CN104559865A - Phenolic resin adhesive for chemical resistant laminate - Google Patents
Phenolic resin adhesive for chemical resistant laminate Download PDFInfo
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- CN104559865A CN104559865A CN201510070645.7A CN201510070645A CN104559865A CN 104559865 A CN104559865 A CN 104559865A CN 201510070645 A CN201510070645 A CN 201510070645A CN 104559865 A CN104559865 A CN 104559865A
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Abstract
The invention discloses a phenolic resin adhesive for a chemical resistant laminate. The adhesive is prepared from the following raw materials in parts by weight: 100 parts of phenolic resin, 20-30 parts of nano-carboxyl-terminated nitrile rubber, 10-20 parts of magnesium hydroxide, 10-15 parts of modified nano-magnesium oxide, 4-10 parts of nano-silicon dioxide, 4-12 parts of kaolin, 4-12 parts of montmorillonite, 2-8 parts of polyvinylpyrrolidone K30, 3-7 parts of dipentaerythritol, 1-3 parts of polyvinyl alcohol and 10-20 parts of alkyl phenol polyoxyethylene ether. The adhesive has the advantages of thermal stability, good toughness, excellent mechanical performance and long service life.
Description
Technical field
The present invention relates to physics and chemistry plate sizing agent technical field, particularly relate to a kind of physics and chemistry plate phenolic resin adhesive.
Background technology
Resol realizes industrialized synthetic resins the earliest in the world, the history of existing last 100 years so far, product after solidification has good corrosion resistance nature, and cost is lower, current resol occupies critical role in physics and chemistry plate sizing agent, phenolic aldehyde resin thermal stability is not high enough, poor toughness, work-ing life is short, thus cause the physics and chemistry plate shock strength of preparation lower, and poor heat stability, work-ing life does not reach requirement, but along with the progress of science and technology, the performance of phenolic resin adhesive can not meet the requirement of physics and chemistry plate at high-technology field.How to prepare a kind of thermostability, good toughness, excellent in mechanical performance, the physics and chemistry plate phenolic resin adhesive of long service life becomes the current technical issues that need to address.
Summary of the invention
The present invention proposes a kind of physics and chemistry plate phenolic resin adhesive, thermostability, good toughness, excellent in mechanical performance, long service life.
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
In the magnesian preparation process of modified Nano, by weight 10-15 part nano magnesia is added in 50-60 part dehydrated alcohol and carry out a ultrasonic disperse 30-60min, in a ultrasonic disperse process, temperature is 50-60 DEG C, after being warming up to 70-80 DEG C with the speed of 1-3 DEG C/min, carry out twice ultrasonic dispersion 10-20min, be cooled to 40-50 DEG C to add 1-3 part dicumyl peroxide and carry out three ultrasonic disperse 10-30min, then at 75-85 DEG C of backflow 70-100min, filter, centrifugation obtains modified Nano magnesium oxide.
Preferably, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 10-20wt%, and particle diameter is that 20-50nm accounts for 40-60wt%, and all the other particle diameters are 50-70nm.
Preferably, in modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 5-10wt%, and particle diameter is that 5-8nm accounts for 50-70wt%, and all the other particle diameters are 9-10nm.
Preferably, in nano silicon, particle diameter is that 0.5-1nm accounts for 5-15wt%, and particle diameter is that 1-3nm accounts for 50-80wt%, and all the other particle diameters are 3-6nm.
Preferably, the weight ratio of resol, nanometer nbr carboxyl terminal is 100:24-28.
Preferably, resol, the magnesian weight ratio of modified Nano are 100:12-14.
Preferably, its raw material comprises by weight:
Preferably, its raw material comprises by weight:
The preparation technology of above-mentioned physics and chemistry plate phenolic resin adhesive is, montmorillonite, kaolin lapping powder are broken into the powder being less than 2mm, mix with magnesium hydroxide, modified Nano magnesium oxide, nano silicon, PVP K30, add dipentaerythritol, polyvinyl alcohol, alkylphenol polyoxyethylene mix to prefabricated material, modified phenolic resins and nanometer nbr carboxyl terminal are made glue mix with prefabricated material, obtain physics and chemistry plate phenolic resin adhesive.
In the present invention, nanometer nbr carboxyl terminal particle diameter is little and very easily disperses, toughening effect is obvious, and its particle surface exists a large amount of polar functional group, with the Electronic interactions of resol, strong Intermolecular Forces is formed between interface, consistency is good, and goods adhesive property significantly strengthens, and cost is low, toughening effect is obvious, and ageing-resistant performance is excellent; Modified Nano magnesium oxide wherein can make goods have good mobility and stability in storage, with nano silicon mating reaction, long service life, and heat-resistant stability is excellent, the kaolin added further, montmorillonite, PVP K30, polyvinyl alcohol, dipentaerythritol and alkylphenol polyoxyethylene, good dispersity, goods toughness, mechanical property and flame retardant resistance strengthen further, said components mating reaction thermostability, good toughness, excellent in mechanical performance, long service life.
Embodiment
Embodiment 1
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
Wherein, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 10wt%, and particle diameter is that 20-50nm accounts for 60wt%, and all the other particle diameters are 50-70nm; In modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 5wt%, and particle diameter is that 5-8nm accounts for 70wt%, and all the other particle diameters are 9-10nm; In nano silicon, particle diameter is that 0.5-1nm accounts for 5wt%, and particle diameter is that 1-3nm accounts for 80wt%, and all the other particle diameters are 3-6nm;
In the magnesian preparation process of modified Nano, by weight 10 parts of nano magnesias are added in 60 parts of dehydrated alcohols and carry out a ultrasonic disperse 60min, in a ultrasonic disperse process, temperature is 50 DEG C, after being warming up to 80 DEG C with the speed of 1 DEG C/min, carry out twice ultrasonic dispersion 10min, be cooled to 50 DEG C and add 1 part of dicumyl peroxide and carry out three ultrasonic disperse 30min, then at 75 DEG C of backflow 100min, filter, centrifugation obtains modified Nano magnesium oxide.
Embodiment 2
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
Wherein, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 20wt%, and particle diameter is that 20-50nm accounts for 40wt%, and all the other particle diameters are 50-70nm; In modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 10wt%, and particle diameter is that 5-8nm accounts for 50wt%, and all the other particle diameters are 9-10nm; In nano silicon, particle diameter is that 0.5-1nm accounts for 15wt%, and particle diameter is that 1-3nm accounts for 50wt%, and all the other particle diameters are 3-6nm;
In the magnesian preparation process of modified Nano, by weight 15 parts of nano magnesias are added in 50 parts of dehydrated alcohols and carry out a ultrasonic disperse 30min, in a ultrasonic disperse process, temperature is 60 DEG C, after being warming up to 70 DEG C with the speed of 3 DEG C/min, carry out twice ultrasonic dispersion 20min, be cooled to 40 DEG C and add 3 parts of dicumyl peroxides and carry out three ultrasonic disperse 10min, then at 85 DEG C of backflow 70min, filter, centrifugation obtains modified Nano magnesium oxide.
Embodiment 3
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
Wherein, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 15wt%, and particle diameter is that 20-50nm accounts for 50wt%, and all the other particle diameters are 50-70nm; In modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 8wt%, and particle diameter is that 5-8nm accounts for 62wt%, and all the other particle diameters are 9-10nm; In nano silicon, particle diameter is that 0.5-1nm accounts for 12wt%, and particle diameter is that 1-3nm accounts for 72wt%, and all the other particle diameters are 3-6nm;
In the magnesian preparation process of modified Nano, by weight 13 parts of nano magnesias are added in 58 parts of dehydrated alcohols and carry out a ultrasonic disperse 50min, in a ultrasonic disperse process, temperature is 56 DEG C, after being warming up to 75 DEG C with the speed of 2 DEG C/min, carry out twice ultrasonic dispersion 16min, be cooled to 46 DEG C and add 2 parts of dicumyl peroxides and carry out three ultrasonic disperse 21min, then at 82 DEG C of backflow 80min, filter, centrifugation obtains modified Nano magnesium oxide.
Embodiment 4
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
Wherein, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 12wt%, and particle diameter is that 20-50nm accounts for 56wt%, and all the other particle diameters are 50-70nm; In modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 6wt%, and particle diameter is that 5-8nm accounts for 68wt%, and all the other particle diameters are 9-10nm; In nano silicon, particle diameter is that 0.5-1nm accounts for 6wt%, and particle diameter is that 1-3nm accounts for 78wt%, and all the other particle diameters are 3-6nm;
In the magnesian preparation process of modified Nano, by weight 11 parts of nano magnesias are added in 58 parts of dehydrated alcohols and carry out a ultrasonic disperse 58min, in a ultrasonic disperse process, temperature is 52 DEG C, after being warming up to 78 DEG C with the speed of 1.5 DEG C/min, carry out twice ultrasonic dispersion 12min, be cooled to 49 DEG C and add 1.5 parts of dicumyl peroxides and carry out three ultrasonic disperse 28min, then at 76 DEG C of backflow 95min, filter, centrifugation obtains modified Nano magnesium oxide.
Embodiment 5
A kind of physics and chemistry plate phenolic resin adhesive that the present invention proposes, its raw material comprises by weight:
Wherein, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 18wt%, and particle diameter is that 20-50nm accounts for 43wt%, and all the other particle diameters are 50-70nm; In modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 9wt%, and particle diameter is that 5-8nm accounts for 52wt%, and all the other particle diameters are 9-10nm; In nano silicon, particle diameter is that 0.5-1nm accounts for 13wt%, and particle diameter is that 1-3nm accounts for 54wt%, and all the other particle diameters are 3-6nm;
In the magnesian preparation process of modified Nano, by weight 14 parts of nano magnesias are added in 52 parts of dehydrated alcohols and carry out a ultrasonic disperse 32min, in a ultrasonic disperse process, temperature is 58 DEG C, after being warming up to 72 DEG C with the speed of 2.5 DEG C/min, carry out twice ultrasonic dispersion 18min, be cooled to 42 DEG C and add 2.8 parts of dicumyl peroxides and carry out three ultrasonic disperse 12min, then at 83 DEG C of backflow 80min, filter, centrifugation obtains modified Nano magnesium oxide.
The above; be only the present invention's preferably embodiment; but protection scope of the present invention is not limited thereto; anyly be familiar with those skilled in the art in the technical scope that the present invention discloses; be equal to according to technical scheme of the present invention and inventive concept thereof and replace or change, all should be encompassed within protection scope of the present invention.
Claims (8)
1. a physics and chemistry plate phenolic resin adhesive, is characterized in that, its raw material comprises by weight:
In the magnesian preparation process of modified Nano, by weight 10-15 part nano magnesia is added in 50-60 part dehydrated alcohol and carry out a ultrasonic disperse 30-60min, in a ultrasonic disperse process, temperature is 50-60 DEG C, after being warming up to 70-80 DEG C with the speed of 1-3 DEG C/min, carry out twice ultrasonic dispersion 10-20min, be cooled to 40-50 DEG C to add 1-3 part dicumyl peroxide and carry out three ultrasonic disperse 10-30min, then at 75-85 DEG C of backflow 70-100min, filter, centrifugation obtains modified Nano magnesium oxide.
2. physics and chemistry plate phenolic resin adhesive according to claim 1, is characterized in that, in nanometer nbr carboxyl terminal, particle diameter is that 10-20nm accounts for 10-20wt%, and particle diameter is that 20-50nm accounts for 40-60wt%, and all the other particle diameters are 50-70nm.
3. physics and chemistry plate phenolic resin adhesive according to claim 1 and 2, is characterized in that, in modified Nano magnesium oxide, particle diameter is that 1-4nm accounts for 5-10wt%, and particle diameter is that 5-8nm accounts for 50-70wt%, and all the other particle diameters are 9-10nm.
4. the physics and chemistry plate phenolic resin adhesive according to any one of claim 1-3, is characterized in that, in nano silicon, particle diameter is that 0.5-1nm accounts for 5-15wt%, and particle diameter is that 1-3nm accounts for 50-80wt%, and all the other particle diameters are 3-6nm.
5. the physics and chemistry plate phenolic resin adhesive according to any one of claim 1-4, is characterized in that, the weight ratio of resol, nanometer nbr carboxyl terminal is 100:24-28.
6. the physics and chemistry plate phenolic resin adhesive according to any one of claim 1-5, is characterized in that, the magnesian weight ratio of resol, modified Nano is 100:12-14.
7. the physics and chemistry plate phenolic resin adhesive according to any one of claim 1-6, it is characterized in that, its raw material comprises by weight:
8. the physics and chemistry plate phenolic resin adhesive according to any one of claim 1-7, it is characterized in that, its raw material comprises by weight:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070645.7A CN104559865A (en) | 2015-02-10 | 2015-02-10 | Phenolic resin adhesive for chemical resistant laminate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510070645.7A CN104559865A (en) | 2015-02-10 | 2015-02-10 | Phenolic resin adhesive for chemical resistant laminate |
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| CN104559865A true CN104559865A (en) | 2015-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510070645.7A Pending CN104559865A (en) | 2015-02-10 | 2015-02-10 | Phenolic resin adhesive for chemical resistant laminate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010395A (en) * | 2016-07-08 | 2016-10-12 | 姚华鹏 | High-temperature-resistant and corrosion-resistant adhesive |
| CN106117963A (en) * | 2016-07-13 | 2016-11-16 | 芜湖恒固混凝土材料有限公司 | A kind of concrete drums plastics and preparation method thereof |
| CN107674422A (en) * | 2017-10-13 | 2018-02-09 | 陶红雨 | A kind of preparation method of corrosion-resistant heatproof construction material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805489A (en) * | 2010-04-27 | 2010-08-18 | 黑龙江省科学院石油化学研究院 | Low volatile and thermostable phenolic resin and fabrication method thereof |
| CN102994027A (en) * | 2012-10-31 | 2013-03-27 | 安徽东方金河精密机械制造有限公司 | Phenolic resin adhesive |
-
2015
- 2015-02-10 CN CN201510070645.7A patent/CN104559865A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101805489A (en) * | 2010-04-27 | 2010-08-18 | 黑龙江省科学院石油化学研究院 | Low volatile and thermostable phenolic resin and fabrication method thereof |
| CN102994027A (en) * | 2012-10-31 | 2013-03-27 | 安徽东方金河精密机械制造有限公司 | Phenolic resin adhesive |
Non-Patent Citations (1)
| Title |
|---|
| 彭进等: "纳米端羧基丁腈橡胶增韧酚醛树脂及其在有机磨具中的应用研究", 《河北化工》 * |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106010395A (en) * | 2016-07-08 | 2016-10-12 | 姚华鹏 | High-temperature-resistant and corrosion-resistant adhesive |
| CN106117963A (en) * | 2016-07-13 | 2016-11-16 | 芜湖恒固混凝土材料有限公司 | A kind of concrete drums plastics and preparation method thereof |
| CN107674422A (en) * | 2017-10-13 | 2018-02-09 | 陶红雨 | A kind of preparation method of corrosion-resistant heatproof construction material |
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