CN104559870A - Modified phenolic resin adhesive for chemical resistant laminate - Google Patents

Modified phenolic resin adhesive for chemical resistant laminate Download PDF

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Publication number
CN104559870A
CN104559870A CN201510070642.3A CN201510070642A CN104559870A CN 104559870 A CN104559870 A CN 104559870A CN 201510070642 A CN201510070642 A CN 201510070642A CN 104559870 A CN104559870 A CN 104559870A
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CN
China
Prior art keywords
modified phenolic
parts
phenolic resin
resin adhesive
physics
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Pending
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CN201510070642.3A
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Chinese (zh)
Inventor
徐学武
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ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL INDUSTRY Co Ltd
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ANHUI XIMA OUMEIJIA DECORATIVE MATERIAL INDUSTRY Co Ltd
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Priority to CN201510070642.3A priority Critical patent/CN104559870A/en
Publication of CN104559870A publication Critical patent/CN104559870A/en
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  • Phenolic Resins Or Amino Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

The invention discloses a modified phenolic resin adhesive for a chemical resistant laminate. The adhesive is prepared from the following raw materials in parts by weight: 40-60 parts of modified phenolic resin, 1.5-2 parts of carboxylic butadiene-styrene latex, 1-1.5 parts of silicon resin methyl branched chain silicone oil, 0.6-0.9 part of surfactant, 0.5-1 part of dipentaerythritol, 1.5-2 parts of polyborosiloxane, 1-2.5 parts of nano-magnesium oxide, 10-15 parts of poplar bark powder, 4-8 parts of natural sodium bentonite and 2-6 parts of anti-aging agent TCY. The modified phenolic resin adhesive has the advantages of low cost, good mechanical performance, good heat resistance, excellent adhering performance and good toughness.

Description

A kind of physics and chemistry plate modified phenolic resin adhesive
Technical field
The present invention relates to physics and chemistry plate technique field, particularly relate to a kind of physics and chemistry plate modified phenolic resin adhesive.
Background technology
Resol is due to unique properties, be widely used and obtain and develop rapidly, in the preparation process of physics and chemistry plate, normal employing resol is as sizing agent production weathering resistance physics and chemistry plate, there is stress equilibrium, Joint strength is high, the advantages such as water-tolerant, closely piling up of the rigidity aromatic ring connected due to the molecular structure methylene of resol, resol body is become fragile, phenolic hydroxyl group on resol and methylene radical are easily oxidized, thermotolerance and scale resistance bad, the physics and chemistry slab warping of large format multilayered structure is easily caused to be out of shape or drum big gun comes unglued the generation of defect, how to prepare a kind of cost low, mechanical property and resistance toheat good, glue performance is excellent, the physics and chemistry plate sizing agent of good toughness becomes the current technical issues that need to address.
Summary of the invention
The present invention proposes physics and chemistry plate modified phenolic resin adhesive, cost is low, mechanical property and resistance toheat good, glue performance is excellent, good toughness.
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, cashew nut oil is sent in distiller and carry out underpressure distillation and obtain the prefabricated material that viscosity is 60-64mPas (25 DEG C); Phenol, prefabricated material, formaldehyde, catalyzer and auxiliary agent are put into reaction flask, adds hydrochloric acid soln adjust ph to 1.4-1.8, be warming up to 100 DEG C, insulation 1.5-2h, decompression dehydration, obtains modified phenolic resins.
Preferably, in the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1000-1200Pa, obtains the prefabricated material that viscosity is 60-64mPas (25 DEG C); Take 100 parts of phenol, the prefabricated material of 20-40 part, 15-20 part formaldehyde, 1-2 part catalyzer and 1-1.5 part auxiliary agent by weight and put into reaction flask, add hydrochloric acid soln adjust ph to 1.4-1.8,100 DEG C are warmed up to the speed of 1-3 DEG C/min, insulation 1.5-2h, decompression dehydration, obtains modified phenolic resins.
Preferably, the weight ratio of modified phenolic resins, carboxylic styrene butadiene latex and silicone resin metlyl branching silicone oil is 50-55:1.6-1.8:1.2-1.4.
Preferably, the weight ratio of modified phenolic resins and nano magnesia is 50-55:2-2.4.
Preferably, the weight ratio of poplar bark powder and natural sodium bentonite is 12-14:5-6.
Preferably, its raw material comprises by weight:
Preferably, its raw material comprises by weight:
Preferably, in the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1100Pa, obtains the prefabricated material that viscosity is 62mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 32 parts of prefabricated material, 17 parts of formaldehyde, 1.4 parts of catalyzer and 1.3 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.5, be warmed up to 100 DEG C with the speed of 2 DEG C/min, insulation 1.8h, decompression dehydration, obtains modified phenolic resins.
The preparation technology of above-mentioned physics and chemistry plate modified phenolic resin adhesive is: the modified phenolic resins of above-mentioned weight part, carboxylic styrene butadiene latex, silicone resin metlyl branching silicone oil, tensio-active agent, dipentaerythritol, polyborosiloxane, nano magnesia, poplar bark powder, natural sodium bentonite, anti-aging agent TCY added in reactor and mix, at 60-75 DEG C of insulation 2-3 hour, be cooled to normal temperature, stir and obtain physics and chemistry plate modified phenolic resin adhesive.
In the preparation process of modified phenolic resins of the present invention, the main component of prefabricated material is cardanol, long alkyl chain between cardanol on position has toughness, the fragility of resol effectively can be overcome with resol mating reaction, modified phenolic resin adhesive solidification value is low, with silicone resin metlyl branching silicone oil mating reaction quick solidifying, goods cohesive force is stronger, and silicone resin metlyl branching silicone oil can improve the stripping result of product, be convenient in demoulding, the poplar bark powder of further interpolation, natural sodium bentonite, carboxylic styrene butadiene latex and dipentaerythritol, not only obviously improve the toughness of modified phenolic resins, mechanical property and flame retardant resistance, nano magnesia wherein can make goods have good mobility and stability in storage, with anti-aging agent TCY mating reaction, storage time increases further, said components mating reaction not only can effectively reduce goods cost, glue performance is excellent, and good toughness, mechanical property and Good Heat-resistance.
Embodiment
Embodiment 1
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1000Pa, obtains the prefabricated material that viscosity is 64mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 20 parts of prefabricated material, 20 parts of formaldehyde, 1 part of catalyzer and 1.5 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.4, be warmed up to 100 DEG C with the speed of 3 DEG C/min, insulation 1.5h, decompression dehydration, obtains modified phenolic resins.
Embodiment 2
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1200Pa, obtains the prefabricated material that viscosity is 60mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 40 parts of prefabricated material, 15 parts of formaldehyde, 2 parts of catalyzer and 1 part of auxiliary agent, add hydrochloric acid soln adjust ph to 1.8, be warmed up to 100 DEG C with the speed of 1 DEG C/min, insulation 2h, decompression dehydration, obtains modified phenolic resins.
Embodiment 3
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1100Pa, obtains the prefabricated material that viscosity is 62mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 32 parts of prefabricated material, 17 parts of formaldehyde, 1.4 parts of catalyzer and 1.3 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.5, be warmed up to 100 DEG C with the speed of 2 DEG C/min, insulation 1.8h, decompression dehydration, obtains modified phenolic resins.
Embodiment 4
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1000Pa, obtains the prefabricated material that viscosity is 63mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 21 parts of prefabricated material, 19 parts of formaldehyde, 1.2 parts of catalyzer and 1.4 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.5, be warmed up to 100 DEG C with the speed of 2.8 DEG C/min, insulation 1.6h, decompression dehydration, obtains modified phenolic resins.
Embodiment 5
A kind of physics and chemistry plate modified phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the preparation process of modified phenolic resins, sent into by cashew nut oil in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, and underpressure distillation pressure is 1100Pa, obtains the prefabricated material that viscosity is 62mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 38 parts of prefabricated material, 16 parts of formaldehyde, 1.92 parts of catalyzer and 1.2 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.7, be warmed up to 100 DEG C with the speed of 1.2 DEG C/min, insulation 1.8h, decompression dehydration, obtains modified phenolic resins.
The above; be only the present invention's preferably embodiment; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.

Claims (8)

1. a physics and chemistry plate modified phenolic resin adhesive, is characterized in that, its raw material comprises by weight:
In the preparation process of modified phenolic resins, cashew nut oil is sent in distiller and carry out underpressure distillation and obtain the prefabricated material that viscosity is 60-64mPas (25 DEG C); Phenol, prefabricated material, formaldehyde, catalyzer and auxiliary agent are put into reaction flask, adds hydrochloric acid soln adjust ph to 1.4-1.8, be warming up to 100 DEG C, insulation 1.5-2h, decompression dehydration, obtains modified phenolic resins.
2. physics and chemistry plate modified phenolic resin adhesive according to claim 1, it is characterized in that, in the preparation process of modified phenolic resins, cashew nut oil is sent in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, underpressure distillation pressure is 1000-1200Pa, obtains the prefabricated material that viscosity is 60-64mPas (25 DEG C); Take 100 parts of phenol, the prefabricated material of 20-40 part, 15-20 part formaldehyde, 1-2 part catalyzer and 1-1.5 part auxiliary agent by weight and put into reaction flask, add hydrochloric acid soln adjust ph to 1.4-1.8,100 DEG C are warmed up to the speed of 1-3 DEG C/min, insulation 1.5-2h, decompression dehydration, obtains modified phenolic resins.
3. physics and chemistry plate modified phenolic resin adhesive according to claim 1 and 2, is characterized in that, the weight ratio of modified phenolic resins, carboxylic styrene butadiene latex and silicone resin metlyl branching silicone oil is 50-55:1.6-1.8:1.2-1.4.
4. the physics and chemistry plate modified phenolic resin adhesive according to any one of claim 1-3, is characterized in that, the weight ratio of modified phenolic resins and nano magnesia is 50-55:2-2.4.
5. the physics and chemistry plate modified phenolic resin adhesive according to any one of claim 1-4, is characterized in that, the weight ratio of poplar bark powder and natural sodium bentonite is 12-14:5-6.
6. the physics and chemistry plate modified phenolic resin adhesive according to any one of claim 1-5, it is characterized in that, its raw material comprises by weight:
7. the physics and chemistry plate modified phenolic resin adhesive according to any one of claim 1-6, it is characterized in that, its raw material comprises by weight:
8. the physics and chemistry plate modified phenolic resin adhesive according to any one of claim 1-7, it is characterized in that, in the preparation process of modified phenolic resins, cashew nut oil is sent in distiller and carry out underpressure distillation, vacuum distillation temperature is 220 DEG C, underpressure distillation pressure is 1100Pa, obtains the prefabricated material that viscosity is 62mPas (25 DEG C); Take 100 parts of phenol by weight, reaction flask put into by 32 parts of prefabricated material, 17 parts of formaldehyde, 1.4 parts of catalyzer and 1.3 parts of auxiliary agents, add hydrochloric acid soln adjust ph to 1.5, be warmed up to 100 DEG C with the speed of 2 DEG C/min, insulation 1.8h, decompression dehydration, obtains modified phenolic resins.
CN201510070642.3A 2015-02-10 2015-02-10 Modified phenolic resin adhesive for chemical resistant laminate Pending CN104559870A (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105331311A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of bamboo plywood with high bonding strength
CN105331318A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of mould-proof bamboo plywood with high bonding strength
CN107177335A (en) * 2017-04-29 2017-09-19 成都博美实润科技有限公司 A kind of timber modified phenolic resin adhesive and preparation method thereof
CN111763489A (en) * 2020-05-29 2020-10-13 安徽老石人石业有限公司 High-strength adhesive for compounding natural granite marble and various artificial materials

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101081890A (en) * 2007-07-25 2007-12-05 山东圣泉化工股份有限公司 Preparation method of cashew nut oil modified alkyd resin
CN102994027A (en) * 2012-10-31 2013-03-27 安徽东方金河精密机械制造有限公司 Phenolic resin adhesive
CN104231540A (en) * 2014-08-31 2014-12-24 王寿高 Modified phenol formaldehyde resin

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101081890A (en) * 2007-07-25 2007-12-05 山东圣泉化工股份有限公司 Preparation method of cashew nut oil modified alkyd resin
CN102994027A (en) * 2012-10-31 2013-03-27 安徽东方金河精密机械制造有限公司 Phenolic resin adhesive
CN104231540A (en) * 2014-08-31 2014-12-24 王寿高 Modified phenol formaldehyde resin

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
杨玮等: "腰果酚/腰果壳油改性酚醛树脂的合成及其应用研究", 《热固性树脂》 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105331311A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of bamboo plywood with high bonding strength
CN105331318A (en) * 2015-11-23 2016-02-17 安徽福佳竹木日用品有限公司 Preparation method of mould-proof bamboo plywood with high bonding strength
CN107177335A (en) * 2017-04-29 2017-09-19 成都博美实润科技有限公司 A kind of timber modified phenolic resin adhesive and preparation method thereof
CN111763489A (en) * 2020-05-29 2020-10-13 安徽老石人石业有限公司 High-strength adhesive for compounding natural granite marble and various artificial materials

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