laser processing unit (plant) | |
| CN114700637A (en) | Laser cutting device, equipment and method | |
| CN110605483A (en) | Laser cutting device of LED wafer | |
| KR101794279B1 (en) | Three dimension structure printing apparatus having linear nozzle possible to line scane printing and method of the same | |
| US20190255649A1 (en) | Laser beam machining method and laser beam machine | |
| KR101766352B1 (en) | Multi-wavelength selective laser cutting system for flexible device | |
| Mendes et al. | Laser machining with QCW fiber lasers | |
| US20220410319A1 (en) | Laser processing method and laser processing device | |
| JP2020121921A (en) | Laser beam machining apparatus for brittle material substrate | |
| US20240109152A1 (en) | Combined dual-wavelength laser light processing device | |
| CN110860799A (en) | Laser cutting method and laser cutting system | |
| KR20210133196A (en) | Multi-laser cutting method and system thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |