CN102998003A - 红外线检测元件、其制造方法及电子设备 - Google Patents

红外线检测元件、其制造方法及电子设备 Download PDF

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Publication number
CN102998003A
CN102998003A CN2012103243665A CN201210324366A CN102998003A CN 102998003 A CN102998003 A CN 102998003A CN 2012103243665 A CN2012103243665 A CN 2012103243665A CN 201210324366 A CN201210324366 A CN 201210324366A CN 102998003 A CN102998003 A CN 102998003A
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CN
China
Prior art keywords
infrared
detecting element
film
support portion
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012103243665A
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English (en)
Chinese (zh)
Inventor
宫下一幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
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Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN102998003A publication Critical patent/CN102998003A/zh
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/04—Casings
    • G01J5/048—Protective parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/34—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using capacitors, e.g. pyroelectric capacitors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0022—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiation of moving bodies
    • G01J5/0025—Living bodies
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
    • G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Radiation Pyrometers (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Studio Devices (AREA)
CN2012103243665A 2011-09-07 2012-09-04 红外线检测元件、其制造方法及电子设备 Pending CN102998003A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011194658A JP2013057526A (ja) 2011-09-07 2011-09-07 赤外線検出素子、赤外線検出素子の製造方法及び電子機器
JP2011-194658 2011-09-07

Publications (1)

Publication Number Publication Date
CN102998003A true CN102998003A (zh) 2013-03-27

Family

ID=47752381

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012103243665A Pending CN102998003A (zh) 2011-09-07 2012-09-04 红外线检测元件、其制造方法及电子设备

Country Status (3)

Country Link
US (2) US8957375B2 (enExample)
JP (1) JP2013057526A (enExample)
CN (1) CN102998003A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258806A (zh) * 2015-11-02 2016-01-20 电子科技大学 热释电红外探测单元及制造方法及其热释电红外探测器

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US20140198195A1 (en) * 2013-01-17 2014-07-17 Electronics And Telecommunications Research Institute Terahertz health checker
US10057508B2 (en) * 2013-06-20 2018-08-21 Excelitas Technologies Corp. Illumination device with integrated thermal imaging sensor
KR20180069147A (ko) * 2016-12-14 2018-06-25 만도헬라일렉트로닉스(주) 차량의 보행자 경고장치
US10984640B2 (en) * 2017-04-20 2021-04-20 Amazon Technologies, Inc. Automatic adjusting of day-night sensitivity for motion detection in audio/video recording and communication devices
US10199424B1 (en) * 2017-07-19 2019-02-05 Meridian Innovation Pte Ltd Thermoelectric-based infrared detector having a cavity and a MEMS structure defined by BEOL metals lines
JP7260736B2 (ja) * 2018-11-08 2023-04-19 富士通株式会社 光検出素子、光センサ、及び光検出素子の製造方法

Citations (5)

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CN1484611A (zh) * 2001-03-29 2004-03-24 ��ʽ���������о��� 硅系列构造体的制造装置与制造方法
CN1755433A (zh) * 2004-09-27 2006-04-05 Idc公司 提供具有抗粘着涂层的mems装置的系统和方法
US20090207879A1 (en) * 2008-02-14 2009-08-20 Seiji Kurashina Infrared sensor and manufacturing method thereof
JP2010127657A (ja) * 2008-11-25 2010-06-10 Panasonic Electric Works Co Ltd 赤外線センサおよびその製造方法
US20110182320A1 (en) * 2010-01-26 2011-07-28 Seiko Epson Corporation Thermal detector, thermal detector device, electronic instrument, and method of manufacturing thermal detector

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JP2002174721A (ja) 2000-12-06 2002-06-21 Yokogawa Electric Corp ファブリペローフィルタ
US6590710B2 (en) 2000-02-18 2003-07-08 Yokogawa Electric Corporation Fabry-Perot filter, wavelength-selective infrared detector and infrared gas analyzer using the filter and detector
JP3409848B2 (ja) * 2000-08-29 2003-05-26 日本電気株式会社 熱型赤外線検出器
JP3435643B2 (ja) * 2001-03-29 2003-08-11 株式会社豊田中央研究所 シリコン系構造体の製造装置と製造方法
US20040232503A1 (en) * 2001-06-12 2004-11-25 Shinya Sato Semiconductor device and method of producing the same
FR2826725B1 (fr) * 2001-06-28 2004-02-27 Commissariat Energie Atomique Microbolometres resistants aux temperatures de scenes elevees.
JP3862080B2 (ja) * 2002-11-01 2006-12-27 防衛庁技術研究本部長 熱型赤外線検出器の製造方法
US7692839B2 (en) * 2004-09-27 2010-04-06 Qualcomm Mems Technologies, Inc. System and method of providing MEMS device with anti-stiction coating
JP5109169B2 (ja) 2007-03-27 2012-12-26 日本電気株式会社 ボロメータ型ＴＨｚ波検出器
JP2011027780A (ja) 2009-07-21 2011-02-10 Denso Corp ファブリペロー干渉計及びその製造方法
JP5750827B2 (ja) * 2010-01-26 2015-07-22 セイコーエプソン株式会社 熱型光検出器の製造方法
JP5771900B2 (ja) 2010-03-26 2015-09-02 セイコーエプソン株式会社 熱型光検出器、熱型光検出装置及び電子機器
JP5964543B2 (ja) * 2010-06-15 2016-08-03 日本電気株式会社 ボロメータ型テラヘルツ波検出器
CN102564601A (zh) * 2010-12-22 2012-07-11 精工爱普生株式会社 热式光检测装置、电子设备、热式光检测器及其制造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1484611A (zh) * 2001-03-29 2004-03-24 ��ʽ���������о��� 硅系列构造体的制造装置与制造方法
CN1755433A (zh) * 2004-09-27 2006-04-05 Idc公司 提供具有抗粘着涂层的mems装置的系统和方法
US20090207879A1 (en) * 2008-02-14 2009-08-20 Seiji Kurashina Infrared sensor and manufacturing method thereof
JP2010127657A (ja) * 2008-11-25 2010-06-10 Panasonic Electric Works Co Ltd 赤外線センサおよびその製造方法
US20110182320A1 (en) * 2010-01-26 2011-07-28 Seiko Epson Corporation Thermal detector, thermal detector device, electronic instrument, and method of manufacturing thermal detector

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105258806A (zh) * 2015-11-02 2016-01-20 电子科技大学 热释电红外探测单元及制造方法及其热释电红外探测器

Also Published As

Publication number Publication date
US8957375B2 (en) 2015-02-17
US20150136983A1 (en) 2015-05-21
JP2013057526A (ja) 2013-03-28
US9255845B2 (en) 2016-02-09
US20130056637A1 (en) 2013-03-07

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Application publication date: 20130327