CN102986053B - Oled装置及制造其的方法 - Google Patents

Oled装置及制造其的方法 Download PDF

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Publication number
CN102986053B
CN102986053B CN201180035011.8A CN201180035011A CN102986053B CN 102986053 B CN102986053 B CN 102986053B CN 201180035011 A CN201180035011 A CN 201180035011A CN 102986053 B CN102986053 B CN 102986053B
Authority
CN
China
Prior art keywords
conductive
protective layer
layer
oled device
conductive protective
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201180035011.8A
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English (en)
Chinese (zh)
Other versions
CN102986053A (zh
Inventor
H.施瓦布
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips Electronics NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koninklijke Philips Electronics NV filed Critical Koninklijke Philips Electronics NV
Publication of CN102986053A publication Critical patent/CN102986053A/zh
Application granted granted Critical
Publication of CN102986053B publication Critical patent/CN102986053B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60—Forming conductive regions or layers, e.g. electrodes
    • H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/88—Terminals, e.g. bond pads

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
CN201180035011.8A 2010-07-16 2011-07-11 Oled装置及制造其的方法 Expired - Fee Related CN102986053B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
EP10169821.5 2010-07-16
EP10169821 2010-07-16
PCT/IB2011/053071 WO2012007893A1 (en) 2010-07-16 2011-07-11 An oled device and a method of manufacturing the same

Publications (2)

Publication Number Publication Date
CN102986053A CN102986053A (zh) 2013-03-20
CN102986053B true CN102986053B (zh) 2016-03-02

Family

ID=44544293

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201180035011.8A Expired - Fee Related CN102986053B (zh) 2010-07-16 2011-07-11 Oled装置及制造其的方法

Country Status (6)

Country Link
US (1) US8829787B2 (https=)
EP (1) EP2593980B1 (https=)
JP (1) JP5892707B2 (https=)
KR (1) KR101947194B1 (https=)
CN (1) CN102986053B (https=)
WO (1) WO2012007893A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014199673A1 (ja) * 2013-06-11 2014-12-18 シャープ株式会社 有機エレクトロルミネッセンス表示装置
FR3017996A1 (fr) * 2014-02-25 2015-08-28 Commissariat Energie Atomique Dispositif a composant electronique
KR102422061B1 (ko) 2017-11-28 2022-07-18 엘지디스플레이 주식회사 Oled 조명 장치
KR102338064B1 (ko) 2021-06-11 2021-12-13 주식회사 올레드링크 Oled 패널 제조방법
KR102337855B1 (ko) 2021-09-03 2021-12-13 주식회사 올레드링크 개선된 증착 효과를 가지는 oled 패널 제조방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272832A (ja) * 2002-03-13 2003-09-26 Denso Corp 有機ｅｌ素子およびその製造方法
US20050008894A1 (en) * 2002-10-17 2005-01-13 Asahi Glass Company, Limited Laminate, a substrate with wires, an organic EL display element, a connection terminal for the organic EL display element and a method for producing each
CN101681998A (zh) * 2007-03-20 2010-03-24 Otb太阳能有限公司 用于制造有机发光装置的方法以及这样的装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002039513A1 (en) * 2000-11-08 2002-05-16 Koninklijke Philips Electronics N.V. Electro-optical device
JP4551592B2 (ja) * 2001-08-14 2010-09-29 パイオニア株式会社 配線付き基体
JP2003297584A (ja) * 2002-04-04 2003-10-17 Asahi Glass Co Ltd 配線付き基体形成用積層体、配線付き基体およびその形成方法
JP4469126B2 (ja) * 2002-06-14 2010-05-26 龍男 内田 ディスプレイとそれに用いる配線基板
JP2004047316A (ja) * 2002-07-12 2004-02-12 Sharp Corp 有機ｌｅｄ素子とその製造方法および表示装置
JP3649238B2 (ja) * 2002-10-17 2005-05-18 旭硝子株式会社 積層体、配線付き基体、有機ｅｌ表示素子、有機ｅｌ表示素子の接続端子及びそれらの製造方法
JP2005305714A (ja) * 2004-04-19 2005-11-04 Asahi Glass Co Ltd 配線付き基体形成用積層体とその形成方法および配線付き基体
EP1797606A1 (en) * 2004-09-27 2007-06-20 Philips Intellectual Property & Standards GmbH Illumination system
KR100647677B1 (ko) * 2005-02-04 2006-11-23 삼성에스디아이 주식회사 금속 보강층을 포함하는 유기 전계 발광 소자 및 그제조방법
FR2904508B1 (fr) * 2006-07-28 2014-08-22 Saint Gobain Dispositif electroluminescent encapsule
KR20070050804A (ko) * 2006-08-28 2007-05-16 주식회사 대우일렉트로닉스 오엘이디 디스플레이 패널
US8328375B2 (en) * 2006-09-29 2012-12-11 Osram Opto Semiconductors Gmbh Organic lighting device and lighting equipment
JP2008166232A (ja) * 2007-01-05 2008-07-17 Fuji Electric Holdings Co Ltd 有機ｅｌディスプレイの製造方法
TW200908413A (en) * 2007-05-02 2009-02-16 Koninkl Philips Electronics Nv Method for manufacturing an OLED device and such an OLED device
JP2009076437A (ja) * 2007-08-31 2009-04-09 Toshiba Matsushita Display Technology Co Ltd 表示装置
JP4950870B2 (ja) * 2007-12-21 2012-06-13 ローム株式会社 有機発光装置
JP5049213B2 (ja) * 2008-07-08 2012-10-17 株式会社ジャパンディスプレイイースト 有機ｅｌパネルおよびその製造方法
US20100118243A1 (en) * 2008-11-12 2010-05-13 Debasis Majumdar Polymeric conductive donor and transfer method
JP4849279B2 (ja) * 2009-05-28 2012-01-11 Ｔｄｋ株式会社 有機ｅｌ表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003272832A (ja) * 2002-03-13 2003-09-26 Denso Corp 有機ｅｌ素子およびその製造方法
US20050008894A1 (en) * 2002-10-17 2005-01-13 Asahi Glass Company, Limited Laminate, a substrate with wires, an organic EL display element, a connection terminal for the organic EL display element and a method for producing each
CN101681998A (zh) * 2007-03-20 2010-03-24 Otb太阳能有限公司 用于制造有机发光装置的方法以及这样的装置

Also Published As

Publication number Publication date
KR20130041945A (ko) 2013-04-25
EP2593980B1 (en) 2019-03-27
WO2012007893A1 (en) 2012-01-19
KR101947194B1 (ko) 2019-02-12
US8829787B2 (en) 2014-09-09
JP2013534706A (ja) 2013-09-05
JP5892707B2 (ja) 2016-03-23
CN102986053A (zh) 2013-03-20
EP2593980A1 (en) 2013-05-22
US20130119858A1 (en) 2013-05-16

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C41 Transfer of patent application or patent right or utility model
TR01 Transfer of patent right

Effective date of registration: 20160331

Address after: Aachen

Patentee after: KONINKLIJKE PHILIPS ELECTRONICS N.V.

Address before: Holland Ian Deho Finn

Patentee before: Koninklijke Philips Electronics N.V.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20160302

Termination date: 20210711