CN102994027A - Phenolic resin adhesive - Google Patents
Phenolic resin adhesive Download PDFInfo
- Publication number
- CN102994027A CN102994027A CN2012104269751A CN201210426975A CN102994027A CN 102994027 A CN102994027 A CN 102994027A CN 2012104269751 A CN2012104269751 A CN 2012104269751A CN 201210426975 A CN201210426975 A CN 201210426975A CN 102994027 A CN102994027 A CN 102994027A
- Authority
- CN
- China
- Prior art keywords
- parts
- phenolic resin
- resin adhesive
- adhesive
- modified nano
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a phenolic resin adhesive which is characterized by comprising the following raw materials in parts by weight: 95-100 parts of phenolic resin, 18-20 parts of polysiloxane, 2-3 parts of anti-aging agent TCY, 8-10 parts of tricresyl phosphate, 60-70 parts of ethanol, 15-25 parts of acetone, 8-10 parts of asbestos powder, 1-1.8 parts of silane coupling agent KH-550 and 3-5 parts of modified nanometer magnesia. As nano-zinc oxide is added into the phenolic resin adhesive, the produced adhesive has excellent flowability and storage stability, the production cost of the phenolic resins adhesive is reduced, the overall quality and efficacy of the adhesive are improved, and a plywood formed by compressing the adhesive has stronger bonding performance.
Description
Technical field
The present invention relates generally to a kind of sizing agent, relates in particular to a kind of phenolic resin adhesive.
Background technology
Resol is to be formed by phenols and aldehyde condensation polymer, this sizing agent has the performances such as good heat-resisting, media-resistant, but the cured glue layer is crisp, the cure under pressure of need to heating, other polymer chemistry things commonly used improve performance, can broadened application, the phenolic resin adhesive of last modification is mainly used in bonding timber, bubble is washed one's hair plastics and other porous materials, also can be in order to make glued board.
Summary of the invention
The object of the invention just provides a kind of phenolic resin adhesive.
The present invention is achieved by the following technical solutions:
A kind of phenolic resin adhesive, it is comprised of the raw material of following weight parts:
Resol 95-100, organopolysiloxane 18-20, anti-aging agent TCY2-3, tritolyl phosphate 8-10, ethanol 60-70, acetone 15-25, asbestos powder 8-10, silane resin acceptor kh-550 1-1.8, modified Nano magnesium oxide 3-5;
The magnesian preparation method of described modified Nano is:
With the nano magnesia ultra-sonic dispersion in the dehydrated alcohol of 5-10 times of its quality, obtain dispersion liquid, then the dicumyl peroxide with its quality 3-5% adds in the above-mentioned dispersion liquid, back flow reaction is 1~2 hour under 80~90 ℃ of temperature, obtain the nano magnesia-alcohol suspension with the modification of reactive group after the reaction, then filter, centrifugation filtrate obtains modified Nano magnesium oxide.
A kind of preparation method of phenolic resin adhesive may further comprise the steps:
Resol, organopolysiloxane, anti-aging agent TCY, tritolyl phosphate, ethanol, acetone, asbestos powder, silane resin acceptor kh-550, the modified Nano magnesium oxide of above-mentioned weight part are mixed in the adding reactor, at 70-80 ℃ of insulation reaction 1-1.5 hour, be cooled to normal temperature, stir and namely get described phenolic resin adhesive.
Advantage of the present invention is:
The present invention is by adding modified nano zinc oxide so that the sizing agent of producing has good flowability and stability in storage, the sizing agent that the method is produced has reduced the production cost of resol class sizing agent, improve overall qualities and the effect of sizing agent, had stronger glue performance with the glued board of this sizing agent compression moulding.
Embodiment
Embodiment 1
A kind of phenolic resin adhesive, it is comprised of the raw material of following weight parts:
Resol 100, organopolysiloxane 20, anti-aging agent TCY3, tritolyl phosphate 10, ethanol 70, acetone 25, asbestos powder 10, silane resin acceptor kh-550 1.8, modified Nano magnesium oxide 5;
The magnesian preparation method of described modified Nano is:
With the nano magnesia ultra-sonic dispersion in the dehydrated alcohol of 10 times of its quality, obtain dispersion liquid, then the dicumyl peroxide with its quality 5% adds in the above-mentioned dispersion liquid, back flow reaction is 2 hours under 90 ℃ of temperature, obtain the nano magnesia-alcohol suspension with the modification of reactive group after the reaction, then filter, centrifugation filtrate obtains modified Nano magnesium oxide.
A kind of preparation method of phenolic resin adhesive may further comprise the steps:
Resol, organopolysiloxane, anti-aging agent TCY, tritolyl phosphate, ethanol, acetone, asbestos powder, silane resin acceptor kh-550, the modified Nano magnesium oxide of above-mentioned weight part are mixed in the adding reactor, 80 ℃ of insulation reaction 1.5 hours, be cooled to normal temperature, stir and namely get described phenolic resin adhesive.
Performance test:
Phenolic resin adhesive of the present invention is diluted with water to applying glue and the compacting test that 27wt% carries out the bamboo offset plate, and at 130-140 ℃, 20MPa is pressed into glued board under the condition of 1-1.5min/mm, and the technical indicator of sizing agent and the performance of glued board are:
The solid content of phenolic resin adhesive of the present invention is 51%, free phenol is 0.083%, viscosity/(25 ℃, be coated with-4 glasss, s) MOR for 28-35, glued board is 126MPa, Young's modulus is 9798 MPa.
Claims (2)
1. phenolic resin adhesive is characterized in that it is comprised of the raw material of following weight parts:
Resol 95-100, organopolysiloxane 18-20, anti-aging agent TCY2-3, tritolyl phosphate 8-10, ethanol 60-70, acetone 15-25, asbestos powder 8-10, silane resin acceptor kh-550 1-1.8, modified Nano magnesium oxide 3-5;
The magnesian preparation method of described modified Nano is:
With the nano magnesia ultra-sonic dispersion in the dehydrated alcohol of 5-10 times of its quality, obtain dispersion liquid, then the dicumyl peroxide with its quality 3-5% adds in the above-mentioned dispersion liquid, back flow reaction is 1~2 hour under 80~90 ℃ of temperature, obtain the nano magnesia-alcohol suspension with the modification of reactive group after the reaction, then filter, centrifugation filtrate obtains modified Nano magnesium oxide.
2. the preparation method of a phenolic resin adhesive as claimed in claim 1 is characterized in that may further comprise the steps:
Resol, organopolysiloxane, anti-aging agent TCY, tritolyl phosphate, ethanol, acetone, asbestos powder, silane resin acceptor kh-550, the modified Nano magnesium oxide of above-mentioned weight part are mixed in the adding reactor, at 70-80 ℃ of insulation reaction 1-1.5 hour, be cooled to normal temperature, stir and namely get described phenolic resin adhesive.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210426975.1A CN102994027B (en) | 2012-10-31 | 2012-10-31 | Phenolic resin adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201210426975.1A CN102994027B (en) | 2012-10-31 | 2012-10-31 | Phenolic resin adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102994027A true CN102994027A (en) | 2013-03-27 |
CN102994027B CN102994027B (en) | 2014-05-21 |
Family
ID=47923150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201210426975.1A Expired - Fee Related CN102994027B (en) | 2012-10-31 | 2012-10-31 | Phenolic resin adhesive |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN102994027B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104559870A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Modified phenolic resin adhesive for chemical resistant laminate |
CN104559864A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Heat-resistance phenolic resin adhesive for chemical resistant laminate |
CN104559869A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | High-toughness thermal-resistance adhesive for chemical resistant laminate |
CN104559865A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Phenolic resin adhesive for chemical resistant laminate |
CN106590486A (en) * | 2016-12-17 | 2017-04-26 | 浦北县建业胶合板有限责任公司 | Phenolic resin adhesive and preparation method thereof |
CN106833459A (en) * | 2016-12-20 | 2017-06-13 | 吴中区穹窿山福顺生物技术研究所 | A kind of Environmental-friendantistatic antistatic phenolic resin adhesive |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101368076A (en) * | 2008-10-01 | 2009-02-18 | 瑞阳汽车零部件(仙桃)有限公司 | High-efficiency adhesion agent for automobile brake flat and preparation method thereof |
CN101875830A (en) * | 2009-11-23 | 2010-11-03 | 黑龙江省科学院石油化学研究院 | Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
JP2011026502A (en) * | 2009-07-28 | 2011-02-10 | Yokohama Rubber Co Ltd:The | Water-based adhesive composition |
CN102627927A (en) * | 2012-03-26 | 2012-08-08 | 黑龙江省科学院石油化学研究院 | Medium temperature curing high temperature resistant phenolic adhesive |
-
2012
- 2012-10-31 CN CN201210426975.1A patent/CN102994027B/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101368076A (en) * | 2008-10-01 | 2009-02-18 | 瑞阳汽车零部件(仙桃)有限公司 | High-efficiency adhesion agent for automobile brake flat and preparation method thereof |
JP2011026502A (en) * | 2009-07-28 | 2011-02-10 | Yokohama Rubber Co Ltd:The | Water-based adhesive composition |
CN101875830A (en) * | 2009-11-23 | 2010-11-03 | 黑龙江省科学院石油化学研究院 | Phenolic resin/phosphate hybrid adhesive and preparation method thereof |
CN102627927A (en) * | 2012-03-26 | 2012-08-08 | 黑龙江省科学院石油化学研究院 | Medium temperature curing high temperature resistant phenolic adhesive |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104559870A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Modified phenolic resin adhesive for chemical resistant laminate |
CN104559864A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Heat-resistance phenolic resin adhesive for chemical resistant laminate |
CN104559869A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | High-toughness thermal-resistance adhesive for chemical resistant laminate |
CN104559865A (en) * | 2015-02-10 | 2015-04-29 | 安徽希玛欧美佳装饰材料工业有限公司 | Phenolic resin adhesive for chemical resistant laminate |
CN106590486A (en) * | 2016-12-17 | 2017-04-26 | 浦北县建业胶合板有限责任公司 | Phenolic resin adhesive and preparation method thereof |
CN106833459A (en) * | 2016-12-20 | 2017-06-13 | 吴中区穹窿山福顺生物技术研究所 | A kind of Environmental-friendantistatic antistatic phenolic resin adhesive |
Also Published As
Publication number | Publication date |
---|---|
CN102994027B (en) | 2014-05-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102994027B (en) | Phenolic resin adhesive | |
Xu et al. | Research status, industrial application demand and prospects of phenolic resin | |
CN101260283B (en) | Method for preparing phenolic aldehyde adhesive based on lignin phenolized liquid and application thereof | |
CN104245799A (en) | Method for increasing the reactivity of lignin | |
CN103601865B (en) | Starch modified phenolic resin and application thereof | |
EP2642150B1 (en) | Friction material | |
CN104837897A (en) | Use of low molecular weight lignin together with lignin for production of phenol-formaldehyde binder composition | |
Pang et al. | Eco-friendly phenol–urea–formaldehyde co-condensed resin adhesives accelerated by resorcinol for plywood manufacturing | |
JP6846887B2 (en) | Method for producing thermosetting resin composition, friction material and thermosetting resin composition | |
JP2023024831A (en) | Modified lignin manufacturing method, modified lignin, and modified lignin-containing resin composition material | |
CN101676311A (en) | Method for preparing modified phenolic resin by adopting cardanol | |
CN106188444A (en) | A kind of functional graphene oxide/phenolic resin and preparation method thereof | |
CN104086947B (en) | For the phenolaldehyde moulding compound of commutator | |
CN103788320A (en) | Method for synthesizing thermoplastic cashew nut phenolic resin | |
Qiao et al. | Preparation and characterization of a Phenol-formaldehyde resin Adhesive obtained From Bio-ethanol Production residue | |
CN104762042A (en) | Modified urea resin adhesive and preparation method thereof | |
CN100549089C (en) | Phenolic resin for humectant refractory material and synthetic method thereof | |
CN105237948A (en) | Moisture-proof phenolic molding plastic | |
CN105315936A (en) | Preparing method for phenolic resin adhesive for wood | |
EP3360926B1 (en) | Thermosetting resin composition for friction material, friction material and method for producing thermosetting resin composition for friction material | |
TR201810422T4 (en) | High-performance aminoplasne resin for lignocellulosic materials. | |
CN104877609A (en) | Phenol-formaldehyde resin adhesive | |
CN106590486A (en) | Phenolic resin adhesive and preparation method thereof | |
CN103951806A (en) | Low molecular weight phenolic resin impregnation liquid for manufacturing sticky membrane paper and preparation method of low molecular weight phenolic resin impregnation liquid | |
CN103509164A (en) | Lignin base reinforcing resin and preparation method thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140521 Termination date: 20141031 |
|
EXPY | Termination of patent right or utility model |